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通富微电:股东国家集成电路产业投资基金减持至6.67%
Xin Lang Cai Jing· 2025-09-08 12:41
Core Viewpoint - The announcement from Tongfu Microelectronics indicates that the National Integrated Circuit Industry Investment Fund has completed its share reduction plan, decreasing its stake in the company from 8.77% to 6.67% by selling 31.8862 million shares, which represents 2.1% of the total share capital [1] Summary by Relevant Sections - **Share Reduction Details** - The National Integrated Circuit Industry Investment Fund has reduced its holdings by a total of 31.8862 million shares [1] - This reduction accounts for 2.1% of Tongfu Microelectronics' current total share capital [1] - The fund's ownership percentage has decreased from 8.77% to 6.67% as a result of this reduction [1] - **Timeline of the Reduction Plan** - The share reduction plan was set to conclude on September 8, 2025, and has now reached its deadline [1]
通富微电:国家大基金累计减持3188.62万股,持股比例降至6.67%
Ge Long Hui A P P· 2025-09-08 12:41
格隆汇9月8日丨通富微电(002156.SZ)公告称,公司收到国家集成电路产业投资基金股份有限公司出具 的《关于通富微电子股份有限公司减持计划时间届满暨减持结果告知函》,截至2025年9月8日,本次减 持计划时间区间已届满,大基金本次减持计划已累计减持公司股份3188.62万股,占公司当前总股本的 2.1%,持股比例从8.77%下降至6.67%。 ...
通富微电(002156) - 关于持股5%以上股东减持计划时间届满暨减持结果公告
2025-09-08 12:33
证券代码:002156 证券简称:通富微电 公告编号:2025-042 通富微电子股份有限公司 关于持股 5%以上股东减持计划时间届满暨减持结果公告 2025 年 8 月 6 日,公司收到产业基金出具的《关于通富微电子股份有限公 司股份变动触及 1%整数倍的告知函》,产业基金在 2025 年 7 月 18 日至 2025 年 8 月 6 日期间,通过大宗交易方式合计减持公司股份 13,142,400 股,减持前持 股比例为 7.77%,减持后持股比例为 6.91%,具体详见公司于 2025 年 8 月 8 日在 巨潮资讯网(http://www.cninfo.com.cn)披露的《关于持股 5%以上股东股份 变动比例触及 1%整数倍的公告》(公告编号:2025-035)。 现公司收到产业基金出具的《关于通富微电子股份有限公司减持计划时间届 满暨减持结果告知函》,截至 2025 年 9 月 8 日,本次减持计划时间区间已届满, 产业基金本次减持计划已累计减持公司股份 31,886,169 股,占公司当前总股本 的 2.1%,持股比例从 8.77%下降至 6.67%。具体减持及权益变动情况如下: 一、 减持计划的 ...
通富微电:产业基金减持至6.67%
Xin Lang Cai Jing· 2025-09-08 12:27
Summary of Key Points Core Viewpoint - The shareholder, National Integrated Circuit Industry Investment Fund Co., Ltd., has completed its share reduction plan, resulting in a significant decrease in its stake in Tongfu Microelectronics Co., Ltd. [1] Group 1: Share Reduction Details - The shareholder reduced its holdings by 15.176 million shares from June 11, 2025, to June 27, 2025, at a price range of 23.24 to 25.23 CNY per share [1] - An additional reduction of 16.7102 million shares occurred from July 18, 2025, to August 20, 2025, at a price range of 23.45 to 25.92 CNY per share [1] - The total shares reduced amounted to 31.8862 million, representing 2.1% of the company's total share capital, decreasing the holding percentage from 8.77% to 6.67% [1]
通富微电:公司紧跟行业技术发展趋势
Zheng Quan Ri Bao· 2025-09-08 08:43
Core Viewpoint - The company is actively developing advanced packaging technologies and expanding its production capacity to seize market opportunities and enhance its competitive edge in the semiconductor industry [2]. Group 1: Company Strategy - The company is focusing on high value-added products and market hotspots, aligning with industry technology trends [2]. - It is investing in the development of advanced packaging technologies such as fan-out, wafer-level, and flip-chip packaging [2]. - The company is also strategically positioning itself in cutting-edge packaging technologies like Chiplet and 2D+ to create a differentiated competitive advantage [2].
通富微电:公司封测的芯片有应用在数据中心
Zheng Quan Ri Bao Wang· 2025-09-08 08:12
Group 1 - The company Tongfu Microelectronics (002156) confirmed on September 8 that its chip packaging and testing services are utilized in data centers [1]
通富微电:主营集成电路封装测试业务
Zheng Quan Ri Bao· 2025-09-08 08:10
证券日报网讯通富微电9月8日在互动平台回答投资者提问时表示,公司主营集成电路封装测试业务,公 司客户资源覆盖国际巨头企业以及各个细分领域龙头企业,大多数世界前20强半导体企业和绝大多数国 内知名集成电路设计公司都已成为公司客户。 (文章来源:证券日报) ...
通富微电:2025年上半年,公司在光电合封(CPO)领域的技术研发取得突破性进展
Zheng Quan Ri Bao Wang· 2025-09-08 07:48
证券日报网讯通富微电(002156)9月8日在互动平台回答投资者提问时表示,2025年上半年,公司在光 电合封(CPO)领域的技术研发取得突破性进展,相关产品已通过初步可靠性测试。后续情况将根据客户 及市场需求进行判断。 ...
通富微电(002156.SZ)封测的芯片有应用在数据中心上
Ge Long Hui· 2025-09-08 06:59
格隆汇9月8日丨通富微电(002156.SZ)在互动平台表示,公司封测的芯片有应用在数据中心上。 ...
通富微电跌2.05%,成交额18.30亿元,主力资金净流出2.36亿元
Xin Lang Cai Jing· 2025-09-08 03:32
Company Overview - Tongfu Microelectronics Co., Ltd. is located in Chongchuan Development Zone, Nantong City, Jiangsu Province, and was established on February 4, 1994. The company was listed on August 16, 2007. Its main business involves integrated circuit packaging and testing, with revenue composition being 96.98% from integrated circuit packaging and testing and 3.02% from sales of molds and materials [1]. Stock Performance - As of September 8, Tongfu Microelectronics' stock price decreased by 2.05%, trading at 31.55 CNY per share, with a total market capitalization of 47.88 billion CNY. The stock has seen a year-to-date increase of 6.93%, a decline of 9.55% over the last five trading days, a rise of 14.94% over the last 20 days, and an increase of 35.67% over the last 60 days [1]. - The company has appeared on the "Dragon and Tiger List" twice this year, with the most recent appearance on September 4, where it recorded a net buy of -155 million CNY [1]. Financial Performance - For the period from January to June 2025, Tongfu Microelectronics achieved a revenue of 13.038 billion CNY, representing a year-on-year growth of 17.67%. The net profit attributable to shareholders was 412 million CNY, reflecting a year-on-year increase of 27.72% [2]. Shareholder Information - As of June 30, 2025, the number of shareholders for Tongfu Microelectronics was 276,000, a decrease of 6.46% from the previous period. The average number of tradable shares per shareholder increased by 6.90% to 5,497 shares [2]. - The top ten circulating shareholders include significant institutional investors, with Hong Kong Central Clearing Limited being the fourth largest shareholder, holding 25.0739 million shares, an increase of 2.1328 million shares from the previous period [3].