公众号记得加星标⭐️，第一时间看推送不会错过。 打 开 AMD 或 Nvidia 最 先 进 的 AI 产 品 包 装 ， 你 会 发 现 一 个 熟 悉 的 布 局 ： GPU 两 侧 是 高 带 宽 内 存 （HBM），这是目前最先进的内存芯片。这些内存芯片尽可能靠近它们所服务的计算芯片，以减少 AI计算中最大的瓶颈——将每秒数十亿比特的数据从内存传输到逻辑电路所需的能量和延迟。但是， 如果将HBM堆叠在GPU顶部，进一步拉近计算和内存的距离，又会怎样呢？ Imec近期利用先进的热模拟技术研究了这种情况，并在2025 年 12 月举行的 IEEE 国际电子器件会 议(IEDM) 上公布了结果，结果令人沮丧。3D堆叠会使 GPU 内部的工作温度翻倍，导致其无法正常 工作。但由 Imec 的James Myers领导的团队并没有就此放弃。他们找到了一些工程优化方案，最终 可以将温差降低到几乎为零。 一种革命性的方案 Imec 首先对一个 GPU 和四个 HBM 芯片进行了热模拟，模拟的是目前常见的封装形式，即所谓的 2.5D 封装。也就是说，GPU 和 HBM 都位于称为中介层的基板上，彼此之间的距离非常小。 ...

Core Viewpoint - Lam Research has become a significant concern for South Korean materials, parts, and equipment (MP&E) companies due to its aggressive patent infringement lawsuits against them, despite most cases being dismissed by South Korean courts [1][2]. Group 1: Patent Infringement Lawsuits - Since the outbreak of the Japan-South Korea semiconductor materials trade dispute in 2020, Lam Research has filed 12 patent infringement lawsuits against South Korean companies, with 9 occurring after the establishment of its R&D center in Yongin, Gyeonggi Province in 2022 [1]. - The number of patents registered by Lam Research in South Korea surged from 68 in 2020 to 344 by 2025, raising concerns in the South Korean semiconductor equipment industry about the implications of such extensive patent registrations [1]. - Lam Research's lawsuits are seen as a tactic to delay the technological advancements of South Korean competitors, as the company can afford to file lawsuits without the immediate need for winning them [2]. Group 2: Legal Outcomes and Industry Impact - In a notable case, Lam Research lost a patent infringement lawsuit against CMTX, which led to CMTX successfully invalidating Lam's patent. The court ruled that Lam's patent lacked creativity, highlighting the challenges faced by Lam in its legal pursuits [3]. - Lam Research also faced defeat in a lawsuit against MP&E company PSK, where two of its claimed patents were declared invalid. In the past year alone, six of Lam's patents were invalidated [3]. Group 3: Calls for Government Action - There is a growing demand for government intervention to protect domestic technologies, as the ongoing patent lawsuits have adversely affected many companies, particularly small and medium-sized enterprises [4]. - The South Korean Intellectual Property Office provides legal consulting services to companies embroiled in patent disputes, but critics argue that the number of companies not receiving assistance is increasing due to the widespread nature of Lam Research's lawsuits [4]. - Lawmakers emphasize the need to minimize damages to local enterprises and prevent unnecessary litigation, especially during a period of significant growth in the semiconductor industry [5].

公众号记得加星标⭐️，第一时间看推送不会错过。 一位经济学家昨天表示，如果台积电（TSMC）增加在亚利桑那州的投资，它可能会在美国和台湾设 立双生产中心，其中美国的产能几乎足以满足该国的本地需求。 台湾经济研究院研究员刘佩真回应了《纽约时报》的一篇报道，该报道称，作为与美国达成的关税协 议的一部分，台积电可能会在亚利桑那州建设更多的芯片工厂。 她表示，台积电在亚利桑那州的晶圆厂数量可能会增加到六到八座，每月总产能至少为 15 万片晶 圆，这将接近满足美国对高性能计算和人工智能芯片的需求。 对于台湾来说，这无疑是一场赌博，因为台湾许多人认为台积电可以为台湾提供"硅盾"，而像美国这 样的国家需要台积电的先进芯片。 刘表示，台积电可以建设更先进的集成电路组装厂，为客户提供先进的3D芯片封装（晶圆基片封 装）和系统级集成电路封装服务，从而使美国成为一个完整的半导体中心。 她表示，台积电提供芯片生产和组装服务的一站式综合生产模式，将满足英伟达和AMD等美国客户 的需求，以降低他们在当前地缘政治动荡时期面临的风险。 刘先生表示："如果台积电在亚利桑那州建设新的晶圆厂，双中心生产模式将会形成，逐步摆脱目前 以台湾为单一中心 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 三星电子预计今年DRAM产量将提升至接近800万片晶圆（半导体衬底），以晶圆投入量计算。这将 比去年的760万片增长约5%，生产主要集中在平泽工厂，季度平均产量也将首次突破200万片。 然而，由于向10纳米第六代DRAM（1c）工艺过渡期间产能暂时下降，产量可能难以达到预期增 长 。 由 于 目 前 的 产 量 远 不 足 以 弥 补 困 扰 市 场 的 全 球 内 存 短 缺 ， 业 界 预 计 高 带 宽 内 存 （ HBM ） 和 DRAM价格的上涨趋势将持续。 据朝鲜财经14日从市场调研公司Omdia获得的数据，三星电子今年的DRAM晶圆产量预计为793万 片，较上年（759万片）增长约5%。SK海力士的DRAM产量预计也将从去年的597万片增至今年的约 648万片，增幅约为8%。由于清州M15X工厂（已进行产能扩建投资）的产量将从今年下半年开始陆 续投产，预计其增幅将略高于三星电子。美光预计年产量约为360万片，与去年持平。 业内人士预计，在三星电子位于平泽园区的P4工厂投产之前，全球DRAM供应短缺问题难以缓解。 即使P4工厂加快建设，三星电子内部人 ...

Core Insights - The semiconductor manufacturing industry is experiencing a unique period characterized by a significant supercycle, with high demand for advanced logic chips, DRAM, and NAND flash, while production capacity is struggling to keep up [1] - Technological advancements in chip size reduction, power consumption, and cost efficiency have slowed down considerably, leading to a situation where the industry may face limitations in wafer fabrication equipment supply [1] - Despite challenges, the semiconductor industry has a history of overcoming pessimistic forecasts, with many innovative technologies currently in development that are expected to shine in the coming decade [1] NAND Flash Technology - The demand for NAND flash memory is critical, but cleanroom space limitations hinder capacity expansion, forcing manufacturers to upgrade existing production lines [3] - SK Hynix's 321-layer NAND process offers a 44% increase in single wafer storage capacity compared to the previous 238-layer process, making upgrades a wise choice given space constraints [4] - The core of NAND flash technology lies in maximizing the stacking of storage cells on wafers, with vertical stacking being the most cost-effective method currently pursued by manufacturers [8] SK Hynix Innovations - SK Hynix's V9 product features significant advancements in connecting decks and managing additional material layers, although challenges remain in etching and processing as layer counts increase [11] - The commercial outlook for SK Hynix's 321-layer V9 product is uncertain, as its density of 21 Gb/mm² is comparable to Micron's 276-layer G9, which achieves similar density with fewer layers and lower costs [13] Samsung's Molybdenum Technology - Samsung has introduced molybdenum as a replacement for tungsten in their V9 technology, achieving a 40% reduction in contact resistance and a 30% decrease in read time [15][16] - The integration of molybdenum presents manufacturing challenges, but the potential performance benefits justify the effort [15][16] Future Directions in Semiconductor Manufacturing - The industry is exploring alternative materials and methods to overcome the limitations of traditional copper interconnects, with ruthenium being a promising candidate [24][25] - Samsung's advancements in ruthenium technology demonstrate significant improvements in electrical performance, with a 46% reduction in resistance for ultra-fine interconnects [25][28] Two-Dimensional Materials - Two-dimensional transition metal dichalcogenides (TMDs) are emerging as a solution to performance bottlenecks in silicon devices as channel lengths shrink below 10 nm [39] - The integration of TMDs into semiconductor manufacturing faces challenges, particularly in achieving high-quality films and scalable production methods [40][47] - The development of reliable doping techniques for TMD devices remains a critical hurdle, with current methods not yet reaching practical manufacturing levels [50][51]

公众号记得加星标⭐️，第一时间看推送不会错过。 徕卡正在重新开发自己的图像传感器，这在图像传感器技术多样性并不高的行业中是一项令人兴奋和 有趣的进展。 徕卡相机股份公司监事会主席安德烈亚斯·考夫曼博士最近做客了米歇尔·伯恩巴赫主持的德语播客节 目"徕卡爱好者播客"。在圣诞夜发布的最新一期节目中，伯恩巴赫与考夫曼博士就徕卡的方方面面进 行了深入探讨，从2025年的百年庆典到最新产品，包括备受争议但又才华横溢的徕卡M EV1。 考夫曼博士还指出，徕卡"有很多项目正在筹备中"，因此摄影师们应该密切关注 2026 年的激动人心 的消息。 但 据 Leica Rumors 报 道 ， 对 话 中 最 激 动 人 心 的 部 分 可 以 说 是 在 后 半 部 分 ， 当 时 Birnbacher 和 Kaufmann 博士讨论了最近徕卡 M 系统相机中的图像传感器。 "我们有很多关于徕卡M系统进一步发展的想法，"考夫曼博士说。"这将非常令人兴奋……正如之前 部分报道的那样，我们也在再次开发我们自己的传感器。" 考夫曼博士继续解释说，传感器的研发一直在进行中，开发图像传感器需要相当长的时间。 目前尚不清楚徕卡自主研发图像 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 在这一年即将结束之际，我们仔细分析了 IDC 对服务器支出的评估，包括用于运行 GenAI 和更传统 的机器学习工作负载的加速超级计算机的巨大增长；而在今年年初，我们根据该公司对以太网交换和 路由收入的估算进行了深入的分析和建模。 今天，我们将对 Gartner 的年度全球半导体销售细分数据进行深入分析和补充，特别关注 AI XPU、 HBM 内存和网络收入，因为它们正以越来越快的速度增长，并在每年销售或委托制造的芯片中所占 比例越来越大。 在Gartner关于全球芯片销售的报告中，或许最重要的一点是市场研究公司高级首席分析师Rajeev Rajput的说法：XPU和GPU处理器、HBM堆叠式内存以及为人工智能系统销售或开发的网络芯片， 在2025年将占芯片总销售额的近三分之一。整体市场销售额达到7934亿美元，同比增长21%。但如 果我们估算一下"近三分之一"的具体数值——我们为了便于预测，取了31.5%作为参考——那么这三 种芯片（XPU、HBM、交换机ASIC）的销售额约为2500亿美元。 Gartner 在其报告中（您可以在这里查看）继续玩弄数据，称 H ...

Core Insights - The Electronic System Design (ESD) industry maintained growth momentum in Q3 2025, achieving a year-on-year revenue increase of 8.8% to $5.6 billion, up from $5.1 billion in the same period of 2024 [1] - The EDA (Electronic Design Automation) sector showed strong growth across all product categories, with notable double-digit increases in semiconductor IP (SIP) and services [2] - The Asia-Pacific region emerged as a significant growth driver, with revenues increasing by 20.5% to $2.22 billion, reflecting robust semiconductor and system design activities in China, South Korea, Taiwan, and Southeast Asia [3] Revenue Growth - The EDA industry reported a revenue increase of 8.8% in Q3 2025, reaching $5.6 billion compared to $5.1 billion in Q3 2024 [1] - The moving average growth rate over the past four quarters was even higher at 10.4%, indicating sustained growth rather than a one-time spike [1] - The semiconductor IP business saw a revenue increase of 13.6% to $1.92 billion, with a four-quarter moving average growth rate of 14.8% [2] Regional Performance - The Americas remained the largest market with Q3 revenues of $2.4 billion, growing by 3.4% [3] - EMEA (Europe, Middle East, and Africa) revenues grew by 4.6% to $675.1 million, with a four-quarter moving average growth of 7.6% [3] - Japan was the only region to experience a decline, with revenues falling by 11.5% to $264 million, although the moving average still showed mild growth [3] Employment Trends - The total global workforce tracked by the EDMD report exceeded 73,000 employees in Q3 2025, marking a 17.3% increase year-on-year [3] - This growth in employment reflects the industry's confidence and the ongoing demand for EDA services despite some regional market weaknesses [3]

Core Viewpoint - The shortage of high-end glass fiber, essential for chip substrates and printed circuit boards (PCBs), is creating significant supply challenges for companies like Apple, Nvidia, and Qualcomm, particularly as demand surges due to advancements in artificial intelligence [1][3]. Group 1: Supply Chain Challenges - Apple is competing with AI companies for high-end glass fiber from Nittobo, a Japanese manufacturer, which is the primary supplier of this material [1]. - The demand for high-performance PCBs, driven by AI developments, has led to a supply shortage affecting both Apple and Qualcomm [1][3]. - Apple has taken proactive measures, including sending employees to Japan to secure more materials for Bluetooth substrates and seeking assistance from the Japanese government [3]. Group 2: Industry Impact - The glass fiber supply constraints are expected to be one of the biggest bottlenecks for the electronics manufacturing and AI industries by 2026 [3][5]. - Companies like AMD and Nvidia have also attempted to secure supplies from Nittobo, but increasing production capacity remains limited [5]. - Qualcomm has sought alternative suppliers, such as Unitika, but their production capacity is significantly lower than that of Nittobo [5]. Group 3: Material Specifications - The specific type of glass being sought is known as low thermal expansion coefficient (CTE) glass, or T-glass, valued for its dimensional stability and high-speed data transmission capabilities, crucial for AI computing and high-end processors [6].

目前，美国市场上仍有大量16GB内存条售价在165至175美元之间，而32GB内存条的售价则接近300 至400美元。鉴于韩国和台湾市场的价格，我们预计美国市场的价格将在一个月内大幅上涨。 公众号记得加星标⭐️，第一时间看推送不会错过。 DDR5 内存价格持续上涨，韩国市场上单条内存条的价格已经达到 500 美元，入门级套装的价格甚 至更高。 内存价格已经失控，并且随着人工智能领域需求的持续增长，未来几个月还将继续上涨。就连那些为 人工智能客户验证和封装内存的厂商也因为订单激增而开始宣布提价。与此同时，消费级内存市场持 续遭受重创。 韩国市场的情况预示着消费者对内存价格的预期。危机爆发之初，韩国是首批经历内存价格上涨的地 区市场之一，而且DDR5内存的价格还在持续上涨。 韩 国 商 家 的 最 新 报 价 显 示 ， 内 存 价 格 还 将 进 一 步 上 涨 。 根 据 最 新 报 价 ， 一 条 16GB DDR5-5600 (CL46)内存条（非套装）的售价接近40万韩元，约合270-300美元。32GB DDR5-5600 (CL46)套装 的售价则在68万至78万韩元之间，约合450-500美元。 ...