据法律界人士推算，2025年12月底将是强制出售的最后期限。 这一强制出售令标志着继荷兰安世 半导体事件后，又一起中资半导体投资遭遇海外政府以"国家安全"为由的粗暴干预，严重扰乱了全 球半导体产业开放交流与合作的良性生态。 被强令出售的行业隐形冠军FTDI： 全球USB桥接芯片生态关键拼图 2021年12月，中国半导体领域知名投资机构建广资产以4.14亿美元收购全球芯片设计细分领域龙 头FTDI公司80.2%的股权。2024年11月5日，英国政府以模糊的"国家安全"为由，强制要求其出售 FTDI的全部股权。 荷兰政府强制接管安世半导体事件的余波尚未平息，英国政府又向中资企业收购的芯片公 司FTDI伸出干预之手，上演英国版的"安世之乱"。 FTDI （ Future Technology Devices International ） ， 是 全 球 USB 桥 接 芯 片 领 军 企 业 ， 成 立 于 1992年，总部位于英国格拉斯哥，专业从事USB桥接芯片相关产品设计、研发和销售，包括USB 桥接芯片、模组、电缆及配套软件等，产品主要应用在汽车电子、IOT 互联网、工业产品、医疗 设备、新能源，以及高端消 ...

Core Viewpoint - NXP Semiconductors is exiting the 5G power amplifier market due to a bleak outlook for the 5G market, which has seen a significant decline in deployment and investment returns [2][3]. Market Conditions - The 5G market has been characterized by low investment returns for mobile operators, leading to a slowdown in deployment rates. The global deployment of 5G base stations has fallen significantly below initial expectations [3]. - 5G product sales have declined for two consecutive years, with revenues dropping from $45 billion in 2022 to $40 billion in 2023, and projected to decrease further in 2024 [3]. Company Performance - NXP's revenue from its "Communication Infrastructure and Other" segment fell nearly 20% to under $1.7 billion last year, and further declined by 25% to $962 million in the first nine months of this year [4]. - The decline in revenue has been attributed to decreased sales of processors, security cards, and RF power products [4]. Strategic Decisions - NXP has decided to gradually reduce its RF power product line, with the ECHO fab expected to produce its last GaN wafer in Q1 2027 [3][4]. - The closure of the ECHO fab will lead to job losses, although the exact number of affected employees is unclear [5]. Competitive Landscape - NXP was previously a market leader in supplying power amplifiers to major base station manufacturers, including Nokia and Huawei. However, it has lost market share to competitors like Sumitomo Electric due to its slow response to industry changes [5][6]. - The exit from the 5G market may impact the supply chain diversity for Western equipment manufacturers, as they will need to seek alternative components [6].

公众号记得加星标⭐️，第一时间看推送不会错过。 为何混合键合成为必选项？ 对于NAND厂商而言，伴随着层数的不断攀升，采用混合键合的必要性正在不断增加。 从技术层面来看，当NAND层数突破300层后，传统的单片制造架构开始遭遇系统性瓶颈。在PUC （Peri under Cell，单元下外围电路）架构中，外围电路被构建在晶圆的最底部，而数百层的存储单 元堆叠在其上。这意味着外围电路必须承受整个堆叠制程的高温考验——其长期暴露在高温环境中， 导致晶体管性能退化、良率恶化，可靠性问题日益突出。 而根据业内人士透露，SK海力士在321层V9 NAND之前一直采用PUC工艺。但随着层数增加，外围 电路故障的可能性也随之增加。三星电子在推进V9（286层）到V10（400+层）的过程中，同样面临 这一挑战。更关键的是，堆叠效率的下降让单纯依靠增加层数变得越来越不经济。 提前一个世代的决策背后，是残酷的市场竞争现实。三星电子正全力冲刺400多层的V10 NAND，其 采用的混合键合外围单元（CoP）架构已经完成技术验证。虽然三星V10的量产之路并不顺利——原 定今年年底开始量产的计划已经推迟，超低温蚀刻设备的评估仍在进行 ...

Core Viewpoint - Qualcomm's acquisition of Ventana Micro Systems demonstrates its commitment to advancing the RISC-V standard and ecosystem, enhancing its CPU capabilities and solidifying its leadership in various business areas during the AI era [2][4]. Group 1: Acquisition Details - Qualcomm has acquired Ventana Micro Systems, integrating its expertise in RISC-V instruction set architecture (ISA) development to bolster Qualcomm's CPU strength [2][3]. - The acquisition allows Qualcomm to complement its ongoing RISC-V and custom Oryon CPU development, aiming to innovate in energy efficiency and performance [3][5]. - Ventana, established in 2018, has developed several generations of high-performance RISC-V CPU designs primarily targeting data center and enterprise applications [3][5]. Group 2: Technical Specifications - Ventana's Veyron V2 chipset design can support up to 32 RISC-V RVA23 compatible CPU cores, with a maximum clock speed of 3.85 GHz and up to 1.5 MB of L2 cache per core, sharing 128 MB of L3 cache [5][6]. - Each core features a 512-bit vector unit based on the RVV 1.0 specification and a custom matrix computation accelerator for AI and machine learning applications, achieving 0.5 TOPS (INT8) per core per GHz [5][6]. Group 3: Future Prospects - Ventana's next-generation Veyron V3 chip design is expected to achieve higher clock speeds of up to 4.2 GHz and enhanced matrix math units supporting FP8 data types [6]. - Qualcomm has not disclosed when it will launch chips based on Ventana's RISC-V IP, but it aims to re-enter the data center CPU market after previous attempts with Arm architecture [6][7]. - The ongoing legal disputes with Arm may lead Qualcomm to further explore RISC-V as a viable alternative if relations deteriorate [7].

Core Insights - The article discusses the current state of US-China relations through the lens of Nvidia's chip exports to China, particularly focusing on the H200 chip and its implications for AI technology competition between the two countries [2]. Group 1: Nvidia's Chip Products - The H200 chip, part of Nvidia's Hopper series, is set for large-scale deployment in 2024 and is crucial for AI computing, enabling the transformation of vast data into AI software [2]. - The H20 chip was designed as a derivative of the Hopper series to comply with US restrictions on chip performance for Chinese customers, but it has significant limitations in memory capacity and speed [4]. - The B200 chip, Nvidia's flagship product, is expected to launch by the end of 2024, with strong market demand leading to a 66% year-over-year revenue increase in the data center business, reaching $51.2 billion [5]. Group 2: Market Dynamics and Regulations - The US government has historically imposed restrictions on chip exports to China to hinder its AI infrastructure development, impacting Nvidia's sales in the Chinese data center market [4]. - Despite initial plans to allow exports of the H20 chip, the US later prohibited its sale to China, leading to a shift in Chinese companies towards domestic alternatives [4]. - Nvidia's co-founder estimated that the Chinese data center market could reach $50 billion by 2025, highlighting the potential market size despite current export challenges [4].

来自 AMD、英伟达、博通和主要研究公司的越来越多的预测表明，在人工智能基础设施建设规模比 该行业历史上任何一次扩张都大数倍的推动下，半导体市场将在本十年结束前突破万亿美元大关。 Creative Strategies 的最新分析将这种转变称为"千兆周期"（Gigacycle），并指出人工智能前所未 有的需求规模正在同时重塑计算、内存、网络和存储的经济格局。2024 年全球半导体收入约为 6500 亿美元，但目前多项预测显示，2028 年或 2029 年将突破万亿美元大关。人工智能是造成这一预测 上调的主要原因。 AMD首席执行官苏姿丰(Lisa Su)近期上调了公司长期预期，称到2030年人工智能硬件市场规模将达 到1万亿美元，并预测AMD整体复合年增长率将达到35%，数据中心业务的复合年增长率将达到60% 左右。她还公开反对近几个月来盛行的人工智能泡沫论调。 与此同时，英伟达给出了更为宏大的预期，在2026年第二季度财报电话会议上，该公司将未来五年人 工智能基础设施市场规模描述为3万亿至4万亿美元。这一数字基于超大规模数据中心、自主人工智能 项目和企业集群的系统级部署。 公众号记得加星标⭐️，第一时间看推 ...

(a)传统SOT-MRMA器件架构与(b)驰拓科技SOT-MRAM自对准架构对比 以 上 SOT-MRAM 相 关 技 术 研 判 还 参 考 了 近 期 发 表 在 半 导 体 器 件 旗 舰 期 刊 IEEE Electron Dvice Letters 上 的 两 篇 文 章 "High TMR over 156% in Perpendicular SOT-MRAM Realized with Channel Engineering" 及 "Manufacturing-Friendly SOT-MTJ Device With High Reliability and Switching Efficiency" 。 关于浙江驰拓科技有限公司 随着人工智能时代来临，高性能和低功耗存储器的重要性愈发凸显，基于自旋轨道力矩写 入机理的磁随机存储器（SOT-MRAM）因其超高速（亚纳秒级写入时间）、低功耗及无 限次擦写特性，是缓存级非易失存储芯片的研发热点。知名集成电路研究机构和领先代工 厂如IMEC、TSMC、台湾工研院、东北大学等在 SOT-MRAM存储器件、工艺及架构等领 域已探索多年，中国公司驰拓科技、致 ...

在今年的IEEE国际电子器件会议（IEDM 2025）上，世界领先的先进半导体技术研发创新中心imec 首次成功展示了利用极紫外（EUV）光刻技术在晶圆级上制备固态纳米孔的成果。固态纳米孔正逐渐 成为分子传感领域的强大工具，但尚未实现商业化。此次概念验证是实现其低成本（大规模）生产的 关键一步。 纳米孔是蚀刻在氮化硅膜上的微小孔洞，宽度仅为几纳米。当浸入液体中并连接到电极时，单个分子 可以通过这些孔洞，产生可实时分析的电信号。由于孔径易于调节，纳米孔的应用范围十分广泛，从 病毒鉴定到DNA和蛋白质分析均可胜任。这种无需标记的单分子检测方法是下一代诊断、蛋白质组 学、基因组学乃至分子数据存储应用的关键。 公众号记得加星标⭐️，第一时间看推送不会错过。 另一方面，由脂质膜中的蛋白质形成的生物纳米孔已应用于商业测序平台，但其稳定性及集成性仍面 临挑战。固态纳米孔凭借其稳健性、可调控性和与半导体制造的兼容性克服了这些限制，使其成为可 扩展、高通量传感的理想选择。然而，在大面积范围内实现纳米级精度和均匀性的固态纳米孔仍然是 一个挑战。目前的制造方法通常速度较慢且仅限于实验室环境，这阻碍了其在传感应用中的广泛应 用。 在 ...

Core Viewpoint - DNP has developed a technology that could reduce energy consumption in advanced semiconductor manufacturing by 90%, significantly lowering the production costs of AI chips [2]. Group 1: Technology Development - DNP plans to start mass production of a template material for manufacturing cutting-edge 1.4 nm chips by 2027 [2]. - The current manufacturing of such advanced chips requires EUV lithography equipment, which is exclusively produced by ASML Holding [2]. - Lithography processes account for 30% to 50% of the total cost of chip manufacturing, with smaller circuit sizes leading to increased power consumption [2]. Group 2: Market Dynamics - Canon has begun selling semiconductor lithography machines in 2023, which consume less power than EUV equipment, with an estimated price of several billion yen (approximately 6.4 million USD) [2]. - The introduction of nanoimprint lithography technology could face challenges in large-scale production due to the need for high economic efficiency [3]. - Major companies like Samsung and TSMC plan to start mass production of 1.4 nm chips in 2027 and 2028, respectively, and are interested in nanoimprint lithography technology [3]. Group 3: Industry Opportunities - If the nanoimprint market expands, it could create opportunities for material manufacturers like DNP [4]. - Fujifilm Holdings has announced plans to enter the market by producing materials for circuit formation on wafers [4]. - Canon is set to deliver its first nanoimprint lithography equipment to the Texas Instruments research institute in 2024 [4].

公众号记得加星标⭐️，第一时间看推送不会错过。 据《连线》杂志报道，两位直接了解该协议的消息人士透露，英特尔已签署一份收购人工智能芯片初 创公司SambaNova Systems的意向书。 意向书的具体内容尚不清楚。该协议不具约束力，这意味着交易尚未最终敲定，可以无条件解除。从 获得监管部门批准、完成责任审查到完成财务尽职调查，可能需要数周甚至数月的时间。 英特尔有意收购这家初创公司的消息最早由彭博社于10月下旬报道。当时，双方的谈判尚处于早期阶 段。报道指出，SambaNova的售价可能低于该公司在2021年4月公布的50亿美元估值。 89 亿美元的注资，计划用于扩大国内半导体制造规模。 参考链接 https://www.wired.com/story/intel-signs-term-sheet-sambanova-ai/ （来 源 ：编译自wired ） 值得注意的是，英特尔首席执行官陈立武目前担任SambaNova Systems的执行董事长。英特尔正在 分拆成立独立基金的英特尔资本也投资了SambaNova Systems。SambaNova的另一位投资者——日 本软银集团——今年早些时候对英特尔进 ...