华为算力，不再低调。 9月18日，在华为全联接大会上，华为副董事长、轮值董事长徐直军放猛料，直接公布了华为AI算力的 全景图。 从全新的4颗昇腾芯片、3个超节点、2款鲲鹏CPU，到全新互联总线架构灵衢，华为从GPU到联接技 术，全面对标英伟达。也很少有科技企业，像华为这样做到AI算力全栈技术。即使在华为内部人士看 来，此次把很多曾在内部视为机密的计划都对外释放了。 徐直军指出："算力，过去是，未来也将继续是人工智能的关键，更是中国人工智能的关键，"并再次强 调："基于中国可获得的芯片制造工艺，华为努力打造'超节点+集群'算力解决方案，来满足持续增长的 算力需求。" 这也是时隔6年，华为又一次在全联接大会上集中展示芯片的进展。每年大会都是华为技术趋势的观察 窗口，今年计算产业站到了最前沿。徐直军甚至在演讲中预告，明年可能叫"华为计算联接大会"，对AI 算力的期许可见一斑。 回看华为在AI算力产业的布局，不论超节点还是昇腾，从来都不是横空出世，而是华为在持续研发中 跑出的科技范式。尊重人才、长期投入基础研究、重视商业化能力，正是这样系统性的研发和市场驱 动，才有了华为独特的范式创新。 徐直军表示，算力的基础是芯片 ...

来源：喜娜AI 金融市场犹如变幻莫测的海洋，时刻涌动着投资与经济政策的波澜，深刻影响着全球经济的走向。在 此，喜娜AI为您呈上昨夜今晨的财经热点新闻，全方位覆盖股市动态、经济数据、企业财务状况以及 政策更新等关键领域，助您精准洞察金融世界的风云变幻，把握市场脉搏。 美联储时隔九月重启降息，市场反应不一前景待察 9月17日，离岸人民币升破7.1，创下11个月新高，人民币兑美元汇率走强或预示人民币资产开启长期升 值周期。与此同时，9月至今，南向资金加仓超1100亿港元，互联网龙头公司成流入重点，恒生科技指 数成功突破前期震荡箱体，站上6300点，创下4年来新高。分析认为，美联储降息、跨境资金流动改 善、人民币中间价调控等因素促使人民币升值，未来人民币汇率有望稳中有升。详情>> A股冲高回落沪指近百点巨震，市场风格转换连板情绪升温 9月18日，受凌晨美联储降息利好影响，A股三大指数早盘冲高，沪指距3900点仅一步之遥，但午后风 云突变，指数齐齐跳水。截至收盘，沪指跌1.15%，深成指跌1.06%，创业板指跌1.64%。市场超4300股 回调，成交额时隔15日再度冲高超3.16万亿元。分析认为，市场涨幅过快，部分资金 ...

以下文章来源于科创板日报 ，作者黄心怡 此外，华为还规划后续推出Atlas 960 SuperPoD ，预计将支持15488张昇腾卡，算力达30 EFLOPS FP8 / 60 EFLOPS FP4，计划2027年四季度 上市。 基于超节点，华为同时发布了 全球最强超节点集群，分别是Atlas 950 SuperCluster和 Atlas 960 SuperCluster，算力规模分别超过50万卡和达到 百万卡。 除了昇腾芯片以外，华为今日还公布了通用计算领域鲲鹏芯片路线图， 预计鲲鹏 950 芯片 2026 年 Q4 推出，鲲鹏 960 芯片 2028 年 Q1 推出 。同时， 华为推出了全球首个通算超节点TaiShan950 SuperPoD，将于2026年第一季度上市。 结合GaussDB分布式数据库，能够取代各种应用场 景的大型机和小型机以及Exadata数据库一体机，将成为各类大型机、小型机的终结者。 科创板日报 . 科创板第一媒体平台，聚焦科创板及新兴产业发展，专业、权威。 "算力，过去是，未来也将继续是，人工智能的关键，更是中国人工智能的关键。"华为轮值董事长徐直军在华为全联接大会2025上表 ...

Core Insights - Huawei Investment Holding Co., Ltd. has increased its registered capital from approximately 58.078 billion RMB to about 63.886 billion RMB, marking an increase of around 5.8 billion RMB, or nearly 10% [1][2] - The company is a leading global provider of ICT infrastructure and smart terminals, with a vision to connect the digital world to every individual, family, and organization, heavily relying on semiconductor support [3] Group 1: Capital Changes - The change in registered capital reflects a strategic move to strengthen financial resources for future investments and operations [1][2] - The ownership structure shows Huawei Investment Holding Co., Ltd. Trade Union Committee holding 99.48% and Ren Zhengfei holding 0.52% [2] Group 2: Semiconductor Strategy - Huawei has been actively expanding its semiconductor footprint through self-research and external investments, particularly via its subsidiary HiSilicon, which designs chips for various applications [4] - HiSilicon has launched multiple series of chip products, including Kirin for mobile processors, Ascend for AI processors, Kunpeng for servers, Balong for communication baseband chips, and Lingxiao for routers [4] Group 3: Investment Activities - Huawei's investment arm, Hubble Technology Venture Capital, has invested in over a hundred semiconductor-related companies, covering the entire semiconductor supply chain from design to manufacturing [5] - Recent investments have slowed, with Huawei's Hubble only acquiring a stake in Chengdu Xinzhao Technology Co., Ltd., a company specializing in ultrasonic fingerprint chips [6][7] Group 4: Future Outlook - Despite a slowdown in recent investments, Huawei's strategy appears to be shifting from broad investments to focused, high-quality engagements in the semiconductor sector [10] - The recent capital increase may enable Huawei to further enhance its semiconductor capabilities, solidifying its competitive edge in the global market [10]

Core Viewpoint - Huawei demonstrates strong technological capabilities in the semiconductor industry, particularly with its Ascend series chips and the recent launch of CM384, positioning itself as a leader in domestic AI chips [2][3]. Group 1: Financial Performance - In 2024, Huawei achieved a total revenue of RMB 862.072 billion, representing a year-on-year growth of 22.4% [5]. - The smart automotive solutions segment saw a remarkable revenue increase of 474.4%, while terminal business and digital energy businesses grew by 38.3% and 24.4%, respectively [5]. - Revenue from the Chinese market reached RMB 615.264 billion, driven by digitalization, intelligence, and low-carbon transformation [5]. Group 2: Huawei Cloud - The overall public cloud market in China is projected to reach USD 24.11 billion in the second half of 2024, with IaaS accounting for USD 13.21 billion, representing a year-on-year growth of 14.4% [6]. - Huawei Cloud holds a 13.2% market share in the Chinese IaaS market, making it the second-largest cloud provider after Alibaba Cloud [6]. - Huawei Cloud's revenue growth rate reached 24.4%, the highest among major cloud vendors in China [6]. Group 3: Ascend Chips - The CloudMatrix 384 super node integrates 384 Ascend 910 chips, achieving a cluster performance of 300 PFLOPS, which is 1.7 times that of Nvidia's GB200 NVL72 [10]. - The single-chip performance of Huawei's Ascend 910C is approximately 780 TFLOPS, which is one-third of Nvidia's GB200 [10][11]. - The Ascend computing system encompasses a comprehensive ecosystem from hardware to software, aiming to meet various AI computing needs [15][20]. Group 4: HarmonyOS - HarmonyOS features a self-developed microkernel, AI-native capabilities, distributed collaboration, and privacy protection, distinguishing it from Android and iOS [12]. - The microkernel architecture enhances performance and fluidity, while the distributed soft bus technology allows seamless connectivity among devices [12][13]. Group 5: Kirin Chips - The Kirin 9020 chip has reached high-end processor standards, comparable to a downclocked Snapdragon 8 Gen 2 [23]. - The Kirin X90 chip, based on the ARMv9 instruction set, features a 16-core design with a frequency exceeding 4.2GHz, achieving a 40% improvement in energy efficiency [25][26]. Group 6: Kunpeng Chips - Kunpeng processors are designed for servers and data centers, focusing on high performance, low power consumption, and scalability [27]. - The Kunpeng ecosystem strategy emphasizes hardware openness, software open-source, enabling partners, and talent development [29].

Core Viewpoint - Arm is aggressively expanding into the custom chip design market, which poses a significant threat to its downstream partners and highlights its dominance in the semiconductor IP sector [1][3]. Group 1: Arm's Business Strategy - Arm plans to offer self-developed chips to clients, a move that has been perceived as exploitative towards its partners [1]. - The company has increased its licensing fees by three times in the past six months, further tightening its grip on downstream manufacturers [2]. - Arm's revenue heavily relies on a few major clients, with 56% of its income coming from the top five customers, making it vulnerable to potential client defections [3]. Group 2: Downstream Manufacturers' Challenges - Downstream manufacturers face high licensing fees and restrictive agreements, such as the "one generation, one purchase" model, which limits their ability to innovate and adapt [2][4]. - Many domestic manufacturers are reportedly surrendering to Arm's demands, despite the high costs associated with licensing [4][5]. - The dependency on Arm's technology has created a widening performance gap between domestic chips and international counterparts [4]. Group 3: Potential Shift to RISC-V - There is a growing necessity for domestic manufacturers to break free from Arm's control, especially for companies involved in national security and innovation [6]. - RISC-V is emerging as a viable alternative to Arm, offering an open-source model that contrasts with Arm's closed ecosystem, thus providing greater autonomy for developers [6][7]. - The increasing investment in RISC-V technology by major companies indicates a shift in the industry, as they seek to reduce reliance on Arm [7][8].

Core Viewpoint - Huawei has evolved from being primarily a telecommunications equipment provider to a global leader in ICT infrastructure and smart terminal solutions, with a diverse range of products across multiple sectors [3][4][69]. Group 1: Business Overview - Huawei's business is categorized into six main areas: Chip and Device Business, ICT Infrastructure, Cloud Computing, Digital Energy, Terminal Business, and Smart Automotive Solutions [6][7]. - The ICT Infrastructure segment, which includes communication and IT, is projected to account for 42.9% of Huawei's total revenue in 2024 [8]. Group 2: ICT Infrastructure - The ICT Infrastructure business is divided into communication and IT components, with communication being the foundation of Huawei's operations, serving primarily telecom operators and enterprise users [8][31]. - Communication products include wireless networks (5G base stations) and fixed networks (optical communication equipment) [10][19]. - Huawei's core network products have transitioned to cloud-based solutions, enhancing their capabilities in 5G and data transmission [15][31]. Group 3: Cloud Computing - Huawei's cloud computing services encompass a wide range of offerings, including computing, storage, networking, databases, AI, and big data, leveraging its ICT infrastructure [46][48]. Group 4: Digital Energy - The Digital Energy business has gained traction due to the growth of solar energy, electric vehicles, and data centers, with Huawei providing energy solutions for these sectors [51][52]. Group 5: Terminal Business - Huawei's terminal products include smartphones, tablets, laptops, and smart wearables, with a focus on integrating its devices with the Harmony operating system [57][59]. Group 6: Smart Automotive Solutions - Huawei collaborates with automotive companies to provide smart vehicle solutions, focusing on intelligent systems and components without manufacturing vehicles itself [62][64]. Group 7: Chip and Device Business - The Chip and Device Business, primarily through its subsidiary HiSilicon, produces a variety of chips for different applications, including mobile devices and AI [67].