Core Viewpoint - The stock of Jing Sheng Mechanical & Electrical Co., Ltd. has shown fluctuations in recent trading sessions, with a notable increase on November 24, 2023, despite a significant decline over the past few weeks [1][2]. Group 1: Stock Performance - On November 24, 2023, Jing Sheng's stock rose by 2.05%, reaching 34.79 CNY per share, with a trading volume of 362 million CNY and a turnover rate of 0.86%, resulting in a total market capitalization of 45.559 billion CNY [1]. - Year-to-date, the stock price has increased by 10.44%, but it has decreased by 9.28% over the last five trading days and 13.35% over the last 20 days, while showing a 14.18% increase over the last 60 days [1]. Group 2: Financial Performance - For the period from January to September 2025, Jing Sheng reported a revenue of 8.273 billion CNY, a year-on-year decrease of 42.86%, and a net profit attributable to shareholders of 901 million CNY, down 69.56% year-on-year [2]. - The company has distributed a total of 3.241 billion CNY in dividends since its A-share listing, with 2.027 billion CNY distributed over the past three years [2]. Group 3: Shareholder Information - As of September 30, 2025, the number of shareholders increased to 86,800, a rise of 25.88%, while the average number of circulating shares per person decreased by 20.56% to 14,189 shares [2]. - The top ten circulating shareholders include Hong Kong Central Clearing Limited, which holds 42.4866 million shares, a decrease of 538,400 shares from the previous period [2].

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Company Overview - Hefei Xinhui Microelectronics Co., Ltd. specializes in high-end integrated circuit packaging and testing services, with its main products being integrated circuit packaging tests [3]. - The company was established on December 18, 2015, and went public on August 18, 2022. Its main business revenue composition includes 90.25% from display driver chip packaging and 9.75% from other services [8]. Recent Developments - On October 14, 2025, the company announced a significant investment in Hefei Xinfeng Technology Co., Ltd., acquiring a 27.5445% stake and forming a strategic partnership to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, to meet customer demands and enhance its technological capabilities [2]. Financial Performance - For the period from January to September 2025, the company reported a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, up 23.21% year-on-year [9]. - As of September 30, 2024, the company's overseas revenue accounted for 54.15%, benefiting from the depreciation of the RMB [4]. Market Activity - On November 21, the company's stock price fell by 6.71%, with a trading volume of 359 million yuan and a turnover rate of 3.17%, leading to a total market capitalization of 11.085 billion yuan [1].

Core Insights - The stock price of Shengmei Shanghai has decreased by 2.11% on November 21, trading at 157.51 CNY per share with a market capitalization of 75.631 billion CNY [1] - Year-to-date, Shengmei Shanghai's stock has increased by 58.55%, but it has seen a decline of 5.15% in the last five trading days and 18.09% over the past 20 days [2] Financial Performance - For the period from January to September 2025, Shengmei Shanghai reported a revenue of 5.146 billion CNY, representing a year-on-year growth of 29.42%, and a net profit attributable to shareholders of 1.266 billion CNY, which is a 66.99% increase year-on-year [2] - Since its A-share listing, Shengmei Shanghai has distributed a total of 0.723 billion CNY in dividends [3] Shareholder Information - As of September 30, 2025, the number of shareholders for Shengmei Shanghai has increased by 85.89% to 21,700, while the average circulating shares per person have decreased by 46.20% to 20,098 shares [2] - The top ten circulating shareholders have seen a reduction in holdings, with significant decreases noted for major institutional investors [3]

Core Viewpoint - The stock of Shenzhen Technology Co., Ltd. (深科技) has experienced fluctuations, with a recent decline of 2.03% and a total market capitalization of 36.34 billion yuan, despite a year-to-date increase of 22.52% [1] Group 1: Stock Performance - As of November 21, the stock price is 23.12 yuan per share, with a trading volume of 1.59 billion yuan and a turnover rate of 0.44% [1] - The stock has seen a net outflow of 14.54 million yuan from main funds, with significant buying and selling activity from large orders [1] - Over the past five trading days, the stock has decreased by 6.55%, and over the past 20 days, it has dropped by 22.00% [1] Group 2: Company Overview - Shenzhen Technology Co., Ltd. was established on July 4, 1985, and listed on February 2, 1994, focusing on advanced manufacturing of hard disk heads, electronic products, and other technology [2] - The company's revenue composition includes high-end manufacturing (50.52%), storage semiconductor business (27.13%), and intelligent metering terminals (21.70%) [2] - The company operates within the electronic industry, specifically in consumer electronics and components, and is involved in various concept sectors such as advanced packaging and automotive electronics [2] Group 3: Financial Performance - For the period from January to September 2025, the company achieved a revenue of 11.28 billion yuan, reflecting a year-on-year growth of 3.93%, and a net profit of 756 million yuan, up 14.27% [2] - The company has distributed a total of 3.96 billion yuan in dividends since its A-share listing, with 702 million yuan distributed in the last three years [3] - As of September 30, 2025, the top ten circulating shareholders include significant institutional investors, with notable changes in holdings [3]

Core Viewpoint - The article discusses the significance of semiconductor packaging and testing (封测) in the semiconductor industry, highlighting its processes, roles, and market potential, especially in the context of China's growing semiconductor sector. Group 1: Definition, Role, and Process of Packaging - Packaging refers to the process of placing, fixing, and sealing chips using specific materials and techniques, which protects chip performance and extends internal functions to the external environment [7][8]. - The four main roles of packaging are protection, support, connection, and heat dissipation [6][8]. - The basic packaging process includes wafer thinning, wafer cutting, chip attachment, wire bonding, encapsulation, curing, testing, marking, packaging, inspection, and shipping [7][8]. Group 2: Semiconductor Packaging Industry Chain - The semiconductor packaging industry is positioned in the midstream of the semiconductor industry chain, which includes design, manufacturing, and packaging/testing [17]. - The packaging segment accounts for a significant portion of the value in the packaging and testing process, with estimates indicating that packaging contributes 80-85% of the total value [22]. Group 3: Market Overview and Growth Potential - In 2022, China's semiconductor industry sales reached 12,006 billion yuan, with packaging accounting for 2,995 billion yuan, representing 24.9% of the total [22]. - The packaging industry is expected to grow, with projections indicating a sales increase to 3,060 billion yuan in 2023, reflecting an 8.4% year-on-year growth [22]. - The article emphasizes that the advanced packaging and high-end packaging materials sectors are likely to benefit from the ongoing AI wave and supportive policies [22]. Group 4: Equipment and Technology in Packaging - The semiconductor packaging process involves various equipment, including thinning machines, cutting machines, die bonders, and encapsulation machines, each playing a critical role in ensuring quality and efficiency [32][37]. - The market for packaging equipment is dominated by a few key players, with significant market shares held by companies like TOWA and ASM Pacific [45]. Group 5: Testing Process and Equipment - Testing is crucial for ensuring the functionality and performance of semiconductor devices, with processes divided into wafer testing and final product testing [16][54]. - The global market for testing equipment is led by companies such as Advantest and Teradyne, which together hold a significant market share [48]. Group 6: Raw Materials in Packaging - The raw materials used in semiconductor packaging include cutting materials, adhesive materials, bonding wires, packaging substrates, and encapsulation materials, with the packaging substrate accounting for 40% of the market share [63][64]. - The article notes that the barriers to entry for packaging materials are lower compared to wafer materials, and China has achieved a level of import substitution in this area [63].

Core Viewpoint - The news highlights that NVIDIA plans to adopt 12-inch silicon carbide substrates in the advanced packaging of its next-generation GPU chips, expected to be implemented by 2027. This development is significant for the industry as it may enhance thermal efficiency, increase integration density, reduce package size, and lower costs [1]. Group 1 - NVIDIA's intention to use 12-inch silicon carbide substrates is a major industry development [1]. - The adoption of these substrates is expected to significantly improve thermal efficiency and integration density [1]. - The company has already launched a full series of 12-inch substrates, including semi-insulating, conductive P-type, and conductive N-type [1].

Core Viewpoint - Bowei Alloy's stock price has experienced fluctuations, with a year-to-date increase of 7.58% but a recent decline in the last five, twenty, and sixty trading days [1][2]. Company Overview - Bowei Alloy, established on January 22, 1994, and listed on January 27, 2011, is located in Ningbo, Zhejiang Province. The company specializes in the research, production, and sales of high-performance and high-precision non-ferrous alloy materials, solar cell components, and precision cutting wires [1][2]. - The revenue composition of Bowei Alloy includes 77.63% from new materials, 21.23% from new energy products, and 1.14% from other sources [1]. Financial Performance - For the period from January to September 2025, Bowei Alloy achieved an operating income of 15.474 billion yuan, representing a year-on-year growth of 6.07%. However, the net profit attributable to shareholders decreased by 19.76% to 881 million yuan [2]. - Since its A-share listing, Bowei Alloy has distributed a total of 1.694 billion yuan in dividends, with 923 million yuan distributed over the past three years [3]. Shareholder Information - As of November 10, 2025, Bowei Alloy had 45,200 shareholders, a decrease of 3.99% from the previous period. The average number of circulating shares per shareholder increased by 4.16% to 18,146 shares [2]. - Among the top ten circulating shareholders, Hong Kong Central Clearing Limited holds 10.8419 million shares, an increase of 5.9259 million shares from the previous period. The Noan Pioneer Mixed A fund is a new entrant among the top shareholders with 8.3159 million shares [3].

Core Viewpoint - The stock of ChipSource Microelectronics has experienced fluctuations, with a recent decline of 2.00% and a year-to-date increase of 51.33%, indicating volatility in the semiconductor equipment sector [1][2]. Financial Performance - For the period from January to September 2025, ChipSource reported a revenue of 990 million yuan, a year-on-year decrease of 10.35%, and a net profit attributable to shareholders of -10.05 million yuan, a significant decline of 109.34% [2]. - Cumulative cash dividends since the company's A-share listing amount to 139 million yuan, with 86.89 million yuan distributed over the past three years [3]. Shareholder Structure - As of September 30, 2025, the number of shareholders increased by 15.37% to 16,000, while the average circulating shares per person decreased by 13.17% to 12,633 shares [2]. - The top ten circulating shareholders include notable funds such as Nuoan Growth Mixed A and Jiashi Shanghai Stock Exchange Science and Technology Innovation Board Chip ETF, with some funds reducing their holdings significantly [3]. Market Activity - As of November 20, 2025, ChipSource's stock price was 126.39 yuan per share, with a trading volume of 238 million yuan and a turnover rate of 0.92% [1]. - The stock has seen a net outflow of 17.95 million yuan from major funds, indicating a cautious sentiment among institutional investors [1]. Business Overview - ChipSource Microelectronics, established on December 17, 2002, specializes in the research, production, and sales of semiconductor equipment, with a significant revenue contribution from photolithography equipment [1]. - The company operates within the semiconductor equipment sector and is associated with advanced packaging, photoresist, and major players like Huawei and SMIC [1].

Core Viewpoint - Huahai Qingke's stock price has experienced fluctuations, with a recent decline of 2.00% and a year-to-date increase of 20.99%, indicating volatility in the semiconductor equipment sector [1][2]. Financial Performance - For the period from January to September 2025, Huahai Qingke achieved a revenue of 3.194 billion yuan, representing a year-on-year growth of 30.28%. The net profit attributable to shareholders was 791 million yuan, reflecting a growth of 9.81% compared to the previous year [2]. - Cumulative cash dividends since the company's A-share listing amount to 271 million yuan [3]. Stock Market Activity - As of November 20, Huahai Qingke's stock was trading at 132.00 yuan per share, with a market capitalization of 46.649 billion yuan. The trading volume was 2.29 billion yuan, with a turnover rate of 0.49% [1]. - The stock has seen a net outflow of 22.9738 million yuan in principal funds, with significant selling pressure observed [1]. Shareholder Structure - As of September 30, 2025, the number of shareholders increased by 112.76% to 28,900, while the average circulating shares per person decreased by 29.83% to 12,245 shares [2]. - Among the top ten circulating shareholders, notable changes include an increase in holdings by E Fund's SSE STAR 50 ETF and a decrease by Huaxia's SSE STAR 50 ETF [3].

Core Insights - The article discusses the rapid development of AI chips, highlighting the importance of advanced packaging technologies like 2.5D/3D packaging, particularly focusing on GPU, AI ASIC, and HBM as key components in high-performance computing [2][4]. Group 1: Advanced Packaging Technologies - Advanced packaging platforms are crucial for enhancing device performance and bandwidth, becoming a hot topic in the semiconductor industry, even surpassing traditional cutting-edge process nodes [2]. - TSMC, Intel, and Samsung have established a "triple dominance" in the advanced packaging field, each playing different roles in the supply chain [4]. - TSMC's CoWoS technology has become the de facto standard for high-bandwidth packaging, with significant adoption by major companies like NVIDIA and AMD [6]. Group 2: Market Projections - The advanced packaging market is projected to exceed $12 billion by Q2 2025, driven by strong demand in AI and high-performance computing [4]. - By 2024, the advanced packaging market size is expected to reach approximately $45 billion, with a robust compound annual growth rate of 9.4%, potentially reaching around $80 billion by 2030 [4]. Group 3: Capacity and Cost Challenges - CoWoS capacity is severely constrained, primarily due to NVIDIA's long-term commitments, which occupy over half of the available capacity [7]. - TSMC plans to expand its CoWoS capacity by over 20% by the end of 2026, aiming for a capacity of at least 120-130 thousand wafers per month [7]. - The high cost of the intermediate layer in CoWoS packaging can account for 50%-70% of the total packaging cost, leading to situations where packaging costs exceed the chip costs [8]. Group 4: Intel's EMIB Technology - Intel's EMIB technology is gaining attention as a flexible alternative to TSMC's CoWoS, with major companies like Apple and Qualcomm evaluating it for their next-generation chips [11]. - EMIB allows for cost-effective heterogeneous integration and supports large-scale system expansion, making it suitable for custom ASICs and AI inference chips [18]. - The combination of EMIB with Foveros technology creates a hybrid architecture that balances packaging size, performance, and cost efficiency [21]. Group 5: Samsung's Position - Samsung's advanced packaging strategy is driven by its HBM supply chain, leveraging its position to influence packaging and system architecture decisions [23]. - Samsung's I-Cube technology offers a different approach to advanced packaging, focusing on high-density interconnects and cost-effective solutions [24][28]. - The X-Cube technology represents a significant advancement in 3D packaging, enhancing chip density and performance through innovative bonding techniques [28]. Group 6: Competitive Landscape - The competition in the AI chip foundry sector is no longer just about packaging processes but involves a comprehensive strategy encompassing computational architecture, supply chain security, capital expenditure, and ecosystem integration [30]. - For downstream chip design companies, navigating between different packaging camps will be crucial for determining the performance limits and delivery certainty of future AI products [30].