另外，市场昨天稍早传出，台积电规划将台湾部分成熟制程设备转至世界先进新加坡12吋厂，进一步冲 刺先进制程、并为成熟制程升级至特殊制程挪出空间。 台积电（2330）扩大美国布局，昨（8）日公告斥资逾1.97亿美元（约新台币62.27亿元），向亚利桑那 州州政府取得新土地，以供美国厂扩大营运与生产。 市场并传出，台积电有意将部分台湾成熟制程设备转至世界先进新加坡12吋厂，借此腾出更多空间设置 新机台，扩大台湾先进制程产能。 台积电表示，新取得亚利桑那州土地，主要供营运与生产使用，惟该公司目前处于法说会前缄默期，不 评论台湾成熟制程设备转至世界先进星国厂区传言。世界先进也不评论相关设备移转消息。法人指出， 若传言为真，意味台积电台美先进制程布局同步催速，有助推升后续业绩。 台积电董事长魏哲家曾在去年10月的法说会上透露，正加大美国布局，将于亚利桑那州再取得一块大面 积土地，以支持目前的拓展计划并提供更多弹性，并借此应对非常强劲的AI相关长期需求。 台积电昨天落实魏哲家的说法，公告美国子公司TSMC Arizona向亚利桑那州州政府取得新土地，该土 地座落于Southwest corner of 43rd Avenu ...

订单与盈利双拐点，高毛利产品占比提升推动利润修复：公司新增订单连续六个季度同比回升，AI 服 务器与国内需求共振带动SMT加速复苏，SEMI随HBM 扩产进入新一轮上行周期。先进封装占比提升、 SMT 结构改善及费用优化带来毛利率与盈利拐点，2025–2027 年业绩弹性充分。 地缘政治+国产替代共振，中国市场份额预期提升：在美国出口管制与国产化替代加速背景下，国内封 测厂资本开支保持高增，公司作为封装设备唯一具备 ECD 供应能力的厂商，结合中国深度本地化网络 与领先客户资源，将持续受益于供应链自主可控与国产化政策红利。 机构：财通证券 研究员：郝艳辉/景柄维 先进封装设备放量，全面布局深度受益：全球AI/HPC 带动TCB、HybridBonding 等先进封装工艺快速渗 透，设备需求进入持续放量周期。公司在先进封装拥有完整的设备矩阵，覆盖沉积、TCB、HB、Fan- out 与SiP 等核心环节，TCB市占率全球第一，HB设备完成代际升级并量产交付。随着 HBM扩产启 动、先进逻辑厂设备采购周期延续，公司有望在行业结构性扩张中获得最大增量，先进封装收入与全球 占有率持续提升。 投资建议：公司受益于先进封 ...

来源：新浪证券-红岸工作室 1月8日，汇成股份涨8.98%，成交额13.32亿元，换手率8.63%，总市值158.15亿元。 异动分析 存储芯片+先进封装+OLED+芯片概念+人民币贬值受益 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、2024年7月3日公司投资者关系活动记录表：公司目前OLED客户主要包括联咏、瑞鼎、 ...

1月8日，中微公司盘中下跌2.05%，截至14:11，报345.10元/股，成交46.47亿元，换手率2.12%，总市值 2160.83亿元。 资金流向方面，主力资金净流出2.51亿元，特大单买入6.72亿元，占比14.47%，卖出8.58亿元，占比 18.47%；大单买入16.44亿元，占比35.38%，卖出17.10亿元，占比36.79%。 分红方面，中微公司A股上市后累计派现4.96亿元。 责任编辑：小浪快报 资料显示，中微半导体设备(上海)股份有限公司位于上海市浦东新区金桥出口加工区(南区)泰华路188 号，成立日期2004年5月31日，上市日期2019年7月22日，公司主营业务涉及高端半导体设备的研发、生 产和销售。主营业务收入构成为：专用设备86.17%，备品备件12.84%，其他0.99%。 中微公司所属申万行业为：电子-半导体-半导体设备。所属概念板块包括：中芯国际概念、大基金概 念、长三角一体化、半导体设备、先进封装等。 截至9月30日，中微公司股东户数6.08万，较上期增加29.52%；人均流通股10301股，较上期减少 22.79%。2025年1月-9月，中微公司实现营业收入80.63亿 ...

盛美上海所属申万行业为：电子-半导体-半导体设备。所属概念板块包括：半导体设备、先进封装、第 三代半导体、中芯国际概念、HBM概念等。 1月8日，盛美上海盘中下跌2.01%，截至10:43，报194.03元/股，成交5.51亿元，换手率0.64%，总市值 931.66亿元。 资金流向方面，主力资金净流出3221.79万元，特大单买入5810.27万元，占比10.55%，卖出5541.78万 元，占比10.07%；大单买入1.43亿元，占比26.03%，卖出1.78亿元，占比32.37%。 盛美上海今年以来股价涨10.21%，近5个交易日涨9.65%，近20日涨18.31%，近60日涨7.99%。 资料显示，盛美半导体设备(上海)股份有限公司位于中国(上海)自由贸易试验区丹桂路999弄5、6、7、8 号全幢，成立日期2005年5月17日，上市日期2021年11月18日，公司主营业务涉及半导体专用设备的研 发、生产和销售。主营业务收入构成为：销售商品99.72%，提供服务0.28%。 责任编辑：小浪快报 截至9月30日，盛美上海股东户数2.17万，较上期增加85.89%；人均流通股20098股，较上期减少 46. ...

公众号记得加星标⭐️，第一时间看推送不会错过。 随着人工智能（AI）半导体需求强度远超市场预期，全球封测龙头日月光投控正迎接前所未有的成长 契机。大摩(摩根士丹利，Morgan Stanley）在最新的研究报告中，将日月光投控的投资评等重申为 「买进」，并将目标价从新台币228 元大幅上调至308 元。此一调整，反映了分析师对其2026 年至 2027 年获利成长的强劲信心，特别是看好其在先进封装领域的领先地位及定价权的提升。 报告指出，由于AI 半导体需求极为强劲，加上日月光的产能已趋近极限，预计该公司将在2026 年调 涨后段晶圆代工服务价格，涨幅预期落在5% 至20% 之间，高于原先预期的5-10%。这波涨价主要导 因于半导体通膨压力，日月光已决定将包含基板、贵金属及电费在内的增加成本转嫁给客户。同时， 公司将优先向毛利率较高的AI 客户供货，以优化产品组合。 报告表示，大中华区外包封测（OSAT）的产能利用率（UTR）在2025 年已持续复苏，预计2026 年 将进一步成长。日月光2025 年第三季的产能利用率已达90%，在实务上什至已接近满载，这使其在 2026 年的价格谈判中拥有极强的议价筹码。 ...

1月8日，中科飞测盘中上涨2.04%，截至09:54，报182.66元/股，成交4.21亿元，换手率0.94%，总市值 639.61亿元。 责任编辑：小浪快报 中科飞测所属申万行业为：电子-半导体-半导体设备。所属概念板块包括：半导体设备、先进封装、 HBM概念、中芯国际概念、半导体等。 截至9月30日，中科飞测股东户数1.37万，较上期增加40.11%；人均流通股18131股，较上期减少 28.63%。2025年1月-9月，中科飞测实现营业收入12.02亿元，同比增长47.92%；归母净利润-1469.85万 元，同比增长71.67%。 分红方面，中科飞测A股上市后累计派现4480.00万元。 机构持仓方面，截止2025年9月30日，中科飞测十大流通股东中，诺安成长混合A（320007）位居第二 大流通股东，持股1345.33万股，持股数量较上期不变。永赢半导体产业智选混合发起A（015967）位居 第八大流通股东，持股600.00万股，为新进股东。嘉实上证科创板芯片ETF（588200）位居第十大流通 股东，持股508.59万股，相比上期减少22.72万股。银华集成电路混合A（013840）退出十大流通股 ...

Market Overview - The three major A-share indices experienced a slight increase on January 7, with total trading volume in the Shanghai and Shenzhen markets reaching 2.88 trillion yuan, an increase of over 49 billion yuan compared to the previous day [1] - More than 2,100 stocks closed higher, with notable gains in sectors such as storage chips, state-owned capital holdings, and advanced packaging [1] Historical Highs - A total of 99 stocks reached their historical closing highs, excluding newly listed stocks from the past year. The electronics, machinery equipment, and non-ferrous metals sectors had the highest concentration of stocks hitting new highs, with 27, 13, and 11 stocks respectively [1] - The average increase for stocks that reached historical highs was 7.25%, with stocks like Shaoyang Hydraulic, Meihua Medical, and Nanda Optoelectronics hitting the daily limit [1] Top Gainers - The top gainers among stocks that reached historical highs included: - Shaoyang Hydraulic (41.33 yuan, +20.01%) - Meihua Medical (41.56 yuan, +20.01%) - Andar Intelligent (170.08 yuan, +20.00%) - Nanda Optoelectronics (55.19 yuan, +20.00%) [2] Institutional Activity - In the market, 17 stocks were net bought by institutions, with five stocks seeing net purchases exceeding 1 billion yuan. Notably, Sanbo Brain Science and Shunhao Co. received over 2 billion yuan in net purchases [2] - Conversely, Jin Feng Technology faced the highest net sell-off by institutions, amounting to over 400 million yuan, followed by Meihua Medical and Chip Source Micro with net sells of 371 million yuan and 241 million yuan respectively [3] Northbound Capital Flow - Northbound funds saw net purchases in 14 stocks, with Nanda Optoelectronics, Sanbo Brain Science, and Lei Ke Defense leading with amounts exceeding 1 billion yuan [4] - On the sell side, Jin Feng Technology topped the list with a net sell amount of 92.58 million yuan, followed by Yunhan Chip City and Shunhao Co. with net sells exceeding 40 million yuan [5] Company Announcements - Zhongke Lanyun (688332) projected a net profit increase of 366.51% to 376.51% for 2025, driven by significant growth in the fair value of investments in Moer Thread and Muxi Co. [7] - Su Meida plans to acquire a 16.92% stake in Blue Science High-Tech to achieve control [7] - Baomo Co. is planning a change in control by its actual controller [7] - Puli Te's LCP film products are suitable for use as flexible electrode materials in brain-computer interfaces [7] - Chuanjin Nuo expects a net profit increase of 144.24% to 172.64% for 2025 [7]

Core Viewpoint - Morgan Stanley has raised its CoWoS capacity forecasts for 2026 and 2027 by 8% and 13% respectively, driven by TSMC's capacity expansion and strong demand for TPUs [1][2]. Group 1: CoWoS Capacity Forecasts - TSMC's CoWoS capacity is expected to reach 115,000 wafers per month by the end of 2026, with additional capacity from external suppliers (mainly ASE and Amkor) contributing 12,000 to 15,000 wafers per month [2]. - The capacity increase is primarily due to rising demand from the ASIC supply chain, with TSMC focusing on CoWoS-L technology while CoWoS-S supply remains stable [2]. Group 2: TPU Demand and Shipments - Morgan Stanley has raised its TPU shipment forecasts for 2026 and 2027 to 3.7 million and 5 million units respectively, reflecting strong market demand and TSMC's ongoing capacity expansion [3][4]. - To meet TPU demand, Broadcom's CoWoS wafer allocation has been increased to 230,000 wafers in 2026 and 350,000 wafers in 2027, while MediaTek is expected to receive 18,000 and 55,000 wafers in the same years [5]. Group 3: Key Players and Projects - NVIDIA's CoWoS allocation for 2026 remains at 700,000 wafers, with slight adjustments in product mix due to HBM4 readiness issues [6]. - AMD's CoWoS forecasts remain unchanged at 90,000 and 120,000 wafers for 2026 and 2027, with potential delays in the MI450 project [6]. - AWS's Trainium project has seen a slight reduction in 2026 shipment expectations to 2.1 million units, with lifecycle totals unchanged [7]. Group 4: Outsourcing and Equipment Suppliers - Due to TSMC's capacity constraints, smaller projects are being outsourced to packaging factories, with ASE expected to benefit from various CPU and TPU projects [8]. - Equipment suppliers are projected to see a 20% to 30% increase in equipment shipments in 2026, driven by strong demand for CoWoS, WMCM, and FOCoS technologies [9].

Investment Rating - The report assigns an "Accumulate" rating for the company, marking its first coverage [2]. Core Insights - The company is positioned to benefit from the accelerating domestic semiconductor equipment replacement and improved order visibility driven by advanced packaging technology [1]. - The company has a comprehensive equipment matrix in advanced packaging, with a leading market share in TCB (Thermal Compression Bonding) and has upgraded its HB (Hybrid Bonding) equipment for mass production [8]. - The company is expected to see significant revenue growth from 2025 to 2027, with projected revenues of HKD 141.14 billion, HKD 165.73 billion, and HKD 189.05 billion, respectively, reflecting year-on-year growth rates of 6.69%, 17.42%, and 14.07% [8]. Summary by Sections 1. Market Performance - The company has experienced a significant market performance shift, with a 44% increase compared to the previous year, while the semiconductor index has shown varied performance [4]. 2. Profit Forecast - The company’s revenue is projected to decline by 24.10% in 2023, followed by a gradual recovery with expected growth rates of 6.69%, 17.42%, and 14.07% from 2025 to 2027 [7]. - The net profit is forecasted to recover from a low of HKD 345 million in 2024 to HKD 1.715 billion by 2027, indicating a strong rebound in profitability [7]. 3. Valuation Recovery - The company is expected to benefit from the long-term trend of advanced packaging, with a clear growth logic supported by order recovery and improved profit structure [8]. - The company’s TCB market share is projected to reach 35%-40% by 2027, with a total potential market exceeding USD 1 billion [66]. 4. Advanced Packaging Growth - The advanced packaging market is anticipated to surpass traditional packaging by 2025, driven by the increasing demand for AI and high-performance computing [36]. - The global advanced packaging market is expected to grow at a CAGR of approximately 10% until 2023, with significant contributions from government policies and diverse downstream demand [37]. 5. Geopolitical and Domestic Market Dynamics - The company is expected to gain market share in China due to the acceleration of domestic substitution and geopolitical factors, with a focus on local supply chain control [8]. - The company has established a strong local presence in China, with a significant portion of its revenue derived from the region, indicating a strategic advantage in the domestic market [35].