以下文章来源于降噪NoNoise ，作者刘诗雨 降噪NoNoise . 不躁不敷衍，关注商业变迁的洪流和细节。 本文来自微信公众号： 降噪NoNoise ，作者：刘诗雨，编辑：孙静，题图来自：视觉中国 懂车帝给尽显疲态的特斯拉送上了一个神助攻。 最近引发高度关注的那场辅助驾驶测试，原本旨在科普技术的安全边界，不过在舆论场中，测试结果 迅速被解构为车企间的"华山论剑"。虽然没有一家车企的辅助驾驶系统完美通过所有测试项目，但在 部分友商的0分衬托下，"加州请来的老司机"特斯拉差点拿满分的成绩，显得分外扎眼。 在网友舌战、友商沉默中，马斯克美滋滋地转发了测试视频，还不忘补一句：这是在没有本地训练数 据的前提下，取得的中国第一。 就在前不久，特斯拉刚交出十年来最惨烈的成绩单：2025年Q2，营收暴跌12%至225亿美元，盈利暴 跌16%至12亿美元。在财报电话会上，马斯克坦言：未来几个季度将很艰难。 第三方测试的背书，让深陷泥潭的特斯拉稍微喘口气。但就特斯拉目前所处的赛程来看，仅得一个三 分球是远远不够的。 早在2018年，马斯克便抛出2.5万美元低价特斯拉的构想；2020年电池日，他更明确给出了"三年 后"的时间表 ...

英特尔转向混合核心架构旨在提升多线程性能并优化移动设计的能效。前者取得了一定成功，而后者却惨败。英特尔第 12 代和第 13 代 CPU 的效率远低于竞争对手的锐龙产品，E 核心在延迟敏感型任务中经常会降低性能。那么，蓝队接下来会 如何发展呢？ 英特尔 P-Core 路线图 2026-28：The Lion, Cougar & Coyote Lion Cove： Lion Cove 核心架构为英特尔 Arrow 和 Lunar Lake 处理器的 P 核提供支持。它扩展了核心前端，包括分 支预测器、提取指令、解码器和运算缓存。它将执行后端拆分为独立的矢量和整数流水线。 公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容来自 hardwaretimes，谢谢 。 Lion Cove 拥有更宽的后端，包括 ROB、重命名和退役缓冲区。执行端口（不包括内存）数量翻倍，从 5 个增加到10 个，并配备了更深的 DTLB 和三级数据缓存。Lion Cove 计算芯片在台积电的N3B节点上制造。 Panther & Nova Lake：2025-26 Cougar Cove（2025 年下半年）： Cougar ...

Core Insights - The article highlights the strategic transition of domestic terminals from key industries to full-scene applications, emphasizing the evolution of product safety, performance, and ecosystem [1] - Major manufacturers like Lenovo, Unisoc, and ZTE have launched over ten new Haiguang C86 terminal products, marking a significant step towards comprehensive domestic terminal application [1] Group 1: Security and Dependence - The "security foundation" is identified as a critical necessity, especially following Intel's security vulnerabilities that exposed risks associated with non-domestic chips [2][3] - The reliance on the Wintel architecture poses potential security threats, making information security a top priority in the domestic terminal market [3] Group 2: Application and Performance Challenges - The domestic terminal market faces challenges in applying products across various industries, necessitating a focus on real-world application scenarios [4] - Mobile office environments demand high performance and efficiency, which current domestic chips struggle to meet due to limitations in technology and ecosystem compatibility [5] Group 3: Strategic Development and Collaboration - The consensus in the industry is that the full-scene application capability of domestic terminals must be built on a foundation of core hardware security, performance upgrades, and ecosystem collaboration [6] - Companies are focusing on partnerships to leverage the latest hardware performance while adhering to national cybersecurity requirements [6][7] Group 4: Haiguang C86 Processor Innovations - The new Haiguang C86 processors have shown significant performance improvements, with single-core performance up by 62% and multi-core performance by over 135% compared to previous generations [9] - The C86 processors also integrate advanced security features without compromising performance, addressing the "impossible triangle" of performance, security, and cost [9][10] Group 5: Ecosystem Expansion - The C86 ecosystem is expanding rapidly, with over 5,000 partners collaborating on technology development and market expansion [10] - The "Xinghai Plan" aims to enhance cooperation among ecosystem partners, supporting a comprehensive approach to the full-scene terminal market [10]

Core Insights - TSMC is projected to increase its foundry market share from 70% in 2025 to 75% in 2026, driven by strong demand for 2nm and 3nm wafers from major clients like Nvidia, AMD, and Apple [2][12] - The AI data center market is rapidly expanding, with TSMC holding nearly 100% market share in logic semiconductors for AI data centers, producing chips for major companies like Microsoft, Amazon, and Google [3][4] - TSMC's advanced process and packaging technologies are critical for meeting the growing demands of AI applications, with plans to enhance production capacity in the U.S. [6][12] Market Share and Financial Strength - TSMC's foundry market share is expected to reach 67% by Q4 2024, a 10% increase from early 2023, while Samsung holds 11% [12] - TSMC's market capitalization is close to $1 trillion, indicating a strong financial position, which is attractive to clients in the AI sector [13] Technological Leadership - TSMC is the only foundry capable of producing advanced AI data center chips, with a focus on maintaining high yield rates and production capacity [8][20] - The company has been developing multi-chip substrate packaging for several years, enhancing its ability to meet complex product demands [10] Future Outlook - TSMC is expected to dominate the advanced packaging market, with estimates suggesting it will hold 90% of the CoWoS capacity by 2026 [12] - The demand for AI accelerators is projected to grow significantly, with the total addressable market for data center AI accelerators expected to exceed $500 billion by 2028 [15] Competitive Landscape - Major cloud service providers are increasingly designing their own AI accelerators, but they remain heavily reliant on TSMC for production [16][18] - TSMC's management strength and operational efficiency are key competitive advantages, allowing it to handle complex technical challenges across multiple fabs [14][20]