Core Insights - The company, Chuangzhi Xinlian, established in November 2006, is a global leader in the wet process plating materials industry and a prominent player in the metallization interconnection field within the electronic packaging sector in China. It was recognized as a national-level specialized and innovative "little giant" enterprise in 2024 [2][44]. Group 1: Market Position and Financial Performance - Chuangzhi Xinlian is the largest domestic provider of wet process plating materials in China, as well as the largest one-stop plating solution provider by revenue in 2024 [6][44]. - The company reported cumulative revenues exceeding 1 billion RMB and a net profit of approximately 100 million RMB over three years [10]. - Revenue for the years 2022, 2023, and 2024 was 320 million RMB, 312 million RMB, and 410 million RMB, respectively, with net profits of 27 million RMB, 19 million RMB, and 53 million RMB [13][18]. Group 2: Revenue Breakdown and Growth - In 2024, revenue from PCB industry plating materials accounted for 61.9%, while semiconductor industry plating materials contributed 18.3%, and plating services made up 19.8% of total revenue [18][19]. - The company has experienced a compound annual growth rate (CAGR) of 53.8% in its semiconductor business from fiscal year 2022 to 2024 [4]. Group 3: Product Offerings and Applications - Chuangzhi Xinlian has developed a comprehensive product matrix for chemical and electroplating materials, covering applications in wafer-level packaging, chip-level packaging, and PCB manufacturing [25][27]. - The company's plating materials are used in various applications, including automotive power chips, CIS chips, RF chips, power management chips, and MEMS, serving sectors such as HPC, electric vehicles, rail transportation, AI, communication electronics, and high-end consumer electronics [8][9]. Group 4: Client Relationships and Market Penetration - The company has established long-term partnerships with leading PCB manufacturers and semiconductor companies, with an average cooperation duration of about 10 years [32]. - By the end of 2024, Chuangzhi Xinlian's chemical nickel/gold and chemical nickel/palladium materials were successfully applied in over 120 production lines in the PCB industry, leading the domestic market in coverage [32]. Group 5: Leadership and Ownership Structure - The company is controlled by a group of shareholders led by Yao Cheng and Yao Yu, with Yao Cheng serving as the chairman and Yao Yu as the executive director and R&D director [39][41]. - Yao Cheng holds a 52.39% stake in the company, while other significant shareholders include Zhiyuanxin and Zhiyuanxin Material [41]. Group 6: Industry Trends and Future Outlook - The demand for wet process plating materials in China is expected to grow, driven by the rapid expansion of sectors such as AI, electric vehicles, and data centers [44]. - The domestic supply of raw materials in the semiconductor sector has increased from approximately 10% to over 15% by 2024, indicating a trend towards localization in the supply chain [44].

Market Performance - The main board led the gains with notable increases in stocks such as Yuyin Co. (+10.08%), Chaoxun Communication (+7.09%), and Yongding Co. (+7.03%) [1] - The ChiNext board saw significant growth with New Guodu (+16.30%) and Xiechuang Data (+11.81%) leading the charge [1] - The Sci-Tech Innovation board was also up, with Dekeli (+7.58%) and Qingyue Technology (+7.19%) showing strong performance [1] - Active sub-industries included SW Communication Network Equipment and Devices (+1.94%) and SW Communication Terminals and Accessories (+1.20%) [1] Domestic News - Aibang Semiconductor Network announced a total investment of 1.2 billion, with Hanjin Technology's silicon carbide packaging project reaching completion, capable of producing 300,000 silicon carbide power modules and 50 million silicon carbide power devices annually [1] - TSMC reported a surge in demand for CoWoS chip manufacturing materials, leading to shortages in the memory market, with Mitsubishi Gas Chemical announcing delays in shipments of materials for BT substrates [1] - Changfei Advanced's Wuhan base achieved mass production, with the first 6-inch silicon carbide wafer successfully produced, expected to reach an annual production capacity of 360,000 silicon carbide chips [1] - Anhui Huaxin Micro-Nano Integrated Circuit Co. announced the successful production of the first batch of products from its 8-inch wafer production line, which will have a monthly production capacity of 30,000 wafers [1] Company Announcements - Huajin Technology announced a 2024 annual equity distribution plan, distributing 9 yuan for every 10 shares [3] - Jingyan Technology also announced a 2024 annual equity distribution plan, distributing 1.10 yuan in cash dividends for every 10 shares [3] - Airong Software reported receiving a government subsidy of 7.201 million yuan, accounting for 10.85% of the company's audited net profit for the last fiscal year [3] - Yingfang Micro disclosed a pre-announcement of share reduction by a major shareholder, planning to reduce up to 1% of shares through centralized bidding [3] Overseas News - IBM and Deca Technologies formed a significant alliance in the semiconductor packaging sector, allowing IBM to enter the advanced fan-out wafer-level packaging market [2] - Rohm launched its first high-voltage GaN driver IC, which enhances the stability of GaN devices during high-frequency and high-speed switching [2] - In April, iPhone exports from India to the U.S. increased by 76% year-on-year, while exports from China decreased by 76%, reflecting Apple's accelerated manufacturing plans in India [2] - Samsung is reportedly exiting the MLC NAND flash memory market, notifying customers that orders will only be accepted until June, prompting a search for new suppliers [2]

Group 1: Business Growth and Innovation - The company is focusing on semiconductor packaging materials, specifically lead frames and copper pin heat sink substrates, to enhance material performance and reduce packaging costs, targeting applications in power devices and third-generation semiconductors [1][2][15]. - The development of modular and customized liquid cooling solutions is underway, aimed at AI servers and high-density data centers, currently in the R&D verification stage [1][2][6]. - The company is expanding its smart security business, with ongoing R&D and testing for products like smart security checks and protective barriers [1][2][15]. Group 2: Financial Performance - In 2024, the company reported a revenue of 360.19 million CNY, a decrease of 8.65% year-on-year, while net profit attributable to shareholders increased by 29.77% to 11.57 million CNY [3][5][11]. - Revenue from lead frame products surged by 467.80% in 2024, with a further increase of 236.78% in Q1 2025 [2][4][11]. - The smart card business, a core revenue source, saw a decline of 12.62% in revenue, while semiconductor product revenue dropped by 91.99% [3][4][11]. Group 3: Market Trends and Risks - The lead frame market is experiencing robust growth, driven by demand in electric vehicle control systems and high-performance power modules [2][3][4]. - The company acknowledges risks in new product development, including technical, market, and application validation risks, urging investors to make informed decisions [2][6][15]. - The shift towards high-end specifications in lead frames is evident, with increasing customer demands for high thermal conductivity and low thermal resistance [2][3][4]. Group 4: Strategic Planning and Future Directions - The company aims to diversify its revenue streams by investing in semiconductor packaging materials, digital and energy thermal management, and innovative applications for super SIM cards [1][2][15][20]. - Future growth points are identified in the semiconductor packaging sector, with a focus on self-designed and mass-produced products covering various power module needs [1][2][15]. - The company plans to maintain a balance between traditional smart card business and emerging sectors, ensuring stable growth while fostering new business opportunities [1][15][20].

Investment Rating - The investment rating for the company is "Buy" (maintained) [1][4]. Core Views - The company achieved a revenue of 945.09 million yuan in 2024, representing a year-on-year increase of 19.24%, and a net profit attributable to shareholders of 212.20 million yuan, up 11.10% year-on-year. The performance is in line with expectations [4][5]. - The company plans to distribute a cash dividend of 6.5 yuan per 10 shares (including tax) to shareholders [4]. - In Q1 2025, the company reported a revenue of 250 million yuan, a year-on-year increase of 11.16%, and a net profit of 66.36 million yuan, up 10.95% year-on-year [4]. Summary by Sections Business Performance - The company benefited from the recovery in consumer electronics in 2024, with a robust performance supported by its "welding and inspection" capabilities. The company is advancing new business lines, particularly in precision welding and automation solutions for smart devices [4]. - The revenue from precision welding equipment and machine vision process equipment grew by 32.25% and 37.00% year-on-year, respectively [4]. International Strategy - The company's international strategy is showing results, with export revenue increasing by 29.06% year-on-year, accounting for 18.21% of total revenue. The company is enhancing its overseas sales and service capabilities, establishing a subsidiary in Vietnam to provide comprehensive services [4]. Profitability and Cash Flow - The company’s gross margin improved by 1.27 percentage points to 48.65% in 2024, driven by a higher proportion of export business. The R&D expense ratio increased to 14.05%, supporting new technology development [4]. - In Q1 2025, the company reported a sales gross margin of 49.40% and a net profit margin of 26.21%, maintaining a stable performance [4]. Semiconductor Sector Development - The company is making progress in its semiconductor segment, with revenue from die bonding equipment increasing by 9.04% to 26.11 million yuan. The company is developing solutions for power semiconductors and SiC modules, with key technology recognized by the Jiangsu Provincial Department of Industry and Information Technology [4]. Investment Recommendations - The company has a strong position in precision welding technology and is expected to see steady growth in visual inspection and semiconductor packaging equipment. The profit forecasts for 2025-2027 have been adjusted, with net profits projected at 246 million yuan, 299 million yuan, and 367 million yuan, respectively [4][5].

Group 1 - The company reported Q1 2025 revenue of 2.459 billion yuan, a year-on-year increase of 15.14% and a quarter-on-quarter decrease of 14.27% [1] - The net profit attributable to shareholders for Q1 2025 was 207 million yuan, up 50.46% year-on-year but down 28.03% quarter-on-quarter [1] - The company maintains its profit forecast, expecting net profits of 1.189 billion, 1.386 billion, and 1.659 billion yuan for 2025-2027, with corresponding EPS of 1.40, 1.64, and 1.96 yuan per share [1] Group 2 - In Q1 2025, the company’s sales volumes for synthetic resin, advanced electronic materials, and battery materials were 166,300 tons, 17,600 tons, and 56,900 tons, respectively, with year-on-year increases of 10.23%, 11.08%, and 36.55% [2] - The sales revenue for these segments was 1.282 billion, 360 million, and 236 million yuan, reflecting year-on-year growth of 10.33%, 31.30%, and 14.10% [2] - The average selling prices for synthetic resin, advanced electronic materials, and battery materials were 7,707.30, 20,433.09, and 4,149.54 yuan per ton, with year-on-year changes of +0.10%, +18.20%, and -16.44% [2] Group 3 - The company’s Q1 2025 gross margin and net margin were 24.13% and 8.79%, respectively, compared to the 2024 annual report, showing increases of 0.52 percentage points and a decrease of 0.10 percentage points [2] - The phenolic resin average price as of April 17, 2025, was 10,759 yuan per ton, down 360 yuan per ton from the 2024 average, a decrease of 3.2% [2] - The company’s dual business model of "chemical new materials + biomass materials" is operating steadily, with ample growth potential due to rich project layouts [2]

Core Viewpoint - The company reported significant growth in sales revenue and net profit for the first quarter of 2025, driven by increased demand in various sectors including AI computing, high-frequency communication, and battery materials [3][5]. Financial Data - The company achieved a sales revenue of 2.459 billion yuan, a year-on-year increase of 15.14% [3]. - The net profit attributable to shareholders was 207 million yuan, reflecting a 50.46% increase compared to the same period last year [3]. - The net profit excluding non-recurring gains and losses was 192 million yuan, up 51.85% year-on-year [3]. Product Performance - The company sold 17,600 tons of advanced electronic materials and battery materials, a growth of 11.08% year-on-year, generating sales revenue of 360 million yuan, which is a 31.30% increase [3]. - Sales volume of synthetic resin products reached 166,300 tons, up 10.23%, with sales revenue of 1.282 billion yuan, a 10.33% increase [3]. - Biomass product sales volume was 56,900 tons, increasing by 36.55%, with sales revenue of 236 million yuan, a 14.10% increase [3]. Operational Highlights - The Daqing production base's "1 million tons/year biomass refining integrated (Phase I) project" is operating smoothly, with increasing capacity utilization and a reduction in losses during the reporting period [3].

Core Viewpoint - The company has successfully utilized the funds raised from its stock issuance for various projects, with a focus on enhancing production capabilities and meeting market demands, while also planning for future investments in advanced materials [1][2][3][4][5][6][7][8]. Fund Utilization Summary - As of December 31, 2024, the company has allocated RMB 165 million of idle funds to supplement working capital [1]. - The company has completed the high-end electronic chemicals project with a total fund usage of RMB 54.41 million, and the remaining funds have been redirected to new projects [3][6]. - The company has adjusted the funding for the ceramic filter project from RMB 144.14 million to RMB 17.15 million, reallocating the difference to the production of functionalized polyphenylene ether and functional sugar projects [4][6]. Project Completion and Future Plans - The functionalized polyphenylene ether project is expected to be completed by September 2024, with a total investment of approximately RMB 160.53 million [4]. - The functional sugar project is anticipated to be completed by April 2024, with the remaining funds also being redirected to the advanced materials innovation base project [5][7]. - The company has announced plans to invest RMB 500 million into the headquarters innovation center project, with a construction period of 30 months [6][7]. Performance Forecast - For the first quarter of 2025, the company expects a net profit of RMB 200 million to RMB 215 million, representing a year-on-year increase of 45.58% to 56.49% [9][12]. - The anticipated increase in profit is attributed to the growing demand for advanced materials driven by developments in AI computing, high-frequency communication, and semiconductor packaging [12][13]. - The company has successfully ramped up production capacity in its new porous carbon production lines, meeting the demand in consumer electronics and power battery sectors [13].

本次股票发行后拟在科创板市场上市，该市场具有较高的投资风险。科 科创板风险提示 创板公司具有研发投入大、经营风险高、业绩不稳定、退市风险高等特点， 投资者面临较大的市场风险。投资者应充分了解科创板市场的投资风险及本 公司所披露的风险因素，审慎作出投资决定。 江苏艾森半导体材料股份有限公司 (Jiangsu Aisen Semiconductor Material Co., LTD.) （江苏省昆山市千灯镇黄浦江路 1647 号） 首次公开发行股票并在科创板上市 招股说明书 （注册稿） 保荐机构（主承销商） （深圳市前海深港合作区南山街道桂湾五路128号前海深港基金小镇B7栋401） 江苏艾森半导体材料股份有限公司 招股说明书（注册稿） 声明：本公司的发行申请尚需经上海证券交易所和中国证监会履行相应程 序。本招股说明书不具有据以发行股票的法律效力，仅供预先披露之用。投资 者应当以正式公告的招股说明书作为投资决定的依据。 声明 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对发 行人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表 明其对发行人的盈利能力、投资价值或者对投资者的收益作 ...