Core Viewpoint - Longji Technology's stock price has shown a positive trend recently, with a year-to-date increase of 6.66% and a 7.13% rise over the past five trading days, indicating strong market interest and potential growth in the semiconductor industry [1]. Financial Performance - For the period from January to September 2025, Longji Technology achieved a revenue of 28.669 billion yuan, representing a year-on-year growth of 14.78%. However, the net profit attributable to shareholders decreased by 11.39% to 0.954 billion yuan [2]. - Cumulatively, since its A-share listing, Longji Technology has distributed a total of 1.533 billion yuan in dividends, with 0.805 billion yuan distributed over the past three years [3]. Shareholder Structure - As of September 30, 2025, the number of shareholders for Longji Technology reached 376,300, an increase of 17.94% from the previous period. The average number of circulating shares per shareholder decreased by 15.21% to 4,755 shares [2]. - The top ten circulating shareholders include significant institutional investors, with Hong Kong Central Clearing Limited holding 52.8334 million shares, a decrease of 48.3210 million shares from the previous period [3].

Core Insights - The article discusses the rising costs associated with advanced semiconductor processes, highlighting that the transition from planar FET to FinFET and Nanosheet technologies has led to exponential increases in design and manufacturing costs, making it difficult for small and medium enterprises to invest in advanced processes [8][9]. - The industry is shifting towards higher concentration among leading foundries, while advanced packaging technologies allow smaller companies to participate in high-end chip design without relying on advanced processes [9][11]. - The article emphasizes the importance of heterogeneous integration and the need for tailored architectures based on application scenarios, indicating a trend towards dynamic adjustments in advanced packaging strategies [25][56]. Cost Trends - Design costs have surged from $28 million for 65nm processes to $725 million for 2nm processes, with manufacturing investments also increasing significantly [9]. - The investment required for a 5nm factory is five times that of a 20nm factory, indicating a substantial financial barrier for smaller players in the industry [8]. Architectural Comparisons - The article compares four architectures, noting that smaller systems (like mobile chips) benefit from a "large chip + 3D stacking" approach, while larger systems (like AI servers) favor a "chiplet + 3D stacking" strategy to balance performance and cost [16][24]. - As system complexity increases, the advantages of chiplet-based designs become more pronounced, particularly in terms of cost efficiency [17][23]. Advanced Packaging Technologies - Advanced packaging is evolving to meet the demands of AI and high-performance computing, with technologies like 2.5D and 3D packaging becoming standard for high-end chips [36][72]. - The integration of HBM (High Bandwidth Memory) with 2.5D packaging has become a standard, driven by the need for high memory bandwidth in AI applications [29][36]. Interconnect Technologies - The article highlights the critical role of interconnect technologies in enhancing I/O density, with projections showing a significant increase in interconnect density from 1960s levels of 2/mm² to future levels of 131072/mm² [38]. - Advanced packaging is shifting from being a secondary process to a core component of performance enhancement, with interconnect-related technologies expected to yield higher profit margins than traditional packaging [39][42]. Market Dynamics - The article notes that the demand for advanced packaging is driven by the need for high bandwidth, miniaturization, and low power consumption, particularly in edge AI applications [49][50]. - The automotive sector's transition from distributed ECUs to centralized computing is pushing for higher integration levels, which in turn drives advancements in packaging technologies [53][56]. Technology Evolution - The evolution of packaging technologies is characterized by a shift from single technology optimization to system-level engineering design, necessitating cross-domain integration capabilities [68][70]. - The article outlines a clear roadmap for the evolution of interconnect technologies, indicating that the industry is entering a phase of rapid technological iteration driven by market demands [154][165]. Cost Structure - The cost structure for 2.5D packaging is primarily driven by the interposer (Si/mold/silicon bridge) and packaging substrate, while for 3D packaging, the key cost factor is the bonding process [168][169]. - The differences in cost structures dictate the profitability models for companies, with 2.5D packaging firms needing to manage interposer and substrate costs, while 3D packaging firms focus on optimizing bonding yields and efficiency [169].

Core Viewpoint - Changdian Technology has launched a new round of equity incentive plans, reflecting its confidence in development and aiming to enhance team cohesion and talent stability [1] Group 1: Incentive Plan - The incentive plan is expected to establish and improve the company's long-term incentive mechanism [1] - It aims to strengthen team cohesion and stabilize the talent pool [1] Group 2: Focus Areas - The company focuses on key application areas such as high computing power, AI edge, and automotive sectors [1] - It possesses industry-leading advanced semiconductor packaging technology [1] Group 3: Financial Outlook - With cost reduction and efficiency enhancement measures being solidified, production capacity is gradually being released [1] - The proportion of high-end products is expected to increase, leading to potential profit elasticity in the future [1] Group 4: Market Demand - There is strong demand for advanced packaging in downstream applications like AI computing and automotive [1] - The company continues to invest in technology and expand capacity in the advanced packaging field [1] - The rating of "buy" is maintained based on these factors [1]

Group 1 - The A-share market saw a collective rise on January 6, with the Shanghai Composite Index increasing by 0.73%, driven by gains in precious metals, brokerage, and basic metals sectors [1] - The chip technology sector continued to strengthen, with the chip ETF (159995) rising by 2.43% as of 10:04 AM, and notable increases in constituent stocks such as Huahai Qingke (+7.88%), Zhongwei Company (+6.80%), and others [1] Group 2 - Changxin announced plans to raise 29.5 billion, allocating 7.5 billion for upgrading the manufacturing line for memory chips, 13 billion for DRAM technology upgrades, and 9 billion for R&D in dynamic random-access memory [3] - SMIC plans to issue 547 million shares at 74.20 yuan per share to acquire a 49% stake in SMIC North, while Huahong Semiconductor intends to issue 191 million shares at 43.34 yuan per share to acquire a 97.4988% stake in Huali Micro [3] - According to Zhongshan Securities, the AI-related industry is expected to maintain a favorable outlook through 2026, with domestic semiconductor opportunities arising from accelerated localization [3] - Predictions indicate that capital expenditure by cloud computing giants may sustain over 40% growth by 2026, with the AI sector remaining robust [3] - The chip ETF (159995) tracks the National Chip Index, comprising 30 leading companies in the A-share chip industry, including SMIC, Cambricon, Changdian Technology, and Northern Huachuang [3]

从资金流向上来看，当日半导体板块主力资金净流入55.41亿元，游资资金净流出48.99亿元，散户资金净 流出6.42亿元。半导体板块个股资金流向见下表： | 代码 | 名称 | 主力净流入(元) | | 主力净占比 游资净流入 (元) | | 游资净占比 散户净流入 (元) | | 散户净占比 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 603986 兆易创新 | | | 16.521Z | 14.29% | -11.58亿 | -10.01% | -4.95 Z | -4.28% | | 688981 中芯国际 | | | 9.97亿 | 8.49% | -5.96 Z | -5.07% | -4.01亿 | -3.41% | | 605358 | 立昂微 | | 3.84(Z | 19.83% | -1.14亿 | -5.88% | -2.70 Z | -13.95% | | 688008 澜起科技 | | | 3.82 Z | 5.70% | -3.05亿 | -4.55% | -7673.36万 | -1.15% | | 68 ...

每经AI快讯，华源证券1月5日发布研报称，给予长电科技（600584.SH）"增持"评级。评级理由主要包 括：1）完善长期激励机制，绑定核心骨干；2）激励目标覆盖多项经营指标，彰显长期良性发展信心； 3）聚焦高成长领域，加速先进封装产能布局。风险提示：半导体周期波动的风险；贸易摩擦的风险； 汇率波动的风险等。 （记者 曾健辉） 每日经济新闻 免责声明：本文内容与数据仅供参考，不构成投资建议，使用前请核实。据此操作，风险自担。 每经头条（nbdtoutiao）——秒光！1499元飞天茅台上线即空，i茅台App冲上苹果购物榜第一，10万用 户已下单！经销商同价做回馈，1000箱很快卖完 ...

证券研究报告 电子 | 半导体 非金融|公司点评报告 hyzqdatemark 2026 年 01 月 05 日 证券分析师 葛星甫 SAC：S1350524120001 gexingfu@huayuanstock.com 熊宇翔 xiongyuxiang@huayuanstock.com | 基本数据 | | | | 2025 | 年 | 12 月 | | 日 | 31 | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 收盘价（元） | | | | | | | 36.78 | | | | | | 一 年 最 低 | 最 | 高 | / | | | | | | | 内 | 47.60/28.90 | | （元） | | | | | | | | | | | | | 总市值（百万元） | | | | | | | | | | | 65,814.67 | | 流通市值（百万元） | | | | | | | | | | | 65,814.67 | | 总股本（百万股） | | | | | | | | | | ...

风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 1月5日，芯片ETF广发（159801）开盘涨1.17%，报0.867元。芯片ETF广发（159801）重仓股方面，寒 武纪开盘涨1.43%，中芯国际涨3.26%，海光信息涨1.38%，北方华创涨1.94%，澜起科技涨1.44%，兆易 创新涨3.30%，中微公司涨1.94%，豪威集团涨0.37%，长电科技涨1.14%。 芯片ETF广发（159801）业绩比较基准为同期国证半导体芯片指数收益率，管理人为广发基金管理有限 公司，基金经理为曹世宇，成立（2020-01-20）以来回报为71.26%，近一个月回报为3.95%。 来源：新浪基金∞工作室 ...

Group 1 - The A-share market saw a collective rise in the three major indices on January 5, with the Shanghai Composite Index increasing by 0.64%. The insurance, semiconductor, and healthcare sectors led the gains, while oil and gas, as well as highways, experienced declines [1] - The semiconductor ETF (159995) rose by 3.52%, with notable increases in component stocks such as Zhongwei Company (up 11.48%), Zhaoyi Innovation (up 7.99%), Beijing Junzheng (up 6.31%), Lanke Technology (up 6.01%), and Huahai Qingke (up 5.60%) [1] Group 2 - Driven by strong demand for AI, storage chip prices are expected to surge by 1800% for DDR4 16Gb, 500% for DDR5 16Gb, and 300% for 512Gb NAND flash by 2025 [3] - Guojin Securities forecasts that the global supply of storage chips will remain insufficient in 2026, leading to continued price increases. The expected growth in DRAM bit supply is around 15% to 20%, while demand growth is projected to reach 20% to 25% [3] - The semiconductor ETF (159995) tracks the Guozheng Semiconductor Index, which includes 30 leading companies in the A-share semiconductor industry across materials, equipment, design, manufacturing, packaging, and testing, such as SMIC, Cambricon, Changdian Technology, and Northern Huachuang [3]

公司层面考核指标聚焦盈利能力、成长质量与运营效率：2026-2028年，净资产现金回报率（EOE）需 分别不低于20.3%、20.4%、20.5%，且不低于对标企业75分位值或同行业平均水平；较2024年利润总额 复合增长率均不低于10%，并满足同期对标要求；应收账款周转率分别不低于7.25、7.30、7.35，同时 每年需完成上级单位下发的研发创新相关任务。 南方财经1月5日电，长电科技（600584.SH）2026年1月4日披露2025年股票期权激励计划，拟向不超过 580名核心员工授予1,789.41万份股票期权，约占公司总股本的1%。激励对象包括董事、高级管理人 员、中层管理人员及核心技术业务骨干，旨在建立长效激励机制，吸引和留住人才。该激励计划有效期 最长不超过60个月，行权价格为每股36.89元。 ...