提升服务效率 项目快速落地 省政府工作报告提出，推动产业投资、民间投资稳定增长，精准务实招商引资。如何进一步优化营商环 境、提升服务水平，吸引更多大项目、好项目落地生根开花结果？代表委员围绕农产品精深加工、绿色 铝及新能源电池、高端文旅等重点产业建言献策。 ●一线实景● 在昆明鹏瑞利健康城的颐养院活动区，不少旅居老人正在挥毫泼墨。依托鹏瑞利医养结合的优势，他们 既能享受专业康养服务，也能参与老年大学的各种特色课程，丰富精神生活。自2024年12月开业以来， 颐养院已接待近200位长者入住，成为云南优化营商环境、推动重大项目落地见效的一个缩影。 昆明鹏瑞利健康城项目的稳步推进，体现了"云南服务"的效率与温度。项目医疗财务经理于介俊介绍， 运营初期，企业就得到多部门联动响应与精准指导，确保各项优惠政策的及时兑付。在高效服务的护航 下，项目各板块陆续投入运营：2025年7月，设有316张床位的护理院开始接诊；10月，规划502张床位 的康复医院正式开诊。2026年4月，拥有500张床位的综合医院也将试营业，项目落地全周期均得到有力 支撑。 该项目的成功运营，为旅居者提供了医养结合的一站式解决方案，同时以实实在在的产 ...

华金证券发布研报称，AI服务器与汽车电子正推动PCB市场规模增长与技术升级，高端产品向高密度、 轻薄化及高频高速基材方向发展。核心覆铜板所需的高端铜箔、电子布与特种树脂等关键材料需求提 升，目前国内厂商正加速技术突破与供应链渗透。 华金证券主要观点如下： 风险提示：宏观经济及需求波动风险；新技术新产品产业化风险；原料供应及价格波动风险；安全环保 风险；贸易冲突及汇率风险。 填料硅微粉高端化，专用化学品追赶 PCB升级带动硅微粉产品迭代，球形硅微粉或更符合高端需求，截至2024年我国硅微粉市场规模为17.3 亿元，需求量为41.8万吨，其中高性能球形硅微粉市场规模8.52亿元，占比49.22%。此外，该行预期 PCB专用化学品随PCB发展市场不断扩大，外资主导市场，国内加速追赶。 投资建议：AI驱动PCB升级，材料迎发展良机，建议关注铜箔-铜冠铜箔、德福科技、诺德股份、中一 科技、隆扬电子；电子布-菲利华、平安电工、莱特光电、石英股份、宏和科技、中材科技、国际复 材、中国巨石、长海股份、山东玻纤、博菲电气；树脂-东材科技、圣泉集团、同宇新材、世名科技、 宏昌电子；硅微粉-联瑞新材、雅克科技、国瓷材料、凌玮科技； ...

Investment Rating - The report maintains an "Outperform" rating for the industry [1]. Core Insights - The development of AI is driving upgrades in PCB technology, leading to increased demand for upstream materials. The global PCB market is expected to reach USD 96.8 billion by 2025 [3]. - The three main materials—copper foil, electronic cloth, and resin—are undergoing expansion and upgrades. High-end copper foil is becoming mainstream, with foreign companies dominating the high-end market while domestic firms gradually enter the supply chain [3]. - The market for silicon micro-powder is expected to grow, with high-performance spherical silicon micro-powder projected to reach a market size of RMB 850 million by 2024, accounting for 49.22% of the total market [3]. - Investment opportunities are highlighted in various segments, including copper foil (e.g., Tongguan Copper Foil, Defu Technology), electronic cloth (e.g., Feilihua, Ping An Electric), resin (e.g., Dongcai Technology), silicon micro-powder (e.g., Lianrui New Materials), and PCB chemicals (e.g., Guangxin Materials) [3]. Summary by Sections AI-Driven PCB Upgrades - The PCB industry is experiencing significant growth due to AI technology and the rise of electric vehicles, with a notable increase in demand for AI servers and automotive electronics [3]. - The trend towards high-density, small aperture, large capacity, and lightweight PCBs is evident, necessitating higher performance from upstream materials [3]. Expansion of Three Main Materials - High-end copper foil demand is on the rise, with HVLP-type copper foil expected to become the mainstream product. Foreign companies currently dominate this segment [3]. - Electronic cloth is becoming thinner and lighter, with domestic companies increasing their investments in high-end electronic cloth [3]. - The performance of copper-clad laminates is largely determined by the resin formulation, with a shift from epoxy resin to more advanced materials [3]. High-End Silicon Micro-Powder and Specialty Chemicals - The upgrade of PCBs is driving the iteration of silicon micro-powder products, with a focus on spherical silicon micro-powder to meet high-end demands [3]. - The market for PCB specialty chemicals is expanding, with foreign companies currently leading while domestic firms accelerate their development [3]. Investment Recommendations - The report suggests focusing on companies involved in copper foil, electronic cloth, resin, silicon micro-powder, and PCB chemicals, highlighting specific firms in each category [3].

Investment Rating - The report maintains an "Outperform" rating for the industry [1]. Core Insights - The development of AI is driving upgrades in PCB technology, leading to increased demand for upstream materials. The global PCB market is expected to reach USD 96.8 billion by 2025 [3]. - The three main materials—copper foil, electronic cloth, and resin—are undergoing expansion and upgrades, with high-end copper foil becoming mainstream [3]. - The market for silicon micro-powder is expected to grow, with high-performance spherical silicon micro-powder projected to reach a market size of RMB 850 million by 2024, accounting for 49.22% of the total demand [3]. - Investment opportunities are highlighted in various sectors, including copper foil, electronic cloth, resin, silicon micro-powder, and PCB chemicals [3]. Summary by Sections AI-Driven PCB Upgrades - PCB is essential in modern electronic products, with significant demand growth driven by AI technology and electric vehicles. The industry is expected to expand further [3][30]. - The trend towards high-density, small aperture, large capacity, and lightweight PCBs is evident, necessitating higher quality upstream materials [3]. Main Materials Expansion - High-end copper foil demand is increasing, with foreign companies dominating the high-end market while domestic firms are gradually entering the supply chain [3]. - Electronic cloth is becoming thinner and lighter, with domestic companies increasing their investments [3]. - The resin market is evolving from epoxy resin to more advanced materials, enhancing the performance of copper-clad laminates [3]. Silicon Micro-Powder and Specialty Chemicals - The upgrade of PCBs is driving the iteration of silicon micro-powder products, with a notable market for high-performance spherical silicon micro-powder [3]. - The market for PCB specialty chemicals is expanding, with foreign companies currently leading but domestic firms accelerating their development [3]. Investment Recommendations - The report suggests focusing on companies in various segments: - Copper Foil: Copper Crown, Defu Technology, Nord Shares, Zhongyi Technology, Longyang Electronics - Electronic Cloth: Feili Hua, Ping An Electric, Lite Optoelectronics, Quartz Shares, Honghe Technology, China National Materials, International Composites, China Jushi, Changhai Shares, Shandong Fiberglass, Bofei Electric - Resin: Dongcai Technology, Shengquan Group, Tongyu New Materials, Shiming Technology, Hongchang Electronics - Silicon Micro-Powder: Lianrui New Materials, Yake Technology, Guoci Materials, Lingwei Technology - PCB Chemicals: Guangxin Materials, Guanghua Technology, Sanfu New Materials, Jiuri New Materials, Yangfan New Materials [3].

Group 1 - The core investment involves a total of 925 million yuan, with ICBC Investment contributing 725 million yuan and Xingyin Investment contributing 200 million yuan, aimed at supporting the semiconductor materials sector [1] - The investment targets Chengdu Kemeite Special Gas Co., Ltd., a core subsidiary of Yake Technology, to enhance its capacity expansion and technological upgrades [1] - Yake Technology has established itself as a leading platform in the new materials sector in China, covering high-barrier areas such as semiconductor precursors, photoresists, electronic special gases, silicon micropowder, and LNG composite materials [1] Group 2 - The collaboration between ICBC Investment and Xingyin Investment exemplifies the role of state-owned banks in empowering the real economy and highlights the achievements of joint investment strategies in supporting high-quality development of emerging industries [2] - This partnership is the first investment signed by a financial asset investment company of a joint-stock bank in Jiangsu Province, showcasing the integration of finance and industry [2] - Future efforts will focus on the "465" modern industrial cluster construction, providing comprehensive financial services to technology-driven enterprises and fostering the development of new productive forces in Wuxi [2]

Core Viewpoint - The semiconductor packaging materials industry is expected to experience a rise in both volume and price driven by advanced packaging and storage demand, with significant opportunities for domestic production [1] Group 1: Epoxy Molding Compound (EMC) - EMC is a key encapsulation material in semiconductor packaging, with low domestic production rates estimated at only 10-20% for high-performance EMC [2] - The price of advanced packaging EMC can be 5-6 times higher than high-performance EMC and over 10 times that of basic EMC [2] - The transition from DRAM to HBM by companies like SK Hynix highlights the increasing demand for advanced EMC technologies [2] Group 2: Silicon Micron Powder - Silicon micron powder is a critical raw material for EMC, with significant procurement shares in companies like Hengsuo Huawai [3] - Low-alpha spherical aluminum effectively addresses challenges in high-density stacked packaging in the storage sector, with low levels of radioactive elements [3] Group 3: Substrate Upstream Materials - Low-CTE electronic cloth is a crucial supply bottleneck in the substrate segment, with lead times extending to 16-20 weeks due to raw material shortages [4] - The global market for carrier copper foil, primarily monopolized by Japanese firms, is valued at approximately 5 billion, with increasing demand driven by AI technology and advanced chip requirements [4] - Domestic supply chain localization is accelerating, which may benefit the domestic replacement process for carrier copper foil [4]

Investment Rating - The investment rating for the company is "Buy" (maintained) [1] Core Insights - The company's Q3 performance met expectations, with revenue of 6.467 billion yuan (YoY +29%) and a net profit of 796 million yuan (YoY +6%). The storage industry is entering a high prosperity cycle, and core businesses such as precursors are expected to continue accelerating [6][5] - The demand for storage is anticipated to increase significantly due to the acceleration of AI infrastructure, with a more steep and sustained demand curve expected in the future [6] - The company is positioned to benefit from the growing demand for electronic materials, with significant growth in various product lines, including precursors and silicon powder [6] Financial Data and Profit Forecast - Total revenue is projected to reach 8.816 billion yuan in 2025, with a year-on-year growth rate of 28.5%. The net profit attributable to the parent company is expected to be 1.117 billion yuan, reflecting a growth rate of 28.2% [5][7] - The gross profit margin for Q3 was 32.78%, with a net profit margin of 13.49%. The company has been increasing its R&D investment, with R&D expenses for Q3 amounting to 97 million yuan [6] - The company's return on equity (ROE) is projected to improve from 10.2% in 2025 to 18.8% by 2027 [5]

Core Viewpoint - The article discusses the differences between quartz powder and silica micro powder, including their production methods, physical and chemical properties, and application fields. Group 1: Definitions and Production - Quartz powder is a coarser form of SiO2 obtained by crushing quartz ore, while silica micro powder is a finer form produced through grinding or chemical methods to achieve high purity [1] - Micro silica, also known as silica fume, is a byproduct of industrial processes, specifically from the collection of smoke dust in smelting plants, containing about 90% SiO2 [3] - White carbon black is produced through chemical methods and can achieve a purity of up to 99% with particle sizes ranging from 10 to 20 nm [3] Group 2: Historical Context - The earliest silica micro powder originated from dust collected from steel plant chimneys, primarily used in the refractory materials industry in the early 1990s [4] - In the late 1990s, the rapid development of the electronic circuit board industry in China led to the ultra-fine purification of quartz powder, which became known as silica micro powder [5] Group 3: Physical and Chemical Properties - Both silica micro powder and quartz powder are fine materials with particle sizes typically below 1 micron, but they differ in physical properties; silica micro powder is lighter and less dense, while quartz powder is denser [7] - Chemically, silica micro powder is a form of SiO2 with a non-crystalline structure and many active surface groups, whereas quartz powder is made from crushed crystalline quartz [7] Group 4: Application Fields - Silica micro powder is widely used in electronics, optics, ceramics, cosmetics, coatings, and plastics to enhance material stability, reduce costs, and improve processing performance [7] - Quartz powder is primarily used in glass, ceramics, cement, building materials, and metal surface coatings due to its high hardness and chemical stability [7]

Group 1 - AI applications are driving the PCB industry towards a growth cycle, with expectations for both volume and price increases. The demand for high-end PCBs, particularly HDI and 18+ layer boards, is projected to grow significantly due to the rise in AI servers and 5G applications, with global market value CAGR estimates of 6.4% and 15.7% respectively from 2024 to 2029 [1][6][39] - Copper-clad laminates (CCL) are identified as the core substrate for PCBs, accounting for approximately 27% of PCB cost structure. Key raw materials include copper foil, resin, and fiberglass cloth, with high-frequency and high-speed CCL expected to see rapid demand growth in AI and 5G applications [2][5][21] - The demand for electronic resins is evolving, with a shift towards high-performance types such as PTFE, PPO, and hydrocarbon resins. These materials are crucial for meeting the high-frequency and low-loss requirements of modern PCBs, with domestic manufacturers making strides in achieving local replacements [2][7][12] Group 2 - The usage of high-performance silicon micro-powder is rapidly increasing, driven by the performance upgrades of downstream devices and the growing application of AI servers. The demand for silicon micro-powder in China is expected to reach 473,000 tons by 2025, reflecting a year-on-year growth of 13.2% [2][12] - The PCB market is projected to recover starting in 2024, with a growth rate of 5.8% and a sustained CAGR of 5.2%, indicating a new growth curve driven by AI demand rather than just cyclical recovery [21][29] - China is the largest PCB production base globally, accounting for 56% of the market value. The growth in the Chinese PCB industry is expected to come primarily from value enhancement rather than quantity expansion, emphasizing the need for high-end materials [24][29] Group 3 - The structure of the PCB cost is heavily influenced by the core materials, with CCL and prepreg accounting for over 41% of the total cost. The production of CCL involves complex chemical and material processes, indicating high technical barriers [58][59][72] - The demand for high-frequency and high-speed CCL is expected to grow significantly, with the market size projected to reach approximately $2.8 billion. This segment is characterized by faster growth rates and higher profit margins compared to the overall CCL market [96][97] - The evolution of electronic resins is critical for enhancing the properties of CCL and PCBs, with various types of resins being developed to meet the specific needs of high-frequency and high-speed applications [115][120][129]

Summary of Key Points from the Conference Call Industry Overview - The global PCB market is experiencing continuous growth, with a projected total output value of **$73.6 billion** in 2024, where mainland China accounts for **56%** of the market, making it the largest production region [1][7] - The multilayer board segment holds the highest market share, with HDI multilayer boards benefiting from the increasing demand for high-density electronic products. The global HDI market is expected to grow at a **CAGR of 8.7%** from 2023 to 2028, reaching a market size of **$16 billion** by 2028 [1][7] Core Insights and Arguments - High-performance AIDC PCBs are crucial components in AI servers, high-speed switches, and autonomous driving systems, with core components including motherboards and power backplanes. The value of a single PCB in NVIDIA's AI servers can reach between **$8,000 and $10,000** [1][9] - High-frequency and high-speed copper-clad laminates must meet stringent requirements for signal transmission speeds of **10-50 Gbps**, with specific demands on impedance, signal dispersion, and loss performance [1][9] - The dielectric constant (DK) and dissipation factor (DF) are critical for high-frequency and high-speed circuit boards, with DK values typically ranging from **3.3 to 3.6** and DF values between **0.002 and 0.004** [1][10] Material Demand and Trends - Hydrocarbon resin is a hot material in the high-frequency and high-speed copper-clad laminate sector, with DK values below **2.6** and DF values below **0.001**. It accounts for **30%** of the 5G high-speed copper-clad laminate market, with demand estimated between **12,000 to 15,000 tons** [1][11] - The global demand for electronic-grade polyphenylene ether (PPO) was approximately **1,000 tons** in 2022, expected to rise to **8,000 tons** by 2026, driven by AI server demand, resulting in a **CAGR of 68.2%** [2][12] - PTFE is recognized as the best resin material for high-frequency and high-speed copper-clad laminates due to its superior dielectric properties, with demand projected to reach **714 tons** by 2026 for AI servers [2][13] Market Risks - Potential risks include slower-than-expected AI development or underperformance in the general PCB market [3] Key Materials in PCB Supply Chain - Key upstream materials in the PCB supply chain include electrolytic copper foil, electronic fiberglass cloth, and various types of resins, each serving critical roles in conductivity and insulation [4][5][6] Future Growth Trends - The global PCB market is expected to grow at an annual rate of **5%**, with the fastest growth in applications related to server storage, projected to have a **CAGR of 11.6%** from 2024 to 2029 [7][8] Major Players and Competitive Landscape - Notable companies in the hydrocarbon resin sector include Japan's Tohoku, Dongcai Technology, and Shengquan Group. In the PTFE market, key suppliers include Rogers and Panasonic. The PPO market is led by Sabic and Shengquan Group [14] Conclusion - The development of data centers and AI servers is driving new requirements for PCB materials, particularly in terms of dielectric constant and loss factor, necessitating advancements in resin technology and additive materials [18]