所属行业：机械设备/专用设备 当前价格(元)：58.35 买入（维持） 陈蓉芳 -43% -34% -26% -17% -9% 0% 9% 17% 26% 2023-04 2023-08 2023-12 2024-04 芯碁微装 沪深300 相关研究 芯碁微装(688630.SH)：24Q1 营 收增长，泛半导体业务持续拓展 事件：4 月 23 日，芯碁微装发布 2023 年年报和 2024 年一季度报告。2023 年公 司实现营收 8.29 亿元，同比增长 27.07%；归母净利润为 1.79 亿元，同比增长 31.28%。2024 年第一季度公司实现营收 1.98 亿元，同比增长 26.26%；实现归 母净利润 0.40 亿元，同比增长 18.66%。 PCB 领域市占率不断提升，PCB 产业转移带来新的需求增量。公司直接成像设备 市场占有率不断提升，实现了 PCB 前 100 强客户全覆盖，深化与深南电路、生益 电子等客户合作，国际头部厂商鹏鼎控股订单良好，持续攻占高端市场。另外 PCB 产业向东南亚转移的趋势也将持续激发对 PCB 直写光刻设备的需求，当前公司产 品技术节点、品质要求均已达到全球领先水 ...

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市场有风险，投资需谨慎。在任何情况下，本公司不对任何人因使用本报告中的任何内容所引致的任何损失 负任何责任。 投资者应注意，在法律允许的情况下，本公司及其本公司的关联机构可能会持有报告中涉及的公司所发行的 证券并进行交易，并可能为这些公司正在提供或争取提供投资银行、财务顾问和金融产品等各种金融服务。 本公司及其本公司的关联机构或个人可能在本报告公开发布之前已经使用或了解其中的信息。 本报告版权归"中泰证券股份有限公司"所有。事先未经本公司书面授权，任何机构和个人，不得对本报告 进行任何形式的翻版、发布、复制、转载、刊登、篡改，且不得对本报告进行有悖原意的删节或修改。 - 5 - 请务必阅读正文之后的重要声明部分 [Table_Profit] 基本状况 总股本(百万股) 131 流通股本(百万股) 131 市价(元) 55.97 市值(百万元) 7,356 流通市值(百万元) 7,356 [Table_Title] 评级：增持（维持） 分析师：王可 Email：wangke03@zts.com.cn 执业证书编号：S0740522120001 备注：股价取自 2024 年 4 月 23 日 ◼ 事件：公司发布 ...

一年内股价与大盘对比走势： | --- | --- | --- | --- | --- | --- | |----------------------|-------|--------|-------|-------|-------| | | 2023 | 2024Q1 | 2024E | 2025E | 2026E | | 营业总收入（百万元） | 829 | 198 | 1,202 | 1,626 | 2,121 | | 同比增长率（%） | 27.1 | 26.3 | 45.0 | 35.3 | 30.4 | | 归母净利润（百万元） | 179 | 40 | 267 | 382 | 516 | | 同比增长率（ %） | 31.3 | 18.7 | 48.8 | 43.0 | 35.2 | | 每股收益（元/股） | 1.36 | 0.30 | 2.03 | 2.90 | 3.93 | | 毛利率（%） | 42.6 | 43.9 | 44.5 | 46.2 | 47.2 | | ROE（% ） | 8.8 | 1.9 | 12.2 | 14.8 | 16.7 | | 市盈率 | 41 | | 28 ...

合肥芯碁微电子装备股份有限公司 2023 年年度股东大会会议资料 证券代码：688630 证券简称：芯碁微装 合肥芯碁微电子装备股份有限公司 2023 年年度股东大会会议资料 2024 年 5 月 1 | 2023 | 年年度股东大会会议须知 | 3 | | --- | --- | --- | | 2023 | 年年度股东大会会议议程 | 6 | | 2023 | 年年度股东大会会议议案 | 8 | | 议案一 | | 8 | | 议案二 | | 9 | | 议案三 | | 10 | | 议案四 | | 12 | | 议案五 | | 13 | | 议案六 | | 14 | | 议案七 | | 15 | | 议案八 | | 16 | | 议案九 | | 17 | | 议案十 | | 20 | | 议案十一 | | 22 | | 议案十二 | | 23 | | 附件一： | | 24 | | 附件二： | | 28 | | 附件三： | | 36 | 合肥芯碁微电子装备股份有限公司 2023 年年度股东大会会议资料 合肥芯碁微电子装备股份有限公司 2023 年年度股东大会会议须知 为了维护全体股东的合法权益，确保 ...

Strategic Partnerships and Market Expansion - The company established a strategic partnership with Japan's VTEC in May 2023, marking its entry into the Japanese market with the NEX60T dual-surface anti-solder DI equipment[3]. - In October 2023, the company reached a strategic cooperation worth NT$310 million with high-end PCB solution provider Shenlian Circuit, focusing on technology R&D and market expansion[3]. - The company has expanded its market presence in Southeast Asia and Japan through a distributor model, enhancing its overseas market strategy[26]. - The company is actively planning to establish a subsidiary in Thailand to strengthen its presence in Southeast Asian markets[108]. - The company is focusing on expanding its overseas market presence, particularly in Southeast Asia, to meet the increasing demand for PCB direct imaging equipment[108]. Financial Performance - The company's operating revenue for 2023 reached ¥828,855,419.07, representing a 27.07% increase compared to ¥652,276,571.62 in 2022[30]. - The net profit attributable to shareholders for 2023 was ¥179,305,770.17, up 31.28% from ¥136,585,006.80 in the previous year[30]. - The net profit after deducting non-recurring gains and losses was ¥157,908,109.95, reflecting a 35.70% increase from ¥116,364,699.20 in 2022[30]. - The company's total assets as of the end of 2023 amounted to ¥2,480,473,001.97, a 60.38% increase from ¥1,546,661,496.51 at the end of 2022[30]. - The net assets attributable to shareholders increased by 93.66% to ¥2,031,690,393.13 at the end of 2023, compared to ¥1,049,104,818.57 at the end of 2022[30]. - The basic earnings per share for 2023 was ¥1.43, a 26.55% increase from ¥1.13 in 2022[30]. - The company's cash dividend distribution plan proposes a payout of 8.00 yuan per 10 shares, totaling approximately 104.75 million yuan, which represents 58.42% of the net profit attributable to shareholders in 2023[84]. Research and Development - Research and development expenses accounted for 11.41% of operating revenue in 2023, down from 12.99% in 2022[30]. - R&D investment for 2023 reached 94.54 million yuan, representing an increase of 11.56% compared to the previous year[142]. - The company has received a total of 168 authorized patents, including 65 invention patents, 96 utility model patents, and 7 design patents[142]. - The company has established joint laboratories with top universities and research institutions to enhance R&D and attract high-end talent[142]. - The company has accumulated a total of 212 intellectual property rights, including 65 invention patents, 96 utility model patents, and 44 software copyrights by the end of 2023[194]. Product Development and Technology - The company’s direct imaging equipment covers multiple applications, including PCB manufacturing, IC/MEMS, and biochips, with a focus on high-end product market share growth[7]. - The company’s PLP3000 packaging equipment achieves a resolution of 3μm, supporting advanced packaging applications in high-performance computing and AI sectors[12]. - The company’s proprietary direct imaging equipment is designed for various advanced packaging forms, including Flip Chip and Fan-Out WLP, enhancing its market position in the semiconductor industry[18]. - The company’s direct-write lithography equipment achieves a minimum line width of 350-500nm, meeting the demands of the semiconductor industry[143]. - The company launched the LDW series of mask-making equipment, which meets the 90-nanometer process node, showcasing industry-leading technical parameters[198]. Market Trends and Industry Insights - The PCB industry is experiencing a trend towards high-end products, with the market share of mid-to-high-end PCB products expected to reach 53.8% by 2027 according to Prismark data[45]. - The global advanced packaging market is projected to grow from $37.9 billion in 2022 to $48.2 billion by 2026, with a CAGR of 6.2%[53]. - The demand for high-end chips used in 5G, IoT, and AI applications is increasing, significantly benefiting advanced packaging technologies[53]. - The global semiconductor mask market is expected to reach $5.098 billion in 2023, with China's market share estimated at $1.778 billion, accounting for only 34.88%[61]. - The Mini LED market in China is projected to approach 20 billion yuan in 2023, with a forecasted market size exceeding 40 billion yuan by 2026, representing a tenfold increase compared to 2020[64]. Operational Efficiency and Strategy - The company has implemented an equity incentive plan for 206 core employees in April 2022, granting 872,000 restricted shares, and an additional 215,000 shares to 45 employees in April 2023[8]. - The company follows an Integrated Product Development (IPD) model for product development, ensuring thorough market research and feasibility analysis before project initiation[149]. - The company has optimized its IPD project execution, enhancing standardization and improving product development success rates[152]. - The company employs three main sales models: direct contracts with customers, trial contracts leading to sales contracts, and agreements with distributors for regional sales[156]. - The company has established a supplier evaluation system to ensure the quality of core components and parts, assessing suppliers based on quality, price, and delivery time[153]. Competitive Position and Future Outlook - The company has achieved a global leading level in product technology nodes and quality, with successful sales of direct imaging equipment to markets in Japan, Vietnam, and Thailand[108]. - The company is committed to continuous product innovation and development in the semiconductor equipment sector to meet domestic and international customer demands[181]. - The company has established a differentiated competitive strategy to directly compete with international peers in the high-end PCB market[181]. - The company is actively integrating into the global competitive landscape, aiming to become a leading player in the micro-nano direct-write lithography field[181]. - The company emphasizes the importance of accurately responding to customer needs and predicting technological trends to maintain its competitive edge[167].

2024 年第一季度报告 证券代码：688630 证券简称：芯碁微装 2024 年第一季度报告 重要内容提示 公司负责人、主管会计工作负责人及会计机构负责人（会计主管人员）保证季度报告中财务信息 的真实、准确、完整。 □是√否 (一)主要会计数据和财务指标 1 / 13 | --- | --- | --- | --- | |---------------------------------|------------------|------------------|----------------------------------------| | 稀释每股收益（元/股） | | 0.30 | 7.14 | | 加权平均净资产收益率（%） | | 1.94 | 减少 1.20 个百分 点 | | 研发投入合计 | | 24,770,472.65 | 40.92 | | 研发投入占营业收入的比例（%） | | 12.51 | 增加 1.30 个百分 点 | | | 本报告期末 | 上年度末 | 本报告期末比上 年度末增减变动 幅度 (%) | | 总资产 | 2,513,706,745.84 | 2,480, ...

【RSM | 容 诚 审计报告 合肥芯碁微电子装备股份有限公司 容诚审字[2024]230Z0062 号 容诚会计师事务所(特殊普通合伙) 中国 · 北京 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://ac.mof.gov.n）"进行了 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://ac.mof.gov.n.）"进行了 【RSM | 容 诚 目 录 | 序号 | 内 容 | 页码 | | --- | --- | --- | | 1 | 审计报告 | 1-7 | | 2 | 合并资产负债表 | 8 | | 3 | 合并利润表 | 9 | | 4 | 合并现金流量表 | 10 | | 5 | 合并所有者权益变动表 | 11-12 | | 6 | 母公司资产负债表 | 13 | | 7 | 母公司利润表 | 14 | | 8 | 母公司现金流量表 | ાર | | 9 | 母公司所有者权益变动表 | 16-17 | | 10 | 财务报表附注 | 18-118 | 审计报告 容诚审字[2024]230Z0062 号 合肥芯碁微电子装备股份有限公司全体股东: 一、审 ...

RSM 容诚 募集资金存放及使用情况鉴证报告 合肥芯碁微电子装备股份有限公司 容诚专字[2024]230Z0133 号 容诚会计师事务所(特殊普通合伙) 中国 · 北京 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://ac.mof.gov.cn）"进行业 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://ac.mof.gov.cn）"进行业 | 序号 | 内 容 | 页码 | | --- | --- | --- | | 1 | 募集资金存放与实际使用情况鉴证报告 | 1-3 | | 2 | 募集资金存放与实际使用情况的专项报告 | 4-12 | 我们审核了后附的合肥芯碁微电子装备股份有限公司(以下简称芯碁微装)董 事会编制的 2023 年度《募集资金存放与实际使用情况的专项报告》。 目 录 t and 募集资金存放与实际使用情况鉴证报告 容诚专字[2024]230Z0133 号 合肥芯碁微电子装备股份有限公司全体股东: 一、对报告使用者和使用目的的限定 本鉴证报告仪供芯碁微装年度报告披露之目的使用,不得用作任何其他目的。 我们同意将本鉴证报告作为芯碁微装年度报告必 ...

合肥芯碁微电子装备股份有限公司 2023 年度独立董事述职报告 作为合肥恭碁微电子装备股份有限公司(以下简称"芯碁微装"、"公司") 的独立董事,本人严格按照《公司法》《证券法》《上市公司独立董事管理办法》 等相关法律法规要求和《公司章程》《公司独立董事工作制度》等规定,在 2023 年度工作中认真、忠实、勤勉、积极地履行独立董事的职责,积极出席公司召开 的相关会议,认真听取和审议各项议案,并对董事会的重要决策事项发表了独立 意见,充分发挥独立董事的专业职能,客观、独立和审慎地行使股东大会和董事 会赋予的权力和义务,为公司的经营决策和规范化运作提出了合理的意见和建议, 切实维护了公司的整体利益和全体股东尤其是中小股东的合法权益。现将 2023 年度履职情况汇报如下: 一、 独立董事的基本情况 (一) 独立董事人员情况 公司董事会由9名董事组成,其中独立董事3人,不低于董事会人数三分之 一,符合相关法律法规及公司制度的规定。 (二) 个人工作履历、专业背景以及兼职情况 杨维生,男,1961年9月出生,中国国籍,无境外永久居留权,南京大学 高分子化学专业硕士研究生,研究员级高级工程师。1987年6月至1998年2 ...