是说芯语

Search documents
对HYGON + Sugon的几点思考
是说芯语· 2025-05-25 23:37
Core Viewpoint - The merger between Haiguang Information and Zhongke Shuguang marks a significant step in the vertical integration of China's semiconductor industry, aiming to enhance domestic capabilities and reduce reliance on foreign technology [2][5]. Group 1: Merger Details - Haiguang Information will absorb Zhongke Shuguang with a market value of 20 billion, initiating a new chapter in China's semiconductor industry [2]. - The merger allows for a direct connection from chip design to computing systems, significantly reducing the adaptation time for hardware architecture from three months to two weeks, and cutting R&D costs by 40% [3]. Group 2: Market Impact - The integration is expected to lower the prices of similar products by 15%-20%, challenging the market positions of Huawei's Kunpeng and Ascend ecosystems [4]. - The combined entity aims to increase the penetration rate of self-developed CPU/DCU in servers from 35% to 70%, enhancing the domestic supply chain's resilience [3]. Group 3: Industry Significance - This merger represents a shift from isolated advancements to a systematic approach in the semiconductor industry, creating a competitive landscape among different architectures: Loongson (MIPS), Kunpeng (ARM), and Haiguang (x86) [5]. - The merger is seen as a pivotal moment for establishing a complete domestic ecosystem in semiconductor design, manufacturing, and software adaptation [9]. Group 4: Challenges Ahead - Haiguang's reliance on TSMC for 7nm chips presents a technological gap that needs to be addressed through joint development of advanced packaging technologies [7]. - The transition from Windows to a Linux ecosystem for 40% of Shuguang's servers poses a significant technical challenge, requiring a complete migration within two years [8]. - The merger is subject to international regulatory scrutiny, particularly from the U.S. CFIUS, which may impact the approval process due to concerns over technology independence [8]. Group 5: Future Outlook - The merger is anticipated to create a Chinese computing ecosystem capable of competing with Intel's IDM model and NVIDIA's design ecosystem, with a long-term vision that extends beyond immediate market valuation [9].
海光信息吸收合并中科曙光!
是说芯语· 2025-05-25 11:53
申请入围"中国IC独角兽" 成立日期:2014年 10月 24 日 注册资本:232,433.8091 万元人民币 半导体高质量发展创新成果征集 5月25日消息,海光信息与中科曙光双双公告,海光信息拟向中科曙光全体A股换股股东发行A股股票,换股吸收合并中科曙光,同时发行A 股股票募集配套资金 。 双方已签署《吸收合并意向协议》。因事项存在不确定性,为防股价异常波动,两家公司A股股票于5月26日开市起停牌,预计不超10个交 易日,重组实施尚需经双方内部决策及监管机构批准。 相关公告并申请公司股票复牌。敬请广大投资者关注后续公告,并注意投资风险。 二、本次重组的基本情况 (一)吸并方的基本情况 公司名称:海光信息技术股份有限公司 统一社会信用代码:911201163004788158 法定代表人:沙超群 住所:天津华苑产业区海泰西路 18 号北 2-204 工业孵化-3-8 公司类型:股份有限公司(上市) 经营范围:集成电路、电子信息、软件技术开发、咨询、服务、转让;批发 和零售业:计算机系统集成:物业管理;货物及技术进出口业务。(依法须经批准 的项目,经相关部门批准后方可开展经营活动) (二)被吸并方的基本情况 ...
中芯国际各foundry的产能
是说芯语· 2025-05-25 11:19
Summary of Key Points Core Viewpoint - The article provides an analysis of the foundry capacity of SMIC (Semiconductor Manufacturing International Corporation) across its facilities in Beijing, Tianjin, Shanghai, and Shenzhen, highlighting the production capacity for both 8-inch and 12-inch wafers in the first quarter of the year and projections for the upcoming quarters. Group 1: Beijing Foundry Capacity - Beijing has three 12-inch wafer fabs with capacities of 56, 76, and 25 KWPM in Q1. The production capacity is expected to remain stable in the next two quarters, with a slight decline anticipated [3][4]. Group 2: Tianjin Foundry Capacity - Tianjin has one 8-inch wafer fab with a capacity of 148 KWPM in Q1. A slight decrease in production capacity is expected in the following two quarters [5][6]. Group 3: Shanghai Foundry Capacity - Shanghai, being SMIC's main base, has one 8-inch fab and two 12-inch fabs. The capacities in Q1 are 120 KWPM for the 8-inch fab and 23 and 13 KWPM for the 12-inch fabs. The 8-inch fab's capacity is expected to decline, while the 12-inch fabs are projected to increase their production [7][8]. Group 4: Shenzhen Foundry Capacity - Shenzhen has one 8-inch fab with a capacity of 67 KWPM and one 12-inch fab with a capacity of 33 KWPM in Q1. Future projections indicate a slight increase in both fabs' capacities [9][10].
英伟达6000D或B40要来了!
是说芯语· 2025-05-25 08:42
申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 加入"中国IC独角兽联盟",请点击进入 投稿 、 商务合作 请微信 dolphinjetta 中国券商广发证券本周在一份报告中称,这款新 GPU 可能会被命名为 6000D 或 B40 ,其采用 GDDR7 内存技术,可实现大约每秒 1.7 太字节的带宽,刚好在出口管控范围内。 在 NVLink 单向速度约 550GB/s 及 CUDA 的支持下,广发预计到 2025 年底出货量将达约 100 万片。 英伟达此前已多次为中国市场设计符合美国出口规则的芯片,如 L20 PCIe 、 L2 PCIe 以及 HGX H20 芯 片等。 2022 年,美国禁止向中国出售和运输先进 AI 芯片。尽管英伟达一直表示遵守规则,但美国商 务部长吉娜 ・ 雷蒙多对该公司不断重新设计 AI 芯片以向中国出售修改版本表示不满。 不过,中国市场对于 AI 芯片的需求庞大,即便面临出口限制,仍有诸多途径获取相关硬件。部分中国 公司通过微软和谷歌云服务器租赁硬件来实现虚拟使用;还有公司通过出口规则宽松的第三国将受限制 的硬件引入中国;甚至一些包含先进芯片的服务器产品也能流入中国市 ...
江丰电子董事长姚力军辞职!
是说芯语· 2025-05-25 05:06
Core Viewpoint - The strategic transition of Jiangfeng Electronics' leadership, with the founder Yao Lijun stepping down as chairman to focus on technology, is aimed at enhancing the company's innovation capabilities in the semiconductor materials sector [2][3]. Group 1: Leadership Changes - Yao Lijun, the actual controller of Jiangfeng Electronics, announced his resignation as chairman to become the Chief Technology Officer, while the original general manager Bian Yijun took over the chairman position [2]. - Yao Lijun's decision to step down is seen as a deliberate strategic shift rather than a mere retirement, allowing him to return to his technical roots [2]. - The nomination of Yao Lijun's son, Yao Shun, as a non-independent director candidate indicates a plan for family succession within the company [3]. Group 2: Implications for Company Strategy - The transition in leadership is expected to facilitate a smoother operational period for the company, leveraging Yao Lijun's extensive management experience and strategic vision [3]. - The governance structure adjustment is a response to current management needs and lays the groundwork for future generational succession, similar to models seen in companies like Midea Group [3]. - The market reacted to the leadership changes with stock price fluctuations, reflecting short-term investor concerns, but long-term prospects depend on the new management's ability to achieve technological breakthroughs and management upgrades [3].
又一家国产CPU初创公司爆雷
是说芯语· 2025-05-24 00:56
博瑞晶芯陷入困境的原因是多方面的。从行业大环境来看,当前整个芯片行业都面临挑战。近年来,全 球芯片市场竞争愈发激烈,技术迭代迅速,对企业的研发投入、技术创新能力和市场拓展能力都提出了 极高要求。同时,宏观经济形势的不确定性,也使得芯片企业在融资、市场需求等方面面临压力。 从公司自身角度分析,芯片研发是一个高投入、长周期的过程。以基于Arm架构开发服务器SoC产品为 例,其复杂度高,商业落地难度大。通常需要经过2-3代产品的研发,企业才可能具备造血能力。若采 用5nm设计芯片,一代产品研发至少需要7-10亿人民币,三代产品则至少需要20-30亿人民币的投入。博 瑞晶芯虽然成立之初获得了大量投资,但面对如此高额且持续的研发投入,资金压力逐渐显现。而且, 公司在发展过程中可能面临技术研发进度不及预期、市场竞争激烈导致产品推广困难等问题,这些都进 一步加剧了公司的困境。 申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 近日,企查查数据显示,深圳博瑞晶芯科技有限公司将公司总部从深圳南山迁至珠海唐家湾镇,同时公 司注册资本从80亿人民币大幅减资至2.21975583亿人民币。在减资公告中,公司呼吁债权人自公告之 ...
特朗普“关税大棒”为何此时挥向苹果?
是说芯语· 2025-05-23 12:12
申请入围"中国IC独角兽" 从经济角度分析,特朗普政府一直对美国庞大的贸易逆差耿耿于怀。苹果产品的大量进口,无疑在贸易 逆差的天平上增加了砝码。征收关税看似是减少贸易逆差的"捷径",既能提升进口成本,促使消费者转 向本土产品,又能增加政府财政收入。 苹果若真面临25%的关税,首当其冲的便是成本剧增。长期以来,苹果构建了全球化的供应链体系,从 芯片制造到组装环节,广泛分布于世界各地,印度、中国等国家承担了重要角色。以iPhone为例,在中 国、印度等地的低成本组装,有力地控制了整体生产成本。一旦关税落地,进口至美国的每一部iPhone 成本都将大幅攀升。 为应对成本压力,苹果可能采取提价策略,但这无疑将削弱产品在美国市场的价格竞争力。美国消费者 对电子产品价格敏感度颇高,竞争对手三星等或许正虎视眈眈,准备趁苹果提价抢占市场份额。此前特 朗普针对汽车等行业的关税举措,已引发相关产品价格上涨,消费者叫苦不迭。若iPhone价格飙升,极 有可能引发消费者抵制情绪,冲击苹果的销量与营收。 苹果也可考虑将生产全面回迁美国,但这一过程绝非易事。美国劳动力成本远高于亚洲国家,且相关产 业配套并不完善,短期内组建起成熟高效的供 ...
美又一禁令出台,或涉及华为、中兴、海康威视!
是说芯语· 2025-05-23 07:39
Core Viewpoint - The article discusses the recent decision by the FCC to prohibit Chinese laboratories deemed a national security risk from testing electronic products intended for the U.S. market, highlighting the escalating tech competition between the U.S. and China [2][6]. Group 1: FCC Decision and Implications - The FCC unanimously passed a rule banning Chinese laboratories identified as national security risks from testing electronic products for the U.S. market, affecting devices like smartphones and cameras [2][4]. - Approximately 75% of electronic products sold in the U.S. are tested in Chinese laboratories, many of which have deep ties to state-owned enterprises or the military [3][4]. - The FCC has created a blacklist that includes entities associated with the U.S. Department of Defense and the Commerce Department, which will lead to the immediate revocation of certification for implicated laboratories [4][5]. Group 2: Impact on Chinese Companies - The ban will significantly impact Chinese companies, particularly those in telecommunications like Huawei and ZTE, as their product development and testing heavily rely on domestic laboratories [5][6]. - Electronic manufacturing service providers may face order losses and production disruptions due to the inability of domestic labs to participate in pre-export testing [5][6]. - Companies in the security and surveillance sector, such as Hikvision and Dahua, will encounter challenges in gaining U.S. market access if their testing is affected by the ban [5][6]. Group 3: Broader Industry Effects - The U.S. action appears to be motivated by a desire to curb the rapid growth of China's tech industry, which poses a competitive threat to U.S. firms [6][7]. - The ban may lead to a shift in the global tech supply chain, prompting China to invest more in independent technology ecosystems and reduce reliance on U.S. markets [7][8]. - The FCC is also considering additional proposals that could further restrict foreign laboratory testing, potentially leading to increased barriers in global tech cooperation [8].
小米芯片!
是说芯语· 2025-05-22 12:58
以下文章来源于芯榜 ,作者芯榜首席 芯榜 . 芯榜 — 中国芯片排行榜,用大数据理解半导体行业。(www.icrank.cn )芯片半导体集成电路IC微电子 元器件晶圆排名榜单,服务芯片圈半导体圈中国半导体论坛社区 申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 小米自研玄戒 O1 芯片重磅发布 小米重磅发布自研玄戒 O1 芯片,采用台积电第二代 3nm 工艺,集成 190 亿晶体管,十核 CPU 主频最 高 3.9GHz,Geekbench 6 单核 3119 分、安兔兔超 300 万,GPU 光追接近苹果 A18 Pro。项目累计 投入超 135 亿,团队超 2500 人。 芯片首发搭载小米 15S Pro(5499 元起)和平板 7 Ultra。助小米成全球第四家自研 3nm 手机芯片企 业,推动国产半导体升级,虽面临制造依赖等挑战,仍是重要里程碑。 发布会现场,雷军说"一个月前,我开始试用小米15S Pro,刚开始我多少(有些)担心,用了一个月以 后,我心里很踏实"。 1. 芯片核心参数与性能:对标苹果 (一)先进制程与强大配置 玄戒 O1 芯片采用台积电第二代 3nm 工艺制程,集成 19 ...
反外国制裁法在“芯片战争”中的首次出手
是说芯语· 2025-05-22 01:21
以下文章来源于东不压桥研究院 ,作者南极土著 东不压桥研究院 . 关注地缘政治竞争中的科技政策与数字治理,仅代表个人观点,与作者所在的组织无关。 申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 近日,对美国意图封杀华为昇腾等中国先进计算芯片的guidance,中国政府进行了严正回应。 5月20日,中共中央政治局委员、外交部长王毅在京会见美国亚洲协会会长康京和时指出: 美方继续遏制打压中国的正当发展权利,近日竟然试图对中国芯片进行全面封杀,这是赤裸裸的 单边霸凌,中方坚决反对。 5月21日,商务部新闻发言人发表谈话: 中方强调,美方措施涉嫌构成对中国企业采取的歧视性限制措施。任何组织和个人执行或协助执 行美方措施,将涉嫌违反《中华人民共和国反外国制裁法》等法律法规,须承担相应法律责任。 美方通过guidance明确使用华为昇腾芯片可能违反美国出口管制规定。中国商务部发言人的上述表态则相当于 明确:如因慑于美国出口管制法规而" 执行或协助执行" 上述guidance,将涉嫌违反中国的《反外国制裁 法》。 根据《反外国制裁法》第12条: 任何组织和个人均不得执行或者协助执行外国国家对我国公民、组织采取的 ...