证券代码：600584 证券简称：长电科技 公告编号：临 2025-007 江苏长电科技股份有限公司（以下简称"公司"）第八届董事会第八次会议 于 2025 年 4 月 8 日以通讯方式发出通知，于 2025 年 4 月 18 日以现场加电话会 议的方式召开，本次会议应参会董事 9 人，实际参会董事 9 人，公司监事及高级 管理人员列席会议。董事长全华强先生主持会议。会议的召集和召开符合《中华 人民共和国公司法》和《公司章程》的有关规定。 二、董事会会议审议情况 本次会议表决通过了相关的议案，形成决议如下： （一）审议通过了《2024 年度董事会工作报告》 表决结果：9 票同意，0 票反对，0 票弃权。 本议案需提交股东大会审议。 （二）审议通过了《2024 年度首席执行长（CEO）工作报告》 江苏长电科技股份有限公司 第八届董事会第八次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 一、董事会会议召开情况 表决结果：9 票同意，0 票反对，0 票弃权。 （三）审议通过了《2024 年年度报告全文及摘要》（详见上 ...

证券代码：600584 证券简称：长电科技 公告编号：临 2025-013 江苏长电科技股份有限公司 关于提请股东大会授权董事会制定 2025 年度中期 分红方案的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 江苏长电科技股份有限公司（以下简称"公司"）于 2025 年 4 月 18 日召开 第八届董事会第八次会议，审议通过了《关于提请股东大会授权董事会制定 2025 年度中期分红方案的议案》，上述议案尚需提交公司 2024 年年度股东大会审议。 现将相关事项公告如下： 一、2025 年中期分红安排 根据《中华人民共和国公司法》《上市公司章程指引》《上海证券交易所股 票上市规则》《上市公司监管指引第 3 号——上市公司现金分红》等相关规定， 为稳定投资者分红预期，提升公司投资价值，增强投资者获得感，公司董事会拟 提请股东大会授权董事会在满足下述条件前提下制定并实施 2025 年中期（半年 度、前三季度）或春节前分红方案。 （一）中期分红的前提条件 1、公司当期归属于上市公司股东的净利润为正，且累计未分配利润亦为正 数； ...

证券代码：600584 证券简称：长电科技 公告编号：临 2025-012 江苏长电科技股份有限公司 2024 年年度利润分配预案公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 每股分配比例：每股派发现金红利 0.12 元（含税）。 本次利润分配以实施权益分派股权登记日登记的总股本为基数，具体日 期将在权益分派实施公告中明确。在实施权益分派的股权登记日前公司总股本发 生变动的，拟维持每股分配比例不变，相应调整分配总额，并将在相关公告中披 露。 公司不触及《上海证券交易所股票上市规则（2024 年 4 月修订）》（以下 简称《股票上市规则》）第 9.8.1 条第一款第（八）项规定的可能被实施其他风险 警示的情形。 本年度现金分红占本年度归属于上市公司股东的净利润比例低于 30%， 是基于公司所处行业情况及特点、公司发展阶段和自身经营模式以及资金需求等 因素的综合考虑。 一、利润分配方案内容 （一）利润分配方案的具体内容 经德勤华永会计师事务所（特殊普通合伙）审计，截至 2024 年 12 月 31 日， 江 ...

Financial Performance - The company achieved operating revenue of RMB 35.96 billion in 2024, representing a year-on-year growth of 21.24%[22]. - Net profit attributable to shareholders reached RMB 1.61 billion, an increase of 9.44% compared to the previous year[22]. - The net profit attributable to shareholders after deducting non-recurring gains and losses was RMB 1.55 billion, up 17.02% year-on-year[22]. - The company reported a net cash flow from operating activities of RMB 5.83 billion, reflecting a 31.50% increase from the previous year[22]. - Basic earnings per share increased to RMB 0.90, a rise of 9.76% from the previous year[23]. - The total assets of the company reached RMB 54.06 billion, marking a 26.96% increase compared to the previous year[22]. - Operating costs amounted to CNY 31.27 billion, reflecting a year-on-year increase of 22.08%[54]. - The company reported a significant increase in cash received from financing activities, totaling CNY 2.41 billion, up 71.06% from the previous year[54]. - The company reported a net profit attributable to ordinary shareholders of RMB 1,609,575,410.92 for the recent fiscal year[157]. - The cash dividend amount (including tax) is RMB 214,729,748.40, which represents 13.34% of the net profit attributable to ordinary shareholders[157]. Dividend and Capital Management - The company plans to distribute a cash dividend of 1.2 CNY per 10 shares, totaling 214,729,748.40 CNY, based on a total share capital of 1,789,414,570 shares[6]. - The company will not conduct capital reserve transfers to increase share capital or issue bonus shares in 2024[6]. - The company distributed a cash dividend of 1 RMB per 10 shares in 2023, amounting to 178,941,457.00 RMB, completed on June 27, 2024[153]. - The profit distribution plan for 2024 proposes a cash dividend of 1.2 RMB per 10 shares, totaling 214,729,748.40 RMB, with no stock dividends or capital reserve transfers[153]. - Over the last three fiscal years, the cumulative cash dividend amount (including tax) is RMB 750,982,770.60, with an average net profit of RMB 2,103,756,396.13, resulting in a cash dividend ratio of 35.70%[158]. Acquisitions and Market Expansion - The company completed the acquisition of 80% equity in Shengdie Semiconductor, expanding its market share in the storage and computing electronics sector[29]. - The acquisition of 80% equity in Shengdi Semiconductor was completed for a total investment of 65,912.50 million USD, with 26,219 million USD already paid[81]. - The company aims to optimize its global layout, enhancing functions at its Singapore headquarters and focusing on emerging markets and high-potential clients[31]. - The company is focusing on expanding its market presence through strategic acquisitions and partnerships[123]. Research and Development - The company increased R&D investment, focusing on advanced packaging technology and materials, establishing a Frontier Technology Research Institute to strengthen innovation capabilities[30]. - The company plans to enhance R&D investment in advanced packaging technologies, aiming for breakthroughs in high-end 3D packaging and automotive electronics[69]. - The number of R&D personnel is 3,550, accounting for 14.76% of the total workforce[67]. - Research and development expenses increased to CNY 1.72 billion, a rise of 19.33% year-on-year[54]. - The company is committed to developing new products and technologies to enhance its competitive edge[123]. Corporate Governance and Compliance - The company has received a standard unqualified audit report from Deloitte Huayong[5]. - The company emphasizes that forward-looking statements do not constitute substantive commitments to investors[7]. - The company’s financial report is guaranteed to be true, accurate, and complete by its management[5]. - The company has implemented a robust internal information disclosure mechanism, optimizing internal reporting processes to ensure timely and accurate information sharing[118]. - The company received the "2024 Shanghai Securities Journal Gold Quality Award" for "Corporate Governance" and was recognized for its best practices in board governance[119]. Environmental Responsibility - The company invested approximately 16,503.94 million CNY in environmental protection during the reporting period[165]. - The company’s wastewater treatment facilities meet the semiconductor industry pollutant discharge standards, with all measured pollutants within acceptable limits[168]. - The company has implemented carbon reduction measures, resulting in a reduction of 16,224.328 tons of CO2 equivalent emissions[184]. - The company has established a structured approach to environmental management, focusing on compliance with environmental regulations and standards[165]. - The company is actively involved in rural ecological revitalization projects, with a total investment of 400,000 yuan[185]. Market Outlook - The global semiconductor market is projected to reach $627 billion in 2024, representing a 19% year-over-year growth, driven by demand in AI, storage, and high-performance computing[33]. - The semiconductor market in China is expected to grow by 18.3% in 2024, contributing significantly to the global market recovery[100]. - The advanced packaging market is expected to grow to $51.9 billion in 2024 (up 10.9% year-over-year) and $56.9 billion in 2025 (up 9.6% year-over-year), driven by demand in AI and HPC sectors[98]. Risk Management - The company has detailed risk factors in the report, advising investors to review the section on potential risks[8]. - The company faces market risks due to the cyclical nature of the semiconductor industry and potential changes in government policies affecting the integrated circuit sector[107]. - The company will continue to monitor market trends and adjust its operational goals to mitigate risks associated with geopolitical uncertainties and trade frictions[108]. Employee Engagement and Development - The company launched the J.E.T Program for core talent development across multiple regions, enhancing employee engagement and corporate culture[31]. - The company has established a training program aimed at enhancing employee skills and competencies across various roles[152]. - The total remuneration for all directors, supervisors, and senior management during the reporting period amounted to RMB 27.52 million[137]. Strategic Management Changes - The company is set to elect new board members and supervisors in the upcoming meetings[126]. - The company is preparing for upcoming changes in its board structure with several members set to leave by November 2024[129]. - The company completed the restructuring of the board of directors and the supervisory board, along with the selection of some senior executives due to the change in controlling shareholder and actual controller[138].

证券代码：600584 证券简称：长电科技 公告编号：临 2025-011 江苏长电科技股份有限公司 关于申请发行中期票据的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 根据中国人民银行《银行间债券市场非金融企业债务融资工具管理办法》等 有关规定，为满足公司经营发展资金需求，江苏长电科技股份有限公司（以下简 称"公司"）在 2025 年度拟向中国银行间市场交易商协会申请注册发行规模不超 过人民币 48 亿元（含）的中期票据。具体内容如下： 一、发行方案主要内容 1、发行主体：江苏长电科技股份有限公司 2、注册发行规模：拟向中国银行间市场交易商协会申请注册中期票据总额 不超过人民币 48 亿元（含）。公司可根据实际资金需求注册、一次性或分期发行， 具体规模将以公司在中国银行间市场交易商协会注册金额为准。 3、发行期限：不超过 5 年（含），另可附最长不超过 5 年（含）的延期选择 权。具体将根据公司的资金需求情况和发行时市场情况确定。 4、发行利率：结合公司信用评级状况和发行时市场情况，通过簿记建档进 行市场化定价。 5 ...

Group 1 - The fruit index concept rose by 1.62%, ranking 9th among concept sectors, with 18 stocks increasing in value, led by Xinyi Technology, Lante Optics, and Lens Technology, which rose by 6.73%, 4.82%, and 4.41% respectively [1][2] - The fruit index concept saw a net inflow of 773 million yuan from main funds, with 14 stocks receiving net inflows, and 6 stocks exceeding 50 million yuan in net inflow, with Lens Technology leading at 247 million yuan [2][3] - The top net inflow ratios were recorded for Lens Technology, Xinyi Technology, and Lingyi Technology, with net inflow rates of 15.12%, 12.74%, and 9.75% respectively [3][4] Group 2 - The fruit index concept's performance was contrasted with other sectors, such as the 6G concept which rose by 3.18%, while the South Korea-China Free Trade Zone fell by 3.88% [2] - The trading volume and turnover rates for leading stocks in the fruit index concept were highlighted, with Lens Technology showing a turnover rate of 1.68% and a trading volume of 246.58 million yuan [3][4] - The overall market sentiment reflected a mixed performance across various sectors, with some experiencing significant declines, such as the dairy sector which fell by 3.69% [2]

Core Insights - The Chinese semiconductor industry is experiencing significant growth, with 134 companies reporting their 2024 annual results, indicating a strong upward trend in revenue and profitability [2][3][4] Group 1: Revenue Growth - Among the 134 semiconductor companies, 9 reported revenues exceeding 10 billion yuan, with notable companies like SMIC achieving 57.796 billion yuan, a 27.72% increase year-on-year [2] - Longji Technology is projected to have a revenue of 35.96 billion yuan in 2024, reflecting a 21.2% year-on-year growth [2] - Northern Huachuang expects revenues of 29.838 billion yuan, with a year-on-year growth of 35.14% [3] Group 2: Profitability Improvement - Out of the 134 companies, 92 achieved profitability, representing nearly 70% of the total, while 77 companies reported year-on-year growth in net profit attributable to shareholders [3] - Weir shares are expected to see a net profit of 3.323 billion yuan, marking a staggering 498.11% increase year-on-year [3] - Northern Huachuang's net profit is projected to be 5.621 billion yuan, a 44.17% increase compared to the previous year [3] Group 3: R&D Investment - A total of 68 companies disclosed R&D expenditures amounting to 37.56 billion yuan, with 58 companies reporting year-on-year growth in R&D spending [4] - SMIC, Haiguang Information, and Weir shares lead in R&D spending, with amounts of 5.447 billion yuan, 3.446 billion yuan, and 3.245 billion yuan respectively [4] - Companies like Zhongke Feimeng and Micro Company reported significant year-on-year increases in R&D expenses, with growth rates of 118.17% and 73.59% respectively [4] Group 4: Market Trends and Future Outlook - The rapid development of the Chinese semiconductor industry is attributed to the accumulation of manufacturing capabilities and the swift growth of electronic product manufacturing [6] - AI is driving the growth of cloud computing, smart vehicles, and smart hardware, significantly boosting semiconductor companies' performance [7] - IDC forecasts a 15% year-on-year growth in the semiconductor market by 2025, with the storage market expected to grow by over 24% [7]

Core Viewpoint - The recent performance reports of major semiconductor packaging and testing companies in the A-share market indicate a mixed outlook, with significant growth in net profits for Tongfu Microelectronics and Huada Semiconductor, while Huicheng Co., focused on display driver chip packaging, faces declining profits due to increased competition and lower gross margins [1][2][3]. Group 1: Performance Summary of Major Companies - Longji Technology reported a revenue of 35.96 billion yuan for 2024, a year-on-year increase of 21.2%, and a net profit of 1.61 billion yuan, up 9.5% [1]. - Tongfu Microelectronics achieved a revenue of 23.882 billion yuan, a growth of 7.24%, with a remarkable net profit increase of 299.9% to 677 million yuan [1][2]. - Huada Technology's revenue reached 14.462 billion yuan, reflecting a growth of 28%, while its net profit increased by 172.29% to 616 million yuan [1]. Group 2: Financial Dynamics and Challenges - The significant net profit growth for Tongfu Microelectronics and Huada Technology is based on a low comparison from 2023, where their profits had previously declined [2]. - Despite the net profit surge, Tongfu Microelectronics experienced a decline in net cash flow from operating activities, which fell by 9.68% to 3.877 billion yuan, attributed to increased depreciation expenses [2]. - The EBITDA for Tongfu Microelectronics was reported at 4.815 billion yuan, showing a modest growth of 9.38% [2][3]. Group 3: Industry Competition and Gross Margin Trends - Huicheng Co. reported a revenue of 1.501 billion yuan for 2024, a year-on-year increase of 21.22%, but its net profit decreased by 18.48% to 160 million yuan due to intensified competition in the display driver chip packaging sector [3][4]. - The average gross margin for Huicheng Co. was 22.34%, down 4.83 percentage points, while Tongfu Microelectronics and Huada Technology reported lower gross margins of 14.50% and 12.29%, respectively [4][5]. - The competitive landscape is expected to further pressure gross margins, as new entrants and expanded capacities in the display driver chip packaging market could lead to price declines [5].

Core Viewpoint - The advanced packaging sector in China's semiconductor industry is experiencing significant growth driven by technological advancements and increasing application demands, particularly in 2.5D/3D packaging, Chiplet technology, and System-in-Package (SiP) innovations [1] Financial Performance of Advanced Packaging Companies - Changdian Technology reported a revenue of RMB 35.96 billion for 2024, a year-on-year increase of 21.24%, with a net profit of RMB 1.61 billion, up 9.52% [2] - Tongfu Microelectronics achieved a revenue of RMB 23.88 billion, a 7.24% increase, and a net profit of RMB 678 million, soaring 299.90% [4] - Huatian Technology's revenue reached RMB 14.46 billion, marking a 28% growth, with a net profit of RMB 616 million, a significant increase of 172.29% [3] - Yongxi Electronics reported a revenue of RMB 3.61 billion, a 50.76% increase, and turned a profit with a net profit of RMB 67.1 million [5] - Guizhong Technology's revenue was RMB 1.96 billion, up 20.26%, but net profit decreased by 15.71% to RMB 313 million [5] - Jingfang Technology expects a net profit between RMB 240 million and RMB 264 million, reflecting a growth of 59.90% to 75.89% [6] Market Trends and Drivers - The advanced packaging market is recovering, with most companies reporting revenue growth between 20% and 50%, except for Guizhong Technology, which saw a decline in net profit [7] - The growth in revenue is attributed to increased demand in sectors such as data centers and automotive electronics, alongside the recovery of the semiconductor market [10] - Changdian Technology focuses on advanced technologies and key application markets, optimizing product structure and enhancing capacity utilization [7] - Tongfu Microelectronics has seen significant growth in automotive products, leveraging its technology advantages in industrial control and automotive applications [7] - Huatian Technology's revenue growth is supported by government subsidies, which contributed significantly to its profits [9] Capacity Expansion and Technological Advancements - Changdian Technology's advanced packaging capacity is fully utilized, prompting expansion efforts to meet customer demand [11] - Tongfu Microelectronics is implementing a multi-point layout strategy, enhancing its production capabilities across various locations [11] - Huatian Technology is progressing with new production bases and significant investment projects aimed at expanding its advanced packaging capacity [11] - Emerging advanced packaging projects are also making strides, with new facilities being established to enhance production capabilities [12] - Domestic advanced packaging companies are continuously iterating their technologies, with notable advancements in high-density packaging and chip integration [13]

Group 1 - The report highlights the significant impact of the April 2025 increase in US import tariffs, marking a new phase in global trade barriers and accelerating the regional restructuring of the electronics supply chain, creating opportunities for domestic semiconductor companies [2][15] - The report emphasizes that the tariff adjustments will likely lead to a short-term supply adjustment for US chip manufacturers due to increased costs, while long-term, the cost advantages of US IDM companies in the Chinese market will diminish, benefiting local semiconductor firms [2][15] - The report identifies key areas for domestic substitution, particularly in analog chips and RF modules, where local manufacturers are expected to gain market share due to reduced price pressures from foreign competitors [3][17] Group 2 - The semiconductor industry is entering an upward cycle, supported by a recovery in consumer electronics and AI computing demand, alongside the catalyzing effect of tariff policies [4][23] - The report forecasts strong earnings for leading companies in various segments, with notable projections such as North China Innovation's expected net profit of 1.42-1.74 billion yuan for Q1 2025, representing a year-on-year increase of 24.69%-52.79% [4][20] - The report suggests focusing on companies that will benefit from tariff impacts, including those in analog chips, RF chips, and storage sectors, as well as those involved in domestic manufacturing and critical technology breakthroughs [5][23] Group 3 - The report indicates that the domestic self-sufficiency rate for analog chips is expected to rise significantly due to tariff impacts, with projections showing an increase from approximately 15% in 2023 to over 16% in 2024 [19][22] - The semiconductor sales in China are projected to exceed 170 billion USD in 2024, with a stable growth outlook for the industry despite challenges in the mid-to-low-end market segments [44][45] - The report notes that the global semiconductor market is expected to recover strongly in 2024, with a projected growth rate of 19%, driven by core markets like China and the US [44][45]