资金流向方面，主力资金净流入1591.94万元，特大单买入798.24万元，占比2.51%，卖出324.59万元， 占比1.02%；大单买入6344.57万元，占比19.93%，卖出5226.27万元，占比16.42%。 1月9日，崇达技术盘中上涨2.05%，截至10:52，报14.43元/股，成交3.18亿元，换手率2.88%，总市值 175.72亿元。 截至12月20日，崇达技术股东户数7.52万，较上期减少3.66%；人均流通股10339股，较上期增加 3.80%。2025年1月-9月，崇达技术实现营业收入55.93亿元，同比增长22.27%；归母净利润3.14亿元，同 比增长19.58%。 分红方面，崇达技术A股上市后累计派现21.12亿元。近三年，累计派现6.65亿元。 机构持仓方面，截止2025年9月30日，崇达技术十大流通股东中，香港中央结算有限公司位居第二大流 通股东，持股3620.69万股，相比上期增加2924.55万股。南方中证1000ETF（512100）位居第七大流通 股东，持股613.48万股，为新进股东。 责任编辑：小浪快报 崇达技术今年以来股价涨5.64%，近5个交易日涨5.64 ...

美国自身的铜消耗量其实非常有限。按照正常的商业逻辑，库存维持在一个合理的周转水平就够了。但 今年的数据显示，美国囤积的铜库存量竟然占到了全球的近半数。这不是正常的做生意，这完全是一种 战略层面的恐慌性备货。欧洲那边也不遑多让，正忙着满世界抢购铝材。 编辑：[微风] 这背后到底发生了什么？这就要说到最近另一个让人瞩目的信号：2025年12月25日离岸人民币兑美元升 破7.0关口。 最近在国际金融和大宗商品市场上，发生了一件极其诡异甚至有些"反常识"的事情。如果你细心观察过 伦敦金属交易所或者纽约商品交易所的数据，会发现美国这边的铜库存出现了一种恐慌性的囤积现象。 很多人看新闻，第一反应是高兴，觉得这是国力的体现。也有人担心，觉得这会让出口生意变得难做。 但如果我们将美国囤铜的怪象与人民币升值这两件事放在一起来看，就会发现这根本不是简单的市场供 需波动，而是一场惊心动魄的全球定价权争夺战。 这也是为什么说，千万别用过去那种"汇率跌了利于出口、涨了利于进口"的教科书思维来理解当下的局 势。我们正在经历的，是一场精心布局的顶级阳谋。 过去几十年，全球化的分工其实特别简单粗暴。西方国家，特别是美国，占据了金字塔顶端。他 ...

CCL 专家交流会 20251227 电子布各代产品的价格变化及未来预期如何？ 目前主要使用的是 LDK 一代和二代电子布，明年（2026 年）客户将转向量产。 这几种玻璃布从编织角度来看，其产能是可以共用的，因此它们的稀缺程度和 涨价情况基本同步。从去年（2024 年）到现在，落地布价格上涨了约 20%。 预计明年（2026 年）这种涨势将继续维持，每季度可能会有一次涨价，总体 涨幅预计在 20%左右。目前 LDK 一代从 120-130 元上涨至 450 元左右； LDK 二代从 100 多元上涨至接近 150 元；QQ Glass 从 250 元上涨至接近 300 元。 明年的具体涨价时间点及幅度预期如何？ 明年的第一次涨价预计在一季度开始，然后可能在二季度和三季度再分别进行 一次涨价。总体来看，明年的整体涨幅预计在 20%左右。 各种电子布中哪一种更为紧张？未来需求增长情况如何？ 摘要 高端 AI 应用铜箔及树脂供应偏紧，铜箔价格指数持续上涨，主要受限于 高端铜箔供应商数量及国内外树脂产能提升速度。 电子布价格普遍上涨，LDK 一代涨幅显著，预计 2026 年将持续上涨约 20%，Q 布可能因英伟达 ...

热点栏目 自选股 数据中心 行情中心 资金流向 模拟交易 客户端 建滔集团（00148）盘中涨近5%，午后股价上涨3.60%，现报27.66港元，成交额6335.88万港元。 建滔集团（00148）盘中涨近5%，午后股价上涨3.60%，现报27.66港元，成交额6335.88万港元。 据最新市场预测显示，英伟达GB300 AI服务器机柜明年出货量有望达到5.5万台，同比增长129%。更值 得关注的是，下一代Vera Rubin 200平台预计将于明年第四季度开始出货。此前，在10月底的GTC会议 上，黄仁勋首次公开展示了Vera Rubin超级芯片，搭载了一颗代号Vera的CPU和两颗体积庞大的Rubin GPU。在RubinUltra NVL576使用的Kyber架构中，将会应用正交背板技术，在Switchtray、Midplane与 CX9/CPX中，由多层PCB板代替铜缆直接连接。 湘财证券认为，AI大厂和互联网大厂的巨额资本开支计划将推动算力集群持续扩容。在新一代服务器 结构中，PCB对于铜缆的替代，以及PCB材料的升级，将会推动单台服务器PCB价值量大幅提升。据 悉，建滔集团为国内PCB领域的主流供 ...

Core Insights - The PCB industry is experiencing significant growth driven by increased capital expenditure in computing power by major North American companies, leading to a shortage of high-end PCB capacity and a transformation in profitability and market valuation [1] - The demand for PCBs is entering a new phase due to explosive growth in computing power driven by AI, with AI servers requiring PCBs with more than 70 to 100 layers and advanced HDI products [1] - A profound transformation towards "smart manufacturing" is occurring in the industry as traditional production methods struggle to meet the new precision and complexity requirements [1] Industry Trends - The scrap rate for PCB products ranges from 2% to 10%, and as layer counts increase, manufacturing processes become longer, raising demands for yield, energy efficiency, and automation [2] - The concept of "factory sockets and subsystem plugs" proposed by the company represents a modular and scalable design for factory energy and utility systems, aiming for overall energy efficiency optimization [4] Technological Developments - The company has developed a low-code platform named "INOCube-FOS" to address data silos and enhance energy management by ensuring seamless integration of various subsystems [5] - AI is utilized primarily for parameter optimization and decision support in PCB manufacturing, which is characterized by high non-linearity and complex variable coupling [6] Energy Management and Sustainability - The company emphasizes the importance of energy management platforms to accurately assess energy usage, which is essential for calculating carbon emissions [8] - A dual flow integration approach is highlighted, focusing on the unification of energy and information flows to enable precise carbon footprint calculations [9] Competitive Advantages - The company differentiates itself from international giants like Siemens and Schneider by offering highly customized solutions tailored to specific customer needs, which is crucial in the rapidly evolving Chinese manufacturing landscape [11] - The company’s products and platforms have passed multiple certifications for information security, addressing customer concerns about autonomy and safety in industrial software and control systems [11] Market Challenges - The PCB industry is characterized by a high degree of customization and a fragmented customer base, making standardization difficult and leading to a "small batch, multiple varieties" production model [12] - Entering the copper-clad laminate market poses challenges due to high dependency on existing systems by leading companies and strict entry barriers for new suppliers [13]

今日市场在金融、AI软硬件等权重方向轮番做多带动下，全天呈现高开高走行情，创业板指一度涨逾3%。随着今日两市成交额重返2万亿上方。 | 大涨板块 | 251208 (周1) | 251205 (周5) | 251204 (周4) | 251203 (周3) | 25 | | --- | --- | --- | --- | --- | --- | | 1 | 光通信19 | 福建自贸/海西概念16 | 机器人13 | 培育钻石3 | 標 | | 2 | 福建自贸海西概念21 | 航天16 | 航天9 | 煤炭4 | 57 | | 3 | 航天17 | 光通信9 | 国产芯片7 | 矢约6 | A | | ব | DRAM (内存) 5 | 有色会属8 | 福建自贸/海西概念7 | 福建自贸/海西概念9 | 房 | | 5 | 大金融3 | 机器人11 | 矢约3 | 加天8 | | | 6 | 大消费11 | 大消费8 | 大消费4 | 大消费6 | ટ | | T | 机器人9 | 大金融8 | STHE1 | STH56 | 吴 | | 8 | STH54 | STH57 | 股权转让1 | 风电4 | E ...

Group 1 - The global semiconductor market is projected to reach $208 billion by Q3 2025, marking the first time it surpasses the $200 billion threshold, with a quarter-on-quarter growth of 15.8%, the highest quarterly growth rate since 2009 [1] - The demand for computing power driven by the AI wave is significantly increasing the value in segments such as servers, AI chips, optical chips, storage, and PCB boards [1] - The next three years will see "advanced process expansion" as a key focus for self-controlled development, with domestic equipment making progress in breakthroughs and validations in advanced processes [1] Group 2 - CoWoS and HBM technologies are positioned to align with AI industry trends, highlighting the importance of advanced packaging [1] - Storage prices have bottomed out and are beginning to recover, with the testing and packaging sector's utilization rates gradually increasing, benefiting from the advanced packaging demand driven by AI chips [1] - In the consumer electronics sector, 3D printing is accelerating penetration, with applications in foldable device hinges and watch/mobile phone frames expected to create new scenarios [1] Group 3 - The potential for edge AI is significant, with headphones and glasses likely to become important carriers [1] - The reduction in costs for AI training and inference is fostering application prosperity, with AI smartphones indicating a new stage of deep integration between technology and hardware [1] - The semiconductor ETF (512760) tracks the China Semiconductor Index (990001), which covers A-share listed companies in semiconductor materials, equipment, and end applications, reflecting the overall performance of China's semiconductor industry [1]

Group 1 - The core viewpoint is that 3D printing is accelerating its penetration in the consumer electronics sector, with applications in foldable device hinges and watch/mobile phone frames expected to mark a new era [1] - The global semiconductor market is projected to exceed $200 billion for the first time in Q3 2025, with a quarter-on-quarter growth of 15.8%, marking the highest growth rate since 2009 [1] - AI training and inference cost reductions are driving application prosperity, with significant potential in edge AI, particularly through devices like headphones and glasses [1] Group 2 - The next three years will see "advanced process expansion" as a key focus for self-controlled development, with CoWoS and HBM positioning themselves to capitalize on AI industry trends [1] - Storage prices are rebounding from their lows, and the utilization rate in packaging and testing is gradually increasing, benefiting from the advanced packaging demand driven by AI chips [1] - The 信创 ETF (159537) tracks the 国证信创指数 (CN5075), which selects listed companies in the semiconductor, software development, and computer equipment sectors to reflect the overall performance of the information technology innovation theme [1]

Group 1 - The conference focused on the theme of "green chemical recycling, empowering industrial scale landing," aiming to construct a comprehensive solution for the entire industry chain from decommissioning to resource regeneration [1] - The National Development and Reform Commission has set an ambitious goal for 2035, targeting wind and solar installed capacity to exceed six times that of June 2020, highlighting the importance of recycling and utilization of wind turbine blades as a typical representative of emerging industrial waste [1] - The event featured 15 industry experts discussing the current status, environmental impact, and challenges of fiber composite material waste resources, including topics like zero-carbon park construction and recycling technology [2] Group 2 - Zhang Rongqi, Secretary-General of the China Material Recycling Association, presented a report on the regional distribution and disposal application analysis of the projected 2 million tons of wind turbine blade waste by 2035, along with detailed interpretations of various standards [2] - The recycling industry for wind turbine blades and fiber composite materials is still in its early stages, facing challenges in technology, business models, and downstream applications, necessitating a solid technological foundation and the development of high-value applications [2] - There is a need to shift recycled products from low-value to high-value applications to overcome industry bottlenecks and establish a complete industrial system [2]

Core Points - The stock price of Chongda Technology has decreased by 2.01% to 12.69 CNY per share as of November 19, with a total market capitalization of 15.453 billion CNY [1] - Year-to-date, the stock has increased by 25.89%, but has seen declines of 5.79% over the last five trading days, 8.18% over the last twenty days, and 19.79% over the last sixty days [1] - For the period from January to September 2025, Chongda Technology reported a revenue of 5.593 billion CNY, representing a year-on-year growth of 22.27%, and a net profit attributable to shareholders of 314 million CNY, up 19.58% year-on-year [2] Financial Performance - The company has distributed a total of 2.112 billion CNY in dividends since its A-share listing, with 665 million CNY distributed over the last three years [3] - As of September 30, 2025, the top ten circulating shareholders include Hong Kong Central Clearing Limited, which increased its holdings by 29.245 million shares to 36.2069 million shares [3] Market Activity - The net outflow of main funds was 14.2077 million CNY, with large single purchases amounting to 15.3858 million CNY, accounting for 10.44% of total transactions, while sales reached 29.5935 million CNY, making up 20.08% [1] - Chongda Technology has appeared on the "Dragon and Tiger List" twice this year, with the most recent instance on August 21, where it recorded a net buy of -359 million CNY [1] Business Overview - Chongda Technology, established on May 4, 1995, and listed on October 12, 2016, specializes in the design, research and development, production, and sales of printed circuit boards (PCBs) [1] - The revenue composition of the company includes 82.83% from PCBs, 10.52% from waste materials and others, and 6.64% from IC substrates [1] - The company operates within the electronic components industry, specifically in the printed circuit board sector, and is involved in various concept sectors such as automotive electronics, sensors, wireless headphones, robotics, and consumer electronics [1]