Core Viewpoint - The 2025 TrendBank (Fifth) Photoresist Materials Industry Conference will be held on July 9-10, 2025, in Hefei, Anhui, focusing on the collaboration between industry, academia, and research to promote industry development [15][9]. Conference Overview - The conference will feature over 20 speakers from the photoresist materials industry, covering various topics related to application terminals, materials, equipment, and processes, providing new insights and prospects for the industry [8][10]. - The event aims to create an interactive platform for upstream and downstream supply chain connections [10]. Agenda Highlights - The agenda includes sessions on advanced lithography technology, market analysis of the Chinese photoresist market, and discussions on challenges and opportunities in new display technologies [5][7]. - Specific topics include the latest advancements in extreme ultraviolet lithography technology, electron beam lithography, and the development of new photoresists for displays [5][7]. Industry Context - The photoresist materials market is characterized by increasing global competition, accelerated technological innovation, and rising barriers to technology protection [13][14]. - The demand for high-performance and high-precision manufacturing processes in the semiconductor chip industry is driving the need for advancements in photoresist materials [14]. Participation and Registration - The conference is expected to host around 300 participants, with registration fees set at RMB 2600 before June 30 and RMB 2800 thereafter [11][9]. - Participants will receive conference materials, guest speaker presentations, and access to meals and a banquet [11]. Background and Significance - The development of the photoresist materials market is crucial for achieving breakthroughs in cutting-edge technology and ensuring the stability and diversification of the supply chain [14]. - Recent government policies at various levels aim to create a favorable environment for the growth of the photoresist materials industry, emphasizing the importance of achieving "win-win" scenarios across the industry chain [14].

Core Viewpoint - The 2025 TrendBank Photoresist Materials Industry Conference will focus on the collaboration between industry, academia, and research to promote the development of the photoresist materials sector, amidst increasing global competition and technological innovation in the semiconductor industry [4][6]. Group 1: Conference Background - The photoresist materials market is experiencing intensified global competition, accelerated technological innovation, and rising barriers to technology protection as of 2025 [4]. - The demand for high-performance and high-precision manufacturing processes in the semiconductor chip industry is driving the need for advancements in photoresist materials [4]. - The international landscape is marked by a blend of cooperation and competition, presenting both significant opportunities and challenges for the photoresist materials industry [4]. Group 2: Industry Development - The growth of China's photoresist materials market is not only a trend but also a crucial element for achieving breakthroughs in cutting-edge technology at the national level [5]. - Various supportive policies have been introduced at both national and provincial levels to create a favorable environment for the development of photoresist materials and related industries [5]. - Companies in the photoresist materials supply chain should seize the opportunity to strengthen their capabilities and pursue a "win-win" strategy across the industry [5]. Group 3: Conference Details - The 2025 TrendBank Photoresist Materials Industry Conference will be held on July 9-10, 2025, in Hefei, Anhui, with a focus on "collaboration between industry, academia, and research to support industry development" [6]. - The conference will cover discussions on semiconductor, display, and packaging photoresists, as well as wet electronic chemicals and specialty gases, addressing technological breakthroughs and application trends [6][9]. - The event will feature over 20 industry chain guest speakers, academic discussions, and a combination of conference and exhibition formats to foster industry interaction and supply chain connections [8][9].

Core Viewpoint - The article discusses the advancements and importance of 3D integrated circuits (3D IC) and the role of EDA tools like 3Sheng Stratify™ in ensuring the accuracy and integrity of stacked chip designs, which are crucial for high-performance applications in various industries [3][30]. Group 1: 3D IC and Advanced Packaging - 3D IC technology provides significant flexibility and reusability in product design, particularly for AI computing and high-end mixed-signal integration [3]. - Stacked chips utilize advanced packaging techniques that are essential for performance, functionality, cost, and iteration methods [3]. - The demand for high-density interconnect advanced packaging is growing across various applications, including military, aerospace, and consumer electronics [4]. Group 2: EDA Tools and Verification - 3Sheng Stratify™ EDA tool offers rapid and accurate assembly-level verification for interconnections between dies and intermediary layers in stacked chip designs [10]. - The tool supports design rule checks (DRC) and layout versus schematic (LVS) checks to ensure consistency and compliance with design specifications [10][12]. - The verification process includes checks for signal integrity and functionality across complex interconnect structures [9]. Group 3: Key Performance Indicators - The EDA tool provides various functionalities, including high-density interconnect verification, static timing analysis, and design rule compliance checks [12][13]. - It also features automated detection of anomalies and supports multi-file collaborative checks to enhance design efficiency [13][14]. - The tool aims to improve manufacturability and reliability of 2.5D designs by ensuring that physical layouts meet manufacturing process specifications [23]. Group 4: Design Rule Checks and Automation - The 3Sheng DRC tool supports a wide range of design rule checks, including geometric rules and special process checks, to ensure compliance with foundry specifications [25][28]. - The tool incorporates machine learning algorithms for anomaly detection in 2.5D designs, enhancing the accuracy of network connection checks [18][20]. - Automated repair features are included to address design rule violations, thereby reducing manual intervention and speeding up the design iteration process [28][29]. Group 5: Future Directions - The company aims to enhance the automation design capabilities for 2.5D/3D/3.5D systems, providing comprehensive design and verification solutions to the industry [31]. - The integration of various design engines within the 3Sheng Integration Platform facilitates rapid design and verification processes, ensuring a balance between performance, power consumption, area, and cost [30].

Core Viewpoint - Asahi Kasei's supply adjustments of PSPI materials have significant implications for the global semiconductor industry, highlighting the tension between surging AI computing demands and limited production capacity [1][2]. Group 1: PSPI Material Overview - PSPI (Photosensitive Polyimide) is a high-performance polymer material that combines excellent dielectric properties, mechanical strength, and heat resistance with photosensitivity, playing a crucial role in semiconductor packaging and advanced packaging processes [3][5]. - The global market for PSPI materials is projected to reach USD 402 million in 2024 and USD 802 million by 2030, with major suppliers dominating approximately 95% of the market share [5][9]. Group 2: Domestic Market and Companies - The domestic PSPI market in China is expected to reach RMB 820 million in 2024, driven by the increasing demand for AI computing chips and advanced packaging technologies [9]. - Key domestic players in the PSPI market include Bomi Technology, Dinglong Holdings, Aisen Semiconductor, and Shengquan Group, with various companies actively developing and producing PSPI materials [10][11][12][13]. Group 3: Company Highlights - Bomi Technology has achieved mass production of PSPI materials and is involved in a national key research project for 2.5D/3D packaging technology [10]. - Dinglong Holdings has developed multiple semiconductor packaging materials and is set to begin mass production in 2024 [11]. - Aisen Semiconductor is launching its first domestic positive PSPI product in 2024 and is also working on various other PSPI types [12]. - Shengquan Group has established a pilot line for PSPI and plans to expand production significantly by 2025 [12].

Core Viewpoint - The article emphasizes the significance of electronic specialty gases, particularly photolithography gases, in the semiconductor industry, highlighting the potential for domestic companies to fill the gap in a market currently dominated by international players [3][4]. Group 1: Electronic Specialty Gases Overview - Electronic specialty gases, also known as electronic gases, are characterized by their high purity and special applications, making them essential materials in industries such as integrated circuits, display panels, and solar cells [1]. - The article categorizes electronic specialty gases into various types based on their applications, including bulk gases, chemical vapor deposition, etching, cleaning, doping, and others [2]. Group 2: Photolithography Gases - Photolithography gases are crucial for the operation of photolithography machines, which directly influence the resolution of these machines. The composition of photolithography gases typically includes argon, neon, krypton, xenon, and fluorides in specific ratios [3]. - Currently, international companies like Linde, Air Liquide, and Taiyo Nippon Sanso dominate over 80% of the global market share for photolithography gases, indicating significant room for domestic alternatives [3]. Group 3: Domestic Companies in Photolithography Gases - The article lists several domestic companies involved in the production of photolithography gases, including their locations and specific products, such as high-purity krypton-neon mixtures and hydrogen [4][5]. - Notable companies mentioned include Huate Gas, KMT Gas, and Qiaoyuan Co., among others, showcasing a diverse range of products aimed at meeting the high purity requirements of the semiconductor industry [4][5]. Group 4: Upcoming Industry Events - The article announces the 2025 TrendBank (5th) Photolithography Materials Industry Conference scheduled for July 8-10 in Hefei, which aims to facilitate discussions on the supply chain and development trends in the photolithography materials sector [6].

Core Viewpoint - The global photoresist market is expected to exceed $15 billion by 2025, with China's market share increasing to 35%, highlighting significant growth potential in the industry [2]. Industry Overview - The photoresist industry is a critical component of high-tech materials, encompassing the entire chain from research and development to production and sales [2]. - In the high-end semiconductor photoresist sector, Japanese companies like JSR and Tokyo Ohka dominate with over 85% market share, while domestic production rates are below 5%, indicating a significant technological and market monopoly [2]. Market Dynamics - The advancement in the photoresist industry is driven by downstream demand, where manufacturers' process improvements necessitate technological iterations in photoresists and raw materials [2]. - Domestic manufacturers are increasingly replacing foreign suppliers and expanding production, creating opportunities for photoresist companies [2]. Supply Chain Components - The upstream of the photoresist supply chain includes raw materials such as resins, monomers, photosensitizers, and solvents; the midstream involves the production and synthesis of photoresists based on formulations; and the downstream includes applications in printed circuit boards, LCDs, and IC chips across various industries [2]. Key Raw Materials - Solvents constitute 50%-90% of photoresist composition, essential for dissolving resins and photosensitizers to create a uniform photoresist solution [3][5]. - Photosensitizers, making up 1%-6% of the composition, are crucial for initiating chemical reactions under specific wavelengths of light, altering the solubility of resins during the development process [3][8]. - Resins account for 10%-40% of photoresist, serving as the inert polymer matrix that binds materials together and determines the basic performance of the photoresist after exposure [3]. Market Players - Domestic companies like Yida Co. hold over 40% market share in electronic-grade PM solvents, while other firms like Xilong Science and Jingrui Electric Materials are also making strides in the solvent sector [7]. - The photosensitizer market is dominated by international players such as BASF and IGM Resins, with a trend of production capacity shifting towards China due to patent expirations and increased domestic demand [10]. Product Types and Applications - Different types of photoresists are used for various exposure wavelengths, with global resin supply primarily monopolized by companies like Sumitomo Chemical and Dow Chemical [11]. - Domestic enterprises such as Shengquan Group and Tongcheng New Materials are making significant advancements in photoresist resin production, with some achieving production capacities exceeding 5,000 tons per year [12]. Upcoming Events - The 2025 TrendBank (Fifth) Photoresist Materials Industry Conference will be held from July 8-10 in Hefei, focusing on new applications, current trends, and in-depth discussions on the photoresist supply chain [13].

Core Insights - The global wafer foundry market is expected to rebound rapidly in 2024, driven by high demand for high-performance computing chips, smartphone chips, and advanced automotive chips [2] - In Q1 2025, the global wafer foundry business revenue increased by 27% year-on-year, marking the fifth consecutive quarter of recovery, although it experienced a 5% quarter-on-quarter decline due to seasonal factors [2] - Chinese domestic company Chipalliance has shown impressive performance, surpassing South Korea's Dongbu HiTek in overall revenue since Q3 2024, ranking 11th globally in wafer foundry business [4] Industry Events - The 2025 TrendBank (5th) Lithography Materials Industry Conference will be held from July 8-10 in Hefei, focusing on in-depth discussions of the lithography materials supply chain and industry development [7] - The conference aims to create an efficient communication platform for government, industry, academia, research, and capital, promoting collaborative innovation in the lithography materials industry [7] Company Overview - TrendBank is a leading industry research and data company in China, providing data, research, consulting, and conference services to support decision-making and business development resources [12]

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 2025势银（第五届）光刻材料产业大会（ 7月8日-10日，安徽·合肥） 点此报名 添加文末微信，加 人形机器人 群 会议背景 加快人工智能技术创新及应用步伐，对促进我国经济高质量发展、经济结构转型升级和现代化产业体系建设具有长远战略意义。我国正处于城市数智 化、新能源化、国际化转型的关键阶段，以科技创新引领新质生产力发展成为重要任务。人形机器人与人工智能技术的发展，能够为我国产业升级提供 强大技术基础，推动企业数字化转型智能化升级，促进形成定制化生产方式，实现经济结构的转型升级。 宁波作 为 我国重要的经济城市 ， 在 新兴产业发展方面具有良好的基础和条件。基于此，在 第四届中国—中东欧国家博览会暨国际消费品博览会 上， 将增设人形机器人与人工智能展区 ，并于 5月23日下午举办" 人形机器人产业创新发展交流会" ，推动人形机器人与人工智能领域的共同发展。 会议主题 具身智能引领未来 会议时间与地点 会议 时 间 ： 202 ...

Core Viewpoint - The semiconductor market is expected to perform better in 2024 compared to 2023, driven by inventory replenishment, advancements in AI and HPC, and increased demand in automotive electronics and new energy sectors [4][5]. Market Overview - The global semiconductor market sales are projected to reach $627.6 billion in 2024, marking a significant growth of 19.1% compared to 2023 [4]. - The global photoresist market is anticipated to grow by 16.15% year-on-year in 2024, with specific growth rates for different types of photoresists: I-line (10.22%), G-line (14.06%), KrF (17.89%), ArF (16.74%), and EUV (21.26%) [5]. Photoresist Market in China - China's semiconductor photoresist market is expected to reach $771 million in 2024, becoming the largest in the world, with a year-on-year increase of 42.25% [5]. - The growth rates for different types of photoresists in China are as follows: G/I-line (29.8%), KrF (42.61%), and ArF (45.84%) [5]. Production Capacity of Photoresist Companies - A survey of 15 companies in mainland China reveals their design production capacities for semiconductor photoresists, with notable capacities including: - Tongcheng New Materials: 1,000 tons/year for G-line, KrF, and ArF [5] - Jingrui Electric Materials: 2,800 tons/year [5] - Feikai Materials: 5,000 tons/year [5] - The continuous investment in new production capacities supports steady growth in the photoresist market [5]. Upcoming Industry Events - The 2025 TrendBank (5th) Photoresist Industry Conference will be held from July 8-10 in Hefei, focusing on new applications, trends, and supply chain discussions [6][7].

Core Viewpoint - The article discusses the advancements and challenges in the 2.5D/3D IC backend design EDA tools, emphasizing the need for collaborative innovation in the heterogeneous integration and advanced packaging sectors to meet the growing demands for AI computing power and overcome existing technological barriers [3][4][5]. Group 1: Event Overview - The "2025 TrendBank Heterogeneous Integration Packaging Industry Conference" was held on April 29, 2025, in Ningbo, co-hosted by TrendBank and Yongjiang Laboratory, with support from Zhuhai Silicon Core Technology Co., Ltd. and Ningbo Electronics Industry Association [1]. - Dr. Zhao Yi, founder and chief scientist of Zhuhai Silicon Core Technology Co., Ltd., delivered a keynote speech focusing on the EDA platform for 2.5D/3D advanced packaging, exploring collaborative innovation in backend design, simulation, and verification [1][3]. Group 2: Industry Insights - The demand for AI computing power has surged, outpacing the growth rate predicted by Moore's Law, leading to a conflict between increasing computational needs and the slow performance growth of chips [4]. - Advanced packaging technologies, such as stacked chips, allow for flexible integration and high-density interconnections, significantly enhancing integration levels and driving improvements in computing speed and storage capacity [4][5]. Group 3: Technical Challenges - The design complexity of stacked chips has increased exponentially, creating a scarcity of comprehensive EDA design toolchains that can address the new challenges in design, testing, and simulation [5]. - Key challenges in the 2.5D/3D Chiplet design field include achieving a cohesive top-level architecture, managing various packaging types, and understanding the benefits of architectural-level analysis [5]. Group 4: Solutions and Innovations - Zhuhai Silicon Core Technology has developed the 3Sheng Integration Platform, which provides a comprehensive solution covering the entire backend design process for Chiplets [5]. - The platform integrates five centers: architecture design, physical design, multi-die testing, analysis simulation, and multi-Chiplet integration verification, facilitating a collaborative design approach that maximizes performance, cost, and testability [5].