Core Viewpoint - The demand for high bandwidth memory (HBM) driven by artificial intelligence and high-performance computing continues to rise, leading to active performance in the HBM sector on the secondary market. Company Summaries - **Unisoc (紫光国微)**: Latest stock price is 86.69 CNY with a daily increase of +10.00%. The company's HBM products are in the sample system integration verification stage [1] - **Chipone (芯源微)**: Latest stock price is 209.09 CNY with a daily increase of +10.63%. The company has received high recognition from downstream customers in the HBM and 2.5D/3D packaging fields, with multiple products in mass production [2] - **Zhongke Feimeng (中科飞测)**: Latest stock price is 196.98 CNY with a daily increase of +9.20%. The company's graphic wafer defect detection equipment and 3D morphology measurement equipment have passed verification from multiple domestic HBM customers, achieving mass shipments [3] - **Yake Technology (雅克科技)**: Latest stock price is 92.68 CNY with a daily increase of +6.63%. The company's subsidiary UP Chemical is a core supplier of precursors for SK Hynix, supplying materials needed for HBM [4] - **JCET (长电科技)**: Latest stock price is 43.99 CNY with a daily increase of +4.79%. The company has launched the XDFOI high-performance packaging technology platform, which supports advanced packaging requirements for HBM [5] - **Shannon Microelectronics (香农芯创)**: Latest stock price is 170.53 CNY with a daily increase of +4.29%. The company is one of the distributors for SK Hynix and holds agency qualifications for HBM products, positioned in the core supply chain of the industry [6] - **Semei Shanghai (盛美上海)**: Latest stock price is 204.77 CNY with a daily increase of +5.23%. The company’s wet processing equipment and copper plating equipment can be used in HBM manufacturing processes, and related packaging equipment can be used for its 2.5D packaging technology [7] - **Lianrui New Materials (联瑞新材)**: Latest stock price is 64.65 CNY with a daily increase of +6.74%. The company supplies packaging materials for HBM, including ball silicon and Lowα ball aluminum used in GMC (granular epoxy molding compound) [8] - **Feikai Materials (飞凯材料)**: Latest stock price is 26.19 CNY with a daily increase of +6.94%. The company produces and sells epoxy molding compounds (EMC), which are key materials required for HBM storage chip manufacturing [9]

Core Viewpoint - The storage chip sector has shown a significant increase, with a rise of 2.33%, ranking third among concept sectors, indicating strong market interest and investment potential in this area [1][2]. Market Performance - As of January 15, the storage chip concept saw 118 stocks increase, with notable performers including Blue Arrow Electronics and Silicon Power, both reaching a 20% limit up. Other significant gainers included Kangqiang Electronics (up 10.03%) and Shanghai Xinyang (up 16.60%) [1]. - The concept sector's performance was highlighted by a net inflow of 8.839 billion yuan from main funds, with 102 stocks receiving net inflows, and 36 stocks exceeding 100 million yuan in net inflows [2]. Fund Flow Analysis - The leading stocks in terms of net fund inflow included Jiangbolong with 909 million yuan, followed by Changdian Technology and Nanda Optoelectronics with 721 million yuan and 630 million yuan respectively [2]. - The net inflow ratios for top stocks were led by Kangqiang Electronics at 30.40%, followed by Sanfu Co. at 17.38% and Unisplendour at 16.64% [3]. Top Performing Stocks - Key stocks in the storage chip sector included: - Jiangbolong (up 9.39%) with a turnover rate of 9.05% and a main fund flow of 908.61 million yuan [4]. - Changdian Technology (up 4.79%) with a turnover rate of 7.00% and a main fund flow of 720.79 million yuan [4]. - Nanda Optoelectronics (up 10.15%) with a turnover rate of 23.70% and a main fund flow of 630.59 million yuan [4]. Sector Comparison - The storage chip sector's performance was compared to other sectors, with notable gains in photolithography (up 2.83%) and SMIC International concept (up 2.59%), while sectors like Xiaohongshu concept and Pinduoduo concept saw declines of 5.25% and 4.03% respectively [2].

截至1月15日收盘，国家大基金持股概念上涨2.30%，位居概念板块涨幅第4，板块内，33股上涨，南大 光电、江波龙、中科飞测等涨幅居前，分别上涨10.15%、9.39%、9.20%。跌幅居前的有盛科通信、北 斗星通、机器人等，分别下跌7.11%、3.50%、2.53%。 国家大基金持股概念资金流入榜 | 代码 | 简称 | 今日涨跌幅 | 今日换手率 | 主力资金流量（万 | 主力资金净流入比率 | | --- | --- | --- | --- | --- | --- | | | | （%） | （%） | 元） | （%） | | 301308 | 江波龙 | 9.39 | 9.05 | 90860.73 | 12.31 | | 600584 | 长电科 技 | 4.79 | 7.00 | 72079.13 | 13.37 | | 300346 | 南大光 电 | 10.15 | 23.70 | 63058.93 | 6.71 | | 002371 | 北方华 创 | 2.72 | 1.73 | 48827.43 | 7.91 | | 688012 | 中微公 司 | 5.28 | 2.84 | 4462 ...

证券之星消息，1月15日半导体板块较上一交易日上涨1.74%，蓝箭电子领涨。当日上证指数报收于 4112.6，下跌0.33%。深证成指报收于14306.73，上涨0.41%。半导体板块个股涨跌见下表： 从资金流向上来看，当日半导体板块主力资金净流入54.81亿元，游资资金净流出22.98亿元，散户资金净 流出31.84亿元。半导体板块个股资金流向见下表： | 代码 | 名称 | 主力净流入 (元) | | 主力净占比 游资净流入 (元) | | 游资净占比 散户净流入 (元) | | 散户净占比 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 301308 | 江波龙 | | 9.31 G | 12.61% | -5.18 Z | -7.02% | -4.13 Z | -5.59% | | 600584 | 长电科技 | | 6.97 Z | 12.92% | -2.09亿 | -3.88% | -4.87 Z | -9.04% | | 002371 | 北方华创 | | 5.01 亿 | 8.12% | -5.00 亿 | -8.10% ...

数据显示，博时基金旗下1只基金重仓长电科技。博时国证消费电子主题指数发起式A（020983）三季 度增持4.39万股，持有股数6.5万股，占基金净值比例为2.58%，位居第十大重仓股。根据测算，今日浮 盈赚取约13.91万元。 博时国证消费电子主题指数发起式A（020983）成立日期2024年4月23日，最新规模3319.74万。今年以 来收益4.98%，同类排名2593/5525；近一年收益42.02%，同类排名1765/4208；成立以来收益79.27%。 博时国证消费电子主题指数发起式A（020983）基金经理为李庆阳。 截至发稿，李庆阳累计任职时间1年349天，现任基金资产总规模115.88亿元，任职期间最佳基金回报 170.45%， 任职期间最差基金回报-1.28%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 1月15日，长电科技涨5.1%，截至发稿，报44.12元/股，成交40.00亿元，换手率5.23%，总市值789.49亿 元。 资料显示，江苏长电科 ...

Group 1 - The global memory market is entering a "super cycle," with price increases spreading to downstream packaging and testing segments due to rising demand for advanced packaging, increased raw material costs, and tight capacity [1] - Major companies in the memory packaging and testing sector are operating at full capacity, with Taiwanese firms raising prices and A-share listed companies reporting full production status [1] - Companies like Shenzhen Changcheng Development Technology Co., Ltd. and Jiangsu Changdian Technology Co., Ltd. are experiencing significant growth in their memory-related packaging and testing businesses, with revenue in related sectors increasing by nearly 70% year-on-year [1] Group 2 - As traditional chip processes face physical limits, advanced packaging and testing technologies are becoming crucial for enhancing chip performance, prompting A-share listed companies to actively invest in these technologies [2] - Jiangsu Changdian Technology Co., Ltd. plans to increase R&D investment in advanced packaging technologies to align with the growing demand [2] - Shenzhen Baiwei Storage Technology Co., Ltd. offers integrated solutions for storage and wafer-level advanced packaging, aiming to create significant value in the AI era [2] Group 3 - Chinese companies in the memory packaging and testing sector are enhancing their competitiveness through R&D innovation and capacity expansion, with expectations of increasing market share in the future [3]

Group 1: Core Business and Technology - Changdian Technology is the largest OSAT manufacturer in mainland China, possessing advanced and comprehensive chip packaging technologies, including wafer-level packaging, 2.5D/3D packaging, system-in-package, flip-chip packaging, wire bonding packaging, and mainstream advanced packaging solutions [1] - The company is accelerating its transformation and optimizing its product structure, with a focus on high-end manufacturing projects in wafer-level packaging, which is expected to gradually improve gross margins and profitability [1] - The company has launched the XDFOI? chiplet high-density multi-dimensional heterogeneous integration series process, which has entered mass production and is applied in high-performance computing, artificial intelligence, 5G, and automotive electronics [1] Group 2: Automotive Sector - The company's product types cover various applications in the automotive sector, including smart cockpits, intelligent networking, ADAS, sensors, and power devices [2] - Changdian Technology is strengthening its industrial ecosystem partnerships and enhancing its one-stop service capabilities, while deepening cooperation with leading domestic and international clients [2] - The company is building an automated production facility for automotive electronics in Shanghai, which is expected to achieve full-process automation from chip packaging to finished product testing by December 2025 [2] Group 3: Memory Sector - The company has over 20 years of experience in memory packaging and is a leader in high-density 3D packaging and control chip testing [3] - The acquisition of Shengdie Semiconductor, a major flash memory packaging and testing factory, enhances the company's capabilities and market share in the enterprise SSD high-end market [3] - The company is focusing on the development of high-density storage products, leveraging synergies across multiple factories [3] Group 4: Financial Projections - Revenue projections for Changdian Technology are estimated to be 40.256 billion, 44.286 billion, and 48.420 billion yuan for the years 2025, 2026, and 2027, respectively, with net profits of 1.642 billion, 2.007 billion, and 2.424 billion yuan [3]

Core Insights - The demand for storage chips is surging due to the explosion of AI computing power, leading to tight supply and significant price increases [1][3] - Analysts predict that the price of storage chips will continue to rise in the first and second quarters of this year, with a potential increase of 40% to 50% by Q1 2026 and an additional 20% in Q2 2026 [2][3] Price Trends - The storage market has surpassed historical highs, with suppliers enjoying unprecedented bargaining power [2] - For example, the price of a single 256G DDR5 server memory module has exceeded 40,000 yuan, and a box of 100 modules has surpassed the price of some properties in Shanghai [2] - Prices for notebook memory modules have also seen significant increases, with Samsung's 16G DDR5 memory rising from over 380 yuan in September 2025 to 1,399 yuan by the time of reporting [2] AI Demand as a Driving Force - The core driver of rising storage chip prices is the explosive demand from AI applications, with over 15% of the global population using AI, leading to a massive surge in computing and model training needs [3] - Supply growth for storage chips is expected to be limited, with only a 7% to 8% increase projected for 2026 [3] - Major memory suppliers have announced that their AI server storage chip products for 2026 are already sold out, indicating a focus on high-bandwidth memory (HBM) and DRAM, which will restrict supply for consumer electronics [3] Capacity Expansion Efforts - Storage manufacturers have begun increasing capital expenditures to enhance production capacity through new facilities and equipment upgrades [4] - However, the construction and ramp-up of new production lines will take time, with supply relief not expected until the second half of 2027 [4] - Domestic manufacturers are actively expanding capacity and investing in high-end storage technology, which may increase their market share [4] Company Initiatives - Several companies are announcing plans to expand production and invest in research and development [4][5] - For instance, Tianshan Electronics is strategically investing in a vertical integration model for storage chip development and manufacturing [4] - Tongfu Microelectronics plans to raise up to 4.4 billion yuan for projects, including 800 million yuan for enhancing storage chip testing capacity, which will help expand production scale and optimize product structure [5] - Longxin Technology has submitted an IPO application to raise 29.5 billion yuan, with significant funds allocated for technology upgrades in DRAM manufacturing [5]

Core Viewpoint - The Chip Leader ETF (516640) opened with a slight decline of 0.08%, indicating a mixed performance in the semiconductor sector [1] Group 1: ETF Performance - The Chip Leader ETF (516640) opened at 1.188 yuan [1] - Since its establishment on August 19, 2021, the fund has achieved a return of 19.13% [1] - The fund's return over the past month is reported at 13.34% [1] Group 2: Major Holdings Performance - Major holdings in the ETF include: - SMIC: down 0.13% [1] - Cambricon: down 1.65% [1] - Haiguang Information: unchanged [1] - Northern Huachuang: down 0.37% [1] - Lattice Semiconductor: unchanged [1] - Zhaoyi Innovation: up 1.59% [1] - Zhongwei Company: down 1.20% [1] - OmniVision: up 0.19% [1] - Chipone: up 0.23% [1] - Changdian Technology: down 0.41% [1]

Summary of Conference Call on Advanced Packaging Industry Industry Overview - The advanced packaging industry is experiencing price increases due to rising costs of upstream precious metals, commodities, and substrate prices, leading to gradual increases in packaging prices [1][2] - Domestic packaging companies are also facing similar cost pressures, with many manufacturers operating at near full capacity, indicating a positive outlook for Q1 2026 [1][3] Key Insights - **Demand Growth**: Strong demand for AI and high-performance computing (HPC) is driving an increase in packaging orders, with prices at ASE rising by 5% to 20%, exceeding previous expectations of 5% to 10% [2] - **Capacity Utilization**: ASE's capacity utilization is over 90%, with a focus on optimizing product mix to prioritize high-margin products [2] - **Market Potential**: Advanced packaging has significant growth potential in AI chip and HBM manufacturing, with the value of advanced packaging in AI chips approaching manufacturing costs [1][5] Market Growth Projections - The global multi-chip integration packaging market is expected to grow from 58.9 billion yuan in 2024 to 185.9 billion yuan by 2029, with a CAGR of 25.8% [8] - The Chinese market is projected to grow from 2.89 billion yuan to 17.68 billion yuan, with a CAGR of 43.7% [8] Company Developments - Major domestic packaging companies such as JCET, Tongfu Microelectronics, and Huatian Technology are actively expanding capacity through advanced manufacturing projects [3][6] - JCET's high-density fan-out packaging project is set to increase capacity by 24,000 pieces per year, with a total investment of nearly 10 billion yuan [6] - Tongfu Microelectronics is progressing with its 2.5D and 3D equipment injection project, while Huatian Technology is investing 2 billion yuan to establish a new advanced packaging company [6] Financial Performance - Shenghe Microelectronics reported a revenue of 3.17 billion yuan for the first half of 2025, with significant contributions from multi-chip integration [10] - The company has a utilization rate of approximately 63%, indicating room for growth [10][11] Future Outlook - The advanced packaging industry is expected to thrive, driven by increasing orders from AI chip design companies and the upcoming IPO of Shenghe Microelectronics, which could enhance market interest [12] - The introduction of advanced technologies such as bonding, TSV, and RDL is expected to increase the value of equipment and materials, with a shift towards higher density I/O interfaces [12][13] - The demand for packaging is anticipated to rise sharply due to the growing number of AI chips, while the complexity of processes and rising costs will elevate the packaging value per chip [13] Investment Opportunities - Companies such as JCET, Tongfu Microelectronics, and Huatian Technology are recommended for investment, along with upstream supply chain opportunities [12] - The need for domestic alternatives in core equipment and materials, currently dominated by foreign suppliers, presents significant investment potential [13]