Core Viewpoint - Jinfu Technology has received an order from a Taiwanese client for its custom-developed 0.08mm blade heat dissipation structure, which is utilized in the liquid cooling system for the B200 chip [1] Group 1: Product Development - The heat dissipation structure employs the latest MLCP (Microchannel Liquid Cooling Plate) technology, providing significant first-mover advantages and technical superiority [1] - This technology effectively addresses the TDP thermal effects of processors with power consumption between 1800W and 2000W and above, ensuring stable low-temperature operation of processor modules [1] Group 2: Future Prospects - The adaptation plan for the next-generation B300 chip has completed multiple rounds of sample testing, receiving positive feedback and is now entering the production preparation phase [1]

Group 1 - The market experienced a significant upward trend, with the Shanghai Composite Index rising over 1% and approaching 4000 points, marking a ten-year high [1] - The trading volume in the Shanghai and Shenzhen markets reached 2.34 trillion, an increase of 365.9 billion compared to the previous trading day [1] - Sectors such as storage chips, CPO, and controllable nuclear fusion saw the highest gains, while gaming and wind power equipment sectors faced declines [1] Group 2 - Guojin Securities expressed optimism about the upward trend in quantum computing and controllable nuclear fusion industries, supported by the "14th Five-Year Plan" which aims to promote these sectors as new economic growth points [2] - Citic Construction Investment recommended focusing on investment opportunities in the liquid cooling sector, anticipating significant growth in market penetration by 2025 due to increased chip power consumption and the adoption of liquid cooling solutions [3] -招商证券 projected a marginal improvement in the profit growth rate of non-financial A-shares in the upcoming quarterly reports, with high growth expected in information technology and midstream manufacturing sectors [4]

Group 1 - The market experienced a significant upward trend, with the Shanghai Composite Index rising over 1% and reaching a ten-year high, approaching 4000 points [1] - The trading volume in the Shanghai and Shenzhen markets was 2.34 trillion, an increase of 365.9 billion compared to the previous trading day [1] - Key sectors that saw gains included storage chips, CPO, and controllable nuclear fusion, while gaming and wind power equipment sectors faced declines [1] Group 2 - Guotai Junan Securities expressed optimism about the upward trend in quantum computing and controllable nuclear fusion industries, supported by national policy and funding [2] - The 14th Five-Year Plan emphasizes the development of quantum technology and nuclear fusion as new economic growth points [2] Group 3 - CITIC Construction Investment highlighted the investment opportunities in the liquid cooling sector, predicting significant growth in market size due to increased adoption of liquid cooling in AI chip applications by 2025 [3] - The penetration of liquid cooling in the ASIC market and domestic market is expected to accelerate as the industry matures [3] Group 4 - China Merchants Securities anticipates a marginal improvement in the profit growth rate of non-financial A-shares in the third quarter, driven by a low base effect [4] - High profit growth is expected in sectors such as information technology and midstream manufacturing, while upstream resources and healthcare are projected to see a narrowing of performance declines [4]

Group 1 - The core viewpoint is that 2025 will see a significant increase in the penetration of liquid cooling in NVIDIA's AI chips, driven by rising single-chip power consumption and the maturation of the liquid cooling supply chain [1][10] - The liquid cooling market is expected to grow significantly as ASIC cabinet solutions gradually adopt liquid cooling, alongside the introduction of domestic manufacturers' ultra-node solutions [1][10] - The report suggests focusing on the liquid cooling sector due to its potential for rapid market expansion [1][10] Group 2 - Diamond materials are highlighted as an ideal solution for efficient heat dissipation in semiconductor applications, with thermal conductivity reaching 2000 W/m·K, significantly outperforming traditional materials like copper and silicon [2][3][4] - The demand for high-efficiency cooling solutions is increasing due to the challenges posed by rising power densities in semiconductor devices, necessitating advanced materials like diamond [2][3][4] - The market for thermal interface materials (TIM) has seen substantial growth, with a compound annual growth rate of 13.97% from 2018 to 2023, indicating a strong demand for effective heat management solutions [5][6][8] Group 3 - North American capital expenditures from major internet companies reached $95.8 billion in Q2 2025, a 64% year-on-year increase, reflecting strong growth in the AI-driven computing sector [9] - Companies like Amazon and Meta have significantly increased their capital expenditure forecasts, indicating optimism for continued investment in AI and related technologies [9][11] - The liquid cooling server market in China is projected to reach 20.1 billion yuan in 2024, with a growth rate of 84.4%, further emphasizing the sector's expansion potential [15]

Core Insights - 2025 is expected to be a significant year for the penetration of liquid cooling in NVIDIA's AI chip market, driven by increased power consumption per chip [1] - The market size for liquid cooling is anticipated to grow substantially as ASIC cabinet solutions gradually adopt liquid cooling, alongside the introduction of ultra-node solutions by domestic manufacturers [1] - The maturity of the liquid cooling supply chain is expected to enhance the penetration of liquid cooling in both the ASIC market and the domestic market, further expanding market opportunities [1] Summary by Categories - **Market Trends** - Liquid cooling is projected to see a substantial increase in market penetration in 2025 due to rising chip power consumption [1] - The adoption of liquid cooling in ASIC cabinet solutions is expected to accelerate, contributing to market growth [1] - **Industry Developments** - Domestic manufacturers are launching ultra-node solutions that will support the growth of liquid cooling technologies [1] - The liquid cooling supply chain is maturing, which will facilitate faster adoption in the ASIC and domestic markets [1]

Core Viewpoint - SuperX has established a joint venture, SuperX Cooltech Pte. Ltd., with a subsidiary of Cheng Tian Wei Ye to address the cooling challenges posed by the exponential growth of AI computing power [1][2] Group 1: Joint Venture Formation - The joint venture aims to integrate both companies' strengths in AI system integration and thermal management components to provide advanced liquid cooling products and infrastructure solutions globally [1][2] - SuperX will become the largest shareholder of the joint venture upon completion of the investment [1] Group 2: Market Context and Technology - Traditional air cooling methods are insufficient for managing the high thermal flux required by AI training and inference clusters, making power consumption and cooling issues critical bottlenecks for AI data center deployment [1] - Efficient cabinet-level liquid cooling technologies, including cooling distribution units (CDUs) and high-performance liquid cooling plates, are rapidly becoming mainstream in the industry [1] Group 3: Competitive Advantages - SuperX's core advantages include a global perspective, AI server system integration capabilities, and an end-to-end customer service network, with a product line that includes high-performance AI servers and AI cloud services [2] - Cheng Tian Wei Ye has established a complete layout in key products such as nano-injection liquid cooling plates and CDU systems, enhancing the joint venture's competitive edge in the AI infrastructure solutions sector [2] Group 4: Production and Efficiency - The joint venture can leverage Cheng Tian Wei Ye's mature engineering and intelligent manufacturing systems to quickly convert advanced R&D results into reliable mass production, meeting global customers' stringent requirements for high-quality and stable supply chains [3] - Standardized modular designs will shorten project delivery cycles and optimize system-level thermal management, significantly improving customers' long-term return on investment [3]

Core Viewpoint - The company, Siquan New Materials, has established a production line for liquid cooling products and is capable of large-scale production of liquid cooling modules, confirming its position as a key supplier in the market [1] Group 1 - The company is recognized as the second core supplier of liquid cooling plates for NVIDIA's GB200 chip, following Invec [1] - The company emphasizes that specific business conditions should be verified through official disclosures on designated information platforms [1]

Core Viewpoint - The company, Qiansuan New Materials (思泉新材), has confirmed its involvement in the production of liquid cooling components for NVIDIA's servers, indicating that its high-performance liquid cooling plates have passed validation tests and are in small batch testing [2]. Group 1 - The company has invested in the construction of a production line for liquid cooling products, demonstrating its capability for large-scale production of liquid cooling modules [2]. - The specific business details are advised to be referenced from the company's designated information disclosure media and platforms [2].

Core Viewpoint - The company, Qingsuan New Materials (思泉新材), has confirmed its role as a core supplier of liquid cooling components for NVIDIA's servers, with its high-performance liquid cooling plates having passed NVIDIA's validation tests and entering small batch testing phase [1] Group 1: Company Developments - The company has invested in the construction of a production line for liquid cooling products, indicating its capability for large-scale production of liquid cooling modules [1] - The company emphasized that specific business details should be referred to in its designated information disclosure media and platforms [1]

Core Viewpoint - The company has received positive feedback regarding its production capacity and growth potential, particularly in the automotive and liquid cooling product sectors, indicating a strong operational status and future growth prospects [1][3][9]. Group 1: Company Performance and Financials - As of September 22, 2025, the top-performing fund under the management of the company, "泉果旭源三年持有期混合A," achieved a return of 71.65% over the past year [2]. - The company has a current production capacity utilization rate of approximately 75% and is preparing for expansion plans [11]. - The company anticipates continued growth in revenue and net profit for 2025, with specific targets linked to its stock incentive goals [15]. Group 2: Production and Capacity - The company has four production bases, with the Dongguan facility focusing on communication connectors and the Henan facility producing automotive connectors, which has not yet reached saturation [4]. - The company is in the early planning stages for a new wholly-owned subsidiary in Vietnam, with production expected to commence by the end of next year [3]. - The company has received customer notifications to prepare production capacity for liquid cooling products, indicating strong demand [4]. Group 3: Product Development and Market Demand - The company’s liquid cooling products are primarily used for heat dissipation in connectors and optical modules, with some products already in the sampling stage for mass production [21][22]. - The automotive business has shown quarter-on-quarter growth, with products developed in collaboration with BYD beginning to ramp up production [6]. - The company maintains strong relationships with major clients such as Amphenol and Molex, and plans to continue developing new communication connector products in response to market demand [8][24]. Group 4: Strategic Outlook - The company is exploring opportunities for mergers and acquisitions as part of its future strategic planning, although specific details are not yet available [19][20]. - The company is actively developing new liquid cooling products in response to North American demand, indicating a proactive approach to market trends [23]. - The company’s growth in the automotive sector is expected to be a significant driver, with ongoing collaborations with major automotive manufacturers [24].