公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自 money，谢谢 。 过去，当全球化浪潮高涨，中国台湾产业多以成本为导向，向劳力便宜、生产成本低的地区进行布 局。然而，地缘政治风险升高，全球供应链重组成为趋势，"地球不再是平的"，中国台湾的产业策略 也随之转向，更注重生产韧性、市场贴近与终端应用的回应能力。 中国台湾半导体产业在全球有关键地位，根据工研院IEK Consulting统计，台湾半导体产业2024年 总产值达1,656亿美元，全球市占约20.3%。其中晶圆代工市占高达68.8%，封测产业市占49%，皆居 全球领先地位。在IC设计也有重要实力。然而，台湾在半导体上游（如设备、材料）与下游应用端仍 有提升空间，也凸显强化市场分工与合作的重要性。 全球高达83%的AI芯片来自中国台湾半导体代工制造，特别是7纳米以下先进制程领域，更是台湾厂 商重点布局项目。这使台湾在高性能运算、数据中心与边缘计算等应用场景中扮演不可或缺的核心。 回顾中国台湾半导体发展，不仅是科技突破，更是政策、人才与企业三者长年累积的成果。自1980年 代起，台湾积极打造科技园区、发展专业技术教育，建构起完整产业体系 ...

| Ranking | Company | | Revenue | | Market Share | | | --- | --- | --- | --- | --- | --- | --- | | | | 2Q25 | 1025 | QoQ | 2025 | 1Q25 | | 1 | 台积电(TSMC) | 30,239 | 25,517 | 18.5% | 70.2% | 67.6% | | 2 | 三星(Samsung) | 3,159 | 2,893 | 9.2% | 7.3% | 7.7% | | 3 | 中芯国际(SMIC) | 2,209 | 2,247 | -1.7% | 5.1% | 6.0% | | 4 | 联电(UMC) | 1,903 | 1,759 | 8.2% | 4.4% | 4.7% | | રે | 格芯(GlobalFoundries) | 1,688 | 1,585 | 6.5% | 3.9% | 4.2% | | e | 华虹集团(Huahong Group) | 1,061 | 1,011 | 5.0% | 2.5% | 2.7% | | 7 | 世界先进(VIS) | ...

Core Viewpoint - The Ministry of Commerce of the People's Republic of China has initiated an anti-dumping investigation against imported analog chips originating from the United States, following a formal application from the Jiangsu Semiconductor Industry Association, which represents the domestic analog chip industry [1][2]. Group 1: Investigation Details - The anti-dumping investigation will cover imported analog chips from the United States, with the investigation period set from January 1, 2024, to December 31, 2024, and the industry damage investigation period from January 1, 2022, to December 31, 2024 [1][2]. - The investigation will focus on certain analog integrated circuit chips, specifically those using 40nm and above process technology, including commodity interface IC chips and gate driver IC chips [4][5]. Group 2: Product Description - The commodity interface IC chips include various types such as CAN interface transceiver chips, RS485 interface transceiver chips, I2C interface chips, and digital isolator chips, which are used in automotive and industrial applications [4]. - The gate driver IC chips are designed to enhance the control signals for power semiconductor devices, providing necessary voltage and current levels for effective switching [5][6]. Group 3: Participation and Information Submission - Interested parties must register to participate in the investigation within 20 days of the announcement, providing relevant information regarding their identity, product quantities, and financial details [7][10]. - Information submitted during the investigation must be accurate and complete, and parties can request confidentiality for sensitive information [13][14]. Group 4: Investigation Process - The Ministry of Commerce may utilize various methods such as questionnaires, sampling, hearings, and on-site verifications to gather information during the investigation [11]. - The investigation is expected to conclude by September 13, 2026, although it may be extended under special circumstances [15].

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自tomshardware 。 英伟达的 DGX Cloud，曾被定位为面向企业的直连式 AI 云服务，如今在公司战略中悄然退居二线。据 The Information 援引内部人士消息称，这 一 GPU 云平台目前大部分算力已用于英伟达自身的研究，而非继续作为面向客户的核心产品。 在英伟达 2026 财年第二季度财报中，公司已不再将数十亿美元的云支出承诺归因于 DGX Cloud，而此前的财报中这一项目曾被重点披露。虽然 DGX Cloud 仍然出现在收入分类里，但其角色显然已经转向"内部基础设施"，而不是正面迎战微软 Azure 或 AWS。换句话说，DGX Cloud 依然 存在，但已不再是市场竞争的前锋。 DGX Cloud 的兴衰 DGX Cloud 于 2023 年推出，当时的定价为每月每个 H100 实例 36,999 美元。在 GPU 严重短缺的背景下，这样的高价还算合理，但随着供应逐 步改善，这种"紧缺替代方案"的价值已大幅下降。如今，AWS 已将 H100 与 A100 的租赁价格削减高达 45%，这让 DGX Cloud 的 ...

Core Viewpoint - Tower Semiconductor announces the launch of the 2025 Global Technology Symposium (TGS), focusing on key market trends in AI, high-speed interconnects, and other rapidly evolving fields, showcasing its capabilities in high-performance interconnects, energy-efficient architectures, and advanced imaging solutions [1]. Event Highlights - The TGS will take place in Shanghai, China on September 16, 2025, and in Santa Clara, California, USA on November 18, 2025 [1]. - Registration for the TGS in China is now open [1][3]. Agenda Overview - The event will feature a keynote speech by Tower's CEO, Russell Ellwanger, discussing the company's future vision and commitment to driving customer business growth through collaboration [4]. - Expert-led technical discussions will focus on Tower's industry-leading solutions in silicon photonics, silicon germanium, RF SOI, power management, image sensors, and advanced display technologies [4]. - A guest panel with global technology leaders will provide insights on AI innovations and breakthroughs in optical communications [4]. - Opportunities for networking with Tower executives, industry experts, and peers to foster collaboration for the next wave of semiconductor innovation [4]. Detailed Session Topics - Keynote by Russell Ellwanger [5]. - Invited talk by Eoptolink on AI high-speed interconnects [5]. - Discussion on market megatrends and Tower's technology solutions in RF mobile, infrastructure, power, and sensors [5]. - Presentation on Tower's design enablement services [6]. - Overview of power management technologies for system efficiency and integration [6]. - Insights into OLEDoS displays and next-generation image sensor technologies [6]. - Foundry technologies for high-speed data transfer applications, including Tower's silicon photonics and RF SOI technologies [6]. Venue Information - The event will be held at the Aloft Hotel in Zhangjiang, Shanghai [9].

尽管距离 50% 的目标仍有差距，但 Arm 在服务器市场的存在感正快速提升。据 Dell'Oro Group 最 新报告显示，2025 年第二季度，Arm CPU 已占据服务器市场的四分之一份额，而一年前这一数字还 仅为 15%。 Dell'Oro 分析师 Baron Fung 向 The Register 表示，这一增长背后的主要推动力，来自英伟达基于 Grace-Blackwell 架构的机架级计算平台（如 GB200 和 GB300 NVL72）的广泛采用。 Grace-Blackwell 平台的驱动作用 每一台功耗达 120 千瓦的 NVL72 系统都配备了 72 枚 Blackwell GPU 与 36 枚 Grace CPU。这些 72 核芯片首次发布于 2022 年，基于 Arm Neoverse V2 架构，并针对数据传输进行了深度优化，充 分利用英伟达定制的 NVLink-C2C 接口。 首批系统在去年底以小规模出货，今年二季度，基于 Blackwell Ultra 架构的升级版本已开始逐步交 付，CoreWeave 等新兴云服务商成为首批客户。需要注意的是，这些系统与英伟达采用英特尔 C ...

Core Viewpoint - The Intel 1103 chip was the first commercially successful DRAM chip, marking a significant advancement in semiconductor memory over magnetic core memory in terms of price, density, and logical compatibility [1][2]. Group 1: Historical Context - The Intel 1103 was launched in October 1970, aiming to match and surpass the performance and cost of magnetic core memory, which was prevalent at the time [1]. - By 1971, the 1103 became the best-selling semiconductor memory chip globally, adopted by 14 out of 18 major computer manufacturers within two years [2]. Group 2: Technical Specifications - The 1103 chip encapsulated 1024 bits of data in an 18-pin dual in-line package, utilizing p-MOS technology with an 8-micron silicon gate process [4]. - It featured a 32×32 bit internal array, requiring a refresh of all memory every 2 milliseconds, with many designers employing burst refresh strategies [6]. Group 3: Market Impact and Adoption - Despite its technical limitations, the economic advantages of the 1103 led to its widespread adoption, with major systems like HP's 9800 series and DEC's PDP-11 utilizing it as primary memory [10]. - The introduction of the 1103A variant improved timing margins and reduced power consumption, further facilitating its integration into various systems [10]. Group 4: Legacy and Influence - The Intel 1103 established a foundation for future DRAM technologies, paving the way for single-transistor DRAM and influencing the development patterns of DRAM that persist today [13]. - It serves as a reminder that disruptive designs do not always need to be the most elegant, emphasizing the importance of system-level economics over transistor-level perfection [13].

2009 年 4 月，甲骨文公司（Oracle Corp.）做了一桩在当时看来并不划算的买卖。至少按照当时的普遍看法是如此。公司宣布以 74 亿美元收购 Sun Microsystems（扣除 Sun 的现金和债务后净额 56 亿美元）。 简而言之，当时外界对甲骨文首席执行官拉里·埃里森（Larry Ellison，见图）的判断是：为什么一家数据库和企业软件公司要收购一家正在衰落的 服务器公司，还要承担硬件业务带来的成本负担？ 公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自siliconangle 。 甲骨文首席执行官拉里·埃里森（Larry Ellison） 那么，这一切和 Sun 有什么关系？如前所述，收购 Sun 带来的是系统能力，而非单纯的服务器。虽然 Exadata 在收购前就已存在，但此前运行在 HP 硬件上。收购后，甲骨文掌握了软硬件两端，很快将 Exadata 的宣传语定为"工程化系统"：即为硬件而设计的软件，反之亦然。 这种专长在甲骨文进军云计算时派上了用场。2008 年甲骨文 OpenWorld 的主题演讲中，埃里森还曾把云业务斥为"胡言乱语"。但几年后，甲骨文 不得不 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ： 内容来自RFID journal 。 Trackonomy 今日宣布已收购 InPlay，这是一家开创性的下一代低功耗蓝牙（BLE）芯片技术开发 商，其技术应用覆盖医疗健康、游戏、物流以及更广泛的无线物联网市场。 InPlay 是 低 功 耗 蓝 牙 （ BLE ） 创 新 领 域 的 领 导 者 ， 最 为 人 熟 知 的 是 其 NanoBeacon 系 统 级 芯 片 （SoC），该产品专为推动超低成本和大规模普及而设计。公司总部位于加州欧文（Irvine），团队 规模约 20 人，凭借其创新精神、灵活应变能力以及对市场趋势的前瞻把握，InPlay 在行业内建立了 良好声誉。 此 次 收 购 正 值 Trackonomy 从 8VC （ 由 Palantir 联 合 创 始 人 Joe Lonsdale 创 建 ） 及 Kleiner Perkins、Koch Disruptive Technologies、Flexport、惠普（Hewlett Packard）、戴尔（Dell）等投 资方获得 2.5 亿美元融资之际。Trackonomy 曾获 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 曾经炙手可热的HBM内存，似乎在一夜之间黯然失色。 最新发布的英伟达Rubin CPX GPU——一款专门针对预填充阶段优化的芯片，出人意料地选择了成 本更为亲民的GDDR7内存，而非业界习以为常的高端HBM方案。瞬间在行业内引发一场热议。 回顾过往数年，英伟达的AI芯片几乎无一例外地搭载最新一代HBM内存，以满足AI训练和推理对超 高内存带宽的苛刻要求。如今Rubin CPX GPU却反其道而行之，转向带宽相对较低的GDDR7，这不 禁让人产生疑问： 曾经的"内存之王"HBM，真的 会迎来新的威胁吗？ 放弃HBM的AI芯片 至于落地时间表，英伟达计划在 2026 年随 Vera Rubin NVL144 CPX 机架一起推出 Rubin CPX GPU。该机架的配置堪称"巨兽"：144 块 Rubin GPU + 144 块 Rubin CPX GPU，36 颗 Vera CPU，100 TB 高速内存，1.7 PB/s 内存带宽。 在这种组合下，整体性能将达到 8 ExaFLOPs NVFP4，是现有一代 GB300 NVL72 的 7.5 倍，也超 过未配 ...