Core Viewpoint - The article discusses the disruptive potential of hybrid bonding technology in increasing the density and complexity of integrated circuit (IC) products, while also highlighting its environmental implications [2][3]. Group 1: Hybrid Bonding Technology - Hybrid bonding is a revolutionary technology initially applied in CMOS image sensors (CIS) and is now penetrating high-performance computing (HPC) in processors and memory [3]. - The demand for hybrid bonding is expected to grow significantly, with the transition to hybrid bonding in advanced memory being a key market driver by the end of the 2020s [4]. Group 2: Environmental Impact - The number of DRAM chips in each stack is projected to triple, leading to a more than 3.5 times increase in chip emissions [5]. - While hybrid bonding processes may increase emissions at the chip level, the critical issue lies in the significant increase in silicon density, which will lead to higher carbon emissions [9][12]. Group 3: Market Projections - Revenue from hybrid bonding is expected to grow from nearly zero in 2025 to approximately $120 billion by 2029, driven by demand for high-bandwidth memory (HBM), particularly in AI applications [9]. - The emissions from HBM stacks are projected to increase significantly as the complexity of the stacks rises, with emissions per stack expected to grow substantially from HBM2E to HBM5 [13][14]. Group 4: Technical Challenges and Innovations - High-stacking HBM requires thinner DRAM chips and lower thermal budgets, which pose challenges for bonding processes [17]. - Despite these challenges, the demand for hybrid bonding technology remains strong, and innovations in the field are expected to mitigate some of the emission increases [17].

公众号记得加星标⭐️，第一时间看推送不会错过。 全球最大的芯片封装和测试服务提供商日月光科技控股有限公司（ASE）近日表示，为满足人工智能 （AI）应用的需求以及非人工智能领域的更广泛复苏，公司今年的资本支出将增加至创纪录的70亿 美元。 报告称，这比去年的55亿美元增长了约27%。 该公司表示，由于需求超过供应，约三分之二的支出将用于尖端服务能力。 日月光科技控股有限公司首席财务官董建华（左）和首席运营官吴天（右） 日月光首席运营官吴田玉在台北的财报电话会议上表示："AI服务器周期仍在继续，主要由超大规模 数据中心和数据中心发展引领。物理层也十分活跃，敏捷应用领域便是其中之一。" "例如，我们看到更多关于机器人和无人机的设计视角，以及汽车和智能制造设备的设计视角，"他 说。 日月光半导体表示，这家总部位于高雄的公司预计，今年其先进封装（LEAP）服务收入将至少翻一 番，达到32亿美元，而去年为16亿美元。 LEAP 服务包括晶圆基板工艺技术，它是芯片基板晶圆 (CoWoS) 技术的一部分。 人 们 普 遍 预 期 日 月 光 将 从 台 积 电 获 得 外 包 晶 圆 基 板 封 装 订 单 ， 以 帮 助 ...

Core Viewpoint - The recent price hikes in passive components, driven by supply-demand imbalances and rising raw material costs, indicate a significant transformation in the market dynamics of the passive components industry [6][9][12]. Price Adjustments - Yageo announced a price increase of 15%-20% for certain resistor products starting February 1, reflecting its position as a market leader with an 18% global market share [2]. - Other companies, including Walsin Technology and Panasonic, have also announced price hikes for various passive components, with increases ranging from 15% to 30% [2][3]. - The price adjustments are widespread, with many small and medium-sized manufacturers in China also raising prices by 5%-20% across multiple product categories [3]. Supply Chain Dynamics - The price increases are primarily driven by rising costs of raw materials such as silver, copper, and aluminum, which have seen significant price surges, with silver prices increasing over 140% in 2025 [7][9]. - The production costs for passive components have risen by 20%-30% due to these raw material price increases, prompting manufacturers to pass on costs to customers [7][9]. - Capacity constraints are exacerbating the situation, as many Japanese manufacturers have shifted focus to high-end products, reducing supply in the mid-to-low-end market [8][9]. Demand Drivers - The demand for passive components is being driven by the rapid growth of AI and electric vehicle markets, with AI server motherboards requiring significantly more MLCCs than traditional servers [10][11]. - The demand for passive components in electric vehicles is also increasing, with the number of MLCCs used per vehicle rising dramatically compared to traditional vehicles [10][11]. - The overall market for passive components in China is projected to grow from 1237.65 billion yuan in 2023 to 2583.59 billion yuan by 2030, with a compound annual growth rate of 11.09% [12]. Market Structure Changes - The current price hikes reflect a structural change in the passive components market, with high-end products for AI servers and electric vehicles experiencing significant demand while traditional consumer electronics face challenges [14][17]. - Domestic manufacturers are beginning to capture more market share, with companies like Walsin Technology and Sunlord Electronics seeing increased orders and expanding their production capabilities [18][19]. - The shift towards high-end products presents opportunities for domestic manufacturers to enter the supply chains of larger companies, especially as global manufacturers face capacity and delivery challenges [22][23].

公众号记得加星标⭐️，第一时间看推送不会错过。 英特尔和英特尔晶圆代工的研究人员展示了新一代去耦电容 (DCAP) 材料，可显著提升先进计算机芯片的供电性能。这项突破性成果将在 2025 年 IEEE 国际电子器件会议 (IEDM) 上发布，它利用了独特的金属-绝缘体-金属 (MIM) 材料特性。铁电氧化铪锆 (HZO) 利用其场强相关的介电响 应，实现了 60 至 80 fF/μm² 的电容值；而氧化钛 (TiO) 和氧化锶钛 (STO) 则凭借其超高的介电常数，分别达到了 80 和 98 fF/μm² 的电容值 ——这三种材料均具有卓越的可靠性，且电压依赖性极低。这三种材料在 10 万秒内均表现出可忽略不计的电容漂移，漏电流远低于要求，并且在 90 摄氏度下，预计 10 年击穿电压均超过规格要求。 这些进步对半导体行业和更广泛的科技领域有着直接的影响。处理人工智能 (AI) 工作负载的数据中心可以通过更高的 MIM 去电容技术更长时间 地保持高能效，从而更快地完成工作负载，同时降低数据中心的能耗和运营成本。移动设备受益于可靠的高性能和更快的低功耗状态切换，从而提 高电池效率。高性能计算 (HPC) 系统可 ...

Core Viewpoint - Nvidia's transition to the new Blackwell AI chips has faced significant deployment challenges, particularly for major clients like OpenAI and Meta, but the company has managed to maintain its market position and address many technical issues [2][3][4]. Group 1: Deployment Challenges - Nvidia's CEO Jensen Huang indicated that the complexity of the new Blackwell AI chips would make the transition from the previous generation challenging for clients, requiring adjustments across various system components [2]. - Major clients, including OpenAI and Meta, struggled with the deployment and operation of Blackwell servers, which contrasted sharply with the quicker deployment of previous Nvidia AI chips [2][3]. - Despite these challenges, Nvidia's business has not been severely impacted, maintaining a market capitalization of $4.24 trillion and resolving many technical issues hindering client deployment [2][3]. Group 2: Client Reactions and Adjustments - Clients like OpenAI and Meta have expressed private dissatisfaction regarding the inability to build chip clusters at the expected scale, which limits their capacity to train larger AI models [3][4]. - To address client dissatisfaction, Nvidia provided refunds and discounts related to issues with the Grace Blackwell chips [3][4]. - Nvidia has collaborated closely with leading cloud service providers to improve the deployment process, indicating a commitment to joint engineering development [4]. Group 3: Product Improvements - Nvidia has learned from the deployment challenges and has optimized the existing Grace Blackwell systems while also improving the upcoming Vera Rubin chip servers [5]. - An upgraded version of the Grace Blackwell chip, named GB300, has been introduced to enhance stability and performance, addressing issues encountered with the first generation [5]. - Some clients have adjusted their orders to the upgraded products, indicating a shift in demand towards improved chip versions [5]. Group 4: Financial Implications - Delays in chip deployment have led to financial losses for cloud service partners of OpenAI, who invested heavily in Grace Blackwell chips expecting quick returns [9][10]. - Some cloud service providers negotiated discount agreements with Nvidia to alleviate financial pressure due to delayed chip usage [9]. - Oracle reported significant losses in its AI cloud business due to the slow deployment of Blackwell chips, highlighting the financial risks associated with new technology launches [10].

Group 1 - Qualcomm announced a significant breakthrough in chip design in India, completing the 2nm semiconductor design, marking an important milestone in the country's semiconductor ecosystem [2][3] - The achievement highlights Qualcomm's strong global engineering capabilities and collaboration among its R&D centers in Bangalore, Chennai, and Hyderabad, which are among the most advanced engineering teams outside the US [2][4] - Indian officials emphasized that this milestone reflects India's growing importance as a key center for advanced semiconductor development and aligns with the vision of building a globally competitive semiconductor industry [3][4] Group 2 - Texas Instruments (TI) opened a new R&D center in Bangalore, celebrating its 40th anniversary in India, which aims to enhance collaboration in chip design [5][6] - The new center, covering 550,000 square feet, includes advanced testing facilities and multiple integrated circuit design labs, showcasing TI's commitment to semiconductor innovation and talent development in India [5][6] - TI's investment reinforces India's position as an innovative country and highlights the company's long-term commitment to leveraging local talent to strengthen its leadership in semiconductor technology [6]

Core Viewpoint - The global semiconductor sales are projected to reach a record high of $791.7 billion in 2025, representing a 25.6% increase from $630.5 billion in 2024, driven by strong demand from emerging technologies like AI, IoT, and 6G [2][5]. Group 1: Sales Projections - In 2025, the semiconductor sales are expected to be $791.7 billion, with Q4 sales reaching $236.6 billion, a 37.1% increase from Q4 2024 and a 13.6% increase from Q3 2025 [2]. - The monthly sales data indicates that December 2025 sales will be $78.9 billion, a 2.7% increase from November 2025 [2]. Group 2: Regional Performance - Sales growth is observed across various regions: Asia-Pacific and others (45.0%), Americas (30.5%), China (17.3%), and Europe (6.3%), while Japan's sales decreased by 4.7% [5]. - In December, sales increased in the Americas (3.9%), China (3.8%), and Asia-Pacific (2.5%), but decreased in Europe (-2.2%) and Japan (-2.5%) [5]. Group 3: Product Segmentation - Logic products are projected to see a sales increase of 39.9%, reaching $301.9 billion, making it the largest product category by sales in 2025 [6]. - Memory products are expected to grow by 34.8% in 2024, reaching $223.1 billion, ranking second in sales [6].

被韩国改写的存储史 日本曾是DRAM的代名词。 上世纪 80 年代，日本的几家存储企业合计占据全球 DRAM 市场过半份额。DRAM几乎等同于日本 半导体工业的名片。当时的日本，正处在制造业全球扩张的巅峰期。汽车、家电、精密仪器、机床、 消费电子几乎在所有工业品门类中都具备国际竞争力，而半导体则是这套工业体系中技术密度最高、 附加值最高的一环。 公众号记得加星标⭐️，第一时间看推送不会错过。 过去三十年，全球存储产业版图完成了一次残酷而彻底的权力更替。 20世纪80–90年代，日本企业几乎垄断DRAM市场；进入21世纪后，这一王座被韩国厂商夺走，并由 此建立起横跨技术、规模与资本的长期统治。今天，HBM 成为 AI 算力体系中最稀缺、最赚钱的核 心器件之一，韩国厂商坐享红利，而日本却基本缺席。 然而，就在大家以为日本存储已经"躺平"时，一家极具野心的本土企业正浮出水面。 在此我们再来老生常谈下，日本是如何成为DRAM霸主的。1970–80 年代，日本政府通过 MITI（通 产省）主导了一系列国家级半导体联合研发计划：包括超大规模集成电路（VLSI）国家项目、企业 之间共享基础工艺成果、大企业联合高校与研究机构 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 AI浪潮快速席卷全球，半导体产业结构正出现关键转折。芯片大厂联发科总经理暨营运长陈冠州指 出，AI对算力、功耗与系统整合的高度需求，正全面推升先进制程与先进封装的重要性，联发科持续 深化与台积电合作，在2纳米及A14制程都是首批采用客户。先进封装部分亦在COUPE（紧凑型通用 光子引擎）平台助攻下，持续推进3.2T硅光子引擎。 AI已从早期的感知型应用，快速进入生成式与自主式阶段，未来两至三年将进一步迈向结合自驾车与 机器人的Physical AI。陈冠州分析，这样的演进，使得芯片在相同功耗与面积限制下，必须整合更 多运算单元，单靠制程微缩已不足以应付需求，必须同步导入小芯片（Chiplet）架构与先进封装， 才能持续放大算力。 原文链接 https://www.ctee.com.tw/news/20260207700059-430502 （来源：工商时报 ） 联发科长期与台积电维持高度互信的合作关系，为台积电2纳米制程首波采用客户之一，陈冠州透 露，相关产品预计于今年底推出；而在下一代A14制程，联发科同样为早期导入名单。对于外传是否 考虑美系晶圆代工之封装， ...

公众号记得加星标⭐️，第一时间看推送不会错过。 众所周知，个人电脑（PC）主系统内存——正式名称为随机存取存储器，简称 RAM——的价格已经 失控。在过去的几个月里，DDR5 RAM（最新标准）模组的价格一路飙升，翻了一倍甚至更多。一 套 64GB 的台式机内存套件迅速变得比索尼 PlayStation 5 还要昂贵，而一些更大容量的套件现在的 价格甚至超过了高端台式机 GPU。这种疯狂的价格上涨也开始蔓延到较旧的内存类型，比如 DDR4 和 DDR3。 这些价格上涨将影响每一个依赖内存或存储的产品——但我现在想专注于笔记本电脑。笔记本电脑使 用的物理模组与台式机不同，但底层的内存颗粒是相同的，且容易受到相同的价格压力影响。作为 PCMag 领先的笔记本电脑专家之一，我可以告诉你：对于今年需要新电脑的人来说，情况即将变得 困难。 此外，这种供应短缺正在影响其他将内存作为整体一部分的组件。最直接的连锁反应将冲击显卡，显 卡依赖专用显存来辅助图形渲染和本地 AI 工作流。（撇开内存紧缺不谈，显卡本身的需求也在大幅 增加。）这些显卡所使用的 GDDR6 和 GDDR7 显存价格也因同样的原因上涨：每 Gb 的成本在 ...