Group 1 - The A-share market saw a strong performance in CPO concept stocks, with Dekoli hitting the daily limit up of 20% [1] - Guangku Technology increased by over 18%, while Fenghuo Communication, Zhongtian Technology, and Hengtong Optic-Electric all reached the daily limit up of 10% [1] - Other notable performers included Zhongbei Communication and Changxin Bochuang, which rose by over 8%, and Guangxun Technology, Huamao Technology, Unisplendour, and Tongfu Microelectronics, which increased by over 6% [1]

Group 1 - The sensor concept continues to strengthen, leading to significant stock price increases for companies such as Suoao Sensor, *ST Weir, Donghua Software, and Jusheng Electronics, which all hit the daily limit up [1] - Other companies like Chicheng Co., Riyi Electronics, Saiwei Electronics, Fola New Materials, Duan'an Environment, and Tongfu Microelectronics also experienced price increases [1]

Group 1 - The company has made significant progress in the development of large-size FCBGA, entering mass production for large-size FCBGA and completing preliminary research for ultra-large size FCBGA, which is now in formal engineering assessment [2] - The company has addressed product warping and heat dissipation issues for ultra-large sizes through product structure design optimization, material selection, and process optimization [2] - Breakthroughs have been achieved in the technology development of optical-electrical hybrid packaging (CPO), with related products passing initial reliability tests [2] Group 2 - The company's Power DFN-clip sourcedown dual-side heat dissipation product has been developed to meet requirements for high current, low power consumption, high heat dissipation, and high reliability [2] - Traditional wire-bond packaging technology has been enhanced through copper plating on both sides of the wafer, improving heat dissipation and power consumption performance [2] - A related process platform has been established to address technical challenges in cutting, mounting, and wire bonding for Cu wafer packaging, achieving mass production across the entire Power DFN series [2] Group 3 - The industry anticipates continued demand growth in emerging fields such as AI and new energy vehicles, which are key drivers for the market [3] - The demand in major sectors like storage, communication, automotive, and industrial is gradually recovering, contributing to a positive outlook for the overall packaging and testing market [3] - Chinese packaging and testing companies need to make continuous breakthroughs in key technology areas such as high-density integration, low power design, and high heat dissipation performance, while enhancing collaboration with international advanced enterprises [3]

Group 1 - The company, Tongfu Microelectronics, has made significant breakthroughs in the research and development of Co-Packaged Optics (CPO) technology, with related products passing initial reliability tests [1][3] - CPO technology integrates optical engines and switching chips into a single module, considered a key direction for next-generation high-performance computing and data center interconnects [3] - The company is increasing its investment in optical integration research and development, aiming to capture more market opportunities in the new wave of computing infrastructure construction [3] Group 2 - CPO is recognized as an important technological route for optical integration, enhancing transmission rates and reducing power consumption [3] - Major global manufacturers are accelerating their layout in CPO technology, indicating a competitive landscape [3] - If the company can achieve large-scale production, it is expected to occupy a more significant position in the data center and AI computing industry chain [3]

Core Viewpoint - Tongfu Microelectronics (002156.SZ) has made significant progress in the development of large-size FCBGA, entering mass production for large-size FCBGA and completing preliminary research for ultra-large size FCBGA, which is now in formal engineering assessment stage [1] Group 1 - The company has achieved important advancements in large-size FCBGA development, with large-size FCBGA entering mass production [1] - The ultra-large size FCBGA has completed preliminary research and is now undergoing formal engineering assessment [1] - The company has addressed product warping and heat dissipation issues for ultra-large size products through optimization of product structure design, material selection, and process improvements [1] Group 2 - The company has made breakthrough progress in the technology development of optical-electrical integrated packaging (CPO), with related products passing initial reliability testing [1]

Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services from design simulation to packaging testing for global clients [2][3] - The company covers various fields including AI, high-performance computing, big data storage, 5G, IoT, automotive electronics, and industrial control [2][3] - Major shareholder is Nantong Huada Microelectronics Group, with stable equity structure [2] Financial Performance - Revenue for 2022, 2023, 2024, and the first half of 2025: CNY 21.429 billion, CNY 22.269 billion, CNY 23.882 billion, and CNY 13.038 billion respectively [3] - Net profit for the same periods: CNY 0.502 billion, CNY 0.169 billion, CNY 0.678 billion, and CNY 0.412 billion [3] - 2024 revenue growth of 7.24% and net profit growth of 299.90% [6] - 2025 H1 revenue growth of 17.67% and net profit growth of 27.72% [6] Industry Situation - Global semiconductor market reached USD 346 billion in H1 2025, a year-on-year growth of 18.9% [4] - Forecast for 2025 global semiconductor market size is USD 728 billion, up 15.4% from 2024 [4] - Expected market size for 2026 is USD 800 billion, with a further growth of 9.9% [4] Key Trends in Semiconductor Market - AI-driven growth continues; Asia-Pacific IC design market expected to grow by 15% in 2025 [5] - TSMC maintains dominance in wafer foundry; strong demand for advanced processes [5] - 2025 is a critical year for 2nm wafer manufacturing technology [5] Business Performance in Specific Fields - In H1 2025, the company increased market share in mobile, home appliance, and automotive sectors [9] - Focus on AI and high-performance products, with successful integration of Suzhou and Penang factories [9] Technology Development - Significant progress in large-size FCBGA development, with mass production initiated [11] - Breakthroughs in optical-electrical hybrid packaging technology [11] - Over 1,700 patent applications, with nearly 70% being invention patents [8] Future Outlook - Continued growth expected in AI and new energy vehicle sectors in H2 2025 [10] - Chinese IC packaging and testing industry is anticipated to transition from "catching up" to "keeping pace" and potentially "leading" [10]

Summary of the Conference Call on China's Semiconductor Supply Chain Industry Overview - In 2Q25, China semiconductor chipmakers (fabless, IDM, foundry, OSAT) reported a revenue growth of 16-21% YoY, indicating a mild recovery in net profit margins (NPM) with fabless/IDM companies' average NPM increasing from 12% in 1Q25 to 13% in 2Q25. Foundry and OSAT suppliers' average NPM improved slightly from 4% to 5% [1][8] - Semiconductor equipment companies experienced a slowdown in sales growth from 42% YoY in 1Q25 to 28% in 2Q25, although their average NPM improved from 16% to 19% [1] - Silicon wafer suppliers, such as NSIG and Lion Electronics, continued to report losses in 2Q25 with NPM at -18% and -5%, respectively [1] Inventory Management - Notable inventory reduction was observed among Chinese semiconductor fabless companies in 2Q25, with inventory turnover periods for MCU, analog, and power discrete segments decreasing by 16-48 days QoQ [2] - Overall inventory levels in the China market remain higher than pre-2022 levels but are healthier compared to 2023-24, where days of inventory (DoI) were between 200-300 days [2] Demand and Supply Dynamics - The integrated circuit (IC) billing volume in China was reported at 12.6 billion units in July, reflecting a 10% YoY increase. This demand growth rebounded from a -1% contraction in June [3] - China's IC import volume grew by 12% YoY, while domestic manufacturing volume increased by 25% YoY. The netting off of a 17% export growth suggests a supply volume increase of 15% YoY on a 3-month moving average basis [3] - The trend of inventory digestion among Chinese chipmakers observed in 2Q25 may be moderating as supply growth has outpaced demand for two consecutive months since June [3] Pricing Trends - The global average unit price for NOR flash was reported at US$0.39 in July, down 6% MoM and 28% YoY, indicating continued price softness [4] - However, major Taiwan and China NOR flash suppliers reported normalized inventory levels, which may support price stabilization [4] - Specialty DRAM contract prices have seen significant increases in 3Q25, with DDR4 prices rising approximately 70% in July and 10% in August, while 4Gb DDR3 prices increased by 20% in July and 50% in August [4] Financial Performance Overview - In 2Q25, the fabless and IDM sectors saw over 20% YoY sales growth, while foundry, OSAT, and silicon wafer sectors grew in the mid to high teens [8] - Despite improvements in net profit margins across sectors, silicon wafer companies like NSIG and Lion Electronics continued to post net losses [8] Future Outlook - Consensus forecasts predict 15%-26% YoY sales growth for the semiconductor industry in 2026, with expectations for further improvement in net profit margins [9] - Specific companies such as SMIC and JCET are projected to see significant sales growth, with SMIC's sales expected to reach US$78.3 billion by 2026, reflecting a 16% YoY increase [9] Additional Insights - The semiconductor supply chain is experiencing a dynamic shift in supply and demand, with potential implications for inventory management and pricing strategies moving forward [3][4] - The recovery in profitability and sales growth across various segments indicates a positive trend for the semiconductor industry in China, despite ongoing challenges in specific areas such as silicon wafer production [1][8]

Group 1 - The A-share market saw a collective rise on September 11, with the Shanghai Composite Index increasing by 0.22%, driven by gains in sectors such as electronic components, communication equipment, and computer hardware, while the restaurant, tourism, and pharmaceutical sectors experienced declines [1] - The Chip ETF (159995) rose by 1.57%, with notable increases in constituent stocks such as Haiguang Information (+7.86%), Zhaoyi Innovation (+3.95%), and Cambrian-U (+2.91%) [1] - According to Everbright Securities, the demand for AI computing power and intelligent driving is driving growth in the global semiconductor industry, with expectations for further growth in the first half of 2025 following a recovery in 2024 [1] Group 2 - The Chip ETF (159995) tracks the National Chip Index, which includes 30 leading companies in the A-share chip industry across materials, equipment, design, manufacturing, packaging, and testing, such as SMIC, Cambrian, and Changdian Technology [1]

Core Viewpoint - Tongfu Microelectronics (002156.SZ) experienced a decline of 5.1%, trading at 31.29 yuan, with a current market capitalization of 47.5 billion yuan. The company announced that it received a notice from the National Integrated Circuit Industry Investment Fund regarding the completion of its share reduction plan, which has resulted in a decrease in the fund's shareholding from 8.77% to 6.67% [1][1][1] Summary by Category Company Actions - The company has been informed that the share reduction plan by the National Integrated Circuit Industry Investment Fund has been completed, with a total of 31.8862 million shares reduced, accounting for 2.1% of the company's total share capital [1][1][1] Market Performance - Following the announcement, Tongfu Microelectronics' stock price fell by 5.1%, with a trading volume of 3.2 billion yuan [1][1][1]

通富微电(002156.SZ)现跌5.1%报31.29元，暂成交32亿元，最新市值475亿元。通富微电公告称，公司收 到国家集成电路产业投资基金股份有限公司出具的《关于通富微电子股份有限公司减持计划时间届满暨 减持结果告知函》，截至2025年9月8日，本次减持计划时间区间已届满，大基金本次减持计划已累计减 持公司股份3188.62万股，占公司当前总股本的2.1%，持股比例从8.77%下降至6.67%。 ...