公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容 编译自zdnet 。 上个月，韩国ICT出口创下了8月份的历史最高水平。尤其是半导体出口创下了历史新高。 据韩国科学技术信息通信部14日发布的《信息通信技术进出口动向》显示，8月份信息通信技术出口 额达228.7亿美元，比去年同期增长11.1%。 同期，ICT进口额同比增长7.6%，达到125.3亿美元，贸易差额暂时录得顺差103.4亿美元。 美国关税政策的一个显著进展是，半导体出口额创下151.1亿美元的历史新高，超过了两个月后6月份 创下的149.8亿美元的月度纪录。 存储器半导体固定价格上涨以及人工智能服务器等基础设施投资增加推动了半导体市场的发展。 其中，半导体出口额激增27.0%，达到151.1亿美元，创历史新高。存储器半导体固定价格上涨，以 及包括人工智能服务器在内的基础设施投资增加，推动了强劲的需求。 显示器出口额同比下降9.4%至18.2亿美元，其中LCD出口受单价下降及需求减少的影响，OLED出口 也因面板产量扩大但前期需求低迷而减少。 手机出口也下降了15.4%，至13.3亿美元。整体出口下降是由于对主要海外生产基地中国的出口 ...

Core Viewpoint - The global demand for DRAM and NAND flash memory is expected to exceed supply in 2024, driven by the surge in AI-related storage needs, leading to price increases and market opportunities for major memory manufacturers like Micron, SanDisk, Samsung, and SK Hynix [1][2][3] Group 1: Market Dynamics - The memory market is experiencing a significant shift due to the rapid increase in AI cloud demand, with DRAM manufacturers focusing on High Bandwidth Memory (HBM) and facing challenges in production capacity [2] - Micron has announced a price increase of 20% to 30% for DRAM products, indicating a strong demand that exceeds expectations, with a potential new wave of purchasing activity in the market [1][2] - SanDisk has also raised prices by over 10% across all channels, signaling the start of a new round of price increases in the NAND market [2] Group 2: Price Trends and Projections - The DRAM price index has increased by approximately 72% in less than six months, while NAND prices remain relatively low compared to last year, indicating a widening gap between the two price indices [3] - The overall market value for NAND flash memory is projected to reach $65 billion in 2026 and $70 billion in 2027, with a growing contribution from AI demand [2] Group 3: Sector-Specific Insights - The server market is seeing a recovery in demand for enterprise-level NAND due to inventory depletion and a strong need for profitability, leading to a more aggressive pricing strategy from manufacturers [4] - With Micron exiting the mobile NAND market, domestic manufacturers are expected to benefit from the resulting market opportunities, leading to a slight increase in mobile NAND prices in Q4 [5]

整体而言，消费性相关IC市况在今年明显受到关税政策变动，及大陆补贴政策效益下半年逐渐消退影 响下，业界人士认为，后续要关注关税政策定案后，对于终端市场需求带来的实际影响。 AI浪潮不但吸引了资本市场多数目光，也吸纳了不少企业与消费市场的资金。 IC设计业者坦言，这 几年如果跟AI还沾不上边，业绩就很难有爆发性成长力道。 公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自 经济日报 。 消费性产品买气未见起色， IC设计业不仅本季传统旺季不太旺，大陆十一长假前夕与电商双11档期 拉货效应也清淡，下半年面临度小月，已有部分厂商坦言，下半年营运表现将顶多持平、甚至恐不如 上半年。 不具名的IC设计业者直言，上半年不少客户因应美国关税议题，提前大举拉货，使得下半年拉货力道 相对减弱，导致本季旺季不太旺。 另一方面，大陆官方先前祭出补贴政策，刺激家电、手机与汽车等内需消费，确实曾带来一段时间的 需求好光景，但下半年相关效益有减弱迹象，都导致近期消费性IC需求相对平淡。 IC设计业者坦言，上半年关税议题让客户拉了不少货，但后来客户销售普遍并没有特别出色，目前仅 能求下半年维持「温温的」，不要再变更差就好。 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自半导体行业观察综合 。 最新报告称，三星的 2nm GAA 技术可能取得了非凡的成果，Exynos 2600 的不确定性有所缓解。现 在，它已准备好进入量产阶段，预计将首批采用该光刻技术的芯片实现量产。从该公司的进展来看， Galaxy S26 的发布似乎不会采用骁龙独有的配置，高通的垄断地位或许最终会被打破。 Fnnews 的最新消息并未提及三星目前的 2nm GAA 良率，但我们早在 2 月份就报道过该数字为 30%。这家韩国巨头花了几个月的时间来公布这一数字，根据爆料人@Jukanlosreve分享的细节，该 公司似乎对 Exynos 2600 能够投入商业化生产充满信心。在一次三星高管也出席的内部会议上，首 款 2nm GAA 芯片组被认为与Exynos 2500相比将带来重大的性能飞跃。 今 年 7 月 ， 三 星 LSI 业 务 负 责 人 Yong-In Park 在 一 次 活 动 上 向 媒 体 表 示 ， " 我 们 正 在 稳 步 筹 备 Exynos 2600"，并且"一定会取得良好的成果"。到目前为止，他的声明是正确的 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 摘要 本文介绍了VLSI Symposium 2025上发布的一项关键技术突破，通过原子级氟掺杂提升IGZO晶体管 在高温下的可靠性，实现395K、4MV/cm下ΔVTH小于44mV的性能，刷新氧化物晶体管的国际纪 录，该突破对IGZO晶体管在DRAM、存算一体、3D集成等应用场景，具有重要技术价值。 随着三维异质集成与先进逻辑技术的发展，如何提升氧化物薄膜晶体管的可靠性，成为实现CMOS后 端兼容电子器件的关键挑战。在本届 VLSI Symposium 2025 上，新加坡国立大学 Aaron Thean教 授联合龚萧课题组 展示了一项具有里程碑意义的工作 —— 首次通过原子级氟掺杂调控氢迁移机制， 成功实现了在高温（395 K）下正偏压不稳定性（PBTI）| ΔV TH |小于44 mV的IGZO晶体管，刷新 了氧化物晶体管的国际记录。 行业痛点与突破意义 1 氧化物薄膜晶体管，特别是铟镓锌氧（IGZO）薄膜晶体管，因其具备高迁移率、低漏电流、宽带隙 和低温可制造性，已在高端显示面板中得到广泛应用，并正在加速扩展至新一代存算集成系统与三维 异质集成芯片等前沿 ...

从 AMD 的角度来看，RDNA4 代表着光线追踪和机器学习方面的巨大效率飞跃，同时在光栅化方面 也得到了改进。改进的压缩功能有助于保持图形架构的正常运行。除了 GPU 的核心图形加速功能 外，RDNA4 还带来了改进的媒体和显示功能，使整个系统更加完善。 公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自 chipsandcheese，谢谢 。 RDNA4 是 AMD 最新的图形架构，并补充了其 RX 9000 系列独立 GPU。AMD 指出，打造一款优 秀的游戏 GPU 不仅需要了解当前的工作负载，还需要考虑未来五年的工作负载情况。因此，AMD 一直在努力提高光栅化、计算和光线追踪的效率。机器学习在游戏领域等重要领域日益重要，因此 AMD 的新 GPU 架构也适用于机器学习工作负载。 Media Engine 媒体引擎为各种编解码器提供硬件加速的视频编码和解码。高端 RDNA4 部件（例如 RX 9070XT） 配备两个媒体引擎。RDNA4 的媒体引擎具有更快的解码速度，通过加速到空闲模式，有助于在视频 播放期间节省电量。对于视频编码，AMD 致力于提高 H.265、H.265 和 AV1 ...

Core Viewpoint - China has initiated anti-dumping investigations against certain imported analog chips from the United States in response to perceived aggressive actions by the U.S. in the semiconductor sector, claiming violations of WTO rules and harm to domestic industries [2][3][15]. Group 1: Anti-Dumping Investigation - The Ministry of Commerce of China received a formal application for an anti-dumping investigation on July 23, 2025, from the Jiangsu Semiconductor Industry Association, representing the domestic analog chip industry [3]. - The investigation will cover imported analog chips from the U.S. with a focus on general interface and gate driver chips, which have seen a 37% increase in import volume and a 52% decrease in import prices from 2022 to 2024 [2][3]. - The investigation period is set from January 1, 2024, to December 31, 2024, with the damage assessment period from January 1, 2022, to December 31, 2024 [3][4]. Group 2: Investigated Products - The investigation targets certain analog integrated circuit chips, specifically those using 40nm and above process technology, including general interface chips and gate driver chips [4][5]. - General interface chips include various types such as CAN transceiver chips, RS485 transceiver chips, and digital isolator chips, which are used in automotive and industrial applications [5][6]. - Gate driver chips are designed to control power semiconductor devices, enhancing their switching speed and efficiency [6]. Group 3: Investigation Procedures - Interested parties must register to participate in the investigation within 20 days of the announcement, providing relevant information about their operations and the products involved [7][9]. - The Ministry of Commerce will utilize methods such as questionnaires, hearings, and on-site inspections to gather information during the investigation [11][18]. - The investigation is expected to conclude by September 13, 2026, unless extended under special circumstances [14][19]. Group 4: Discrimination Investigation - The Ministry of Commerce has also launched an anti-discrimination investigation against U.S. measures affecting China's semiconductor industry, citing evidence of discriminatory practices since 2018 [15][16]. - The investigation will assess various U.S. actions, including tariffs and restrictions on exports of semiconductor products and manufacturing equipment to China [16][17]. - The investigation will follow similar procedures as the anti-dumping investigation, with a typical duration of three months [19][21].

Core Viewpoint - Apple has officially launched its long-awaited self-developed Wi-Fi 7 chip, the N1 chip, which is now integrated into the new iPhone 17 series and iPhone Air, marking a significant shift in its connectivity strategy [2][9]. Summary by Sections Wi-Fi 7 Chip Development - Apple has been working on developing its own Wi-Fi chips for a long time, and the release of the N1 chip signifies its commitment to this strategy [2]. - The N1 chip supports Wi-Fi 7, Bluetooth 6, and Thread connectivity, enhancing the overall performance and reliability of features like AirDrop and personal hotspots [8][9]. Performance Limitations - The N1 chip supports a maximum channel bandwidth of 160 MHz for Wi-Fi 7, which is below the standard's theoretical limit of 320 MHz, potentially limiting its peak speed capabilities [4][8]. - Despite the bandwidth limitation, the actual performance is often constrained by internet service providers and other factors, which may not significantly impact most users [4]. Market Position and Competition - Apple is expected to capture approximately 15-20% of the mobile Wi-Fi chip market following the transition from Broadcom to its own N1 chip [10]. - The success of the N1 chip will depend on Apple's ability to ensure interoperability with a wide range of Wi-Fi devices produced by various manufacturers [10][11]. Industry Interaction - There are concerns regarding how Apple will interact with other participants in the Wi-Fi ecosystem, as effective collaboration is crucial for optimizing user experience [11]. - The industry anticipates that Apple will need to provide sufficient information to access points or service providers to enhance the overall quality of experience for users [11].

Core Viewpoint - Japan is providing 536 billion yen (approximately 3.63 billion USD) to Micron Technology for R&D and capital expenditures at its Hiroshima factory, aiming for large-scale production of advanced memory chips [1] Group 1: Investment and Production Plans - Micron plans to invest 1.5 trillion yen in the Hiroshima factory by the end of fiscal year 2029 to produce cutting-edge semiconductors, with shipments expected to start between June and August 2028 [1] - The factory's maximum capacity is targeted to expand to 40,000 wafers per month, with this level expected to be reached between March and May 2030 [1] - The Japanese Ministry of Economy, Trade and Industry will provide up to 500 billion yen in subsidies for these capital expenditures, covering one-third of the total costs [1] Group 2: Research and Development Funding - An additional 36 billion yen will be allocated for R&D over the next five years, which is about half of the expected costs for developing high-speed, high-capacity, energy-efficient DRAM [1] - This memory is anticipated to be utilized in data center GPUs and autonomous driving technologies [1] Group 3: Local Sourcing and Workforce Development - Approximately 80% of Micron's production materials are sourced from Japan, and the company is actively recruiting and training talent in Japan, which influenced its decision to invest in the Hiroshima facility [1]

Core Viewpoint - The article discusses the evolving challenges in static timing analysis (STA) within the semiconductor industry, emphasizing the need for adaptation to new factors affecting timing, such as voltage drop, thermal effects, and aging, particularly with the rise of advanced technologies like 3D stacking [3][4][7]. Group 1: Static Timing Analysis (STA) Evolution - STA has been a foundational technology for ensuring that designs meet timing requirements, but it must evolve to address new timing challenges that arise from increased complexity and activity-related factors [3][4]. - Traditional methods relied on fixed delay calculations, but as designs grow larger and more complex, the need for dynamic analysis that considers various influences becomes critical [4][5]. - The industry is moving towards incorporating thermal effects and aging into STA processes, as these factors significantly impact performance and reliability [7][8]. Group 2: Factors Affecting Timing - Voltage drop due to increased current demands at advanced nodes is a significant concern, leading to potential performance degradation if not properly managed [5][6]. - Thermal effects are becoming more pronounced with the adoption of 3D stacking technologies, necessitating a shift towards thermal-aware STA methodologies [7][8]. - Aging and manufacturing variations are increasingly important, especially in long-lifecycle products, requiring more sophisticated analysis techniques to predict their impact on timing [7][8]. Group 3: Methodologies and Tools - There is no one-size-fits-all methodology for STA; approaches must be tailored to specific markets, technology nodes, and performance requirements [8][9]. - Companies are adopting instance-based analysis to better understand the effects of voltage drop and aging on timing, which involves detailed modeling of each component's performance under varying conditions [6][9]. - The integration of voltage and temperature sensors within chips is emerging as a solution to dynamically adjust clock frequencies in response to detected timing issues, enhancing design reliability [10][11]. Group 4: Future Outlook - The complexity of modern chip designs is increasing, leading to greater demands on STA tools for accuracy and computational efficiency [10][11]. - As the industry continues to innovate, addressing the challenges posed by new technologies will be essential for maintaining the relevance of STA [10][11]. - The ongoing evolution of STA reflects the industry's need to balance accuracy with computational costs, ensuring that designs can meet performance targets without excessive resource expenditure [10][11].