点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 新能源汽车高分子材料应用现状及发展趋势 当前，新能源汽车产业的高速发展对轻量化、安全性和续航性能提出了更高要求，高分子材料凭借其低密度、高强 度、耐腐蚀及可设计性等优势，正成为关键材料技术之一。 在应用现状方面，工程塑料（如PA6、PC/ABS）广泛用于电池壳体、充电桩部件；弹性体材料（如硅橡胶）应用于密 封与减震系统；而轻量化复合材料（如碳纤维增强塑料）逐步覆盖车身结构件。 未来发展趋势将聚焦于三大方向： 一是开发耐高温、阻燃的电池专用高分子材料以提升安全性；二是推动生物基或可 回收材料的绿色化转型，响应碳中和目标；三是通过材料-结构-工艺一体化创新（如免喷涂材料、微发泡技术）进一 步降低成本并优化性能。 随着材料科学与智能制造技术的融合，高分子材料有望在新能源汽车中实现更高效、更环保的全生命周期应用。 0) ០​ក 新能源汽车与高分子材料 新能源汽车高分子材料应用特征分析 新能源汽车高分子材料发展趋势 总结及展望 1、新能源汽车与高分子材料 ▌1.2 新能源汽车性能与结构特征 □ 新能源汽车融汇新能源 ...

从机头到机尾，从钛合金到碳纤维，国内22个省份的200多家企业共同托起了国产大飞机的蓝天梦。 2023年5月28日上午，中国东方航空使用中国商飞全球首架交付的C919大型客机，执行MU9191航班， 从上海虹桥机场飞往北京首都机场，标志着国产大飞机正式投入商业运营。 在这架承载着大国梦想的蓝天使者背后，是国内200多家企业、36所高校和数十万名产业人员的心血结 晶。 C919大型客机是我国首次按照国际通行适航标准研制、具有完全自主知识产权的喷气式干线客机。其 机体结构材料的国产化率已超过50%，实现了关键材料的自主可控。 1 国内供应商的地域分布 C919大飞机采用与波音、空客等世界"航空巨头"一样的"主制造商-供应商"生产模式。整体设计由"中国 商飞"完成，各零件则和其他企业协同设计和生产。 据统计， 国内有22个省份的200多家企业参与了C919大飞机研制。 从地域分布看， 以上海为总装中 心，辐射长三角、西南、东北等地区，形成了完整的产业链布局。 点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 C919供应商一览 无锡作为制造业重镇，已有44家企 ...

Core Insights - The rapid evolution of AI is outpacing the development of computing infrastructure, leading to a significant gap in computing power that is expected to widen by 2026. This gap will manifest in two key areas: a growing demand for core computing capabilities across chips, storage, packaging, and cooling, and a shift towards edge computing to reduce cloud latency and costs, resulting in an explosion of applications from AI smartphones to integrated robots [1]. Industry Overview - The electronic sector has reached a record high in Q3 2025, driven by AI, with the electronic index rising by 44.5% year-to-date, outperforming the CSI 300 index by 26.6% [12][13]. - The semiconductor sector has shown significant growth, with various sub-sectors experiencing substantial increases: PCB (+114%), consumer electronics (+51%), and semiconductors (+40%) year-to-date [12][13]. - The overall electronic industry reported a revenue increase of 19% and a net profit increase of 35% in Q1-Q3 2025, with all major segments showing positive growth [18][24]. Performance Metrics - The electronic sector's inventory levels have risen, particularly in consumer electronics and PCBs, indicating strong demand and recovery in terminal markets [22][25]. - The semiconductor sector's monthly sales growth has rebounded since June 2023, with a notable increase in demand for digital, storage, and equipment segments [34][41]. AI Impact on Semiconductor Cycle - The semiconductor market is entering an upward cycle, with significant growth in capital expenditures from both domestic and international cloud service providers, driven by AI demand [41][42]. - Major cloud providers are expected to increase their capital expenditures significantly, with projections indicating a 50%-60% growth in 2026 [43]. Consumer Electronics Trends - Global smartphone sales are projected to recover, with a forecast of 1.29 billion units in 2024, reflecting a 6.1% year-on-year increase [26][27]. - The PC market is also expected to grow, with global sales reaching 263 million units in 2024, a 1.0% increase year-on-year [27][29]. Automotive Sector Insights - The automotive market is experiencing a weak recovery, with global sales expected to reach 92.23 million units in 2025, reflecting a 1.8% year-on-year increase [39]. - The penetration rate of electric vehicles is projected to rise, with expectations of 20% in 2025 for global sales [39]. AI Narrative Acceleration - The competition among AI model developers has intensified, with significant advancements in model capabilities and applications across various sectors [47][50]. - The demand for AI-related spending is expected to reach $3-4 trillion by 2030, driven by the need for enhanced computing power and applications [58]. Edge Computing and Hardware Development - The shift towards edge computing is becoming crucial, with predictions indicating that the global edge AI market will grow to ¥1.2 trillion by 2029, with a CAGR of 39.6% [69]. - Major AI companies are actively entering the edge hardware market to enhance user experience and profitability [69].

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 摘要 Low CTE电子布是AI先进封装的关键材料 ，能显著降低载板翘曲与应力失配，提升长期可靠性。随着AI 算力芯片出货爆发与芯片大尺寸封装面积提升， 叠加智能手机主板需求放量， Low CTE 电子布需求迎来爆发 。 此外，电脑芯片、车载芯片、光模块等需求亦有望快速放量，更大的潜力来自类载板化的CoWoP封装工艺在AI 服务器的应用。 Low CTE电子布供给稀缺，龙头 日东纺 此前为唯一供应商但其产能短期没有增长，国内企业借机导入，目前仅 中材科技、宏和科技 技术突破开始量产贡 献，有望在本轮景气周期中承接缺口、加速国产化替代。 1、需求不及预期的风险;2、原材料与能源价格波动风险;3、工艺良率与技术选代不及预期 的风险；4、产能建设进度不及预期的风险。 目录 | Low CTE 电子布 : Al 时代的关键材料 | | --- | | 需求爆发： AI 算力封装与消费电子升级双轮驱动 . | | AI 算力芯片封装技术发展提升 Low CTE 用量 . | | 智能手机主板升级带来 Low CTE ...

Core Viewpoint - The article emphasizes the critical role of material innovation in driving the next generation of AI computing power, highlighting the shift from traditional silicon-based materials to advanced materials that can meet the increasing demands of AI applications [2][53]. Group 1: Key Materials for AI Computing - Advanced channel materials are essential for semiconductor transistors, directly influencing speed, power consumption, and integration [4]. - AI chips require channel materials with high mobility, high switching ratio, high stability, low power consumption, low leakage current, and ultra-thin thickness [6]. - Various materials such as MoS₂, black phosphorus, InGaAs, germanium, and carbon nanotubes are identified as promising candidates for next-generation AI chips, each with specific performance metrics [7][10][11][12][14]. Group 2: Gate and Dielectric Materials - Gate and dielectric materials are crucial for controlling the flow of current in transistors, affecting switching speed, power consumption, and reliability [17]. - Hafnium oxide (HfO₂) and its doped variants are highlighted for their low leakage currents and high dielectric constants, suitable for advanced logic chips [18][20][21]. Group 3: Substrate Materials - Substrate materials provide physical support and thermal management for semiconductor chips, impacting performance and reliability [23]. - Silicon carbide (SiC) and gallium oxide (β-Ga₂O₃) are noted for their high breakdown fields and thermal conductivity, making them suitable for AI power modules [24][25]. Group 4: Non-volatile Storage Materials - Phase change materials and resistive switching materials are identified for their potential in next-generation memory applications, offering high speed and low power consumption [26][27]. Group 5: Advanced Packaging and Integration Materials - Materials for substrate and interconnects, such as silicon photonic intermediates and glass substrates, are crucial for enhancing signal transmission speed and reducing power loss [29][30]. - Diamond-based thermal management materials are highlighted for their superior heat dissipation capabilities, essential for high-performance AI chips [32]. Group 6: New Computing Paradigms - Photonic computing materials, such as lithium niobate and silicon-based photonic materials, are discussed for their potential to significantly increase processing speed while reducing energy consumption [35][36]. - Quantum computing materials, including superconductors and diamond nitrogen-vacancy centers, are essential for developing quantum computing hardware [38][39]. Group 7: Investment Logic - The investment opportunity lies in material innovation that can replace traditional silicon technologies, aligning with national strategies for semiconductor supply chain security [53]. - Focus areas for investment include advanced logic and storage materials, packaging and thermal management materials, and frontier materials for emerging computing paradigms [54]. Group 8: Conclusion - The article presents a comprehensive overview of the material innovations driving the AI computing revolution, emphasizing the importance of these advancements for China's semiconductor industry and global competitiveness [56].

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 材料汇文章标签汇总 如何下载（加入知识星球-材料汇） 材料汇部分文章 未来40年材料强国革命：这13大领域将重塑人类文明！ 国产替代爆发！14种卡脖子的先进封装材料，百亿赛道谁将突围？ | 先进封装材料 | 全球市场规模 | 中国市场规模 | 国外企业 | 国内企业 | | --- | --- | --- | --- | --- | | PSPI | | | 微系统、AZ电子材料 | 鼎龙股份、国风新材、三月科 | | | | 5.28亿美元(23年 7.12亿元(21 | Fujifilm, Toray, HD | 技、八亿时空、强力新材、瑞 | | | 全球) . 预计 | 年中国)、预 | | 华泰、诚志殷竹、艾森股份、 | | | 2028年将达到 | 汁到2025年增 | | 奥采德:波米科技、明士新材 | | | 20.32亿美元 | 长至9.67亿元 | 、旭化成 | 、东阳华芯、上海玟昕、理硕 | | | | | | 科技等 | | 光敏绝缘 | 2020年:0.1亿 | | | | | ...

Core Viewpoints - The nylon 6 industry is facing structural overcapacity, with supply growth outpacing demand, leading to price competition and shrinking profit margins [2][7][59] - The industry must shift from scale expansion to value enhancement, focusing on high-end applications and differentiated products to drive growth [7][17] - Technological and environmental barriers are becoming critical, requiring continuous innovation and compliance with green manufacturing standards [7][17] - Integrated supply chain management and international market expansion are essential strategies for companies to navigate current challenges [7][17] Overview - Nylon 6, also known as PA6 or nylon 6, is a widely used synthetic fiber and engineering plastic with excellent mechanical properties and versatility [6] - The industry has seen significant growth in China, which now accounts for over 50% of global production and consumption [2][3] Industry Chain Analysis - The nylon 6 industry chain includes key components such as caprolactam, nylon 6 chips, fibers, engineering plastics, films, and composite materials [10][11][12][15] - Caprolactam is a crucial raw material, with China holding a significant share of global production capacity [20][21] - Nylon 6 chips are primarily used for fiber production, with a smaller portion allocated to engineering plastics and films [11][12] Market Supply and Demand - China dominates global nylon 6 production, holding 57% of total capacity, while demand growth is expected to be driven mainly by the Chinese market in the next 5-10 years [18][22] - Domestic nylon 6 chip production has shown steady growth, with production increasing from 312,000 tons in 2018 to 502,500 tons in 2023, reflecting a compound annual growth rate of 10% [25][28] Capacity Distribution - As of the end of 2023, China's caprolactam production capacity reached 6.53 million tons, with several major producers dominating the market [36][37] - The nylon 6 chip production capacity in China is concentrated among 25 companies, totaling 5.34 million tons [39] Future Predictions - The nylon 6 industry is projected to experience a mismatch between production capacity and demand, with overcapacity expected to persist in the short term [46][47] - By 2030, caprolactam capacity is expected to reach 10 million tons, while nylon 6 chip capacity will also increase, leading to intensified competition [47][48] Technical Features - The nylon 6 production process has evolved significantly, with various polymerization techniques being employed to enhance product quality [51][52] - The industry relies on advanced spinning and twisting technologies to produce high-quality nylon fibers [53][54] Industry Barriers and Challenges - The nylon 6 industry faces significant barriers to entry, including high capital requirements and the need for advanced production technology [57][58] - Overcapacity remains a critical issue, with the industry experiencing a saturation of the downstream market, leading to intensified competition [59]

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 | 2.1 Al+言销 2.2 Al+办公 2.3 Al+医疗 2.4 Al+硬件 2.5 Al+消费 | | --- | | 2.6 具身智能 | | 2.7 Al+制造 2.8 Al+出行 | | 3.1 | 未来制造 | | --- | --- | | 3.2 | 未来信息 | | 3.3 | 未来材料 | | And Production of the Market of the Property of | 未来能源 | | 3.5 | 未来空间 未来健康 | | 3.6 | | | 3.7 | 未来产业融合 | 中国AI发展关键节点,场景解决方案行业渗透加剧,Agent将进入规模化商业爆点 ◆ 2025年是中国人工智能规划中期规划的关键节点,AI场景解决方案从"能用"到"有用"到"好用",在垂类行业渗透率持续提升。 ◆ 未来三年，Agent将进入规模化商业爆点，其确定性信号主要体现在政策层面的国家人工智能产业建设指南、信创替代窗口;技术层面的L4级自主 决策、多智能体协作成熟;商业层面的基础设施 ...

Core Viewpoint - The article emphasizes the rapid growth of global computing power demand driven by advancements in artificial intelligence, cloud computing, and high-performance computing, leading to unprecedented cooling challenges for data centers. Liquid cooling technology is evolving from an optional solution to a necessary one due to its energy efficiency, low power consumption, and noise reduction advantages, especially in light of tightening national PUE (Power Usage Effectiveness) requirements. The article outlines the evolution of liquid cooling technology, market landscape, and future trends, predicting that the global liquid cooling market will exceed 100 billion yuan by 2026, marking the beginning of a liquid cooling revolution driven by technology, policy, and industry collaboration [2]. Group 1: Liquid Cooling Technology - Liquid cooling technology is essential for addressing the cooling pressures of data centers. It utilizes liquid to dissipate heat from components, leveraging the high thermal conductivity and heat capacity of liquids compared to air, resulting in lower energy consumption, higher cooling efficiency, and reduced noise [6][13]. - The core advantages of liquid cooling include low energy consumption, high cooling capacity (4-9 times that of air cooling), low noise levels, and lower total cost of ownership (TCO), with PUE values potentially dropping below 1.2 [13][26]. - The rapid increase in chip power density necessitates the adoption of liquid cooling solutions, as traditional air cooling struggles to meet the demands of next-generation architectures like NVIDIA's Rubin, which anticipates power densities reaching up to 600 kW [14][18]. Group 2: Market Trends and Future Outlook - The liquid cooling market is expected to surpass 100 billion yuan by 2026, driven by technological advancements, policy support, and collaboration across the supply chain [2]. - The evolution of liquid cooling technology is characterized by the emergence of microchannel cold plates and phase change cooling plates, which enhance efficiency and customization [2][14]. - The article highlights the increasing importance of liquid cooling in meeting national PUE requirements, with policies pushing for lower PUE values, thereby promoting the adoption of energy-efficient technologies [22][25]. Group 3: Industry Applications and Solutions - Liquid cooling solutions are categorized into direct contact and indirect contact types, with single-phase immersion cooling being the primary development direction due to its high efficiency and energy savings [30][47]. - Single-phase cold plate cooling is expected to remain the mainstream solution for a considerable time due to its compatibility with existing infrastructure and lower retrofit costs [37]. - Immersion cooling offers high energy efficiency (PUE < 1.13) and supports high-density deployments, although it presents challenges in product design and maintenance [48][49].

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 《建议》提出打造新兴支柱产业，加快 新能源、新材料、航空航天、低空经济等战略性新兴产业集群发展 ，这将催生出数个万亿元级甚至更大规模的市 场； 《建议》还提出前瞻布局 未来产业 ，推动 量子科技、生物制造、氢能和核聚变能、脑机接口、具身智能、第六代移动通信等 成为新的经济增长点。这些 产业蓄势发力，未来10年新增规模相当于再造一个中国高技术产业。 那么， 什么是未来产业，具体包括哪些内容？我们应该关注哪些投资方向？本文内容如下： 一、引言 二、十大投资机会 三、未来产业全景图，包括（一）6大重点方向，（二）10大创新标志性产品。 一、引言 对比十四五规划,部分产业例如新能源汽车已成优势产业 | 专栏2 科技前沿领域政关 | 专栏4 制造业核心意争力提升 | | --- | --- | | | 01 高端新材料 | | 01 新一代人工智能 | 推动高端科士功能材料、高品质特殊钢材、高性能合金、高温合金、高纯稀有金属材料、高性能障资 | | 前沿基础理论突破,专用芯片研发,深度学习框架等开源算法平台构 | ...