点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 我知道，在这个领域里，我们都在做着同样困难却有意义的事： 我们像是散落在不同公司和实验室的 " 侦察兵 " ，独自在信息的迷雾中探索。 是时候，将我们手中的 " 情报地图 " 拼凑完整了。 正是出于这个初衷（ 期待 - 江湖有你： 一直在路上，所以停下脚步，只在于分享 ），我建立了 微信公众号与知识星球： 材料汇 。它不是一个单向输出 的 " 专栏 " ，而是为我们这群 新材料 " 攻坚者 " 准备的 「前线情报站」 。 这里有什么？ 不止是 1300 篇文档，更是三年多的持续 " 踩点 " 在过去的一千多个日夜里，我系统地梳理、整理、撰写了 1300+ 篇 行业资料。它们被打上了 精细的标签 ，形成了你之前看到的那张庞大的知识网络。 这意味着： 这个情报站的核心功能是： 我们真诚邀请这样的你加入： 加入我们，获取你的 " 情报权限 " 扫描下方二维码，即可成为我们这个 " 前线情报站 " 的一员 。 ✅ 帮你 " 跳过调研 " ：我们已为你完成了 80% 的基础信息梳理工作 。 ✅ 帮你 " 触类旁通 ...

Core Insights - Polyimide (PI) is a high-performance polymer material known for its exceptional thermal stability, withstanding temperatures from -269℃ to over 500℃, making it crucial in aerospace, flexible displays, and advanced chips [2][5][19] - The PI industry faces significant challenges due to high-end product monopolization by foreign companies, leading to a "bottleneck" in domestic production capabilities [2][10][21] Group 1: Overview of Polyimide - Polyimide is a polymer characterized by the presence of imide rings, synthesized from diamines and dianhydrides [4] - It is recognized as one of the most promising engineering plastics of the 21st century, with applications across various high-tech industries [5][7] Group 2: Polyimide Industry Chain - The PI industry chain follows a "raw material supply - product manufacturing - application" model, with a notable integration of synthesis and product formation [10][26] - The upstream segment includes core monomers and auxiliary materials, with a reliance on imports for high-end monomers [14][15] - The midstream focuses on the manufacturing of various PI products, with significant technical barriers and a concentration of production among a few global leaders [17][18] - The downstream applications span electronics, aerospace, and military sectors, driven by the demand for high-performance materials [23][24] Group 3: Market Supply and Demand - Global PI production capacity increased from approximately 90,000 tons in 2020 to an estimated 110,000 tons by the end of 2023, with a compound annual growth rate (CAGR) of 6.9% [28][30] - The market for PI materials is projected to reach 104.4 billion yuan by 2030, with a CAGR of 6.98% from 2023 to 2030 [37] - In China, the PI production capacity is expected to grow significantly, with a focus on high-end applications, although the country still relies heavily on imports for advanced PI products [42][46] Group 4: Technological Aspects - The production of PI involves complex chemical reactions and requires a deep understanding of polymerization mechanisms and process control [55][57] - Various synthesis methods for PI resins include one-step, two-step, and three-step processes, each with distinct technical requirements [58]

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 没有它，就没有芯片。 而它的国产化，才刚刚开始。 半导体掩模版是技术要求最高的掩模版品类，同时也是最大的掩模版应用市场， IC制造生产占据掩模 版下游60%的份额 ，而 高端半导体掩模版主要被美国和日韩厂商垄断 ，因此其国产化突破对国产半导 体产业链具备重要战略意义。 2、全球掩模版市场空间广阔，增长动力强劲 半导体掩模版作为核心半导体材料之一，2021年占全球半导体材料市场的12%，仅次于硅片和电子特 气。 根据SEMI、CEMIA数据， 全球半导体掩模版市场规模有望在2025年达到60.79亿美元，同比增长7% 。 中国大陆半导体掩模版市场规模快速增长，从2017年的9.12亿美元增至 2022年的15.56亿美元 ，2017- 2022年复合增速达到11.3%。随着中国大陆在先进制程领域不断突破，掩模版市场规模有望进一步扩 大，为国产厂商带来巨大机遇。 3、 空白掩模版是半导体掩模版的核心部件 。 空白掩模版和光掩模版可以类比为拍照前后的胶片。 空白掩模版的基本结构是在玻璃面板上镀一层光 学薄膜 ，材料包 ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 我知道，在这个领域里，我们都在做着同样困难却有意义的事： 我们像是散落在不同公司和实验室的 " 侦察兵 " ，独自在信息的迷雾中探索。 是时候，将我们手中的 " 情报地图 " 拼凑完整了。 正是出于这个初衷（ 期待 - 江湖有你： 一直在路上，所以停下脚步，只在于分享 ），我建立了 微信公众号与知识星球： 材料汇 。它不是一个单向输出 的 " 专栏 " ，而是为我们这群 新材料 " 攻坚者 " 准备的 「前线情报站」 。 这里有什么？ 不止是 1300 篇文档，更是三年多的持续 " 踩点 " 在过去的一千多个日夜里，我系统地梳理、整理、撰写了 1300+ 篇 行业资料。它们被打上了 精细的标签 ，形成了你之前看到的那张庞大的知识网络。 这意味着： 这个情报站的核心功能是： 我们真诚邀请这样的你加入： 加入我们，获取你的 " 情报权限 " 扫描下方二维码，即可成为我们这个 " 前线情报站 " 的一员 。 （ 加入后，我建议你 ：别客气，直接把这里当成你的专业搜索引擎。输入你手头正在攻坚的难题，比如 #PEE ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 半导体材料： 化合物半导体材料用高纯砷、氮化镓单晶衬底及外延片、碳化硅单晶衬底及同质外延片、 4-6 英寸低位错锗单晶、硅基微阵列透镜、 8-12 英寸硅单晶抛光片和外延片、区熔用多晶硅材料、 2-4 英寸高品质磷化铟晶片、 4-6 英寸低位错密度掺硫磷化铟单晶衬底 半导体制程材料： 光掩膜版、芯片用 5N5 超纯铝及铝合金铸锭、高纯钨及钨合金靶材、超高纯化学试剂、集成电路用光刻胶及其关键原材料和配套试 剂、特种气体 半导体封装材料： 晶体封装材料、电子封装用热沉复合材料、第三代功率半导体封装用 AMB 陶瓷覆铜基板、高可靠性封装的金锡合金、半导体芯片封 装导热有机硅凝胶、半导体芯片封装自粘接导热硅橡胶、封装基板用高解析度感光干膜及配套 PET 膜、封装基板用高性能阻焊、封装载板用电子化学品 - 闪蚀药水 半导体零部件： 半导体装备用精密陶瓷部件 OLED 有机发光： 有机发光半导体显示用玻璃基板、 OLED 用发光层、传输层及油墨材料、 OLED 基板用聚酰亚胺材料（ YPI ） 显示光刻胶： 平板显示 ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 1 投资框架:当我们在谈新材料的时候,我们 到底在谈什么 当说投资新材料的时候,到底是在投什么 合金邮轮 木质帆船 蒸汽船 复合材料游艇 资料来源: Shutterstock , Borri, United Yacht,中国航海博物馆,天风证券研究所 请务必阅读正文之后的信息披露和免责申明 4 请务必阅读正文之后的信息披露和免责申明 3 我们认为,投资新材料,投资的是未来新兴产业。材料工业是现代化工业体系的基石,每一轮技术革命都与 � 新材料的发现、发明和推广密不可分。发展战略性新兴产业和未来产业，其基础是先进材料产业; 我们认为,投资新材料,投资的是产业结构转型升级。从农业文明、到工业文明、再到信息文明,每一阶段 � 主导产业不同——从一个阶段发展到另外一个阶段，产业结构面临转型升级，而这又要有能与之匹配的新材 彩。 投资新材料,判断产业生命周期至关重要 请务必阅读正文之后的信息披露和免责申明 投资新材料,判断产业生命周期至关重要 通常,处于导入期的新材料,产业化变数或较小 --- 产品形态基本定型、产 ...

Group 1 - The article highlights that the materials science sector is driving unprecedented industrial transformation and innovation, with a focus on sustainability, intelligent materials, and advanced manufacturing techniques by 2026 [2][31] - It outlines ten core trends in the materials field, including sustainable materials, smart materials, nanotechnology, lightweight materials, materials informatics, advanced composites, two-dimensional materials, surface engineering, and digitalization in materials management [2][31] Group 2 - Sustainable materials are increasingly adopted across various industries to reduce carbon footprints and waste, with the global sustainable materials market projected to grow from approximately $333.31 billion in 2024 to about $1,073.73 billion by 2034, reflecting a compound annual growth rate (CAGR) of 12.41% [4] - Smart materials are being developed with programmable characteristics that respond to external stimuli, with the piezoelectric smart materials market expected to grow at a CAGR of 15.63%, reaching $39.49 billion from 2024 to 2028 [6][7] - The global nanomaterials market is estimated at $22.6 billion in 2024, with a projected CAGR of 14.3%, reaching $98.3 billion by 2035 [9][10] - The additive manufacturing market is expected to reach $6.92 billion by 2029, driven by innovations in 3D printing technologies [14] - The lightweight materials market is projected to reach $276.4 billion by 2030, with a CAGR of 8.3% from 2023 to 2030 [17] - The materials informatics market is expected to grow from $154.78 million in 2024 to $705.21 million by 2034, with a CAGR of 16.4% [19][21] - The advanced composites market is projected to reach $168.6 billion by 2027, with a CAGR of 8.2% from 2022 to 2027 [23] - The graphene market is expected to grow from $26.89 million in 2023 to $270 million by 2030, with a CAGR of 38.9% [25] - The surface engineering market is projected to grow from $25.46 billion in 2023 to $46.22 billion by 2030, with a CAGR of 8.89% [27] - The digitalization of materials management is being driven by Industry 4.0, enhancing the efficiency and connectivity of material handling and processing [29]

Core Insights - Advanced packaging technology is crucial for overcoming performance bottlenecks in the semiconductor industry, driven by emerging applications like AI, high-performance computing, and 5G communication [3] - The global advanced packaging market is projected to grow from approximately $45 billion in 2024 to $80 billion by 2030, with a compound annual growth rate (CAGR) of 9.4% [3][75] Technical Evolution Dimension - TSMC's CoWoS technology has evolved from supporting 1.5x to 3.3x mask sizes, with plans for a 5.5x version by 2025-2026 and a 9x version by 2027, significantly increasing integration density and reducing signal transmission latency [6][7] - Hybrid bonding technology is emerging as a core technology for next-generation advanced packaging, enabling direct wafer bonding without bumps, thus enhancing interconnect density and reducing power consumption [10][11] - AMD's MI300X AI accelerator utilizes a 3.5D packaging architecture, combining TSMC's SoIC and CoWoS technologies, achieving unprecedented integration levels with 1,530 billion transistors [14][15] - Intel employs a multi-technology strategy in advanced packaging, focusing on EMIB and Foveros technologies, with plans for further enhancements to improve performance and integration [18][19] - Glass substrate technology is gaining traction as a disruptive innovation, offering advantages in electrical performance, thermal stability, and cost-effectiveness, with a projected market penetration exceeding 50% within five years [22][23] Material System Analysis - BT resin substrates are the most widely used packaging material, accounting for over 70% of IC substrates, known for their excellent thermal and electrical properties [26][27] - ABF substrates, developed by Ajinomoto, are preferred for high-end chip packaging due to their superior processing capabilities and electrical performance, despite higher costs [28][30] - Ceramic substrates, particularly AlN and Si3N4, are ideal for high-performance applications due to their high thermal conductivity and mechanical strength [32][34] Equipment and Process Dimension - TCB equipment is critical for HBM packaging, with ASMPT holding over 80% market share, driven by the demand for AI chips and high-performance computing [45][47] - The global die bonder market is dominated by four major players, with ASMPT leading at 31% market share, followed by BESI, Ficontec, and Neways [49][51] - The back-end packaging equipment market is characterized by a diverse competitive landscape, with Disco leading in wafer thinning and cutting technologies [54] Industry Layout Analysis - TSMC is experiencing exponential growth in CoWoS capacity, projected to reach 65,000-75,000 units per month by 2025, driven by AI chip demand [63][65] - The HBM market is dominated by three players: SK Hynix, Samsung, and Micron, collectively holding over 95% market share, with SK Hynix leading at 60-70% [67][68] - China's packaging industry is rapidly advancing, with Jiangsu Changjiang Electronics Technology, Tongfu Microelectronics, and Huada Semiconductor becoming significant players globally [70][71] - The global advanced packaging market is shifting towards IDM manufacturers, who leverage integrated design and manufacturing advantages, with Taiwan companies holding a dominant position in the AI packaging market [73][74]

Core Viewpoint - The article discusses the potential supply disruption of core photoresists by Japanese companies like Canon and Nikon, analyzing the implications of such actions in the context of the semiconductor industry and the ongoing China-Japan semiconductor rivalry [3][21]. Group 1: Japan's Supply Power - Japan holds significant power in the semiconductor materials and equipment sector, particularly in photoresists, where it dominates 95% of the global market share through companies like JSR, Shin-Etsu Chemical, and Tokyo Ohka Kogyo [5][8]. - In the photoresist market, the domestic production rates for G-line and I-line photoresists exceed 60%, while KrF photoresists have a low domestic production rate of less than 5% [7]. - Japan's dominance extends to 14 out of 19 critical semiconductor materials, with major players like Shin-Etsu Chemical holding a 27% market share in silicon wafers [8]. Group 2: Economic Interdependence - China is Japan's largest customer in the semiconductor sector, with Japan's semiconductor equipment exports to China reaching $11.843 billion in 2021, accounting for 38.8% of Japan's total exports [10]. - The semiconductor trade between China and Japan exceeded $47 billion in 2021, with over 30,000 Japanese semiconductor-related companies operating in China, relying on the Chinese market for 20%-30% of their revenue [10][11]. - The potential for a complete supply disruption poses a significant risk to Japanese companies, as it could severely impact their production capacity and revenue [10][11]. Group 3: Emerging Supply Chain Challenges - While a complete supply disruption is unlikely, "de facto" supply restrictions are becoming more common, such as increased export controls and approval delays for semiconductor equipment [12][14]. - Approval rates for photoresist exports to China have dropped from 89% to 76%, with longer approval times indicating a tightening of supply [14]. - Japanese companies may prioritize supply to international clients over Chinese firms, leading to reduced quantities and increased prices for Chinese customers [15][16]. Group 4: China's Response and Opportunities - The pressure from Japan's supply restrictions is prompting Chinese wafer fabs to prioritize supply chain security, accelerating the validation and application of domestic photoresists [18][20]. - Chinese companies have made significant advancements in high-end photoresist production, with several firms achieving stable sales and customer validation for their products [18][20]. - The shift towards domestic alternatives is seen as a critical strategy for breaking Japan's monopoly in the semiconductor materials sector [18][20]. Conclusion - A complete supply disruption from Japan is deemed unlikely due to mutual economic interests, but the trend of indirect supply restrictions is expected to persist in the ongoing semiconductor rivalry [21][22]. - The focus for China should be on enhancing its capabilities across the semiconductor supply chain to mitigate reliance on Japanese imports [22].

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 我知道，在这个领域里，我们都在做着同样困难却有意义的事： 正文 我们像是散落在不同公司和实验室的 " 侦察兵 " ，独自在信息的迷雾中探索。 是时候，将我们手中的 " 情报地图 " 拼凑完整了。 正是出于这个初衷（ 期待 - 江湖有你： 一直在路上，所以停下脚步，只在于分享 ），我建立了 微信公众号与知识星球： 材料汇 。它不是一个单向输出 的 " 专栏 " ，而是为我们这群 新材料 " 攻坚者 " 准备的 「前线情报站」 。 这里有什么？ 不止是 1300 篇文档，更是三年多的持续 " 踩点 " 在过去的一千多个日夜里，我系统地梳理、整理、撰写了 1300+ 篇 行业资料。它们被打上了 精细的标签 ，形成了你之前看到的那张庞大的知识网络。 这意味着： 这个情报站的核心功能是： 扫描下方二维码，即可成为我们这个 " 前线情报站 " 的一员 。 （ 加入后，我建议你 ：别客气，直接把这里当成你的专业搜索引擎。输入你手头正在攻坚的难题，比如 #PEEK # 复合材料 或 #HBM # 导热 瓶颈，你会 发现， 你不 ...