Company Overview - Jiangsu Changjiang Electronics Technology Co., Ltd. is located at 275 Binhai Middle Road, Jiangyin City, Jiangsu Province, established on November 6, 1998, and listed on June 3, 2003 [2] - The company specializes in integrated circuit system integration, design simulation, and technology development [2] - Changjiang Electronics is classified under the semiconductor packaging and testing sector within the electronics industry [2] Stock Performance - As of August 22, the stock price increased by 2.16% to 37.37 CNY per share, with a trading volume of 1.862 billion CNY and a turnover rate of 2.84%, resulting in a total market capitalization of 66.87 billion CNY [1] - Year-to-date, the stock price has decreased by 8.27%, but it has seen a recent increase of 4.21% over the last five trading days, 7.32% over the last 20 days, and 14.74% over the last 60 days [2] Financial Performance - For the first half of 2025, the company achieved a revenue of 18.605 billion CNY, representing a year-on-year growth of 20.14% [2] - The company has distributed a total of 1.48 billion CNY in dividends since its A-share listing, with 751 million CNY distributed over the past three years [2] Shareholder Information - As of June 30, 2025, the number of shareholders is 319,000, a decrease of 1.37% from the previous period, with an average of 5,608 circulating shares per shareholder, an increase of 1.39% [2] - The second-largest circulating shareholder is Hong Kong Central Clearing Limited, holding 101 million shares, an increase of 13.6115 million shares from the previous period [2] Capital Flow - On August 22, the main funds experienced a net outflow of 35.2573 million CNY, with large orders accounting for 24.30% of purchases and 23.44% of sales [1]

合肥颀中科技股份有限公司 2024 年限制性股票激励计划（草案二次修订稿） 证券简称：颀中科技 证券代码：688352 合肥颀中科技股份有限公司 二〇二五年八月 合肥颀中科技股份有限公司 2024 年限制性股票激励计划（草案二次修订稿） 声明 本公司及全体董事、监事保证本激励计划及其摘要不存在任何虚假记载、误 导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责 任。 特别提示 一、《合肥颀中科技股份有限公司 2024 年限制性股票激励计划（草案二次 修订稿）》（以下简称"本激励计划"）由合肥颀中科技股份有限公司（以下简称 "颀中科技"、"公司"或"本公司"）依据《中华人民共和国公司法》《中华人民共 和国证券法》《上市公司股权激励管理办法》《上海证券交易所科创板股票上市 规则》《科创板上市公司自律监管指南第 4 号——股权激励信息披露》和其他有 关法律、行政法规、规范性文件，以及《公司章程》等有关规定制订。 二、本激励计划采取的激励形式为第二类限制性股票。股票来源为公司向激 励对象定向发行的本公司人民币 A 股普通股股票和/或从二级市场回购的公司 A 股普通股股票。 符合本激励计划授予条件的 ...

Summary of Key Points Core Viewpoint The company, Hefei Qizhong Technology Co., Ltd., has proposed a second revised draft of its 2024 Restricted Stock Incentive Plan, aiming to enhance corporate governance and attract key talent through a stock incentive mechanism. Group 1: Incentive Plan Overview - The total number of restricted stocks to be granted is 35.671119 million shares, accounting for approximately 3.00% of the company's total share capital as of the announcement date [2][4] - The initial grant consists of 34.950985 million shares, representing about 2.94% of the total share capital, while 720134 shares are reserved, making up 0.06% of the total [2][4] Group 2: Purpose of the Incentive Plan - The plan aims to improve the company's governance structure, establish a long-term incentive mechanism, and align the interests of shareholders, the company, and the core team [2][3] Group 3: Incentive Mechanism and Stock Source - The incentive method involves the issuance of second-class restricted stocks [3][4] - The stocks will be sourced from the company's directed issuance of A-shares or repurchased shares from the secondary market [3][4] Group 4: Granting and Vesting Conditions - The initial grant of restricted stocks is subject to performance conditions, including achieving specific financial metrics such as earnings per share and revenue growth rates [15][18] - The vesting period for the granted stocks is set for a maximum of 72 months, with specific vesting schedules outlined [9][12] Group 5: Performance Assessment - The performance assessment will be based on three key indicators: earnings per share, revenue growth rate, and net profit margin, with specific targets set for each assessment period [19][24] - The plan includes a detailed evaluation process for both company-level and individual performance [23][24] Group 6: Legal and Regulatory Compliance - The plan complies with relevant laws and regulations, including the Company Law and Securities Law, ensuring that the incentive mechanism is legally sound [3][15] - The company will conduct necessary disclosures and obtain approvals from the board and shareholders before implementation [25][26]

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., specializes in advanced packaging and testing services for integrated circuits, with a significant focus on Chiplet technology and OLED applications, benefiting from the depreciation of the RMB and recognized as a "specialized, refined, distinctive, and innovative" enterprise [2][3][5]. Company Overview - Hefei Xinhui Microelectronics was established on December 18, 2015, and went public on August 18, 2022. Its main business involves gold bumping, wafer testing, and various packaging services, with 90.38% of revenue coming from integrated circuit packaging and testing [7]. - The company is located in the Hefei Comprehensive Bonded Zone, Anhui Province, and operates within the semiconductor and integrated circuit testing industry [7]. Financial Performance - For the period from January to March 2025, the company achieved a revenue of 375 million yuan, representing a year-on-year growth of 18.80%, and a net profit attributable to shareholders of 40.59 million yuan, up 54.17% year-on-year [8]. - As of March 31, the number of shareholders decreased by 6.64% to 20,400, while the average circulating shares per person increased by 7.11% to 28,329 shares [8]. Market Position and Recognition - The company has a significant overseas revenue share of 54.15%, benefiting from the depreciation of the RMB [5]. - It has been recognized as a national-level "specialized, refined, distinctive, and innovative" small giant enterprise, which enhances its competitiveness and stability within the industry [5]. Investment and Technical Aspects - The company is actively expanding its technological capabilities in advanced packaging, focusing on customer needs and exploring high-end packaging technologies such as Fan-out, 2.5D/3D, and SiP [2]. - The average trading cost of the stock is 12.71 yuan, with the stock price approaching a resistance level of 15.00 yuan, indicating potential for upward movement if the resistance is broken [6].

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., specializes in advanced packaging and testing services for integrated circuits, with a significant focus on Chiplet technology and OLED applications, benefiting from the depreciation of the RMB and recognized as a "specialized, refined, distinctive, and innovative" enterprise [2][3][5]. Group 1: Company Overview - Hefei Xinhui Microelectronics was established on December 18, 2015, and went public on August 18, 2022, focusing on gold bumping technology and providing comprehensive packaging and testing services for display driver chips [7]. - The company's main revenue source comes from integrated circuit packaging and testing, accounting for 90.38% of total revenue, with other services contributing 9.62% [7]. - As of March 31, the company had 20,400 shareholders, a decrease of 6.64% from the previous period, with an average of 28,329 circulating shares per shareholder, an increase of 7.11% [8]. Group 2: Financial Performance - For the period from January to March 2025, the company achieved a revenue of 375 million yuan, representing a year-on-year growth of 18.80%, while the net profit attributable to shareholders was approximately 40.59 million yuan, up 54.17% year-on-year [8]. - The company has distributed a total of 161 million yuan in dividends since its A-share listing [8]. Group 3: Market Position and Trends - The company is positioned within the semiconductor industry, specifically in the integrated circuit packaging and testing sector, and is recognized as a "specialized, refined, distinctive, and innovative" enterprise, which enhances its competitiveness and stability within the supply chain [3][5]. - The company has a significant overseas revenue share of 54.15%, benefiting from the depreciation of the RMB [3].

此外，由于激光直接成像曝光工艺省去了传统制作工艺需要制作电路曝光掩膜版的环节，将新品导入周 期从传统的8~10周时间，缩短到2~4周，显著节省了客户开发新品的周期与成本，具有明显的客户吸引 力。公司目标是在稳定工艺与提高产品品质的同时，计划用三年的时间提高蚀刻引线框架产能，致力于 成为全球主流的蚀刻金属引线框架供应商。（全景网） 更多精彩请点击：https://rs.p5w.net/html/147882.shtml 新恒汇（301678）首次公开发行股票并在创业板上市网上路演6月10日成功举行。新恒汇董事长任志军 在回答投资者提问时表示，蚀刻金属引线框架是集成电路封装的关键材料，近年来集成电路封测市场对 蚀刻金属引线框架的需求量在逐年增大。目前蚀刻引线框架的主要供应商还集中在日本、韩国、中国香 港等地区，国内大陆地区自给率较低。公司在技术工艺方面采用独特的激光直接成像曝光技术，生产工 艺不同于传统厂家，可以有效提升产品良率，因此在成本方面有较大的潜力与竞争优势。 ...

Core Viewpoint - The company, Hefei Qizhong Technology Co., Ltd., is a leading provider of advanced packaging and testing services for integrated circuits, maintaining a strong position in the industry through technological leadership and a solid customer base [1] Industry Overview - The display driver industry chain is shifting to mainland China, leading to rapid growth in domestic packaging and testing demand. In 2020, the market size for display driver chip packaging in mainland China reached 4.68 billion yuan, with a CAGR of 16% from 2016 to 2020 [2] - The penetration of AMOLED technology in smartphones, wearables, and tablets is driving incremental demand. The global AMOLED penetration rate is expected to rise from 18% in 2017 to 41% by 2024 [2] Company Positioning - The company offers comprehensive packaging services across various processes, including gold bump manufacturing and COG/COP/COF packaging, and has established a strong customer base including leading firms like Novatek and Etron Technology. The company is well-positioned to benefit from the domesticization trend in the industry [3] - The company is strategically targeting the high-growth AMOLED DDIC packaging segment, with projections indicating that revenue from AMOLED products will account for 20% of total revenue by 2024 [3] Non-Display Business Development - The company's non-display packaging services focus on power management and RF front-end chips, providing a complete solution for wafer-level chip-scale packaging. The projected revenue from non-display chip packaging is approximately 150 million yuan in 2024, reflecting a year-on-year growth of about 17% [4] Financial Projections - The company is expected to achieve revenues of 2.253 billion, 2.686 billion, and 3.042 billion yuan in 2025, 2026, and 2027, respectively, with corresponding net profits of 310 million, 410 million, and 520 million yuan. The projected EPS for these years are 0.26, 0.34, and 0.44 yuan, with PE ratios of 43.65, 33.54, and 26.21 based on the closing price on August 8, 2025 [5]

来源：新浪证券-红岸工作室 8月5日，汇成股份跌0.35%，成交额3.49亿元，换手率5.30%，总市值95.45亿元。 异动分析 先进封装+OLED+芯片概念+人民币贬值受益+专精特新 1、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 2、2024年7月3日公司投资者关系活动记录表：公司目前OLED客户主要包括联咏、瑞鼎、奕力、云英 谷、集创北方、芯颖、傲显、昇显微、晟合微等。 该股筹码平均交易成本为10.40元，近期该股有吸筹现象，但吸筹力度不强；目前股价靠近压力位 11.55，谨防压力位处回调，若突破压力位则可能会开启一波上涨行情。 5、专精特新"小巨人"企业是全国中小企业评定工作中最高等级、最具权威的荣誉称号，是指专注于细 分市场、创新能力强、市场占有率高、掌握关键核心技术、质量效益优的排头兵企业，对于提升中小企 业自身的竞争力 ...

Core Viewpoint - Hefei Chipmore Technology Co., Ltd. is issuing convertible bonds to unspecified investors, with a focus on meeting the suitability requirements for investors in the Sci-Tech Innovation Board [1][2]. Group 1: Convertible Bond Issuance - The company is issuing convertible bonds with redemption clauses, including maturity redemption and conditional redemption, with the redemption price determined by the board based on market conditions [2][3]. - The company has set a credit rating of "AA+" for the bonds, with a stable outlook, as assessed by Dongfang Jincheng [3][4]. Group 2: Risks and Considerations - Investors who do not meet the suitability requirements may face risks, including the inability to convert bonds into shares and potential losses if redemption prices are lower than the acquisition cost [2][3]. - The company has not provided guarantees for the bonds, which may lead to repayment risks if significant negative events affect its operational management and debt repayment capabilities [3][4]. Group 3: Business Development and Market Position - The company has been expanding its non-display advanced packaging technology since 2015, but its overall scale remains relatively small compared to leading competitors in the industry [6][7]. - The company faces risks from intensified market competition, particularly in the advanced packaging sector, where larger firms are actively investing [6][7]. Group 4: Fund Utilization and Project Risks - The funds raised will be used for projects including high-pin-count micro-sized bump packaging and advanced power and flip-chip packaging technology upgrades, which are expected to enhance the company's core competitiveness [7][8]. - There are risks associated with project implementation, including potential delays, market changes, and the possibility of not achieving expected profitability from the new projects [8][9]. Group 5: Measures to Mitigate Immediate Return Dilution - The company plans to implement various measures to protect investors' interests and mitigate the dilution of immediate returns from the bond issuance [10][11]. - The company has committed to strict governance and management practices to ensure effective use of raised funds and to enhance its profitability and core competitiveness [10][11].

来源：新浪证券-红岸工作室 7月31日，汇成股份跌1.63%，成交额4.73亿元，换手率7.38%，总市值91.25亿元。 异动分析 先进封装+芯片概念+OLED+人民币贬值受益+专精特新 1、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 2、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品是 集成电路封装测试。 主力没有控盘，筹码分布非常分散，主力成交额1.78亿，占总成交额的4.85%。 技术面：筹码平均交易成本为10.22元 3、2024年7月3日公司投资者关系活动记录表：公司目前OLED客户主要包括联咏、瑞鼎、奕力、云英 谷、集创北方、芯颖、傲显、昇显微、晟合微等。 4、根据2024年年报，公司海外营收占比为54.15%，受益于人民币贬值。 5、专精特新"小巨人"企业是全国中小企业评定工作中最 ...