Group 1 - The State Council of China is implementing a package policy to promote domestic demand through fiscal and financial collaboration, focusing on enhancing consumer capacity and supporting private investment [1] - The Ministry of Finance and the State Taxation Administration announced the cancellation of the export VAT rebate for photovoltaic products starting April 1, 2026, which is expected to help stabilize foreign market prices and reduce trade friction risks [1] - The State Administration for Market Regulation is conducting an investigation into the competitive status of the food delivery service industry, with major platforms like Meituan and JD Express expressing their willingness to cooperate [1] Group 2 - Baogang Co. announced an adjustment in the related transaction price for rare earth concentrate to 26,834 yuan per ton (excluding tax), reflecting a 2.4% increase from the previous quarter [3] - The company Tongfu Microelectronics plans to raise no more than 4.4 billion yuan through a private placement [3] - Zhongchao Technology expects a net profit increase of 149.61% to 196.88% year-on-year for 2025 [3]

Group 1 - On January 10, a total of 5 companies in the A-share market announced related plans for private placements [1] - Among these, 2 companies disclosed new private placement proposals, 1 proposal was approved by the shareholders' meeting, and 1 proposal was approved by the exchange [1] - The highest proposed fundraising amounts were from Tongfu Microelectronics and Meilan New Materials, with plans to raise no more than 4.4 billion and 1.0 billion respectively [1] Group 2 - Since the beginning of the year, 5 companies have announced completed private placement plans, with 3 companies raising over 1.0 billion [1] - The companies with the highest fundraising amounts were Shuneng Electric, Shenzhen Sanda A, and Taisheng Wind Energy, raising a total of 1.649 billion, 1.2 billion, and 1.176 billion respectively [1]

1月9日晚间，通富微电公告称，拟向特定对象发行A股股票，募集资金总额不超过44亿元，用于多个业 务领域的封测产能提升，其中存储芯片、汽车、晶圆级、高性能计算及通信这四个领域项目分别拟投入 募集资金8亿元、10.55亿元、6.95亿元和6.2亿元，此外计划将12.3亿元用于补充流动资金及偿还银行贷 款。 从行业来看，随着下游人工智能、新能源汽车、移动智能终端、物联网等领域的技术变革与升级，叠加 半导体领域国产替代的推进，正持续催生对相关芯片的大规模封测需求。通富微电表示，公司产线整体 保持较高产能利用率，产能瓶颈逐步显现。实施本次募集资金投资项目旨在优化公司产能水平及结构布 局，提升公司持续创新能力，实现公司业务升级。 此次募投项目以现有产业化封测平台为基础实施产能提升，针对行业发展趋势，重点围绕存储芯片封 测、车载芯片封测、晶圆级封测以及面向高性能计算与通信芯片的封测能力进行布局，在扩充产能规模 的同时优化产品与工艺结构，提升公司面向高端化产品的封测实力。值得一提的是，多个募投项目的总 投资额均高于实际拟投入的募集资金，可见公司加码相关业务的决心与底气。具体来看： 拟定增募资不超44亿元 通富微电加码封测产能 ...

Group 1 - The company Tongfu Microelectronics (002156) announced that it will hold its first extraordinary general meeting of shareholders for 2026 on January 26, 2026 [1]

Core Viewpoint - Tongfu Microelectronics (002156) plans to issue shares to specific investors, aiming to raise a total of no more than 4.4 billion yuan (including the principal) [1] Group 1: Fundraising Purpose - The funds raised will be used for enhancing packaging and testing capacity for storage chips [1] - The capital will also support packaging and testing capacity improvements in emerging applications such as automotive [1] - Additional allocations include enhancing wafer-level packaging capacity and supporting high-performance computing and communication sectors [1] - A portion of the funds will be used to supplement working capital and repay bank loans [1]

Core Viewpoint - Tongfu Microelectronics (002156) plans to raise up to 4.4 billion yuan through a private placement of shares to enhance its packaging and testing capacity across various sectors, including storage chips and automotive applications, while also supplementing working capital and repaying bank loans [1][2][3][4] Group 1: Investment Projects - The storage chip packaging capacity enhancement project will invest 888 million yuan, with 800 million yuan from the raised funds, adding an annual capacity of 849,600 storage chips. The storage chip market is expected to rebound in 2024, reaching a market size of 170.4 billion USD, a year-on-year increase of 77.64% [1] - The automotive and emerging applications packaging capacity enhancement project plans to invest nearly 1.1 billion yuan, with 1.055 billion yuan from the raised funds, adding an annual capacity of 504 million units. This project aims to meet automotive standards and strengthen high-end testing capabilities in response to the growing demand for automotive electronics [2] - The wafer-level packaging capacity enhancement project plans to invest 743 million yuan, with 695 million yuan from the raised funds, adding an annual capacity of 312,000 wafer-level packages and enhancing the reliability of automotive product packaging [2] - The high-performance computing and communication packaging capacity enhancement project plans to invest 724 million yuan, with 620 million yuan from the raised funds, adding an annual capacity of 480 million units, focusing on advanced packaging technologies [3] Group 2: Financial Utilization - The company intends to use 1.23 billion yuan of the raised funds to supplement working capital and repay bank loans [4]

分组1 - China Merchants Bank plans to distribute a cash dividend of approximately 25.548 billion yuan for the first half of 2025, with a per-share dividend of 1.013 yuan (tax included) [1] - Luzhou Laojiao proposes a cash dividend of 13.58 yuan per 10 shares, totaling around 2 billion yuan (tax included) for the mid-2025 profit distribution [3] - Tongfu Microelectronics intends to raise up to 4.4 billion yuan through a private placement to enhance its packaging capacity for storage chips and other emerging applications [2] 分组2 - Xibu Gold announces that its shareholder, Turpan Jinyuan Mining Co., plans to reduce its stake by up to 1% due to funding needs [4] - Jiaoyun Co. is planning a significant asset restructuring by swapping its automotive sales and service assets with the cultural and tourism-related assets of its controlling shareholder [5] - Guo Sheng Technology expects a negative net profit for the fiscal year 2025, leading to a stock resumption after a period of trading suspension [8] 分组3 - North Rare Earth adjusts its first-quarter rare earth concentrate trading price to 26,834 yuan per ton, reflecting a 2.4% increase from the previous quarter [11] - Baotou Steel plans to set the same trading price for rare earth concentrate at 26,834 yuan per ton for the first quarter of 2026, also indicating a 2.4% increase [12] - Wanbangde's subsidiary has been selected for a national major science and technology project for Alzheimer's drug development, which is expected to positively impact its clinical development and long-term business growth [13]

Group 1 - The company Tongfu Microelectronics announced a plan to issue shares to specific investors, approved by its board of directors, with a maximum of 35 eligible investors [1] - The total number of shares to be issued will not exceed approximately 455 million shares, which is 30% of the company's total share capital prior to the issuance [1] - The issuance price will be no less than 80% of the average trading price of the company's shares over the 20 trading days prior to the pricing benchmark [1] Group 2 - The company aims to raise up to 4.4 billion yuan through this issuance, with funds allocated for various projects including enhancing packaging capacity for storage chips, automotive applications, wafer-level packaging, and high-performance computing [1] - Specific project investments include approximately 880 million yuan for storage chip packaging, 1.1 billion yuan for automotive applications, 743 million yuan for wafer-level packaging, and 724 million yuan for high-performance computing [1] - Additionally, 1.23 billion yuan will be used to supplement working capital and repay bank loans [1]

Core Viewpoint - Tongfu Microelectronics (002156.SZ) plans to raise a total of no more than 440 million yuan through a private placement of shares, with the funds allocated for various capacity enhancement projects and working capital [1] Group 1: Fundraising Details - The total amount to be raised is capped at 440 million yuan, which includes the principal amount [1] - The funds will be used for enhancing storage chip packaging capacity, packaging capacity for emerging applications such as automotive, wafer-level packaging capacity, and high-performance computing and communication packaging capacity [1] Group 2: Financial Management - The raised funds will also be used to supplement working capital and repay bank loans [1]

Core Viewpoint - Tongfu Microelectronics (002156.SZ) plans to issue A-shares to specific investors in 2026, aiming to raise up to 4.4 billion yuan for various capacity enhancement projects and working capital [1] Group 1: Stock Issuance Details - The company intends to issue shares to no more than 35 specific investors [1] - The issuance price will be no less than 80% of the average trading price of the company's stock over the 20 trading days prior to the pricing benchmark [1] - The total number of shares issued will not exceed 30% of the company's total share capital before the issuance, amounting to a maximum of 455 million shares [1] Group 2: Fund Utilization - The total funds raised will not exceed 4.4 billion yuan, including issuance costs [1] - The funds will be allocated to enhance storage chip testing capacity, testing capacity for emerging applications in the automotive sector, wafer-level testing capacity, high-performance computing and communication testing capacity, as well as to supplement working capital and repay bank loans [1]