曾经因80亿注册资本轰动行业、又在2024年底陷入欠薪停摆风波的博瑞晶芯，近期似乎正悄 然回归。 有博瑞晶芯的前员工告诉我们，引进了新投资的博瑞晶芯已经给他们补上了之前拖欠的工 资。也有供应商透露，博瑞晶芯已经结清了此前的欠款。 天眼查信息显示，珠海新质生产力基金等机构已于近期正式完成对博瑞晶芯的入股，这也意 味着博瑞晶芯正式获得了珠海国资的战略支持。 过去几年，芯片行业经历了一波大起大落，有不少曾被寄予厚望的初创企业从惊艳亮相走向 了一蹶不振甚至倒闭，能实现V字回归的屈指可数。博瑞晶芯能成为少数突围的幸运儿吗？这 又是否代表着众多ARM CPU厂商乃至大芯片赛道正在迎来新转机？ 芯片创业浪潮，ARM玩家崛起 自2014年大基金出台，中国就兴起了一股芯片创业潮。尤其在2019年美国将华为加入黑名单后， 本土芯片创业潮双倍加速。从魏少军教授过去几年在ICCAD上发布的数据，我们可以一窥国内的 芯片热。 统计数据显示，2019年，全国共有1780家芯片设计企业，比2018年增长了4.8%；进入2020年，中 国芯片设计企业增加到2218家，同比增长了24.6%；2021年再度增长26.7%到2810家。而截止到 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 近日，经济合作与发展组织(OECD：Organisation for Economic Co-operation and Dev elopment ) 发布了一份名为（THE CHIP LANDSCAPE：GEOGRAPHICAL DISTRIBUTION OF WAFER FABRICATION CAPACITY）的报告。 报告中，他们基于其了解，分享了其对全球晶圆厂产能的数据统计。现在，我们将其摘译如 下，分享给读者。需要声明的是，由于本文讨论的数据基于对SEMI、TechInsights数据和案 头研究的分析而得出的部分结论。 鉴于上文所述的数据局限性，我们应谨慎解读这些结论。 因工艺节点而异的生产能力的地理分布 图 1 显示了五个晶圆产能最高的经济体（即中华人民共和、中国台湾、韩国、日本和美国）在七 个不同工艺节点密度范围内（详见方框 1）的在产晶圆产能（不包括即将投产的晶圆厂的产能）的 地理分布。截至 2025 年 9 月，这五个经济体合计占全球在产晶圆产能的 87%。 图 1 展示了不同经济体工艺节点组合的差异。例如，韩国的晶圆产能高度集中，近 80% 的 ...

Financing Overview - A total of 20 financing events occurred in Shanghai from December 15 to December 21, with 7 disclosing amounts totaling approximately 1.171 billion yuan [3] - This period saw a decrease of 2 financing events compared to the previous week, which had 22 events [3] Company Dynamics - Moudian Intelligent won the highest award at the National Disruptive Technology Innovation Competition on December 12 [2] - Maikang Smart secured the first prize at the "Huawei Cloud Cup" 2025 AI Application Innovation Competition on December 17 [2] - Jieti Medical was selected for the "2025 China Sci-Tech Innovation Good Company" list by Zhito Finance on December 18 [2] - Jeno Bio's "Gong'anli®" successfully obtained registration in Thailand on December 20 [2] Industry Focus - The Shanghai Open Processor Industry Innovation Center was officially launched in the RISC-V Ecological Block on December 15 [2] - Muxi Co., a Zhangjiang enterprise, was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on December 17 [2] - A team from Shanghai Jiao Tong University's Integrated Circuit Institute developed the all-optical computing chip LightGen on December 21 [2] Financing by Region - Nine districts in Shanghai experienced financing events, with Pudong New District having the highest number at 9 events, followed by Xuhui District with 3 events [5] Financing by Round - The majority of financing rounds were Series A, with 8 occurrences, followed by 6 angel rounds [5] Financing by Industry - The artificial intelligence sector led with 6 financing events, followed by the healthcare sector with 4 events [7] Notable Financing Events - Jeno Bio completed over 200 million yuan in Series B financing on December 16, led by Huagai Capital [10] - Anlingke Bio secured nearly 50 million USD in A+ round financing on December 16, with investments from multiple firms [12] - Fangqing Technology completed over 500 million yuan in angel+++ and Pre-A round financing on December 16 [14] - Yuanma Zhiyuan completed angel+ round financing on December 15, exclusively invested by Yifeng Capital [16] Industry Highlights - Five financing events related to the artificial intelligence industry occurred, with three involving AIGC [18] - Three financing events in the integrated circuit industry included two in EDA and one in logic chips [18] - The successful listing of Muxi Co. set a benchmark for the commercialization of domestic high-end chips [18] - The development of the LightGen chip provides a new method to address the computational power gap in generative AI deployment [18] - The Shanghai Open Processor Industry Innovation Center aims to strengthen policy guidance and ecological cultivation for the integrated circuit industry [18]

这样一幕令人惊叹。 随着摩尔线程、沐曦相继上市，科创板短短半个月内一举诞生两个3000亿市值IPO，创投圈为之沸腾。在此之前，寒武纪、海光信息市值均一度突破6000 亿元。至此，中国"算力四贵"合计市值已超1.6万亿元。 鲜少有人注意到，梳理寒武纪、海光信息、摩尔线程、沐曦背后，意外浮现着一个共同的身影——联想创投。复盘下来，能做到独中四元的投资机构，似 乎就只有联想创投一家。 这是中国算力崛起叙事当中的一个惊喜片段。感叹于此，我们尝试去还原这段几近被忽略的投资往事。 从寒武纪到沐曦 联想创投，独中四元 回过头看，联想创投这几笔投资在当时都投在了"寂寞无声处"。 时间回到2017年，正值移动互联网的风口，芯片算力赛道几乎无人问津，鲜少有投资人会专注于此。但彼时刚成立不久的联想创投却是一个例外——当时 他们根植于联想集团"端-边-云-网-智"新IT战略，将AI算力视为智能世界的"心脏"，判断应用导向的大计算将会使得未来十年对算力需求仍然有百倍增 长。 出手寒武纪始于一个下午。投资界曾记录这段往事：2017年，联想创投总裁、创始合伙人贺志强在中国科学院第一次见到陈天石，"话不多，典型的技术 天才气质。" 经过几次 ...

先是身披 " 国产 GPU 第一股 " 光环的摩尔线程登陆科创板，上市首日股价最高涨超 500% 至 688 元 / 股，市值一度突破 3000 亿元；紧随其后的沐曦表现更是亮眼，开盘即报 700 元 / 股，市值直接站上 3500 亿元关口。 成为千亿捕手需要什么投资逻辑？ 作者丨 王满华 来源丨 投中网 若论近期一二级市场的关注焦点，AI芯片赛道无疑独占鳌头。 将投中网设为"星标⭐"，第一时间收获最新推送 如此显著的赚钱效应摆在公众面前，人们自然好奇：谁是这波红利的受益者？我也不能免俗地梳理了一番，结果发现一个有趣 的现象：尽管两家公司背后的投资机构多达数十家，但同时押中二者的却寥寥无几。 这其实不难理解。一方面，早期 VC 向来有 " 只押龙头 " 的习惯，况且在 2024 年底之前， "IPO 不确定性 " 始终是横亘 在这个领域的一道现实难题；另一方面，两家公司的估值一直不低，份额争抢也相当激烈。对多数机构而言，能投进其中一家 已属不易。 不过， 我也发现了一个例外 —— 联想创投。尤为值得一提的是，这家机构不仅同时斩获了摩尔线程和沐曦股份的 IPO 红 利，更是在寒武纪、海光信息这两家先行上市的 ...

Qualcomm has concluded the acquisition of Alphawave Group, known as Alphawave Semi, for an implied enterprise value of around $2.4bn (£1.79bn). The company reported that the transaction was completed a quarter ahead of schedule. Announced in June 2025, the deal was originally expected to close in the first quarter of 2026. Tony Pialis, CEO and co-founder of Alphawave Semi, will lead Qualcomm’s data centre business. Pialis said: “Joining Qualcomm marks an exciting new chapter for Alphawave Semi. “We a ...

Core Insights - The Chinese semiconductor industry is experiencing a significant transformation, marked by the successful IPOs of domestic GPU companies such as MuXi and Moer Thread, reflecting a collective investor sentiment towards "computing power autonomy" [1][2] - The value focus in the semiconductor sector is shifting from centralized computing power to "ubiquitous intelligence," indicating a profound change in the IoT semiconductor landscape [1] Group 1: Current Trends - The listings of MuXi and Moer Thread occur during a unique time when AI applications are rapidly emerging, making computing power a fundamental resource [2] - The expansion of computing power is moving from data centers to edge and terminal devices, driven by the maturation of AI technology and decreasing costs [3][4] Group 2: Predictions for IoT Semiconductor Industry - Prediction 1: The integration of edge AI will accelerate, leading to widespread application of IoT devices equipped with edge AI capabilities by 2026 [7] - Prediction 2: Modular design (Chiplet) and open architecture (RISC-V) will see significant growth, allowing for more flexible and cost-effective chip designs [10][11] - Prediction 3: Carbon footprint tracking will become a critical design constraint, alongside performance, power consumption, and cost [12][13] - Prediction 4: Localized production of IoT chips will increase, driven by government incentives and the need for supply chain security [16][17] - Prediction 5: AI will evolve from a supportive tool to a co-pilot in the design process, automating routine tasks and allowing engineers to focus on higher-level decisions [18][19] - Prediction 6: Security design will transition from an optional feature to a regulatory requirement, necessitating built-in hardware protections [20][21] Group 3: Strategic Recommendations - For chip design companies: Shift focus from parameter competition to scenario differentiation and evaluate the availability of lightweight NPU reserves [24] - For equipment manufacturers (OEMs): Avoid reliance on cloud-based intelligence and seek SoC suppliers that support edge inference capabilities [27] - For industry investors: Look for companies providing AI EDA plugins, compliance automation tools, and Chiplet interconnect IP, as they are likely to be the winners in the upcoming market [29] Group 4: Future Landscape - The semiconductor industry's value will transition from "peak computing power" to "intelligent density per unit energy consumption" and "lifecycle security compliance" [31] - The global semiconductor supply chain will evolve from a unipolar dominance to a multipolar coexistence, emphasizing the importance of regional chip ecosystems [32]

资料显示，芯来科技的RISC-V IP业务在中国本土处于领先地位，拥有全系列RISC-V CPU IP矩阵和领 先的车规IP产品，在全球已授权客户超300家。通过本次交易，芯原股份计划进一步完善IP储备并强化 在RISC-V领域的布局。 但是12月12日，芯原股份公告终止本次重组。对于终止原因，公司介绍，在推进各项工作过程中，标的 公司管理层及交易对方提出的核心诉求及关键事项与市场环境、政策要求及公司和全体股东利益存在偏 差；公司收到了标的公司管理层及交易对方终止本次交易的通知。 日前，芯原股份董事长戴伟民在合肥举行的上市公司高质量发展大会上表示，半导体并购最大的挑战是 标的估值问题，即卖方对估值预期太高致使谈不拢，成为并购方案失败的原因。对此戴伟民建议，可以 针对不同融资轮次进行差异化定价，让后期进入的投资人可以以本金或者"本金+利息"方案退出，但早 期投资人和标的创始人也需要做出适当的估值让步；另外，可以针对较高收购估值的标的，设定合理的 对赌及相应的补偿安排，以及根据业绩目标完成情况，分期支付收购的股份或价款。 证券时报记者阮润生 近日，半导体领域多起并购搁浅。12月18日，芯原股份（688521）就终 ...

格隆汇12月18日｜芯原股份(688521.SH)发布投资者关系活动记录表，终止收购芯来智融97%股权事项 不会对公司正常业务开展和生产经营活动造成不利影响。未来公司将继续强化在RISC-V领域的布局； 作为芯来智融的股东，公司将与其保持并深化合作关系。目前，集成了芯原NPU IP的人工智能（AI） 类芯片已在全球范围内出货近2亿颗。目前，公司已为某知名新能源汽车厂商提供基于5nm车规工艺制 程的自动驾驶芯片定制服务，正在积极推进智慧出行领域Chiplet解决方案平台研发。基于上述技术布 局，芯原正在与一系列汽车领域的关键客户进行深入合作。 ...

芯原股份 20251214 摘要 芯原以 2000 万元注册资本和 3.5 亿元现金获得竹电半导体 2.11%股份， 共同投资方包括大基金三期等知名机构。投资后，芯原持股 40%成第一 大股东，取得控制权，强化视觉处理技术优势，提升端侧和云侧 AI 芯片 市场竞争力。 终止对新莱的并购，但芯原仍将强化在 RISC-V 领域的布局，并保持与 新莱的合作关系，同时扩大与其他 RISC-V IP 供应商的合作，以推动该 领域的发展，战略目标未变。 2025 年第三次降息是自 2024 年 9 月以来的第六次降息，为行业带来 利好，但未来一年内可能出现加息，企业需做好准备，关注日本货币政 策调整，预计 2026 年市场环境将继续向好。 与谷歌合作开源 Coral NPU 项目（0.27B 参数），旨在推动生态系统发 展，为开发者提供免费资源，采用 RISC-V 架构，吸引更多客户并促进 技术普及，商业支持由 Verisign 提供。 高通收购 RISC-V 高性能公司表明 RISC-V 产业前景广阔，芯原仍致力于 推动 RISC-V 发展，相信该架构将在未来取得更大市场份额，与高通和 三星的 ARM 客户关系不受影响 ...