Core Viewpoint - Taihe New Materials has made significant progress in the mobile phone cooling sector by developing high-performance thermal film materials based on POD (Polyoxadiazole), which is currently in the pilot test stage [2][7]. Group 1: Product Development - The new thermal film material being developed is distinct from previously mentioned products like thermal films and aramid thermal films [2]. - POD is a functional heterocyclic polymer known for its excellent thermal and mechanical properties, chemical stability, and unique electronic and optical properties, making it suitable for various applications [2]. - Traditional synthesis methods for POD are complex and limited, which restricts the structural diversity and functional applications of POD materials [2][4]. Group 2: Market Context - The smartphone market has evolved into a high-performance computing device, leading to increased processor power consumption and heat output [2]. - Passive cooling methods have been the norm, transitioning from natural graphite sheets and copper foils to advanced materials like graphene thermal films and VC (Vapor Chamber) heat spreaders [2][6]. - The market for mobile phone thermal films is substantial, with annual demand measured in billions of pieces, indicating a promising future for scaled production once material performance is validated [7]. Group 3: Competitive Landscape - The main suppliers of artificial synthetic graphite films are limited, with key players including DuPont, Zhongyuan Chemical, Ube Industries, SKC, and Maida Technology [3]. - Taihe New Materials' entry into POD-based thermal films represents a strategic extension into the electronic cooling materials sector, providing a differentiated competitive approach for domestic thermal material manufacturers [5][7]. Group 4: Future Trends - By 2025, companies like Huawei and OPPO are expected to lead the adoption of active cooling technologies, such as micro fans and piezoelectric micro pumps, in response to the high power consumption era [9]. - The global thermal interface materials (TIM) market is projected to grow rapidly, driven by emerging applications in AI, humanoid robots, communication, chips, and electric vehicles [11]. - The upcoming 6th Thermal Management Industry Conference in December 2025 will focus on cutting-edge thermal management materials and solutions, highlighting the importance of advanced cooling technologies in the industry [11].

Core Viewpoint - The company is leveraging its established supply chain, product matrix, and technological reserves in automotive thermal management to explore applications in non-automotive sectors, specifically in data centers, communication cabinets, and energy storage [1] Group 1: Business Development - The company has achieved small-scale production of electronic water pumps, rubber hoses, and nylon pipes for liquid cooling applications in data centers and energy storage cabinets [1] - The board of directors has approved an investment of 50 million yuan to establish a wholly-owned subsidiary focused on the research, production, and sales of liquid cooling components and products for energy storage and servers [1] - The company aims to continuously explore new development directions to lay a foundation for long-term sustainable growth [1]

Summary of TSMC and NVIDIA Thermal Management Strategies Industry and Companies Involved - **Industry**: Semiconductor and AI Chip Thermal Management - **Companies**: TSMC (Taiwan Semiconductor Manufacturing Company), NVIDIA Core Points and Arguments Thermal Management Challenges - The development of AI chips is driven by the need for higher performance, which leads to significant thermal management challenges due to increased power consumption and heat generation [6][35][36] - Effective heat dissipation is crucial for next-generation AI chip architectures, as traditional cooling methods struggle with high heat flux densities [37][38] Innovations in Cooling Technologies - TSMC and NVIDIA are exploring advanced cooling technologies, including Direct Liquid Cooling (DLC) and Microchannel Liquid Cooling (MLCP) to address thermal demands [10][30][40] - TSMC's innovative Direct Liquid Cooling solution integrates microfluidic structures into the chip's backside, enhancing cooling efficiency [10][30] - The Microchannel Lid (MCL) concept combines heat spreading and cooling functions, allowing for efficient heat removal and higher compute density [110] Material Evolution - The shift from traditional Thermal Interface Materials (TIM) to advanced materials like Silicon Carbide (SiC) and CVD diamond films is essential for improving thermal conductivity and reliability [74][84] - SiC substrates offer superior thermal conductivity (up to 490 W/m·K) and structural advantages, making them suitable for high-power AI chips [74][76] Industry Trends and Future Directions - The power consumption of AI chips is expected to rise significantly, with projections reaching 6,000–7,000 W by 2028, necessitating advanced thermal solutions [84] - The collaboration between TSMC and NVIDIA is evolving into a strategic alliance focused on thermal technology, which could redefine data center cooling infrastructure [42][41] Competitive Landscape - The next-generation cooling market is valued at $5 billion, with various players including Taiwan's thermal solution providers and emerging innovators like Fabric8Labs and xMEMS [49] - The competition in AI thermal management is intensifying, as effective thermal solutions become a key differentiator in the semiconductor industry [53] Other Important Insights - The evolution of TIM is moving towards "zero-interface" thermal resistance solutions, with a focus on direct structural thermal solutions [47][81] - The integration of cooling technologies with packaging and interconnect technologies is becoming increasingly important for achieving optimal thermal performance [41][52] - The industry is witnessing a paradigm shift where thermal management solutions are being integrated at the chip and packaging levels, rather than just at the system level [41][42]

报告导读： 高密度算力中心不断发展，芯片层面的冷却技术愈发成为热管理系统的核心瓶 颈，我们认为导热界面材料（ TIM ）的需求将快速增长。 投资观点。 在面对人工智能和更新芯片设计不断增长的需求，当前的冷却技术将在短短几年内限制产业的不断发展。近日，微软宣布已成功开发出一种芯片 内的微流体（ Microfluidic ）冷却系统，可以对模拟团队会议核心服务的服务器进行有效冷却，散热效果比冷板好 3 倍。这个技术方案是将微小的通道直接 蚀刻在硅片的背面，形成凹槽，冷却液直接流到芯片上，实现更有效的散热。我们认为 AI 智算中心的热管理系统的核心瓶颈正不断聚焦于芯片层面，建议关 注 TIM1 、 TIM1.5 、 TIM2 等导热界面材料的需求增长，以及芯片内微流体技术的不断演进 。 AI 发展，热管理对完整散热系统的要求越来越高。 伴随 AI 大模型、 AI 应用的不断发展，其算力底座数据中心面临全新挑战以满足智算发展需求，数据中心 架构正加速向高密度、智能化和可持续方向演进。根据 TrendForce 表示， AI 服务器采用的 GPU 和 ASIC 芯片功耗大幅提升，以 NVIDIA GB200/GB300 ...

Core Viewpoint - The article emphasizes the growing importance of thermal management solutions in the electronics industry, driven by advancements in high-end smartphones, AI computing demands, and the increasing power density of electric vehicle control systems. The thermal materials industry is rapidly evolving, showcasing a vibrant ecosystem of domestic companies and innovative technologies [2]. Listed Companies - Feirongda (300602) is a leading expert in electromagnetic shielding and thermal management solutions, providing a complete product chain from thermal conductive materials to liquid cooling plates and heat spreaders. The company serves major clients like Huawei and BYD in the communication and new energy sectors [3][5]. - Siquan New Materials (301489) focuses on thermal management materials, offering a comprehensive range of products including graphite heat dissipation films and modules. The company has notable clients such as Xiaomi and Google [18][20]. - Suzhou Tianmai (301626) is recognized for its comprehensive thermal management solutions, with a strong emphasis on self-developed thermal interface materials and gel products, serving clients like Huawei and BYD [22][23]. - Zhongshi Technology (300684) specializes in high-performance synthetic graphite thermal solutions, becoming a core supplier for top global consumer electronics brands like Apple. The company reported significant revenue growth in 2024 [26][28]. - Lingyi Zhi Zao (002600) provides intelligent manufacturing services, with thermal management business revenue reaching 4.107 billion in 2024, showcasing a diverse product range [30][34]. - AAC Technologies (02018) leads in perception experience solutions, with its thermal business achieving substantial growth, particularly in the smartphone market [35]. - Shuo Beide (300322) offers antennas and thermal devices, reporting a revenue of 1.28 billion from thermal products in 2024 [36]. Financial Performance - Feirongda reported a revenue of 5.031 billion in 2024, with a net profit of 173 million, reflecting a 15.76% year-on-year growth [17]. - Siquan New Materials achieved a revenue of 656 million in 2024, marking a 51.10% increase compared to the previous year [21]. - Suzhou Tianmai's revenue for 2024 was 942 million, with a slight increase of 1.62% year-on-year [25]. - Zhongshi Technology's revenue reached 15.66 billion in 2024, with a net profit of 2.01 billion, indicating a 24.51% growth [29]. - Lingyi Zhi Zao's total revenue for 2024 was 442 billion, with a net profit of 17.59 billion, showing a 29.56% increase [34]. - AAC Technologies reported a revenue of 326 million from its thermal business, a 40.1% increase [35]. - Shuo Beide's thermal device revenue was 1.28 billion in 2024, with a total revenue of 18.6 billion [36]. Industry Trends - The thermal materials industry is characterized by rapid technological advancements and increasing domestic production capabilities, driven by the demand for efficient thermal management solutions in various high-tech applications [2]. - The article highlights the competitive landscape of the thermal materials sector, with numerous companies innovating to meet the growing needs of the electronics and automotive industries [2][3].

Core Viewpoint - Elon Musk emphasized that Tesla is fully committed to scaling the Optimus project, defining it as the most important product in the company's history, with expectations that it will account for 80% of the company's future value [2][6]. Group 1: Production Timeline and Goals - Tesla aims for internal limited production and testing of thousands of Optimus units by 2025, ramping up to 50,000-100,000 units for external sales in 2026, and targeting an annual production of 1 million units within five years [2]. - The current supply chain for Optimus is based on the design of Optimus V2, with actuators and sensors each accounting for approximately 30% of material costs [4]. Group 2: Supply Chain and Component Suppliers - The supply chain for Optimus includes Tier 1 suppliers such as Sanhua Intelligent Controls and Top Group for actuators, and Mingzhi Electric and Zhaowei Electromechanical for dexterous hands [7]. - Key component suppliers include Shuanghuan Transmission and Lide Harmony for reducers, Best for lead screws, and Rongtai Health for insulation parts [7]. - International Tier 1 suppliers include Amphenol for cables, TE Connectivity for six-dimensional torque sensors, and THK for lead screws [8]. Group 3: Challenges and Development Needs - Current challenges for Optimus include hardware issues such as overload and overheating of joint motors, insufficient dexterity and load capacity of dexterous hands, and the lifespan of transmission components [10]. - There is a need for improved compatibility between hardware and software, particularly in complex dynamic environments and multi-task coordination [10]. Group 4: Thermal Management Solutions - The thermal management system for Optimus V3 is similar to that of electric vehicles, focusing on the management of key components like batteries and motors [11]. - Sanhua Intelligent Controls is developing liquid cooling modules for Optimus, leveraging its experience in electric vehicle thermal management to address overheating issues in robotic joints [13]. - Sanhua plans to deliver approximately 2,000 actuators to Tesla by Q3 2025, with an annual order forecast of 5,000-10,000 units [13]. Group 5: Industry Trends and Future Outlook - Domestic suppliers are increasing investments to meet the demand for high-performance, miniaturized thermal management components for robots [14]. - The year 2025 is anticipated to be a pivotal year for humanoid robot mass production, with 2026 expected to be a critical turning point for the industry landscape [14]. - The upcoming iTherM 2025 conference will address advanced thermal management technologies and materials relevant to humanoid robots [15].

Core Insights - The article emphasizes the growing importance of thermal management as a "hidden core" in cross-industry collaborative innovation, driven by advancements in new energy, semiconductors, data centers, automotive, and low-carbon economies [2] - The iTherM 2025 conference aims to create a comprehensive platform for the thermal management industry, integrating exhibition, forums, results release, and resource matching to foster collaborative development [3] Group 1: Event Overview - iTherM 2025 is set to take place in Shenzhen, featuring an exhibition area of 20,000 square meters and attracting over 350 core enterprises from the thermal management industry [4] - The previous conference attracted over 10,000 professional visitors and 1,500 attendees, highlighting its significance as a leading event in the thermal management sector [4] Group 2: Participation and Networking - The event will gather over 300 top enterprises, including international representatives like Honeywell, 3M, and NVIDIA, as well as domestic leaders such as BYD and Huawei, showcasing the latest products and technologies [7] - iTherM 2025 is expected to connect with over 1,000 targeted buyers from major companies, facilitating efficient supply-demand matching through VIP buyer channels [9] Group 3: Expert Engagement - The conference will feature over 100 expert reports from industry leaders and researchers, focusing on key topics such as thermal science and battery cooling, providing strategic insights and technology trend analyses [11] - A series of specialized forums will be held, allowing participants to share cutting-edge research and innovative applications across various sectors [13] Group 4: Exhibition Structure - The exhibition will be organized into six thematic areas, covering the entire thermal management process from materials to systems, with a focus on practical applications [14] - A dedicated area for innovative achievements will showcase the latest research breakthroughs from academic institutions, promoting the transition from research to industry applications [23] Group 5: Investment and Collaboration - iTherM 2025 will emphasize investment and entrepreneurial project matching, inviting industry capital and startups to engage in discussions, particularly in areas like innovative materials and data center systems [25] - The event aims to create a positive cycle of technological breakthroughs, industrial implementation, and capital empowerment within the thermal management industry [25] Group 6: Future Outlook - The conference is positioned as a key platform for driving technological innovation and industrial upgrades in the thermal management sector, with a focus on multi-scenario applications and comprehensive industry engagement [27]

Investment Rating - The report gives a "Buy" rating for the company [15]. Core Views - The company is a leader in automotive thermal management in China, expanding into digital energy and robotics, with significant growth potential in these areas [5][13]. - The company has seen a substantial increase in net profit, projected to reach 9.6 billion yuan in 2025, with a corresponding PE ratio of 36.4x [5][13]. Summary by Sections Company Overview - The company has over 40 years of experience in automotive thermal management and is focusing on business expansion and globalization [8]. - It has developed four major growth curves: commercial vehicles, passenger vehicles, digital energy, and robotics [8]. Automotive Sector - The transition to new energy vehicles is driving upgrades in thermal management systems, with significant growth in both passenger and commercial vehicle segments [9]. - The domestic market for passenger vehicle thermal management is expected to reach 166.3 billion yuan by 2030, with a projected revenue of 51.1 billion yuan in 2024, reflecting a CAGR of 105.0% from 2020 to 2024 [9]. Digital Energy - The company is expanding its thermal management solutions from automotive applications to data centers and energy storage, with a projected market space of 10.3 billion yuan in 2024 [10]. - The global demand for liquid cooling solutions in data centers is expected to create a supply gap, with the company positioned to capitalize on this trend [10]. Robotics - The company is entering the robotics sector with a focus on embodied intelligence, which is expected to open up long-term growth opportunities [11]. International Expansion - The company has established R&D and production bases in the US, Mexico, Sweden, and Poland, with overseas revenue projected to reach 32.9 billion yuan in 2024 [12]. - The international business is entering a profitable phase, with North America expected to turn profitable in 2024 and Europe in 2025 [12]. Financial Performance - The company's revenue has grown from 2.2 billion yuan in 2021 to a projected 7.8 billion yuan in 2024, with a CAGR of 52.6% [8][41]. - The company’s net profit for the first half of 2025 is expected to be 4.4 billion yuan, reflecting a year-on-year growth of 9.5% [8][41]. Investment Recommendations - The report emphasizes the company's leadership in automotive thermal management and the growth potential in digital energy and robotics, supporting the "Buy" rating [5][13].

Group 1 - The stock of Zhejiang Yinlun Machinery Co., Ltd. increased by 5.1% on September 22, reaching a price of 42.67 yuan per share, with a trading volume of 1.555 billion yuan and a turnover rate of 4.79%, resulting in a total market capitalization of 35.621 billion yuan [1] - The company, established on March 10, 1999, and listed on April 18, 2007, specializes in the research, production, and sales of heat exchangers, automotive air conditioning, and related products, with heat exchangers accounting for 88.73% of its main business revenue [1] Group 2 - Huashang New Energy Mixed A Fund (013886) holds a significant position in Yinlun shares, with 469,700 shares held, representing 2.55% of the fund's net value, making it the ninth largest holding [2] - The fund has achieved a year-to-date return of 35.48%, ranking 2167 out of 8244 in its category, and a one-year return of 53.07%, ranking 2819 out of 8066 [2] Group 3 - The fund manager Zhang Wenlong has a tenure of 2 years and 51 days, with a total asset scale of 1.221 billion yuan, achieving a best return of 60.48% during his tenure [3] - Co-manager Chen Xiaoqiong has been in position for 260 days, managing assets of 841 million yuan, with a best return of 86.84% during her tenure [3]

Core Viewpoint - The 6th Thermal Management Industry Conference and Exposition (iTherM 2025) will focus on the integration and innovation within the thermal management industry, highlighting the latest trends, technologies, and collaborative opportunities across various sectors such as electronics, new materials, and green energy [1][2]. Group 1: Conference Information - The conference will take place from December 3 to 5, 2025, at the Shenzhen International Convention and Exhibition Center, with an expected attendance of over 2000 participants and more than 350 exhibitors [1][2]. - The theme of the conference is "Fusion · Innovation | Delivering a Little More," emphasizing the importance of thermal management in various industries [1][2]. Group 2: Key Activities and Focus Areas - iTherM 2025 will feature over 20 activities, including keynote speeches, roundtable discussions, and case studies, aimed at fostering communication and collaboration in the thermal management field [2][4]. - The conference will particularly emphasize intellectual property, entrepreneurial projects, and innovative technologies that can transition from laboratory to market, promoting cooperation among government, industry, academia, and investment sectors [4]. Group 3: Featured Companies and Innovations - Notable participants include Henkel, which specializes in thermal interface materials and has applications in electric vehicles and power electronics [5]. - Shenzhen Hongfu Cheng New Materials Co., Ltd. focuses on carbon-based thermal materials for high-speed optical communication and intelligent driving chips [6]. - Shanghai Aled Group Co., Ltd. is expanding its high-performance thermal interface materials for data centers and AI applications [7]. - Other companies like tesa, Chengdu Silica Technology Co., Ltd., and Indium Corporation are also contributing innovative thermal management solutions [8][9][13]. Group 4: Conference Agenda - The agenda includes various specialized forums covering topics such as thermal science, functional materials, technology applications, and engineering solutions, addressing current challenges and future opportunities in the thermal management industry [19][20]. - Specific topics will include liquid cooling technology, power device thermal management, and thermal management for electric vehicles and data centers [19].