Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market sizes and growth rates anticipated [8]. Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, including: - PSPI: $528 million in 2023, expected to grow significantly [8]. - Conductive adhesives: projected to reach $3 billion by 2026 [8]. - Chip bonding materials: expected to grow from approximately $485 million in 2023 to $684 million by 2029 [8]. - The investment landscape is characterized by a shift towards domestic production, with numerous Chinese companies emerging as competitors to established foreign firms [7][8]. Industry Trends - The article emphasizes the trend of domestic substitution in advanced materials, particularly in sectors heavily reliant on imports from countries like Japan [7][8]. - It highlights the importance of innovation and R&D in maintaining competitive advantages within the industry [7][8]. Strategic Insights - Investment strategies vary across different stages of company development, from seed rounds to pre-IPO phases, with a focus on team capabilities, market potential, and product maturity [10]. - The article suggests that the current market conditions present a favorable environment for investments in advanced materials, particularly for companies that can demonstrate strong growth potential and innovative capabilities [10].

Group 1 - AI applications are driving the PCB industry towards a growth cycle, with expectations for both volume and price increases. The demand for HDI and 18+ layer boards is expected to grow significantly due to the rise in AI servers and 5G applications, with global market value CAGR predictions of 6.4% and 15.7% respectively from 2024 to 2029 [3][40]. - Copper-clad laminates (CCL) are identified as the core substrate for PCBs, accounting for approximately 27% of PCB cost structure. Key raw materials include copper foil, resin, and fiberglass cloth, with a shift towards high-frequency and high-speed CCLs driven by AI and 5G applications [4][9]. - The demand for electronic resins is evolving, with a focus on high-performance types such as PTFE, PPO, and hydrocarbon resins. These materials are crucial for meeting the high-frequency and high-speed requirements of modern PCBs, with domestic manufacturers making strides in replacing imported materials [4][9][149]. - The use of high-performance silicon micro-powder is rapidly increasing, driven by the performance upgrades of downstream devices and the growing application of AI servers. The demand for silicon micro-powder in China is projected to reach 473,000 tons by 2025, reflecting a year-on-year growth of 13.2% [4][156]. Group 2 - The global PCB market is projected to recover from a downturn in 2023, with a growth rate of 5.8% in 2024 and a sustained CAGR of 5.2% through 2029, indicating that new AI-driven demands are creating a new growth curve rather than merely a cyclical recovery [23][24]. - China is the largest PCB manufacturing base globally, accounting for 56% of the market value. This proximity to customers enhances supply chain security and responsiveness, positioning domestic material companies favorably for growth [24][21]. - The shift towards high-end PCBs is evident, with a decline in single/double-sided boards and an increase in HDI and packaging substrates. This trend highlights the growing demand for advanced packaging technologies, which require high-performance materials [29][30]. - The demand for high-frequency and high-speed CCLs is expected to grow significantly, with the market size projected to reach approximately $2.8 billion. This segment, while a smaller part of the overall CCL market, is characterized by faster growth and higher profit margins [87][89].

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 材料汇文章标签汇总 如何下载（加入知识星球-材料汇） 材料汇部分文章 未来40年材料强国革命：这13大领域将重塑人类文明！ 国产替代爆发！14种卡脖子的先进封装材料，百亿赛道谁将突围？ | 先进封装材料 | 全球市场规模 | 中国市场规模 | 国外企业 | 国内企业 | | --- | --- | --- | --- | --- | | PSPI | | | 微系统、AZ电子材料 | 鼎龙股份、国风新材、三月科 | | | | 5.28亿美元(23年 7.12亿元(21 | Fujifilm, Toray, HD | 技、八亿时空、强力新材、瑞 | | | 全球) . 预计 | 年中国)、预 | | 华泰、诚志殷竹、艾森股份、 | | | 2028年将达到 | 汁到2025年增 | | 奥采德:波米科技、明士新材 | | | 20.32亿美元 | 长至9.67亿元 | 、旭化成 | 、东阳华芯、上海玟昕、理硕 | | | | | | 科技等 | | 光敏绝缘 | 2020年:0.1亿 | | | | | ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 人工智能算力突破的物理边界、量子计算工程化的核心瓶颈、深空探测的极端环境挑战、高端制造的自主可控难 题，背后都藏着材料科学的终极较量。2025年，中国新材料产业迎来历史性转折： 告别"跟踪仿制"的被动模式，全 面打响"堡垒材料守底线、攻坚材料争主权、融合材料定义未来"的三维战争 。 这一年，第四代单晶高温合金实现量产，打破西方 60 年航发材料封锁；12 英寸硅片自给率翻倍，半导体材料国产 化再提速；AI 赋能研发让新材料迭代效率提升 3 倍…… 无数突破串联起中国从材料大国迈向材料强国的坚实脚 步。 本文将 全景扫描2025年三大战线的关键突破，拆解技术攻坚细节，绘制2026年体系化决战的战略地图 。从国家重 大工程到产业链自主可控，从实验室创新到产业化落地，你关心的核心进展与未来方向，都在这份深度报告中。 | 战场名称 | 战略定位 | 核心目标 | 2025 关键突破 | | --- | --- | --- | --- | | 堡垒材料 | 筑牢国家安全底线 | 极端环境下的绝对可靠 | 第四代单晶高温合 ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 （请添加小编微信，后续会组建 相关行业微信群 ） （欢迎 一级市场投资朋友 加入） 正文 全球科技和产业竞争格局加速重塑，前瞻预判前沿技术和颠覆性技术，谋划布局新兴产业和未来产业发 展成为打造国家竞争新优势的关键。 新材料是高新技术产业发展的基石和先导，新材料的突破将加速新兴和未来产业变革！中国未来产业崛 起引领全球新材料创新发展！ 新一代信息技术、新能源、重大工程与高端装备、生命健康等是中国实现科技强国、制造强国的战略必 争领域 ，也是对新材料有重大需求的重点领域。支撑和满足以上重点领域应用需求，也是未来 10 年中 国新材料发展的重点任务。 一、人工智能发展和数字中国建设对高性能计算与存储、高速及大容量网络通信和智能化人机交互系统 提出更高要求，亟待发展一批新型信息材料 （ 1 ）先进计算与存储关键材料 随着人工智能、超算、云等计算场景的快速发展，未来将会出现百万级的数据中心。传统硅基材料及与 其相配合的周边材料性能，无论在 AI 计算方面还是电能功率方面都接近极限。 异质异构集成 将不同 材料体系、器件结 ...

Core Viewpoint - The new materials industry is crucial for supporting modern industrial systems and achieving high-level technological self-reliance in China, with significant strategic importance for building a strong manufacturing and quality nation [2]. Industry Background and Development Situation - During the 14th Five-Year Plan, China's new materials industry saw continuous growth, with total output value exceeding 8.2 trillion yuan and an average annual growth rate of over 12% [4]. - Achievements include breakthroughs in ultra-high-strength steel, high-performance carbon fiber, semiconductor silicon wafers, and key materials for lithium-ion batteries [4]. - Challenges remain in high-end materials and the need for improved self-sufficiency in core processes and equipment [4]. Overall Requirements - The guiding ideology emphasizes innovation-driven development, demand-oriented approaches, and green low-carbon principles, focusing on enhancing the self-sufficiency of strategic materials and original innovation capabilities [8]. - Basic principles include innovation leadership, application orientation, enterprise-driven collaboration, and green development [9]. Development Goals (by 2030) - Comprehensive security capability for strategic materials to exceed 80%, with a focus on achieving global leadership in original achievements in frontier new materials [11]. - Continuous increase in R&D investment intensity, aiming to break through over 500 key core technologies [11]. - Establishment of over 20 distinctive, complete, and internationally leading new materials industrial clusters [11]. Key Development Directions - Advanced basic materials include ultra-high-strength automotive steel and high-performance aluminum alloys [13][14]. - Key strategic materials focus on high-temperature alloys and advanced semiconductor materials [18][19]. - New energy materials target high-energy-density battery materials and photovoltaic materials [21]. Key Tasks and Major Projects - Focus on urgent new materials needed in critical application areas such as aerospace, new energy vehicles, and electronic information [27]. - Specific projects include developing high-performance carbon fiber composites for aircraft and high-nickel ternary cathode materials for batteries [29][31][32]. Collaborative Innovation System - Establish a collaborative innovation system that integrates enterprises, academia, and research institutions to enhance innovation capabilities [51]. - Plans to build five national new materials laboratories and ten engineering research centers to support innovation [52]. Market Cultivation for Key New Materials - Implement insurance compensation mechanisms for the first application of key new materials to encourage market adoption [56]. - Establish a project library for demonstration projects to showcase the advantages of new materials in practical applications [57]. Breakthroughs in Key Processes and Equipment - Focus on overcoming bottlenecks in key processes and specialized equipment for new materials production [61]. - Plans to support the development of over 80 key processes and equipment technologies, aiming for significant improvements in production efficiency and cost reduction [64].

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 （欢迎一级市场投资朋友加入微信群）正文 引言 当前，国际局势风云变幻，国际关系的紧张态势为全球产业链供应链的稳定带来了不容忽视的不确定性。在这一宏大背景 下，一个关乎中国高端制造业命脉与国家安全的问题愈发凸显—— 我们在关键战略新材料上，究竟在多大程度上受制于 人？ 特别是我们的近邻日本，它并非仅仅是众多进口来源国之一。在光刻胶、大硅片、高端聚合物等数十种堪称"工业血液"的 新材料领域，日本企业凭借数十年的技术积累，构建了难以撼动的全球垄断地位。数据显示，中国在 半导体核心材料、高 端电子化学品、氢能关键部件 等多个维度，对日依赖度 超过50%，部分高端品类甚至达到近乎100%的绝对依赖 。这意味 着一场外交风波或一次出口管制，就可能让我们的芯片产线、先进显示工厂乃至新能源汽车的推进面临停滞风险。 本文将深度拆解这份中国新材料产业的"卡脖子"清单，清晰揭示哪些环节紧握在日本手中，哪些又广泛依赖其他发达国 家，目前国产化进展如何。认清这份依赖图谱，不仅是为了预警风险，更是为了明确我们必须全力攻坚的自主化方向。 第一部 ...

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Core Viewpoint - The new materials industry in China is experiencing a historic development window driven by domestic substitution becoming a necessity and the emergence of new production demands. The Beijing Stock Exchange (北交所) serves as a core platform for innovative small and medium enterprises, gathering a number of "invisible champions" in niche markets [4][8]. Group 1: Overview of the New Materials Industry on the Beijing Stock Exchange - The new materials industry is categorized into five major segments: non-metal functional materials, new energy materials, polymer and composite materials, metal materials, and fine chemicals [6][10]. - Companies listed on the Beijing Stock Exchange typically focus on niche markets, demonstrating high technical barriers, high gross margins, and rapid growth [7][10]. - The industry is characterized by a high degree of specialization, with many companies being in the early to mid-stages of development, offering significant growth potential [7][10]. Group 2: Investment Themes in New Materials - The investment focus is on domestic substitution and new production capabilities, particularly in semiconductor materials and lightweight, high-performance materials for robotics and low-altitude economies [8][16]. - Key companies in semiconductor materials are making breakthroughs in critical areas such as photoresists and electronic gases, which are essential for the semiconductor supply chain [17][26]. - The demand for lightweight and high-performance materials is driven by new applications in robotics and low-altitude economies, creating new market opportunities [30][31]. Group 3: Future Outlook and Target Companies - The new materials industry is expected to transition from scale advantages to quality advantages, focusing on high-end breakthroughs and domestic substitution [4][42]. - Specific directions for development include the high-endization of bulk materials, the localization of electronic chemicals, and the upgrading of new energy materials [42]. - Companies such as 贝特瑞 (BTR), 安达科技 (Anda Technology), and 民士达 (Minsida) are highlighted as key players in the new energy materials sector, focusing on battery materials and lightweight structural components [17][33]. Group 4: Methodology for Investment Tracking - A three-dimensional analysis framework is proposed, focusing on demand drivers, core competitiveness, and industry value chain positioning [4][11]. - Key indicators for tracking investment value include capacity release, price signals, product breakthroughs, and customer certifications [11][12]. - The investment strategy should revolve around industry trends, selective stock picking, and identifying incremental opportunities, particularly in companies with technological leadership and strong customer ties [4][12].

（请添加小编微信，后续会组建 相关微信群 ） 正文 主要内容： 电子布淡季超预期涨价，印证供给紧俏格局。 据卓创资讯，2026 年2 月4 日林州光远7628 布报价上涨0.55 元至5.40 元（+11%），国际复材7628 布涨0.55 元至5.20元（+12%），薄布亦涨0.60 元（+11%）。自今年年初以来电子布价格连续两次快速上调，涨价节奏明显加快、幅度显著扩大。尤其在传统淡季 背景下，此轮提价来得短促且凌厉，充分印证供给紧俏格局。 当下行业供给的核心矛盾在于中游织造环节，织布机短缺。 2026 年电子纱供需紧平衡（我们测算供给端+6.1% vs 需求端+6.6%），奠定了涨价基础；同 时，我们判断当前更核心的供给矛盾在于中游织造环节。 本报告重点剖析中游织布机短缺的成因，并对中期供需缺口进行定量测算。 AI驱动电子布薄型化趋势，对中游织造效率造成高密度与低转速的双重挤压。 AI 服务器及高速应用场景对Low-Dk、Low-CTE 等特种薄布的需求激增， 并带动配套薄型及超薄电子布用量提升，导致全行业产品结构变薄，织造效率下行。 从物理参数看，电子布越薄，其纬向密度越高，生产薄型布所需打入的纬纱根 ...