证券代码：002916 证券简称：深南电路 编号：2024-75 深南电路股份有限公司投资者关系活动记录表 | --- | --- | --- | --- | |--------------------------------|---------------------------------------------------------------------|-------|----------------------------------------------------------------------------------| | 投资者关系 活动类别 | □特定对象调研 □分析师会议 \n□媒体采访 □业绩说明会 \n□路演活动 √其他 | （ | □现场参观 \n □新闻发布会 \n上市公司网上集体接待日 ） | | 活动参与人 员（排名不 分先后） | 投资者网上提问 | | | | 上市公司 接待人员 | | | 副总经理、董事会秘书：张丽君；总会计师：楼志勇；独立董事：于洪宇 | | 时间 | 2024 年 12 月 12 日 | | | | 地点 | 全景网"投资者关系互动平台" ...

证券代码：002916 证券简称：深南电路 公告编号：2024-050 特此公告。 深南电路股份有限公司 深南电路股份有限公司 关于参加 2024 年度深圳辖区上市公司 董事会 集体接待日活动的公告 二〇二四年十二月六日 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 为进一步加强与投资者的互动交流，深南电路股份有限公司（以下简称"公 司"）将参加由深圳证监局和深圳证券交易所指导、深圳上市公司协会与深圳市 全景网络有限公司联合举办的"2024 年度深圳辖区上市公司集体接待日" 活动， 现将相关事项公告如下： 本次活动将采用网络远程的方式举行，投资者可登录"全景路演"网站 （https://rs.p5w.net），或关注微信公众号：全景财经，或下载全景路演 APP，参 与本次互动交流，交流时间为 2024 年 12 月 12 日（周四）15:40-17:00。届时公 司独立董事及高管将在线与投资者进行沟通与交流，欢迎广大投资者踊跃参与！ ...

Group 1: Company Overview - The company focuses on the electronic interconnection field, with three main businesses: printed circuit boards (PCBs), electronic assembly, and packaging substrates, forming a unique "3-In-One" business layout [2][4] - As of the first half of 2024, PCB business accounted for approximately 58% of total revenue, packaging substrates for about 19%, and electronic assembly for around 15% [2][4] Group 2: Packaging Substrate Development - Since 2008, the company has been incubating its packaging substrate business, starting from niche products and has become a pioneer in the field in China [4][6] - The company has established a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [4][6] Group 3: Production Capacity and Projects - The Wuxi substrate phase II factory started production in late September 2022 and has achieved monthly breakeven [6] - The Guangzhou packaging substrate project phase I began production in Q4 2023, with rapid capacity enhancement ongoing [6] Group 4: Impact of AI on PCB Business - The acceleration of AI technology and its applications have increased demand for high-performance PCB products, particularly in high-speed communication networks and data centers [6][4] Group 5: Financial Performance - In Q3 2024, the company reported revenue of 4.728 billion RMB, an increase of 8.45% quarter-on-quarter, primarily due to increased project settlements in electronic assembly [6] - The overall gross margin slightly decreased due to changes in product structure and rising raw material costs [6]

Group 1: Company Overview and Business Expansion - The company focuses on PCB business with applications in communication devices, data centers, automotive electronics, industrial control, and medical fields [2] - In Q3 2024, the company's revenue in data centers and automotive electronics increased compared to Q2, while revenue from the communication sector declined due to lack of demand [2] - The company has invested 1.274 billion RMB in building a factory in Thailand to expand overseas market presence [4] Group 2: AI and Technology Impact - The advancement of AI technology has increased demand for high-performance PCB products, particularly in high-speed communication networks and data centers [2] - The company is adapting to the growing needs for larger, high-layer, high-frequency, and high-heat dissipation PCBs driven by new information technology [2] Group 3: Automotive Electronics Strategy - The company is focusing on the new energy and ADAS sectors, which require higher integration and more complex designs for PCBs compared to traditional automotive electronics [4] - The trend towards electric and intelligent vehicles is expected to transform cars into mobile data terminals, leveraging the company's communication technology advantages [4] Group 4: Electronic Assembly Business - The electronic assembly business is positioned as a downstream segment of PCB manufacturing, focusing on communication, data centers, medical, and automotive electronics [4] - The company aims to enhance customer loyalty by providing integrated solutions that leverage its PCB technology platform [4] Group 5: Production Capacity and Market Demand - In Q3 2024, PCB factory utilization rates remained stable at high levels, while packaging substrate factory utilization slightly decreased due to fluctuations in downstream demand [6] - The company is progressing with the Guangzhou packaging substrate project, focusing on platform capability and customer product certification [6] Group 6: FC-BGA Packaging Substrate Development - The company has achieved mass production capabilities for FC-BGA substrates with up to 16 layers, and is progressing with sample production for 20-layer products [6] - Future plans include accelerating technological breakthroughs in high-end products and enhancing the R&D team to strengthen core competitiveness [6]

关于使用部分闲置募集资金进行现金管理的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 深南电路股份有限公司（以下简称"公司"）第三届董事会第二十次会议和 第三届监事会第十五次会议审议通过了《关于使用部分闲置募集资金进行现金管 理的议案》，同意公司在不影响募集资金投资计划正常进行的情况下，将总额不 超过 10 亿元（含本数）的闲置募集资金购买期限不超过 12 个月（含）的保本型 产品，使用期限自董事会审议通过之日起 24 个月内有效，在上述额度内资金可 滚动使用。独立董事、监事会及保荐机构就该事项已发表同意的意见。 证券代码：002916 证券简称：深南电路 公告编号：2024-049 深南电路股份有限公司 具体公告详见公司于 2022 年 12 月 30 日在《证券时报》和巨潮资讯网 （http://www.cninfo.com.cn）披露的《关于使用部分闲置募集资金进行现金管理 的公告》（公告编号：2022-087）。 一、关于使用部分闲置募集资金进行现金管理的情况 本次购买的产品属于低风险投资品种，但金融市场受宏观经济的影响较大， 不排除该项投资 ...

Group 1 - The core viewpoint of the article indicates that ShenNan Circuit (002916) reported stable PCB factory utilization rates for Q3 2024, maintaining high levels, while the packaging substrate factory utilization slightly declined due to fluctuations in demand from certain downstream sectors [1] - The company highlighted that there are differences in material properties and production processes between glass substrates and PCB, as well as organic packaging substrates, which leads to distinct characteristics in their respective application fields [1] Group 2 - The company is closely monitoring and researching glass substrate technology, although it currently does not engage in the production of glass substrates [2]

Group 1: Company Overview and Business Strategy - The company focuses on electronic assembly business as a downstream segment of PCB manufacturing, targeting communication, data centers, medical, and automotive electronics sectors [2][4] - The electronic assembly business aims to leverage interconnectivity, enhancing customer loyalty through a one-stop solution platform [2][4] Group 2: Customer Base and Market Expansion - The electronic assembly services are not limited to existing PCB clients, allowing for efficient collaboration and expansion in respective fields [2][4] - The PCB business is primarily centered on communication devices, with significant growth in data centers and automotive electronics, while the communication sector has seen a decline in revenue share [4] Group 3: Production Capacity and Future Plans - The company has factories in Shenzhen, Wuxi, Nantong, and plans for a project in Thailand, with ongoing upgrades to enhance production efficiency [4] - Nantong's fourth phase project is progressing, aimed at establishing a PCB technology platform with HDI capabilities [4] Group 4: Market Demand and Product Adjustments - In Q3 2024, the demand for packaging substrates has slowed, leading to adjustments in product structure according to market needs [4] - The factory utilization rates for PCB remained stable at high levels, while packaging substrate rates slightly decreased due to fluctuations in demand [4] Group 5: Compliance and Information Disclosure - The company adhered to information disclosure regulations during the investor relations activity, ensuring no significant undisclosed information was leaked [4]

Investment Rating - The report maintains an "Outperform" rating for the company, with a target price of 147.79 RMB based on a 2025 PE of 30x, reflecting a 42% increase from the previous target price of 104.14 RMB [4][14]. Core Insights - The company reported a revenue of 13.05 billion RMB for the first three quarters, representing a year-on-year increase of 37.92%. The net profit attributable to shareholders was 1.49 billion RMB, up 63.86% year-on-year, with a gross profit margin of 25.91% [9][10]. - In Q3 2024, the revenue was 4.73 billion RMB, a 37.95% increase year-on-year and an 8.45% increase quarter-on-quarter. The net profit attributable to shareholders was 501 million RMB, reflecting a 15.33% year-on-year increase but a 17.60% decrease quarter-on-quarter [10][11]. - The demand for PCB in data centers and automotive electronics has increased, while the communication sector has seen a decline in revenue due to stagnant demand for wireless communication base station products [12][13]. Financial Performance Summary - For the first three quarters, the company achieved a revenue of 13.05 billion RMB, with a net profit of 1.49 billion RMB, and a gross profit margin of 25.91% [9]. - The projected revenues for 2024, 2025, and 2026 are 17.89 billion RMB, 21.11 billion RMB, and 24.44 billion RMB, respectively, with corresponding net profits of 2.05 billion RMB, 2.53 billion RMB, and 2.98 billion RMB [4][14]. - The company’s gross profit margin is expected to improve from 25.7% in 2024 to 26.3% in 2026, indicating a positive trend in profitability [8].

Group 1: Company Overview - The company focuses on the electronic interconnection field, with three main businesses: printed circuit boards (PCBs), electronic assembly, and packaging substrates, forming a unique "3-In-One" business layout [1] - The company provides comprehensive manufacturing capabilities from samples to small and large batch production, offering one-stop solutions through design, manufacturing, assembly, micro-assembly, and testing services [1] Group 2: Financial Performance - In Q3 2024, the company reported a revenue of CNY 4.728 billion, representing a quarter-on-quarter growth of 8.45%, primarily due to increased project settlements in the electronic assembly business [2] - The overall gross margin slightly decreased due to the lower gross margin of the electronic assembly business and the impact of rising raw material prices [2] Group 3: Business Expansion and Market Focus - The PCB business is primarily focused on communication equipment, with key layouts in data centers (including servers) and automotive electronics, showing revenue growth in these areas in Q3 2024 [2] - The company is expanding its production capacity in Thailand with a total investment of CNY 1.274 billion, with ongoing construction of the factory [2] Group 4: Technology and Product Development - The company has achieved batch production capabilities for FC-BGA packaging substrates with up to 16 layers, and is progressing with sample certification for 20-layer products [3] - The electronic assembly business is positioned as a downstream segment of PCB manufacturing, focusing on communication, data centers, medical, and automotive electronics [3] Group 5: Currency Impact - The company faces currency risk primarily from export sales and import purchases settled in foreign currencies, with Q3 2024 showing a loss due to the appreciation of the RMB against the USD, impacting financial expenses [4]

证券代码：002916 证券简称：深南电路 公告编号：2024-048 深南电路股份有限公司 2024 年第二次临时股东大会决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 特别提示 1、 本次股东大会不存在否决议案的情形。 2、 本次股东大会关于变更会计师事务所的议案，涉及变更以往股东大会已 通过的决议：深南电路股份有限公司（以下简称"公司"）于2024年4月18日召开 了2023年年度股东大会，续聘立信会计师事务所（特殊普通合伙）为公司2024年 度财务报表和内部控制审计机构。根据《国有企业、上市公司选聘会计师事务所 管理办法》相关规定，结合公司审计工作的需要，本次变更容诚会计师事务所（特 殊普通合伙）为公司2024年度年审会计师事务所。 一、会议召开情况 1、会议召开时间： （1）现场会议时间：2024 年 11 月 13 日（星期三）15:15 （2）网络投票时间：2024 年 11 月 13 日。其中，通过深圳证券交易所交易 系统进行投票的时间为 2024 年 11 月 13 日 9:15-9:25、9:30-11:30、13:00-15:0 ...