公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容 编译自wifinowglobal. 。 苹果长期以来一直致力于内部开发Wi-Fi芯片，这已是公开的秘密。昨天，苹果终于发布了期待已久 的自主研发Wi-Fi 7芯片。N1芯片现在为从iPhone 17 Pro Max到iPhone Air的全系列新手机提供Wi- Fi连接。那么，这将如何影响Wi-Fi行业？最重要的是，新的N1芯片性能如何？ 昨天举行的苹果九月发布会（精简版可在此处查看）终于揭晓了苹果全新 Wi-Fi 芯片"N1"，同时也 标志着一个时代的终结：自 2008 年 iPhone 3G 以来，苹果一直在使用博通芯片提供 Wi-Fi 连接 （2007 年首款 iPhone 2G 使用的是 Marvell Wi-Fi 芯片）。那么，iPhone爱好者们对搭载 N1 芯片 的 Wi-Fi 7 连接有何期待呢？ N1 支持 Wi-Fi 7、蓝牙 6 和 Thread 的全部功能，但苹果公布的关于其功能的细节却寥寥无几，例 如峰值数据速率等。相反，苹果强调通过改进与其他 iPhone 硬件和软件（例如 Airdrop、个人热点 和基于 AI 的服 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自半导体行业观察综合 。 台积电正在将其位于新竹科学园区的已停产的旧8英寸晶圆厂3号晶圆厂重新利用，用于生产极紫外光 防护薄膜（extreme ultraviolet pellicles），并将该生产流程移至内部。 极紫外光防护薄膜是一种高度透明的薄膜，覆盖在光掩模上方，用于防止在极紫外光曝光期间颗粒接 触光掩模。其设计旨在承受强烈的极紫外辐射和热应力，同时最大限度地减少光吸收和波前畸变。生 产防护薄膜可以缩短更换周期，并更好地控制组件。在极紫外光环境下，组件必须保护光掩模免受颗 粒物的影响，同时还要应对极端的曝光条件。 与传统的深紫外 (DUV) 工艺不同，EUV 系统采用 400 W 光源，局部加热温度最高可达 1,000°C， 这增加了污染风险，并使防护薄膜的性能对晶圆良率的影响更大。 防护薄膜的经济性促使人们采取不同的方法。深紫外光防护薄膜价格相对低廉，约为 600 美元，这 使得其在早期节点中得到广泛应用。然而，EUV 变体的定价已接近 30,000 美元，这一大幅上涨阻碍 了一些芯片制造商的全面部署，并可能导致了已记录的产量差距。 通 ...

第二届湾区半导体产业生态博览会（简称：湾芯展2025）将于 10月15-17日 在 深圳会展中心（福田）1/2/9 号馆 盛大开幕！本届展会覆盖 60,000m 2 展览面积，聚焦半导体全产业链的高效整合，以晶圆制造为核心纽 带，全面展示从IC设计到封装测试的产业生态，携手来自全球 600余家 半导体优质企业，预计为 60,000+ 专 业观众带来贯穿半导体产业链的前沿技术成果和最新解决方案。 不一样的展会 承上启下 本届湾芯展的国际展商数量同比增长超50% ，国际化水平实现跨越式提升。湾芯展的巨大国际吸引力，植根 于中国市场的广阔前景与展会自身的精准定位。对于国际企业而言，湾芯展不仅是展示其尖端技术、先进产品 和解决方案的绝佳舞台，更是深入了解中国本土应用需求、实现 "技术落地" 与 "市场拓展" 双重目标的重要 通道。 以晶圆制造为纽带,打通全产业链 湾芯展2025以晶圆制造为核心纽带，深度联动IC设计、先进封装、化合物半导体等关键环节，构建起半导体 全产业链的"生态展示圈"，涵盖EDA/IP、半导体设备、半导体材料、核心零部件、晶圆制造、封装测试等前 沿技术，以场景化方式集中呈现半导体领域最新成果、前沿 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 Jim Keller 表示，Tenstorrent 正在建造一座特殊的电脑工厂，目标是生产所有现代高阶AI 电脑和高 性能处理器所需的零组件。一直以来，Tenstorrent 一直致力于打造高阶AI 电脑和具备大量IP 与技 术的高速CPU，如今产品已经开始出货，包括可扩展的Galaxy box 伺服器，以及为了回应客户抱怨 噪音而设计的水冷quiet box 等。此外，我们还推出了PCI Express卡，并刚开始向客户提供Eson TPU 作为IP。令人兴奋的是，还已经将AI 处理器出货给多家客户，其中包含LG，他们将AI 处理器 整合到电视芯片中。 于这些Tenstorrent 的成果，Jim Keller 强调自己是个任务导向的人，虽然长远来看也希望公司能够 赚 钱 。 但 更 重 要 的 是 要 有 一 个 使 命 ， 就 是 当 今 AI 世 界 正 在 彻 底 改 变 一 切 ， 随 处 都 可 见 对 「 千 兆 瓦」、「兆位元组」 产品的需求。但这一切都变得越来越大、越来越昂贵，而且很多技术是专有 的。尽管有些模型是开源的，但大部分仍然是封闭的 ...

Core Viewpoint - The article discusses the growth and challenges faced by China's RF front-end companies in the context of U.S. sanctions and the competitive landscape dominated by foreign firms, highlighting both opportunities and risks in the industry. Group 1: Market Dynamics - Following U.S. sanctions in 2019, China's RF front-end companies experienced significant growth, with many emerging firms like Zhaoshengwei, Weijiechuangxin, and others contributing to the sector [1] - In 2023, domestic smartphone manufacturers successfully launched flagship models using fully domestic chips, allowing local RF front-end manufacturers to achieve mass production of a full range of RF front-end chips [1] - Despite initial growth, by 2025, many domestic RF front-end companies faced a growth bottleneck, with notable declines in revenue and profitability among key players [1][2] Group 2: Competitive Landscape - The top five global RF front-end companies are predominantly American, with Qualcomm, Broadcom, Skyworks, and Qorvo leading the market, while domestic companies collectively generate less than 20 billion yuan in sales [2] - The new U.S. tariff policies since April 2025 have prompted Chinese smartphone brands to seek domestic RF front-end solutions, creating a second wave of opportunities for local manufacturers [2] - The article anticipates that by 2026, domestic RF front-end companies could overcome current challenges and see revenue growth, particularly in the high-integration module segment [2] Group 3: Technological Challenges - Domestic RF front-end companies face significant hurdles in patent accumulation, particularly in filter and SOI switch technologies, where foreign competitors have a stronghold [3] - The need for customized high-integration modules for different smartphone brands requires substantial R&D investment, posing a challenge for domestic firms [4] - The article emphasizes the importance of innovation and patent accumulation for domestic companies to compete effectively against established foreign players [3][5] Group 4: Future Outlook - The increasing demand for advanced communication technologies, such as 6G and satellite communication, necessitates ongoing investment in RF front-end technology development [5] - The article suggests that while domestic RF front-end companies have made progress, they must remain vigilant and committed to long-term development to close the gap with leading global firms [6]

华邦电第三季季涨60％，第四季再涨二成，华邦电第四季合约价相较第二季低谷，涨幅高达80～ 90％，涨势一发不可收拾，法人估，两厂皆有望提早转亏为盈。 公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自半导体行业观察综合 。 下半年电子业传统旺季来临，记忆体市场再次掀起涨价风潮，继第三季报价走扬后，第四季仍可望季 增20％～50％涨幅。台韩记忆体制造大厂纷纷控产，使得市场供给更加吃紧。 市场传出，南亚科第三季合约价季对季大涨70％，第四季季涨50％。 *免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该 观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。 END 市场法人分析，AI浪潮带动运算与储存需求持续飙升，全球记忆体供需结构已彻底改观，传统景气循 环模式正在被改写。 特别是DDR4产品，随着减产与停产进程推进，供不应求格局几乎确立。法人预期，南亚科与华邦电 将成为最大受惠者。 随着全球记忆体产业加速迈向DDR5与高频宽记忆体（HBM）世代，DDR4规格逐步迈入停产（End of Life, EOL）。 法人估算，至2 ...

Core Viewpoint - The article discusses the emergence and significance of Ultra Ethernet (UE) in high-performance computing (HPC) and artificial intelligence (AI) sectors, highlighting its advantages over traditional InfiniBand networks, particularly in large-scale deployments [1][27]. Group 1: Ultra Ethernet Overview - Ultra Ethernet Consortium (UEC) was established in July 2023, comprising major companies like AMD, Intel, and Microsoft, aiming to develop an open standard for high-performance Ethernet [2]. - The UE specification 1.0 is set to be released in June 2025, with over 100 member companies expected by the end of 2024 [2]. Group 2: Compatibility and Scalability - UE is designed to be compatible with existing Ethernet infrastructures, allowing for easy deployment without the need to dismantle current systems [3]. - It supports massive scalability, accommodating millions of network endpoints, which is essential for future AI systems [3]. Group 3: Performance Features - High performance is achieved through efficient protocols designed for large-scale deployments, enabling point-to-point reliability without added latency [4]. - UE introduces features like packet spraying to enhance load balancing and reduce congestion issues [16]. Group 4: Network Types and Applications - UE distinguishes between three network types: local networks, backend networks, and frontend networks, with a primary focus on backend networks for high bandwidth applications [6][8]. - The specification supports various configurations tailored for HPC and AI workloads, allowing for flexibility in implementation [15]. Group 5: Loss Detection and Recovery - UE defines advanced loss detection mechanisms to improve response times for lost packets, including packet trimming and out-of-order counting [19][20]. - The framework allows for efficient handling of packet loss scenarios, reducing unnecessary retransmissions and optimizing bandwidth usage [19]. Group 6: Future Outlook - The anticipated hardware for UE is expected to launch in Fall 2025, with initial products already being developed by various suppliers [24][25]. - As UE gains traction, it may emerge as a competitor to InfiniBand, particularly in AI-driven data center networks, while still leveraging the strengths of existing Ethernet technologies [27].

陈福阳上周表示，博通已在该领域获得一个重要的新客户——后来知情人士透露是 OpenAI——并表 示 2026 年定制 AI 芯片的销量将远高于之前的预测。 陈福阳周二在高盛集团的一次会议上表示，他拒绝透露明年或2027年该业务的销售额预期。彭博社调 查的分析师平均预计，2025年的AI芯片销售额将接近200亿美元。 陈福阳上周表示，他和董事会已达成一致，他将"至少"留任博通首席执行官至2030年。 博通加大力度挑战英伟达 公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容 编译自彭博社 。 博通公司首席执行官陈福阳（Hock Tan）的续约合同中包含一项条款，如果公司到2030年人工智能 产品销售额达到1200亿美元，他将获得数亿美元的股票薪酬。 根据周二提交的监管文件，如果到2030财年人工智能收入达到900亿美元，陈福阳将获得610,521股 博通股票。按目前的股价计算，这些股票价值约为2.055亿美元。如果销售额达到1200亿美元，陈福 阳将获得300%的薪酬，按当前水平计算约为6.166亿美元（约43.91亿人民币）。 这笔薪酬方案凸显了博通致力于成为人工智能计算领域主要参与者的使命。该公 ...

Core Viewpoint - Marvell, once a semiconductor giant benefiting from AI custom chip demand, has faced a dramatic stock price decline, dropping 18.6% in a single day and over 40% year-to-date, raising concerns about its future growth prospects in the AI sector [1][2][3]. Financial Performance - Marvell's Q2 revenue reached $2.01 billion, a 58% year-over-year increase, but the Q3 revenue guidance of approximately $2.06 billion fell short of analyst expectations of $2.11 billion, triggering market reactions [4][7]. - The data center segment, which is crucial for Marvell, saw a 69% year-over-year revenue growth to $1.49 billion, but it did not meet market expectations, leading to investor concerns about future growth [7][8]. Market Dynamics - Marvell's reliance on major clients like Amazon and Microsoft has created vulnerabilities, especially as these clients adjust their strategies, impacting Marvell's order flow and revenue expectations [9][10]. - The competitive landscape has shifted, with Nvidia entering the ASIC market and maintaining high growth, contrasting sharply with Marvell's recent struggles [3][12]. Business Structure Challenges - Marvell's business model is heavily dependent on its data center segment, which contributes approximately 75% of total revenue, making it susceptible to fluctuations in demand from a few large clients [9][10]. - Other business segments, such as carrier infrastructure and consumer electronics, have underperformed, further exacerbating Marvell's challenges as they fail to provide a buffer against the slowdown in the data center business [13][14][15]. Competitive Pressures - The ASIC market is becoming increasingly competitive, with companies like Broadcom dominating with a market share of 55%-60%, while Marvell holds only 13%-15% [16][17]. - Nvidia's emphasis on its GPU ecosystem and performance efficiency poses a significant challenge to Marvell's ASIC offerings, raising doubts about their competitiveness in the AI market [16][17]. Future Outlook - Despite current challenges, Marvell has opportunities for recovery, particularly in its high-speed interconnect business and the long-term growth potential of the ASIC market [22][23]. - To regain stability, Marvell must diversify its client base, enhance its technological capabilities, and optimize profitability to navigate the competitive landscape effectively [24][25].

来源 ： 内容来自 经济日报 。 台积电先进封装接单火热，台积电营运／先进封装技术暨服务副总经理何军昨（9）日表示，和封测 龙头日月光投控一样，「我们共同客户都追赶着非常紧」。 公众号记得加星标⭐️，第一时间看推送不会错过。 他提到，随客户产品上市时间愈来愈快，现在台积电部署先进封装产能已无法像过去一样按部就班， 有时甚至要把时程缩短至一年，甚至变成三个季度内就要把产能拉到颠峰，等于技术开发还没到位就 要先拉机台。 先进封装在全球半导体重要性大幅提高，台积电在发展先进封装10多年后，将首度设立后段先进封 装，类似「总厂长」编制。这项组织规画意味过去曾被视为「小媳妇」的台积电后段先进封装终于有 了出头天，成为台积电大啖人工智能（AI）芯片商机的关键核心团队。 业界分析，何军「客户追着非常紧」、「现在台积电部署先进封装产能已无法像过去一样按部就班」 等谈话，凸显AI芯片需求强劲，推动配套的先进封装同步火热。台积电早在2008年投入先进封装， 也因为先进封装让台积电拿下更多晶圆代工大单，提供客户完整服务。 何军直言，过去几代AI的演进，让客户产品上市时间愈来愈快，因此，先进封装产能量产速度也需要 加快。 他提到，过 ...