Investment Rating - The report assigns an "Accumulate" rating for the semiconductor equipment industry, indicating a positive outlook for the sector [2][17]. Core Insights - The report highlights that hybrid bonding solutions are becoming a critical breakthrough for AI chips and advanced packaging, with significant developments expected in the coming years [3][4]. - Applied Materials (AMAT) has acquired a 9% stake in Besi, viewing hybrid bonding as a strategic long-term investment, and both companies will collaborate on developing hybrid bonding solutions [3][4]. - The demand for hybrid bonding technology is projected to surge, particularly in the logic process field starting in 2022, with a second wave of demand anticipated in 2024 [4]. Summary by Sections Industry Overview - Hybrid technology is expected to begin mass production in the logic process field in 2022, with further adoption in the memory sector by 2025-2026 and in advanced packaging (AP) by 2027-2028 [4]. - By 2030, the demand for hybrid bonding equipment is estimated to reach around 1,400 units [4]. Company Developments - AMAT's acquisition of Besi shares is part of a long-standing partnership aimed at developing the industry's first fully integrated equipment solution for wafer-based hybrid bonding [4]. - Besi's equipment orders are expected to increase significantly in 2024, driven primarily by demand from AI applications [4]. Financial Performance - Besi is projected to achieve revenues of €607.5 million in 2024, reflecting a year-on-year increase of 4.9%, with a gross margin of 65.2% [4]. - The company's order intake is expected to rise to €586.7 million, a 7.0% increase year-on-year, largely due to the growing demand for AI application equipment [4]. Recommended Companies - The report recommends companies such as Tuojing Technology and Northern Huachuang for investment, highlighting their potential benefits from the hybrid bonding technology [4][9].

本报告导读： EMC 龙头强强联合，并购衡所华威打开成长空间。衡所华威是一家从事半导体芯片封装材料研发、生 产和销售的国家级专精特新"小巨人"企业，拥有Hysol 品牌及一百多个型号的产品，销售网络覆盖全球 主要市场。据Prismark 发布的统计数据，2023 年度，衡所华威在环氧塑封料行业按出货量居全国第 一、全球第三。华海诚科和衡所华威均以高性能类环氧塑封料为主，本次并购将有利于上市公司突破海 外技术垄断，整合标的公司研发体系，协同开展半导体封装材料工艺技术的迭代开发，快速取得高端封 装材料技术突破。 EMC 龙头企业华海诚科积极进行横向拓展，收购衡所华威将有利于公司实现研发能力快速提升，加快 取得高端封装材料技术突破。 风险提示：1、下游需求弱于预期；2、新产品导入不及预期；3、并购项目进展不及预期。 投资要点： 调评至"增持 "，目标价 81.22 元。我们预计公司 2025E-2026E 收入为 4.26、5.26 亿元，同增28%、 23%；归母净利润（扣非前）为0.50、0.65 亿元，同增24%、30%。公司当前对衡所华威的收购尚未完 成，故上述盈利预测并未计入并购影响。考虑到完成收购后，公 ...

Core Viewpoint - The advanced packaging sector in China's semiconductor industry is experiencing significant growth driven by technological advancements and increasing application demands, particularly in 2.5D/3D packaging, Chiplet technology, and System-in-Package (SiP) innovations [1] Financial Performance of Advanced Packaging Companies - Changdian Technology reported a revenue of RMB 35.96 billion for 2024, a year-on-year increase of 21.24%, with a net profit of RMB 1.61 billion, up 9.52% [2] - Tongfu Microelectronics achieved a revenue of RMB 23.88 billion, a 7.24% increase, and a net profit of RMB 678 million, soaring 299.90% [4] - Huatian Technology's revenue reached RMB 14.46 billion, marking a 28% growth, with a net profit of RMB 616 million, a significant increase of 172.29% [3] - Yongxi Electronics reported a revenue of RMB 3.61 billion, a 50.76% increase, and turned a profit with a net profit of RMB 67.1 million [5] - Guizhong Technology's revenue was RMB 1.96 billion, up 20.26%, but net profit decreased by 15.71% to RMB 313 million [5] - Jingfang Technology expects a net profit between RMB 240 million and RMB 264 million, reflecting a growth of 59.90% to 75.89% [6] Market Trends and Drivers - The advanced packaging market is recovering, with most companies reporting revenue growth between 20% and 50%, except for Guizhong Technology, which saw a decline in net profit [7] - The growth in revenue is attributed to increased demand in sectors such as data centers and automotive electronics, alongside the recovery of the semiconductor market [10] - Changdian Technology focuses on advanced technologies and key application markets, optimizing product structure and enhancing capacity utilization [7] - Tongfu Microelectronics has seen significant growth in automotive products, leveraging its technology advantages in industrial control and automotive applications [7] - Huatian Technology's revenue growth is supported by government subsidies, which contributed significantly to its profits [9] Capacity Expansion and Technological Advancements - Changdian Technology's advanced packaging capacity is fully utilized, prompting expansion efforts to meet customer demand [11] - Tongfu Microelectronics is implementing a multi-point layout strategy, enhancing its production capabilities across various locations [11] - Huatian Technology is progressing with new production bases and significant investment projects aimed at expanding its advanced packaging capacity [11] - Emerging advanced packaging projects are also making strides, with new facilities being established to enhance production capabilities [12] - Domestic advanced packaging companies are continuously iterating their technologies, with notable advancements in high-density packaging and chip integration [13]

Summary of Huada Jiutian Conference Call Company and Industry Overview - **Company**: Huada Jiutian - **Industry**: Electronic Design Automation (EDA) Key Points and Arguments - **Acquisition of Newhe Semiconductor**: Huada Jiutian acquired 100% of Newhe Semiconductor through a combination of cash and stock issuance, which is expected to enhance its competitive edge in the EDA market, particularly in system-level simulation for chips [3][4] - **Market Positioning**: The acquisition marks the beginning of a large-scale merger and acquisition cycle for Huada Jiutian, aimed at addressing its development gaps as the only EDA platform in China [3][4] - **Technological Trends**: The integrated circuit design is entering a post-Moore's Law era, where advanced packaging is crucial for increasing chip integration. Multi-physical field simulation technology is becoming essential in EDA tools to address challenges posed by chip integration [5][6] - **Challenges in SOC Design**: Huada Jiutian faces significant challenges in SOC design and chip manufacturing, including complex function decomposition, inter-chip connectivity, and advanced packaging issues [9] - **Market Growth Potential**: The domestic EDA market is projected to reach 16 billion RMB by 2030, with Huada Jiutian's localization rate expected to increase to 50%-70%, indicating a potential market capitalization of over 100 billion RMB [3][15] - **IP Business Development**: Huada Jiutian has the potential to develop its IP business, especially after establishing a leading position in the digital EDA market, which could become a new growth driver [3][16] - **Valuation Logic**: The high valuation of Huada Jiutian is supported by its strong market position and growth potential, with a projected PS ratio of 15-20 times based on future market conditions [11][14] - **Future M&A Plans**: The acquisition of Newhe Semiconductor signals the start of a broader M&A strategy, aimed at enhancing key capabilities and achieving a market valuation of 100 billion RMB [17] Additional Important Insights - **Collaboration with International Giants**: Huada Jiutian has partnered with international companies like Xindasi to launch a comprehensive 3D advanced packaging design analysis EDA platform, reinforcing its industry leadership [7][8] - **Technological Achievements**: The company has received national awards for its technological advancements, further solidifying its position in the domestic EDA industry [8] - **Impact of US-China Relations**: The current geopolitical climate is influencing market liquidity and sentiment, which in turn affects Huada Jiutian's revenue growth [12] This summary encapsulates the critical insights from the conference call, highlighting Huada Jiutian's strategic moves, market positioning, and future growth potential within the EDA industry.

Core Viewpoint - The semiconductor outsourcing packaging and testing company, Huada Technology, has experienced significant growth in its performance due to the recovery in demand for electronic terminal products and increased order volumes [1][2]. Financial Performance - In 2024, Huada Technology achieved a revenue of 14.46 billion yuan, representing a year-on-year increase of 28% [1][2]. - The net profit for the same period was 616 million yuan, showing a remarkable growth of 172.29% [1][2]. - The company successfully turned around its non-recurring net profit from a loss of 30.8 million yuan in the previous year to a profit of 33.42 million yuan, marking a year-on-year increase of 110.85% [2]. - In Q4 2024, the company reported a revenue of 3.93 billion yuan, up 21.7% year-on-year, and a net profit of 259 million yuan, an increase of 80.7% [2]. Production and Capacity Expansion - Huada Technology completed the packaging of 57.514 billion integrated circuits in 2024, a year-on-year increase of 22.56% [3]. - The company also packaged 1.7642 million wafer-level integrated circuits, which is a growth of 38.58% compared to the previous year [3]. - The total assets of Huada Technology reached 38.24 billion yuan by the end of 2024, reflecting a growth of 13.3% from the previous year [3]. Investment in Advanced Packaging - The global advanced packaging market is projected to grow from 37.8 billion USD in 2023 to 69.5 billion USD by 2029, with a CAGR of 10.7% [4]. - Huada Technology is investing in advanced packaging capacity, including a 3 billion yuan project for its subsidiary in Jiangsu, which is set to partially commence production in 2025 [4]. - A second phase of the advanced packaging industry base in Nanjing is under construction with an investment of 10 billion yuan, expected to be completed by 2028, aiming for an annual output value of 6 billion yuan [4]. - An investment of 4.8 billion yuan for upgrading the automotive electronics production line is also underway, projected to generate an additional sales revenue of 2.159 billion yuan annually [4]. Research and Development - Huada Technology has consistently increased its R&D investment, with cumulative R&D expenses reaching 2.345 billion yuan from 2022 to 2024 [5][6]. - In 2024, the company made significant progress in advanced packaging technology, completing the construction of a 2.5D production line and achieving customer certification for FOPLP technology [6]. - The company was granted 29 patents in 2024, including 26 invention patents, indicating a strong commitment to technological innovation [6].

Core Viewpoint - The article discusses the recent skepticism regarding the necessity of semiconductor equipment for chip production, particularly in the context of 3nm chips, and highlights the strategic advancements of North China Innovation in the semiconductor equipment market [1][2]. Group 1: Company Overview - North China Innovation Technology Group Co., Ltd. was established in September 2001 and listed on the Shenzhen Stock Exchange in 2010, focusing on high-end integrated circuit equipment [1]. - The company aims to accelerate its strategic transformation towards new manufacturing, becoming a trusted leader in semiconductor foundational products, and contributing to China's vision of becoming a manufacturing powerhouse [1]. Group 2: Product and Market Development - North China Innovation's main products include etching equipment, thin film deposition equipment, thermal treatment equipment, precision electronic components, cleaning equipment, and equipment related to new energy such as single crystal silicon growth furnaces [2]. - The company recently announced the acquisition of Chip Source Micro, specializing in coating, developing, and cleaning equipment, to achieve product and technology synergy [2]. - The launch of the first 12-inch electroplating equipment, Ausip T830, marks North China Innovation's entry into the electroplating equipment market, providing a complete interconnection solution in advanced packaging [2]. - The company also announced its entry into the ion implantation equipment market with the release of the Sirius MC 313, covering nearly all semiconductor front-end manufacturing equipment except for lithography [2].

Core Viewpoint - TSMC has established a dominant position in advanced semiconductor processes, while Intel faces significant operational challenges. The former TSMC R&D leader, Jiang Shangyi, expressed pride in TSMC's achievements post-retirement, highlighting the key factors behind the competition between TSMC and Intel [1][3]. Group 1: TSMC vs. Intel - Jiang Shangyi noted that Intel was historically the leader in semiconductor technology but failed to maintain its competitive edge, leading to TSMC's rise. He humorously remarked that he should have delayed his retirement to witness this success [3]. - The shift in competitive dynamics is attributed to Intel's focus on maintaining technology leadership without considering cost efficiency, while TSMC has consistently sought to reduce costs, making it difficult for Intel to compete on price [3][4]. Group 2: Recommendations for Intel - Jiang suggested that Intel should consider merging with a company that excels in mature processes but struggles in advanced processes to enhance its competitiveness. He implied that companies like UMC and GlobalFoundries could be potential candidates for such a merger [3]. - He emphasized that Intel's current priority should be to regain technology leadership, which he believes is achievable [3]. Group 3: Manufacturing Challenges - The high manufacturing costs in the U.S. compared to Taiwan hinder Intel's competitiveness, particularly as an Integrated Device Manufacturer (IDM) [4]. - Intel's traditional model of "copy exactly" limits its ability to innovate in production processes, while TSMC focuses on improving production efficiency and yield, providing better value to customers [4].

Core Viewpoint - NVIDIA's next-generation Rubin AI architecture will utilize the company's first SoIC packaging, indicating a significant shift in the hardware market with the integration of advanced components like HBM4 [1][5] Group 1: SoIC Packaging Development - TSMC is rapidly constructing factories in Taiwan to shift focus from advanced packaging (CoWoS) to SoIC, with expectations for NVIDIA, AMD, and Apple to release next-generation solutions based on this design [1][2] - SoIC allows for the integration of different chips, reducing internal circuit layout space and lowering costs, with AMD being an early adopter and Apple expected to follow with its M5 chip [2][3] - TSMC's SoIC production capacity is projected to reach 15,000 to 20,000 wafers by the end of this year, with plans to double that capacity next year [2][6] Group 2: NVIDIA's Rubin Architecture - The Rubin GPU will separate the GPU and I/O die, utilizing N3P and N5B processes respectively, and will integrate these components using SoIC packaging [2][5] - The Vera Rubin NVL144 platform is expected to deliver up to 50 PFLOPS of FP4 performance with 288 GB of HBM4 memory, while the NVL576 will provide up to 100 PFLOPS and 1 TB of HBM4e capacity [5] Group 3: Workforce and Production Adjustments - TSMC plans to adjust its workforce from 8-inch fabs to support advanced packaging facilities, aiming to recruit 8,000 new employees this year to reach a target of 100,000 [3] - The company is actively preparing for the integration of SoIC technology, which is seen as crucial for future developments in semiconductor packaging [3][6]

Core Viewpoint - TSMC, referred to as the "guardian mountain" of Taiwan, plays a crucial role in the economic and technological development of Taiwan, symbolizing its achievements in the semiconductor industry [2][3]. Group 1: TSMC's Role and Impact - TSMC was established in 1987 and pioneered the foundry model, quickly becoming a leader in the global semiconductor industry [2]. - The company's rapid advancements in logic process technology are largely attributed to the dedication of its engineers, who work tirelessly to push R&D efforts forward [3]. - TSMC's overseas expansion has raised concerns about technology leakage and regional security, despite its contributions to Taiwan's economic growth and technological image [3][4]. Group 2: Semiconductor Manufacturing Challenges - TSMC's manufacturing facilities include a research center, a main factory, several high-volume manufacturing plants, and advanced packaging facilities, making it a model of a comprehensive semiconductor ecosystem [4][5]. - The manufacturing process involves complex roles and modules, including lithography, etching, thin films, and diffusion, requiring precise management of the overall process [6][7]. - Engineers face a demanding work environment, often needing to be on call 24/7, which poses challenges to work-life balance [7][8]. Group 3: Corporate Culture and Recruitment - TSMC's corporate culture is influenced by Confucian values, emphasizing discipline, professionalism, and integrity, while adapting to cultural differences in global operations [10]. - The company plans to recruit approximately 8,000 new employees, with an average annual salary of 2.2 million New Taiwan Dollars for master's degree holders [11]. - TSMC's recruitment efforts also include a summer internship program aimed at undergraduate students, with high-performing interns potentially receiving job offers [11]. Group 4: Key Aspects of Semiconductor Foundries - Knowledge transfer and technical legacy are critical, as new engineers rely on mentorship from experienced colleagues to gain practical skills [31]. - System integration in foundries requires extensive experience and data analysis capabilities to create a seamless manufacturing system [32]. - The high-pressure work environment necessitates effective talent retention strategies, especially as TSMC expands its operations internationally [33]. Group 5: Production Optimization and Market Dynamics - Maximizing yield and capacity utilization is essential for foundries, as each process step is interconnected, impacting overall production efficiency [34]. - Pricing strategies directly affect profitability, with aggressive pricing from competitors like China putting pressure on global pricing [36]. - Advanced packaging is becoming a key trend in the industry, with TSMC investing in facilities to support cutting-edge processes [39].

Core Viewpoint - The demand for ultra-thin wafers is increasing due to the transition from planar SoC to 3D-IC and advanced packaging, which enhances performance and reduces power consumption [1][18]. Group 1: Thin Wafer Processing - The total thickness of HBM modules, which include 12 DRAM chips and basic logic chips, is still less than that of high-quality silicon wafers [1]. - Thin wafers play a crucial role in fan-out wafer-level packaging and advanced 2.5D and 3D packaging for AI applications, which are growing faster than mainstream ICs [1]. - The processing of ultra-thin wafers requires careful decisions regarding temporary bonding adhesives, carrier wafers, and debonding processes [1][3]. Group 2: Challenges in Wafer Thinning - Engineers face challenges in preventing defects or micro-cracks, especially at the wafer edges, which can significantly impact yield [10]. - The thinning process involves a balance of grinding, chemical mechanical polishing (CMP), and etching to meet strict total thickness variation (TTV) specifications [8]. - The most common TSV architecture in silicon features a diameter of 11 micrometers and a depth of 110 micrometers, with a barrier metal and oxide insulation layer occupying 1 micrometer of that diameter [9]. Group 3: Temporary Bonding and Debonding - The industry is refining thinning steps, adhesives, and debonding chemicals, with temporary bonding typically performed under vacuum thermal compression or UV exposure [3][7]. - Glass and silicon carrier wafers are both used, with glass being popular due to its thermal expansion coefficient (CTE) compatibility with silicon [5]. - Mechanical debonding methods are preferred for thinner wafers, as they allow for lower stress levels and better thermal budgets [15]. Group 4: Adhesive Properties and Requirements - Ideal adhesives should bond at low temperatures and withstand high-temperature processing without degrading performance [7]. - The adhesive's uniformity in thickness is critical, as any inconsistency can lead to uneven back grinding and processing challenges [7][8]. - The choice of adhesive is influenced by temperature stability, with some materials capable of withstanding temperatures up to 350°C [7]. Group 5: Yield and Reliability - Chip manufacturers are seeking customized solutions for specific device types, emphasizing the need for tool reliability and process repeatability [2]. - The industry is focused on achieving high yield and reliability in producing ultra-thin devices with thicknesses below 50 micrometers [18]. - The management of back and edge defects is essential for maintaining yield, with selective plasma etching and CVD being employed to mitigate edge defects [10][11].