据天眼查APP显示，江苏艾森半导体材料股份有限公司成立于2010年03月26日，注册资本8813.3334万 人民币。（数据宝） 12月17日艾森股份大宗交易一览 | 成交量 | 成交金额 | 成交价 | 相对当日收盘 | | | | --- | --- | --- | --- | --- | --- | | （万 | （万元） | 格 | 折溢价（%） | 买方营业部 | 卖方营业部 | | 股） | | （元） | | | | | 35.24 | 1783.14 | 50.60 | -18.61 | 华泰证券股份有限公司杭州学 | 华泰证券股份有限 | | | | | | 院路证券营业部 | 公司云南分公司 | | 28.63 | 1448.68 | 50.60 | -18.61 | 华泰证券股份有限公司杭州学 | 华泰证券股份有限 | | | | | | 院路证券营业部 | 公司云南分公司 | | 4.00 | 202.40 | 50.60 | -18.61 | 东方财富证券股份有限公司山 | 华泰证券股份有限 | | | | | | 南香曲东路证券营业部 | 公司云南分公司 | | 4.00 | 20 ...

"成立该基金，是公司落实外延式发展的诸多路径之一。该基金将结合公司的产业优势，重点关注围绕 晶圆制造需要的关键设备、零部件、材料等方向进行布局；基金的投资地域重点聚焦于中国境内，兼顾 布局全球及投资拥有先进技术、优质产能且有望引进国内的海外优秀标的公司。"神工股份表示，公司 已与管理人国泰君安创新投资及其他合伙人正式签署了合伙协议。截至目前，该基金已完成合伙协议的 签署、收到缴款通知并取得了武汉市江汉区行政审批局颁发的《营业执照》。 展望2025年第四季度以及2026年，神工股份认为当前半导体产业正在"换挡变速"。今年以来，全球科技 巨头对算力中心的单季度资本开支金额，已经从此前的300亿至400亿美元，大幅增加到800亿至1000亿 美元的历史新高，并叠加年底消费电子产业链备料出货需求，因此存储芯片产能出现结构性短缺；中国 本土存储芯片制造厂商发展迅猛，已经在前沿技术和市场份额两方面不断赶超海外竞争对手，改变了既 有的全球产业格局；此外，消费者端侧应用创新正在加速，有望为半导体周期上行带来最根本且持久的 市场驱动力。 公司大直径硅材料的制成品硅零部件，主要应用于存储芯片制造厂的刻蚀环节，开工率越高，使用量越 ...

每经AI快讯，12月17日，神工股份(688233.SH)发布投资者关系活动记录表，公司大直径硅材料的制成 品硅零部件，主要应用于存储芯片制造厂的刻蚀环节，开工率越高，使用量越大。公司认为，半导体产 业周期上行有望带来更多市场需求。公司是上游材料及零部件供应商，如果下游终端存储芯片制造厂的 开工率提升乃至资本开支增加带来新的需求，一般需要约1-2个季度传导到公司。本月初开始，公司已 经与日本、韩国客户接洽新订单。 ...

Core Viewpoint - The company has developed a full range of high-end semiconductor KrF photoresist resin production capabilities and is collaborating with several leading photoresist manufacturers [1] Group 1: Company Capabilities - The company has established the ability to research and produce a complete series of high-end semiconductor KrF photoresist resins [1] - The company is currently in partnership with multiple top-tier photoresist manufacturers [1] Group 2: Market Position - The company does not have direct cooperation with end wafer manufacturers, which limits its access to specific information about end customers in the supply chain [1] - The company plans to continue advancing product validation and market expansion efforts [1]

Core Viewpoint - The IPO journey of Wuxi Chuangda New Materials Co., Ltd. is facing uncertainties due to questions surrounding its prospectus, despite being positioned in the strategically supported semiconductor industry [1][3]. Industry Context - Chuangda New Materials specializes in epoxy molding compounds, essential for semiconductor packaging, benefiting from domestic substitution trends and policy support, yet faces intense competition, particularly in the high-end market dominated by international firms [3]. - The chemical new materials industry is undergoing cyclical adjustments, with previous capacity expansions leading to increased competition and pressure on overall profit margins [3]. Supply Chain Dependencies - The company exhibits dual dependencies in its supply chain, being vulnerable to fluctuations in raw material prices, which significantly impact production costs [4]. - The increase in gross margin in 2023 was largely attributed to a decrease in raw material prices, indicating a reliance on external factors for profitability [4]. - There are concerns regarding related-party transactions with Wuxi Shaohui, which have raised questions about the commercial substance and fairness of pricing, potentially affecting the credibility of the company's business independence [4]. Financial Health and Risks - Chuangda New Materials has a high level of accounts receivable, which consistently accounts for about half of its revenue, indicating weak cash conversion and raising concerns about revenue quality [5]. - The company has significant bad debt provisions related to clients facing operational difficulties, which could impact net profit substantially if realized [5]. - The fluctuation in gross margin from 24.75% in 2022 to 33.05% in mid-2025 raises questions about the sustainability of its growth, especially given the divergence from industry trends [6]. Growth Sustainability - The company's net profit growth rate has slowed from 127.83% in 2023 to 19.15% in 2024, with projections indicating further deceleration into single digits for 2025 [7]. - Chuangda's R&D expenditure has been consistently below industry averages, which may hinder its long-term competitiveness in the rapidly evolving semiconductor materials sector [7]. Governance and Financing Concerns - The company faces governance risks due to concentrated ownership, which may lead to management issues [8]. - There are concerns regarding its financing strategy, as the company has distributed significant cash dividends while planning to raise funds for working capital, raising questions about the necessity and rationale of such actions [8].

正文 在半导体产业攀登工艺巅峰的征程中，光刻胶作为集成电路图形化工艺的核心媒介，其地位堪比精密绘制蓝图的"画笔"。它不仅决定了电路图案能否被高 保真地转印至硅片，其材料本身的每一次革新—— 从早期的DNQ-酚醛树脂体系，到随KrF、ArF光刻技术而生的化学放大光刻胶，直至面向EUV时代的金 属簇光刻胶 ——都直接推动了摩尔定律的延续。 然而，这项精密且关键的产业，长期以来被少数国际巨头在 材料设计、核心树脂及复杂工艺 诀窍上所构建的壁垒所主导。 国产化之路，因而远非简单的产品替代，而是一场贯穿 基础化学、精密工程与供应链安全的系统性攻坚，涉及从分子设计、配方研发、稳定量产到客户 验证 的全链条能力重塑。 报告将系统性地梳理 半导体光刻胶的技术脉络与产业现状 。报告内容主要涵盖四大方面： 首先 ，回顾光刻胶随光刻技术代演进的 发展历程 ，揭示设备、材料与工艺协同发展的规律； 其次 ，深入剖析成熟制程中主流光刻胶（如248nm、193nm化学放大胶及I线胶）的 工作原理与配方核心 ； 再次 ，明确界定评估光刻胶性能的 关键技术指标 ，解读其背后的设计考量； 点击 最 下方 "在看"和" "并分享，"关注"材料汇 ...

Company Overview - Shanghai Tongchuang Purun New Materials Co., Ltd. was established in July 2021 with a registered capital of 287.35 million yuan [2][4] - The company specializes in the research and production of ultra-pure metal materials for chip manufacturing, achieving world-leading levels with materials such as 6N aluminum, 6N tantalum, 7N copper, and 5N manganese [2][4] - As the sole domestic supplier of high-purity materials for Jiangfeng Electronics, the company's jointly developed ultra-pure aluminum, copper, and manganese sputtering targets have entered first-class international chip factories, holding over 40% of the global market share, ranking first in the world [2][4] Financing Situation - The company completed over 2 billion yuan in financing in 2025, including 1 billion yuan in Series B financing in August and 1 billion yuan in Pre-IPO financing in October [6][7] - The Pre-IPO financing round on October 15, 2025, raised 1 billion yuan, with investors including Shanggu Capital [7] - The Series B financing round on August 21, 2025, also raised 1 billion yuan, with notable investors such as SAIC Group and China National Building Material New Materials Fund [7]

Group 1: Company Overview - The company is a leading platform in the field of core innovative materials, focusing on two main business segments: semiconductor materials and general printing consumables [2]. - The semiconductor segment includes CMP process materials, photoresists, and advanced packaging materials, with a leading position in domestic supply for CMP pads and OLED display materials [2]. Group 2: Financial Performance - In the first three quarters of 2025, CMP-related business revenue accounted for over 60% of the semiconductor segment [3]. - The semiconductor business revenue represented 57% of total revenue, while the printing consumables segment provided stable cash flow with revenue of 1.153 billion yuan [5]. Group 3: Research and Development - R&D investment in the first three quarters of 2025 increased by 16%, reaching 389 million yuan, primarily directed towards the semiconductor segment [4]. - The company has achieved significant technological breakthroughs, including the independent development of core materials for high-end photoresists, with a production capacity of 30 tons per year for KrF/ArF photoresists [4]. Group 4: Intellectual Property and Competitive Advantage - As of June 30, 2025, the company holds 1,052 authorized patents, with over 37% being invention patents, establishing a robust patent barrier against competition [6]. - The company emphasizes a comprehensive patent system covering core raw materials, product formulations, production processes, and application solutions [6]. Group 5: Business Strategy and Market Position - The company positions itself as a "platform company," leveraging technology reuse, customer reuse, and industrialization capabilities to enhance new business development [8]. - The core competitive advantage lies in a comprehensive capability built over 20 years, combining full-chain technical ability, industrialization experience, and deep customer relationships [9]. - Future strategies include maintaining R&D investment above industry average, accelerating capacity construction, and enhancing "one-stop" service capabilities to increase market share and profitability [9].

格隆汇12月16日丨中晶科技(003026.SZ)在互动平台表示，公司3-8英寸研磨硅片、抛光硅片及高频高压 半导体芯片及器件产品规格齐全，客户数量多，市场需求稳定。我们会根据客户需要持续研发新品，更 好的满足客户需求。 ...

格隆汇12月15日丨南大光电(300346.SZ)在投资者互动平台表示,公司Arf光刻胶目前没有在建产能。 ...