Core Viewpoint - TSMC is considering advancing its chip production technology at its second factory in Japan to meet the demand for AI-related products, which may lead to construction delays and design changes [3][4]. Group 1: Factory Development - TSMC's second factory in Kumamoto, Japan, which began construction in late October, is now contemplating a shift to 4nm process technology, moving away from the initially planned 6nm and 7nm chips [3]. - The construction of the Kumamoto factory has reportedly been paused, with heavy machinery cleared from the site by early December [3]. - TSMC has informed suppliers that it will not add equipment to its existing factory in Kumamoto until at least 2026, as demand for 6nm and 7nm chips has decreased [4]. Group 2: Market Demand and Technology Shift - The demand for 6nm and 7nm chips has declined, impacting TSMC's production capacity utilization at its main facility in Taichung, Taiwan [4]. - TSMC has a history of adjusting its construction plans based on market demand, as seen with its facility in Kaohsiung, which shifted from mature processes to advanced 2nm technology [4]. - TSMC is also considering introducing advanced chip packaging technology in Japan, which is crucial for AI chip manufacturing [5]. Group 3: Partnerships and Support - TSMC's projects in Japan are supported by companies such as Sony Semiconductor Solutions, Denso, and Toyota [5].

例如在1998年第一次加入AMD的时候，他参与了K7架构的研发，并成为K8架构的主架构师；在 2004年加入PA Semi出任工程副总裁后，他随着公司被收购加入苹果，与团队一起缔造了苹果芯片 的开山之作Apple A4；2012年重返AMD之后，他还领导了让AMD翻身的Zen架构的研发；2016 年，Jim Keller又加盟了特斯拉，帮助这家电动汽车新贵打开了芯片自研的大门。 总而言之，Jim Keller是芯片行业当之无愧的芯片大神，他在过去研发的芯片也涵盖了Alpha、 X86 、 Arm 和 MIPS 等 知 名 架 构 。 于 是 ， 在 RISC-V 横 空 出 世 之 后 他 就 跃 跃 欲 试 ， 从 一 开 始 投 资 Tenstorrent，到加盟做CTO，再到出任Tenstorrent CEO，Jim Keller希望在新兴架构上再次证明 自己。 在日前于上海举办的Tenstorrent TT Blueprint China技术峰会上，Tenstorrent带来了公司最新的 高性能RISC-V CPU TT-Ascalon，在行业引起了轰动。尤其是在Jim Keller宣布Tenstor ...

2025年12月11日（星期四）下午，由复旦大学微电子学院指导，复旦大学校友总会集成电路 行业分会主办，上海半睿研市场信息咨询有限公司、深圳市坪山区投资推广服务署、深圳市 坪山区城市建设投资有限公司共同承办的 "深圳坪山区产业投资推介会暨复旦大学校友会交 流活动" 将在上海隆重举行。 本次活动以 "坚持自主可控、强化协同创新、推动集群发展" 为主线，聚焦晶圆制造核心生态，围 绕设备、材料、芯片设计、EDA及工业软件等关键环节展开深度研讨。旨在汇聚复旦大学集成电 路领域校友企业家以及全国产业链重点企业代表，共同探讨技术趋势、产业协作与生态构建，为坪 山区打造具有核心竞争力的集成电路产业集群建言献策，推动优质项目精准落地。 活动亮点抢先看： 坪山推介： 坪山作为深圳市委市政府赋予的"东部中心城区、国家高新区核心园区、未来产业试 验区"，现正从昔日的"大工业区"向高质量的"工业大区"和"产业强区"迈进。 主题演讲： 喆塔科技、盛美半导体等企业嘉宾分享前沿洞察； 闭门研讨： 围绕"自主可控的晶圆制造供应链发展趋势"开展高层对话，重点企业高管共同参 与； 会议时间:2025.12.11 会议地点: 张江之尚 (上海市张 ...

Core Insights - Nintendo's stock price dropped 4.7%, reaching its lowest level since May, due to concerns over rising storage chip prices impacting profit margins [3] - The cost of 12GB RAM modules for the Switch 2 has surged by 41%, while NAND flash memory prices have increased by nearly 8%, affecting the pricing of related storage products [3] - The market sentiment towards the Switch 2 is cooling as the supply crisis for storage chips worsens, with Nintendo's market value declining by approximately $14 billion over eight trading days [3] Group 1 - The rising costs of storage components are expected to compress the profit margins of Nintendo's new Switch 2 gaming console, potentially suppressing market demand [3] - The price of a 256GB high-speed SD card on Amazon has reached $89.99, with costs being passed on to consumers, particularly affecting players due to the limited internal storage of the Switch 2 [4] - The unexpected early price drop of the Switch 2, including a $50 discount during Black Friday, raises concerns about its ability to maintain high sales momentum beyond its initial launch [4]

为保护商业机密，台积电制定了严格的内部作业规范，包括通过内部系统追踪员工打开及打印的文件，要求员工报备各自取得的工程技术突破。此 外，公司还会持续监控前员工的专利申请情况，并要求众多员工签署竞业禁止条款。 如果您希望可以时常见面，欢迎标星收藏哦~ 据《纽约时报》报道，台积电此前曾曝出离职员工泄密案，近期又传出前高管罗唯仁疑似 "携核心技术跳槽" 英特尔的消息。专家分析称，台积电 如今 "处境艰难"：一方面被美国视为可倚重的战略龙头企业，另一方面又需维系与英特尔之间合作与竞争并存的关系，而特朗普政府正大力扶持英 特尔，试图将其打造为美国本土新的芯片巨头。 《纽约时报》指出，罗唯仁离职后转投英特尔，这一行为在中国台湾地区当局看来，可能构成危害 "国家安全" 的举动。调查人员已搜查其位于台 北和新竹的住所，查扣电脑与 U 盘等相关物品，法院也对其名下股票及不动产实施了冻结。台积电则已对罗唯仁提起民事诉讼。 与此同时，中国台湾地区检方于 2 日以未能有效防范泄密行为为由，对日本设备大厂东电电子的台湾分公司提起诉讼。这是首例企业因涉嫌窃取半 导体商业机密，被依据"国家安全法"起诉的案件。 尽管英特尔、中国大陆的中芯国际 ...

Group 1 - The core viewpoint of the article highlights India's efforts to attract high-end chip design and manufacturing investments, particularly through a meeting between Prime Minister Narendra Modi and Intel CEO Pat Gelsinger [2] - Modi expressed optimism about deeper collaboration with Intel, emphasizing the importance of India's engineering talent in building a competitive chip ecosystem [2] - Gelsinger acknowledged the Indian government's comprehensive semiconductor design and manufacturing policy, indicating Intel's growing interest in India's semiconductor development roadmap [2] Group 2 - The proposed collaboration includes assessing the feasibility of producing and packaging Intel products at Tata Electronics' upcoming semiconductor manufacturing and OSAT facilities [3] - Both companies plan to explore opportunities to scale AI-enabled personal computers for the Indian market, with expectations that India will rank among the top five global markets by 2030 [3] - The collaboration will leverage Intel's reference designs, Tata Group's electronic manufacturing capabilities, and the distribution network across Tata Group [3]

以下文章来源于矽加半导体 ，作者矽加半导体 碳化硅硬度高、脆性大，传统线切割加工方式存在材料损失大、易断线、表面损伤深等问题， 制约了大尺寸衬底的良率与量产进程。为从源头改善加工质量，矽加推出了激光剥离与减薄自 动化产线， 涵盖晶锭减薄机、激光改质设备、超声波剥离设备、AGV搬运系统，并可与后续研 磨抛光产线无缝衔接，形成完整的"晶锭进—衬底出"闭环制程。 激光技术作为新一代高硬脆材料加工手段，通过精准控制激光在晶锭内部进行改质层扫描，实 现材料"预分离"，从源头降低切削应力与表面损伤。结合超声波精准剥离，该技术可显著改善晶 片内部应力分布，提升衬底可靠性，为8英寸及未来更大尺寸碳化硅衬底制造提供了明确技术路 径。 产线全程采用AGV与自动化控制系统，实现晶片在不同模块间的自主流转与精准定位， 不仅大 幅减少人工干预、降低操作风险，更通过标准化流程保障工艺一致性与产品良率， 积极响应国 家智能制造与产业自动化升级的政策导向。 矽加半导体 . 传承森松匠心精神，融合日本尖端技术，矽加半导体专注提供碳化硅衬底剥离、减薄、抛光全制程解决 方案。 我们以"精磨每一片晶圆，成就每一颗芯片"为使命，依托产学研协同创新，持 ...

Core Viewpoint - SK Hynix is considering issuing American Depositary Receipts (ADRs) for its inventory shares, which could enhance its market value in the U.S. and allow American investors to trade its stock indirectly [2]. Group 1 - SK Hynix announced that it has not yet made a final decision regarding the issuance of ADRs for approximately 2.4% (17,407,800 shares) of its inventory stock [2]. - The company stated that it is exploring various measures to enhance corporate value, including the potential listing of inventory shares in the U.S. stock market [2]. - Analysts suggest that SK Hynix's valuation is currently underestimated compared to its U.S. competitor Micron Technology, indicating that issuing ADRs could boost the company's value in overseas markets [2].

(来源：编译自路透 ) 作为全球两大存储芯片巨头三星电子与 SK 海力士的所在地，韩国在逻辑芯片的设计与制造领域却正奋力追赶。当前该领域的主导者包括台积电， 以及英伟达、高通等企业。 韩国产业通商资源部在一份声明中指出，政府正考虑建设一座12 英寸、40 纳米制程的晶圆代工厂，为本土无晶圆设计企业提供成熟制程芯片的研 发与测试支持。这类芯片广泛应用于汽车、数据中心等多个领域。 声明称，韩国政府将与三星电子、DB HiTek等本土晶圆代工厂商展开磋商，推进该项目的落地实施，资金来源将采用 "公私合营" 模式。 韩国产业部长官金宗埙指出："我们正面临严峻的危机与挑战。半导体行业的竞争早已从企业间的博弈，升级为国家层面的较量。" 他还提到，中 国、美国、欧洲及日本均在大力扶持本土芯片产业，竞争日趋白热化。 声明还透露，鉴于韩国国防领域99% 的半导体依赖进口，政府计划推动国防专用芯片的本土化生产。此外，韩国政府拟在相关法律中增设条款，规 定国家安全基础设施建设需优先采购本土半导体产品。根据声明，韩国将在总统直属框架下成立半导体特别委员会，作为国家芯片政策的统筹协调 与决策中枢。 如果您希望可以时常见面，欢迎标星收藏 ...

Core Viewpoint - Kiwoom Securities predicts that Samsung Electronics' high bandwidth memory (HBM) shipments will triple next year compared to this year, maintaining a "buy" rating with a target price of 140,000 KRW [2] Group 1: HBM Market Outlook - HBM sales for major ASIC chips are expected to significantly increase in Q1 2025, with mass production of HBM4 for Nvidia's Rubin platform starting in Q2 [2] - Samsung's HBM business revenue is projected to reach 26.5 trillion KRW next year, representing a 197% year-on-year growth [2] - If competitors face delays in HBM4 supply, Samsung's revenue could see further upside [2] Group 2: New Customers and Market Expansion - Meta is expected to become a new HBM customer by transitioning from LPDDR5 to HBM3e with the release of MTIA v3 next year [3] - Amazon is anticipated to steadily increase its HBM usage in 2025 based on this year's figures [3] - Samsung's stock price is expected to benefit from rising general DRAM prices and increased HBM shipment forecasts, leading to a continued upward trend [3] Group 3: Competitive Positioning - Samsung's valuation is noted to be the lowest among the three major DRAM manufacturers, which could drive differentiated stock price increases due to the aforementioned factors [3]