Industry Insights - The current supply tightness in the memory industry is driven by a surge in AI data center demand and increasing complexity in memory manufacturing, rather than a deliberate adjustment of customer structures by manufacturers [1] - Substantial improvement in memory supply is expected to take a long time, with the tight situation likely to persist until around 2028 [1] - Major packaging and testing companies in Taiwan, such as Liancheng, Huadong, and Nanmao, are experiencing overwhelming orders, leading to a first round of price increases approaching 30%, which will reflect in financial reports starting from Q1 [1] - Memory chips account for approximately 30% of the integrated circuit market, with mainland China being the second-largest storage sales market globally, following the United States [1] - Domestic storage companies like Changxin Storage and Yangtze Memory Technologies are rapidly catching up in technology and are expected to enhance competitiveness through continuous R&D and process improvements [1] Company Developments - Huicheng Co., Ltd. is strategically investing in Xinfeng Technology and establishing a partnership with Huadong Technology to expand its DRAM packaging and testing business, focusing on advanced packaging for 3D DRAM [2] - Tongfu Microelectronics is collaborating with domestic storage manufacturers for strategic synergy in storage packaging and testing [3]

12月30日，备受关注的我国DRAM（动态随机存取存储器）产业龙头企业长鑫科技集团股份有限公 司（以下简称"长鑫科技"）公开披露了首次公开发行股票并在科创板上市招股说明书，该公司拟募资 295亿元。其中，75亿元拟用于存储器晶圆制造量产线技术升级改造项目，130亿元拟用于DRAM存储器 技术升级项目，90亿元拟用于DRAM前瞻技术研究与开发项目。 转自：证券日报网 本报记者 丁蓉 当下，全球存储器市场迎来"超级周期"，产业链上下游亦同步吹响扩产号角。中关村物联网产业联 盟副秘书长袁帅在接受《证券日报》记者采访时表示："存储产业链掀起的扩产潮，本质上是人工智能 技术爆发引发的结构性需求与产业升级迫切性的集中释放。人工智能技术发展对高端存储产品的需求呈 现指数级增长，不仅为存储产业提供了广阔的市场前景，更推动企业加速技术升级，从制程微缩到先进 封装，从架构优化再到产品创新，这直接关系到产业链企业在人工智能时代的市场竞争力。" 产业链企业积极建设产能 1月9日，国内先进封测领军企业通富微电子股份有限公司（以下简称"通富微电"）发布2026年度向 特定对象发行A股股票预案，拟募资不超44亿元。其中，8亿元拟用于存储芯 ...

Core Viewpoint - The semiconductor packaging and testing industry is experiencing significant growth, with multiple companies announcing major investments and project advancements to enhance their capabilities in high-end packaging and testing sectors. Group 1: Company Developments - Tongfu Microelectronics plans to raise up to 4.4 billion yuan to enhance its packaging capacity in key areas such as memory chips, automotive electronics, and wafer-level packaging [1][3] - The investment breakdown includes 3.17 billion yuan for four major capacity enhancement projects, which will significantly increase production capabilities in various semiconductor sectors [2][3] - Longji Technology's automotive-grade chip packaging factory has commenced operations, focusing on smart driving and power management applications, indicating a strategic move to meet growing demand in the automotive sector [6][8] Group 2: Industry Trends - The global semiconductor packaging industry is witnessing a recovery in capacity utilization rates, driven by surging demand for AI-related semiconductors and a resurgence in consumer electronics [3][27] - The automotive electronics sector is becoming a core growth engine, with Longji Technology reporting a 31.3% year-on-year increase in automotive electronics revenue in the first three quarters of 2025 [8] - The recent surge in project announcements reflects a broader trend of companies responding to market demands and enhancing their production capabilities to alleviate supply pressures in high-end packaging [26][27] Group 3: Financial Performance - Tongfu Microelectronics reported a revenue of 20.116 billion yuan for the first three quarters of 2025, marking a 17.77% year-on-year increase, with net profit rising by 55.74% to 860 million yuan [4][5] - The financial performance of companies in the semiconductor sector is strengthening, providing a solid foundation for ongoing expansion projects and investments [4][5] Group 4: New Projects and Investments - He Lin Micro-Nano plans to invest up to 760.5 million yuan to expand its semiconductor packaging capabilities, focusing on optical lens components and testing probes [17] - The Guangdong Yuehai 2.5D/3D TSV advanced packaging project has reached a significant milestone with the completion of its basic supporting facilities, indicating ongoing investment in advanced packaging technologies [11][14] - The establishment of new testing and R&D bases, such as the one by Chipeng Microelectronics in Wuxi, aims to enhance the testing capabilities for automotive-grade power semiconductors, addressing industry capacity constraints [22][23]

Core Insights - The Computer ETF (159998) has seen a strong performance, with a recent increase of 2.66% in the underlying index and significant inflows of 186 million yuan over the past week [1][9] - The Chip ETF Tianhong (159310) also performed well, with a 0.68% increase in its index and notable gains in several component stocks [1] Group 1: Computer ETF Performance - The Computer ETF (159998) recorded a turnover of 2.24% and a transaction volume of 645.887 million yuan [1] - As of January 9, the latest scale of the Computer ETF reached 2.715 billion yuan, with a total of 2.511 billion shares, marking a one-month high [1] - The ETF has experienced continuous net inflows totaling 186 million yuan over the last seven days [1] Group 2: Chip ETF Performance - The Chip ETF Tianhong (159310) had a transaction volume of 2.2106 million yuan [1] - The underlying index for the Chip ETF has achieved a six-day consecutive increase, with component stocks like Changdian Technology and Zhongwei Company seeing gains of 8.57% and 5.72%, respectively [1] Group 3: Industry Highlights - The first domestically produced 1000-qubit coherent optical quantum computer has been delivered, marking a significant step towards the industrialization of quantum technology in China [6] - A new computing architecture developed by a research team at Peking University has reportedly increased computing power by nearly four times compared to existing silicon-based chips [7] - Tongfu Microelectronics plans to raise 4.4 billion yuan through a private placement to expand its packaging and testing capacity across various fields [8] Group 4: Institutional Perspectives - Zhongtai Securities suggests that the fundamentals of the computer sector are expected to improve, with institutional holdings at historical lows, indicating potential future growth opportunities [9]

（原标题：利好！上市公司，密集公告！） 今日关注 近90家A股上市公司发布2025年年度业绩预告 17家净利同比预增上限超100% 两部门：4月1日起 取消光伏等产品增值税出口退税 证监会较大幅度提高证券期货违法行为"吹哨人"奖励 最高奖励100万元 重要的消息有哪些 1.全国商务工作会议：加快培育服务消费新增长点 优化消费品以旧换新政策实施 全国商务工作会议1月10日至11日在京召开。会议指出，2026年全国商务系统要重点做好八个方面工作：一是深入实施提振消费专项行动，打 造"购在中国"品牌。加快培育服务消费新增长点，释放服务消费潜力。优化消费品以旧换新政策实施，推动商品消费扩容升级。打造国际化消费 环境。发展数字消费、绿色消费、健康消费，激发下沉市场消费活力。二是健全现代市场和流通体系，推进全国统一大市场建设。加强制度保 障，优化设施载体，推动零售业创新发展，完善现代商贸流通体系，深入推进试点城市建设。推进内外贸一体化。三是推动贸易创新发展，打 响"出口中国"品牌。优化升级货物贸易，大力发展服务贸易，鼓励服务出口，创新发展数字贸易、绿色贸易，促进贸易投资一体化。四是塑造吸 引外资新优势，擦亮"投资中国"品 ...

Core Viewpoint - Tongfu Microelectronics plans to raise up to 4.4 billion yuan through a private placement to enhance its testing capacity in various sectors, including storage chips and automotive applications, marking its first fundraising in four years [1][5]. Fundraising Details - The company aims to use the raised funds for several projects: - 8.88 billion yuan for storage chip testing capacity, adding 849,600 units annually [3]. - Nearly 11 billion yuan for automotive and emerging applications, adding 504 million units annually [3]. - 7.43 billion yuan for wafer-level testing, adding 312,000 units and enhancing automotive product reliability [3]. - 7.24 billion yuan for high-performance computing and communication, adding 480 million units annually [3]. - Additionally, 1.23 billion yuan will be allocated for working capital and repaying bank loans [4]. Historical Fundraising - Since its IPO in 2007, Tongfu Microelectronics has raised a total of 10.757 billion yuan across six fundraising rounds, primarily focused on enhancing its core business [1][5][7]. Client Base and Revenue - The company’s major client is AMD, contributing 50.35% of its revenue, with total sales from the top five clients reaching 16.478 billion yuan, accounting for 69% of total sales in 2024 [1][8]. - Revenue figures from 2022 to the first three quarters of 2025 show consistent growth, with revenues of 21.429 billion yuan, 22.269 billion yuan, 23.882 billion yuan, and 20.12 billion yuan respectively [8]. R&D Investment - Tongfu Microelectronics has significantly invested in R&D, with expenditures of 1.062 billion yuan, 1.162 billion yuan, 1.323 billion yuan, 1.533 billion yuan, and 1.123 billion yuan from 2021 to the first three quarters of 2025, totaling 6.203 billion yuan [10]. - As of June 30, 2025, the company has filed over 1,700 patents, with nearly 70% being invention patents, and has obtained technology licenses from Fujitsu, Casio, and AMD [2][10]. Capacity Expansion - To meet growing market demand, the company is expanding its production capacity, including upgrades to its advanced packaging technology and the construction of a new substation to enhance power supply capabilities [9].

Core Viewpoint - Tongfu Microelectronics (002156.SZ) plans to raise up to 440 million yuan through a private placement of A-shares, with proceeds allocated to various capacity enhancement projects and working capital needs [1][2]. Group 1: Fundraising Details - The total amount to be raised is capped at 440 million yuan, which will be used for projects including storage chip packaging capacity enhancement (80 million yuan), automotive and emerging application packaging capacity enhancement (105.5 million yuan), wafer-level packaging capacity enhancement (69.5 million yuan), high-performance computing and communication packaging capacity enhancement (62 million yuan), and replenishing working capital and repaying bank loans (123 million yuan) [2]. - The total investment for these projects amounts to approximately 468.55 million yuan, indicating that the company will cover the difference through other means [2]. Group 2: Issuance Mechanism - The issuance will adopt a competitive pricing method, with the price set at no less than 80% of the average trading price over the 20 trading days prior to the pricing date [3]. - The number of shares to be issued will not exceed 30% of the company's total shares prior to the issuance, amounting to a maximum of 455,279,073 shares [3]. Group 3: Shareholding Structure - As of September 30, 2025, the total share capital of the company is 1,517,596,912 shares, with the actual controller holding 19.79% of the shares. Post-issuance, this percentage is expected to decrease to 15.22% if the maximum number of shares is issued [4]. - The issuance plan stipulates that any single subscriber and their affiliates cannot collectively subscribe for more than 10% of the total shares prior to the issuance, ensuring that control of the company remains unchanged [4]. Group 4: Historical Context - The company has raised a total of approximately 5.965 billion yuan over the past six years through various fundraising activities [7].

Key Points - Major asset restructuring plans are underway for several companies, including JiaoYun Co. and Dongzhu Ecology, with significant risks of termination noted for Dongzhu Ecology's restructuring efforts [11][12] - ST KeliDa is set to resume trading on January 12, 2026, following a proposed change in its actual controller [5] - NineLink Technology has terminated its major asset restructuring plans due to disagreements on core transaction terms [6] - Companies like Huazhou Laojiao and others have announced substantial profit distributions and performance forecasts, indicating positive growth trends [8][9][10] Focus Area 1: Asset Restructuring - JiaoYun Co. is planning a major asset swap involving its automotive sales and service segments with assets from its controlling shareholder [11] - Dongzhu Ecology is attempting to acquire control of Kai Rui Xing Tong Information Technology but faces significant termination risks due to valuation disagreements [12] - NineLink Technology has decided to halt its plans to acquire a 51% stake in Chengdu Neng Tong Technology after failing to reach consensus on key transaction details [6] Focus Area 2: Trading Resumption and Risk Warnings - ST KeliDa will resume trading on January 12, 2026, after a proposed change in its actual controller [5] - China First Heavy Industries and Oriental Pearl have issued risk warning announcements regarding their stock trading, highlighting the volatility and lack of revenue from certain projects [3][4] Focus Area 3: Performance Forecasts - Huazhou Laojiao expects a net profit of between 235 million to 271 million yuan for 2025, a significant recovery from a loss in the previous year [8] - China Shipbuilding Defense anticipates a net profit increase of 149.61% to 196.88% for 2025, driven by improved production efficiency and revenue from joint ventures [9] - Daotong Technology projects a net profit of 900 million to 930 million yuan for 2025, reflecting a growth of 40.42% to 45.10% [10]

Macro Economy - The State Council has deployed a package policy for fiscal and financial coordination to promote domestic demand, emphasizing the importance of effective demand expansion and innovative macro-control measures [2] - The National Business Work Conference highlighted the need to accelerate the cultivation of new growth points in service consumption and optimize the implementation of the old-for-new consumption policy [3] - The Ministry of Finance and the State Taxation Administration announced the cancellation of VAT export tax rebates for photovoltaic products starting April 1, 2026, and a reduction in the VAT export tax rebate rate for battery products from 9% to 6% until the end of 2026 [4] Capital Market - The China Securities Regulatory Commission has significantly increased the rewards for whistleblowers reporting violations in the securities and futures markets, with the maximum reward rising to 1 million yuan for major cases [10] - The Shanghai Stock Exchange issued over 130 disciplinary penalties for information disclosure violations in 2025, with a focus on financial fraud and serious violations leading to delisting [11] Industry Dynamics - The first successful flight of the "Tianma-1000" unmanned transport aircraft was reported, which is designed for logistics transport and emergency rescue, showcasing its capabilities in complex terrains [16] - New Jian Transmission, a first-tier supplier for humanoid robots, has initiated its IPO process, indicating strong industry interest due to its connection with Tesla's Optimus supply chain [17] - The domestic first 3D-printed aviation engine has completed its flight test, marking a significant milestone in China's aerospace technology [30] Company News - Tianpu Co., Ltd. is under formal investigation for significant disclosure omissions, raising concerns about its market conduct [33] - Guizhou's Green Land Holdings has projected a net loss of 16 billion to 19 billion yuan for 2025, attributed to declining asset prices and increased promotional efforts [36] - The stock of Guozheng Technology is set to resume trading after a suspension due to abnormal price fluctuations, with an expected net loss for the fiscal year [39]

Core Viewpoint - Tongfu Microelectronics Co., Ltd. plans to raise up to 4.4 billion yuan through a private placement of A-shares to enhance its competitiveness in the semiconductor packaging and testing industry, focusing on storage chips, automotive electronics, wafer-level packaging, high-performance computing, and communication sectors [1][7]. Fundraising Projects Summary - The total investment for the five projects is approximately 46.86 billion yuan, with the following allocations: - Storage chip packaging capacity enhancement project: 8.88 billion yuan investment, raising 8 billion yuan [2][3]. - Automotive electronics packaging capacity enhancement project: 10.99 billion yuan investment, raising 10.55 billion yuan [2][4]. - Wafer-level packaging capacity enhancement project: 7.43 billion yuan investment, raising 6.95 billion yuan [2][5]. - High-performance computing and communication packaging capacity enhancement project: 7.24 billion yuan investment, raising 6.2 billion yuan [2][6]. - Supplementing working capital and repaying bank loans: 12.3 billion yuan [2][6]. Storage Chip Packaging Insights - The storage chip packaging project aims to invest 8.88 billion yuan, adding an annual capacity of 849,600 pieces. The Chinese storage chip market is projected to reach 460 billion yuan in 2024 and exceed 550 billion yuan in 2025, driven by demand from AI, smart terminals, and new energy vehicles [3]. Automotive Electronics Focus - The automotive electronics project, with a total investment of 10.99 billion yuan, will add an annual packaging capacity of 50.4 million pieces. The global automotive semiconductor market is expected to grow from 72.1 billion USD in 2024 to 80.4 billion USD in 2025, supported by the rise of electric vehicles and smart driving technologies [4]. Wafer-Level Packaging Development - The wafer-level packaging project, with a total investment of 7.43 billion yuan, will increase capacity by 312,000 pieces and 1.5732 billion pieces for high-reliability automotive products. This technology is crucial for AI chips and data centers, with the AI chip market in China expected to grow at a CAGR of 53.7% from 2024 to 2029 [5]. High-Performance Computing and Communication - The high-performance computing and communication project, with a total investment of 7.24 billion yuan, will focus on advanced packaging technologies, adding an annual capacity of 48 million pieces. This project aims to meet the demands of AI, 5G communication, and edge computing applications [6]. Financial Structure Improvement - The 12.3 billion yuan raised will also be used to supplement working capital and repay bank loans, addressing the company's increasing operational funding needs and optimizing its financial structure [6].