在慕尼黑上海光博会中：X Match计划 作为重磅推出的增值服务，旨在为光电领域展商与买家构建专业 化供需适配桥梁，通过精准商业配对提升参展实效。 其核心优势体现在： 什么是X Match计划？ 在办公室应用软件中：XMatch 是 Excel 函数体系的重要组成部分，其核心功能是在指定数组中精准定位目 标值的位置，支持按顺序、按数值大小或自定义规则进行匹配。与传统匹配函数相比，XMatch具备更灵活 的参数配置和更强的容错性，广泛应用于数据整理、报表分析及跨表关联等场景，是提升数据处理效率的 关键工具。 服务定位 聚焦具备明确采购规划、拥有决策或参与权限的 国内外特邀采购商 ，提供定制化商务服务，确保对接对象 的精准性与合作性。 形式创新 通过 特邀采购商洽谈区、参观团等 多元场景，在展位或指定会议区域促成面对面洽谈，打破传统展会的沟 通壁垒。 价值闭环 有效提升 展商 与 国内外特邀采购商 的现场沟通效率，增大业务合作达成概率，从供需两端加速光电产业 的资源对接与市场拓展，形成 "精准匹配 — 高效洽谈" 的服务体系。 特邀采购商礼遇 1 特邀采购商证件印制 2 专属会合点 3 现场双语指引小助理 4 快 ...

Core Viewpoint - The article highlights the significant transformation in the global semiconductor industry, particularly in the power semiconductor sector, where Chinese companies are rapidly advancing from a position of dependency to becoming key players in the global market [1][2][3]. Group 1: Industry Dynamics - Onsemi and Innoscience have formed a deep collaboration to develop next-generation efficient power devices based on Innoscience's 8-inch silicon-based GaN technology, indicating a shift in global partnerships towards Chinese technology leaders [1][3]. - The global power semiconductor giants are increasingly engaging in comprehensive collaborations with Chinese firms, including joint R&D and supply chain integration, reflecting a recognition of China's industrial strength [2][8]. - The power semiconductor sector is identified as a leading area for China's semiconductor industry to achieve breakthroughs, supported by a growing number of domestic companies emerging in this field [2][9]. Group 2: Market Opportunities - The global market for GaN power semiconductors is projected to reach approximately $2.9 billion by 2030, with a compound annual growth rate of 42% from 2024 to 2030, highlighting the growth potential in this segment [3][12]. - The Chinese power semiconductor market is expected to reach 105.775 billion yuan in 2024, maintaining its position as the largest consumer market globally, with a significant increase in domestic production rates [11][12]. - The domestic market for low-end power devices has surpassed 80% in localization, with expectations for SiC manufacturers' market share to increase by 10-15 percentage points this year [11][12]. Group 3: Technological Advancements - Innoscience has become the first global company to achieve mass production of 8-inch GaN wafers, with a market share exceeding 42.4% in 2024, showcasing its technological and production capabilities [12]. - Chinese companies have made significant advancements in SiC substrate and epitaxial wafer technologies, with Tianyu Semiconductor leading in market share for carbon silicon epitaxial wafers [11][12]. - The collaboration between international firms and Chinese manufacturers is evolving from technology licensing to joint R&D and supply chain binding, indicating a deeper integration of Chinese firms into the global semiconductor ecosystem [8][9]. Group 4: Strategic Collaborations - STMicroelectronics and Sanan Optoelectronics are collaborating to build a SiC manufacturing facility in Chongqing, with an expected investment of approximately 23 billion yuan, marking a significant step in localizing SiC production [5][6]. - Infineon has established long-term supply agreements with domestic SiC substrate manufacturers to secure competitive materials for its semiconductor production, further integrating Chinese suppliers into its supply chain [6][7]. - Other international companies, such as ROHM and Panasonic, are also forming strategic partnerships with Chinese firms to enhance their product offerings and market reach in the power semiconductor sector [7][8]. Group 5: Future Outlook - The article emphasizes that the rise of China's power semiconductor industry is not coincidental but a result of multiple factors, including strong market demand, strategic opportunities in third-generation semiconductors, and supportive policies [12][13][14]. - The industry is transitioning from a focus on domestic market replacement to actively participating in global competition, with Chinese firms expanding their international presence and capabilities [14][15]. - The future competition in the power semiconductor sector will hinge on technological endurance, ecosystem development, and global operational capabilities, as Chinese companies aim to lead in key areas like SiC and GaN [15][16].

公众号记得加星标⭐️，第一时间看推送不会错过。 缓慢但稳步前进。 台积电在其欧洲OIP论坛上展示的一张幻灯片清晰地阐述了其将于2028年推出的A14（1.4nm级，正 面供电）制程工艺相比其前代产品N2（2nm级，正面供电）的优势。结果表明，A14在相同功耗和复 杂度下性能提升16%，在相同时钟频率和复杂度下功耗降低27%。然而，为了充分发挥下一代制造技 术的潜力，芯片设计人员可能需要使用更智能的电子设计自动化（EDA）工具。 当代工厂发布新的工艺技术时，通常会公布一系列特性，以展现不同代际工艺之间的相对差异。随着 生产节点的不断推进，芯片制造商往往会获得更多关于其性能的数据，并随着时间的推移逐步明确其 特性。台积电的A14工艺正是如此。此前，该公司表示，与N2工艺相比，在相同的功耗和晶体管数量 下，A14工艺的性能将提升10%至15%；在相同的时钟频率和复杂度下，功耗将降低25%至30%；混 合芯片的晶体管密度也将提升约20%。而从幻灯片来看，新节点的性能将略高于预期，但功耗方面则 保持在预期值的中等水平。 台积电展示这张幻灯片是为了说明其工艺技术的可扩展性，旨在表明尽管摩尔定律增速放缓并面临严 峻挑战，但 ...

Core Viewpoint - The article discusses the emerging competition in the AI chip market, highlighting the challenges faced by NVIDIA as Google and Amazon introduce their own chips to compete with NVIDIA's dominance in the sector [1][3][12]. Group 1: NVIDIA's Dominance and Profitability - NVIDIA reported quarterly revenue of $57 billion, with $51.2 billion coming from data center GPUs, showcasing its high profitability with a GAAP gross margin of 73.4% [3][4]. - The high costs associated with training advanced AI models using NVIDIA GPUs raise concerns among executives and investors about the sustainability of these prices [4][12]. Group 2: Emergence of Competitors - Google has introduced its seventh-generation TPU, named Ironwood, which offers 4614 TFLOPS of FP8 computing power and can connect up to 9216 chips, creating a supercomputer with over 40 exaflops of performance [6]. - Amazon's Trainium3 chip, designed for AI workloads, boasts 2.52 FP8 petaflops of computing power and aims to provide a more cost-effective AI infrastructure option [8]. Group 3: Developer Preferences and Challenges - Developers favor NVIDIA due to the established CUDA programming ecosystem, which has been in development since 2006, making it challenging for companies to switch to alternative chips like TPU or Trainium [10]. - The complexity of rewriting and optimizing code for new architectures poses a significant barrier for enterprises considering a shift away from NVIDIA [10]. Group 4: NVIDIA's Strategic Response - NVIDIA is proactively addressing competition by accelerating its product roadmap, introducing the Rubin architecture and the next-generation Vera Rubin NVL144 system, which aims for significant performance improvements [11]. - The company is focusing on maintaining its leadership position while facing the threat of competitors like Google and Amazon [11]. Group 5: Future Market Scenarios - Three potential scenarios for the future market include NVIDIA maintaining its dominance but with reduced profit margins, a multi-polar market emerging with several key players, or a slowdown in AI spending leading to challenges for NVIDIA [12]. - The article suggests that a combination of the first two scenarios is the most likely outcome, with NVIDIA remaining a key player while Google and Amazon gain ground [12]. Group 6: Implications for Users and Developers - The article raises questions about how AI usage and costs will evolve over the next decade, including whether AI subscription services will become cheaper and if specialized chips will dominate the AI ecosystem [13]. - The competition among major players like NVIDIA, Google, and Amazon will significantly influence the future landscape of AI technology [13].

12月6日， "2025浦东国际人才港论坛·集成电路产业人才论坛" 在张江科学会堂举行，集成电路行业内顶尖专家、学者、企业家齐聚一堂，分 享产业前沿动态、探讨人才创新机遇与挑战，旨在进一步促进集成电路产学研深度融合，助力浦东打造国际人才发展引领区并推动集成电路 产业高质量发展。 本次论坛以"聚智青年，筑芯未来"为主题 ，由上海市浦东新区人才工作局指导，上海张江高科技园区开发股份有限公司主办，上海张江浩芯 企业管理有限公司、复旦大学校友总会集成电路行业分会承办，汇聚了来自产业界、学术界与研究机构的众多领袖与专家，通过政策解读、 成果展示、创业分享等不同视角展现了集成电路产业创新人才发展现状，为集成电路产业高质量发展积蓄"芯"智慧。 论坛首先由浦东新区区委组织部人才工作一处处长季胜男进行了 最新人才政策的权威宣介 ，展现了浦东打造国际人才发展引领区的决心与力 度，为整场论坛奠定了"政策赋能产业，生态吸引人才"的基调。 来源：内容来自张江高科，谢谢。 聚焦材料，破题AI时代瓶颈 集成电路材料创新联合体秘书长冯黎发表了题为 《AI时代集成电路材料发展》 的演讲。她前瞻性地指出，在算力需求爆炸式增长的AI时代， 底层材 ...

Core Insights - The article discusses the significant impact of memory shortages on server and PC prices, with manufacturers facing rising component costs due to a shift in production focus towards AI servers [3][4]. Group 1: Price Increases - DRAM prices are projected to rise by 8% to 13%, with some forecasts suggesting even higher increases [3]. - Major OEMs, including Dell, Lenovo, HP, and HPE, plan to raise server prices by approximately 15%, while PC prices are expected to increase by about 5% [4][5]. - Samsung has reportedly raised memory prices by up to 60% as wafer production capacity shifts towards AI workloads [4]. Group 2: Industry Response - Manufacturers are reevaluating their product lines, with some brands halting consumer-oriented memory production to meet enterprise demands [4]. - The COO of Dell described the current memory shortage as "unprecedented," indicating that supply is struggling to keep pace with growing demand [4]. - Lenovo's COO highlighted the immense cost pressure from memory and solid-state drives, complicating mitigation efforts [5]. Group 3: Market Dynamics - The shift towards AI-centric production is affecting the supply and cost of general hardware components [4][6]. - IDC analysts noted that the current market volatility is unusually high compared to past fluctuations, driven by increasing demand for servers, CPUs, and GPUs [5].

公众号记得加星标⭐️，第一时间看推送不会错过。 由于台积电看到了美国客户对 CoWoS 的巨大需求，该公司目前正考虑将亚利桑那州的一个晶圆厂改 造成先进封装工厂。 由于先进封装技术是人工智能性能大幅提升的关键技术之一，人工智能GPU和ASIC制造商对先进封 装的需求急剧增长。英伟达和AMD等公司已将生产重心转向美国；然而，台积电在美国缺乏先进封 装设施，最终迫使这些客户寻找替代方案，其中之一便是与竞争对手合作。不过，台积电似乎计划尽 快解决这一供应瓶颈问题。据台湾《自由时报》报道，位于亚利桑那州的台积电预计将于2027年底前 建成一座先进封装工厂。 据报道，台积电已加快在美国引进先进封装生产线的步伐，并计划将一块芯片制造厂的旧址改建为先 进封装工厂。此前，美国客户对封装技术的需求十分迫切，甚至像英伟达这样的公司也开始将美国生 产的Blackwell晶圆运往台湾进行封装，最终制成成品。台积电此前一直将美国的封装服务外包给安 靠等公司，但现在看来，这种情况正在发生变化。 我们知道，鉴于台积电在CoWoS封装方面面临的供应限制，美国客户正在将目光转向英特尔等竞争 对手，以满足其先进的封装需求。据报道，微软、高通、苹 ...

2026年慕尼黑上海光博会 观众组团福利再度升级！ 诚邀您加入展会观众组团计划 尊享 超多 多 多 福利 ！ 2026年3月18-20日 上海新国际博览中心 团长、团员 有何要求？ 为了能够精准地匹配您及参展企业，我们希望团长/团员来自以下领域及职能部门： 我们期待您浩浩荡荡携伴而来！ 来自 电气工程 / 电子工业、通讯、化工 / 制药行业、医疗技术 / 生物技术、汽车、农业、半导体、能源、精 密机械、航天 / 航空、材料处理 / 加工、运输、工具制造 / 工程机械、工业机器人 / 具身智能、照明 / 显示、 环境、安全技术、国防工业、商贸、纺织工业、食品工业、高校、非大学研究机构、政府 / 公共事业 / 服务 等 成员代表。 如果您是符合上述要求的小伙伴，就别犹豫了，快快快来报名吧！ 如何参与观众组团？ Step 1 扫码报名参观 Step 2 进入注册首页后 进行个人手机号验证 Step 3 选择团体观众注册 Step 4 实名制填写个人信息 及简单填写问卷后选择下一步 提交您邀请的团队成员 A 添加团员 直接输入您的团队成员信息 Step 5 完成注册弹出组团登记参观页面 Step 6 您可选择三种方式 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 近日，英伟达首席执行官黄仁勋做客乔·罗根（Joe Rogan）的播客节目，深入探讨了人工智能革命、英伟达的起源，以及GPU如何驱动从游戏到现 代数据中心等方方面面的应用。在这次内容丰富的对话中，黄仁勋谈到了人工智能的真正风险与回报、全球"人工智能竞赛"，以及能源和制造业为 何是未来创新的核心。 他还分享了自己作为移民的成长经历，以及将英伟达打造成为一家改变世界的公司的早期奋斗历程。如果您想了解未来几十年计算、国家安全和日 常生活的发展方向，那么这期节目绝对不容错过。 黄仁勋：你知道，他魅力的一部分——或者说，他才华的一部分——是的，他直言不讳。 以下为对话原文： 黄仁勋：嘿，乔。 乔·罗根：很高兴再次见到你。我们刚才还在聊——那是我们第一次交谈吗？还是——我们第一次交谈是在SpaceX？ 黄仁勋：SpaceX。 乔·罗根：SpaceX。第一次你把那块疯狂的人工智能芯片交给Elon Musk的时候。 黄仁勋：是吗？ DGX Spark。 乔·罗根：是的。 黄仁勋：哦，那是—— 乔·罗根：那是一个重要的时刻。 黄仁勋：那是一个意义重大的时刻。 乔·罗根：当时在场感觉 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 日本政府全力支持的新创芯片制造商Rapidus，正试图挑战全球半导体霸主台积电（TSMC）的地 位，目标直接量产全球最先进的2纳米芯片。外媒对此形容，任务难度不亚于当年美国的「阿波罗登 月计划」，堪称一场赌上日本科技命运的「登月级赌注」，如同当年台积电押注28纳米制程战略类 似，日本正面临决定未来数十年技术竞争力的关键时刻。 《彭博》报导，Rapidus成立仅3年，目标是跨越数代技术，直接跃进全球最先进的2纳米逻辑芯片制 成。但这种堪称「不可能的任务」让外界质疑声不断，认为这项技术极为复杂昂贵，即便是全球顶尖 芯片大厂也鲜少能挑战。 然而正因这个赌注，最终让台积电迎来智能型手机大爆发的浪潮，逐步淘汰众多竞争对手，打开台湾 半导体国际地位，也奠定今日所说的「硅盾」。 如今，日本正面临类似的时刻。 AI与数据中心的爆炸式成长，让全球对超先进处理器的需求飙升； 疫情则证明芯片短缺足以瘫痪整个产业。而一通来自IBM传奇研究员的电话，让现任Rapidus董事长 获得制造2纳米芯片的关键技术，日本因此取得光靠砸钱也买不到的珍贵的合作与智财起步优势。 如今日本看到一丝重建本土 ...