根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民共和国 证券法》（以下简称"《证券法》"）、《上市公司股权激励管理办法》（以下简称"《管 理办法》"）、《国有控股上市公司（境内）实施股权试行办法》（以下简称"《试行 办法》"）等有关法律、法规和规范性文件和《公司章程》的规定，深南电路股份 有限公司（以下简称"公司"）第四届董事会薪酬与考核委员会就公司 A 股限制 性股票激励计划（第二期）（以下简称"本激励计划"）相关事项发表审核意见如 下： 1、未发现公司存在《公司法》、《证券法》、《管理办法》、《试行办法》等法 律、法规和规范性文件规定的禁止实施限制性股票激励计划的情形，公司具备实 施限制性股票激励计划的主体资格。 2、本激励计划所确定的激励对象均符合《公司法》、《证券法》、《管理办法》、 《试行办法》等法律、法规及规范性文件及《公司章程》有关任职资格的规定， 亦符合公司业务发展的实际需要，激励对象的主体资格合法、有效。 3、公司 A 股限制性股票激励计划（第二期）（草案）及其摘要的内容符合 《公司法》、《证券法》、《管理办法》、《试行办法》等法律、法规及规范性文件的 规定，对各激励对象限 ...

Group 1 - A total of 433 companies were investigated by institutions in the past 10 days, with 381 being securities firms and 302 being fund companies [1] - 88 listed companies were researched by overseas institutions, with 8 companies receiving attention from more than 20 overseas institutions, including Huichuan Technology, which was investigated by 68 overseas institutions [1] - Lixun Precision was the second most researched company, with 48 overseas institutions participating in the investigation, indicating significant growth potential in the non-overseas consumer electronics market over the next decade [1] Group 2 - Stocks that were investigated by overseas institutions saw an average increase of 0.36% in the past 10 days, with Shenghui Integration experiencing the highest increase of 32.47% [3] - 13 stocks received ratings from at least 15 institutions, with a consensus forecast of over 20% profit growth in 2025, including Kaiying Network, Lixun Precision, and Huichuan Technology [3] - Jinli Permanent Magnet is predicted to have the highest profit growth, with 18 institutions forecasting a net profit increase of 152.52% in 2025 [3][4]

Core Viewpoint - The company, Shenzhen Circuit, reported a broad and diverse range of products in its packaging substrate business, indicating growth in demand across various downstream sectors, particularly in storage packaging substrates [1] Group 1: Business Overview - The packaging substrate products include module packaging substrates, storage packaging substrates, and application processor chip packaging substrates [1] - These products are primarily used in mobile smart terminals, servers, and storage fields [1] Group 2: Financial Performance - In the third quarter of 2025, the revenue from packaging substrates increased sequentially, with notable growth in demand across all downstream sectors [1] - The most significant growth was observed in the storage packaging substrate segment [1]

Core Viewpoint - The company, Shenzhen Sunnan Circuit (002916), reported a diverse range of packaging substrate products during an institutional survey, indicating growth in demand across various downstream sectors, particularly in storage packaging substrates [1] Group 1: Business Overview - The company's packaging substrate business includes a wide variety of products such as module packaging substrates, storage packaging substrates, and application processor chip packaging substrates [1] - These products are primarily used in mobile smart terminals, servers, and storage fields [1] Group 2: Financial Performance - In the third quarter of 2025, the revenue from packaging substrates is expected to increase quarter-on-quarter, with notable growth in demand across all downstream sectors [1] - The most significant growth is anticipated in the storage packaging substrate segment [1]

Financial Performance - In Q3 2025, the company achieved a revenue of 9.66 billion CNY, representing a year-on-year increase of 92.87%. The net profit attributable to shareholders reached 9.16 billion CNY, up 94.16% year-on-year [1] - The improvement in financial performance is attributed to the company's focus on opportunities in AI upgrades, structural growth in the storage market, and the demand for automotive electronics [1] Gross Margin and Profitability - The overall gross margin showed improvement in Q3 2025, driven by increased demand for storage packaging substrates and enhanced capacity utilization in the Guangzhou factory [2] - The PCB data center and wired communication business revenues continued to grow, contributing to a slight increase in gross margins [2] Business Expansion - The PCB business is primarily focused on communication equipment, with key expansions in data centers (including servers) and automotive electronics, maintaining consistent revenue contributions from various sectors [3] - The packaging substrate business saw a revenue increase in Q3 2025, with significant growth in storage packaging substrates [4] Capacity Utilization - The overall capacity utilization rate remained high in Q3 2025, with notable increases in the packaging substrate business due to rising demand in the storage market [5] - The company has factories in Shenzhen, Wuxi, Nantong, and Thailand, with new capacity coming from both new factories and upgrades to existing facilities [6] AI and Technology Development - The PCB business is adapting to the growing demand for high-performance products driven by advancements in AI technology, focusing on high-speed networks and large-scale PCB products [7] Raw Material Prices - In Q3 2025, the prices of key raw materials such as gold salt and copper increased due to fluctuations in commodity prices, prompting the company to monitor market conditions closely [8] Future Planning - The new land in Wuxi is designated for the storage of products related to the PCB business, with investments planned based on market developments [8]

Summary of Shengyi Technology Conference Call Company Overview - **Company**: Shengyi Technology (600183.SS) - **Industry**: Copper Clad Laminate (CCL) manufacturing - **Headquarters**: Dongguan, China - **Key Markets**: Consumer electronics, communication, automotive, and data center markets - **Revenue Breakdown**: CCL business accounted for 68% of total revenues in 1H25, followed by PCB business at 29% [3][4] Key Points Discussed 1. 2026 Outlook - **CCL Pricing**: The company raised CCL pricing in October due to higher raw material costs and supply constraints - **Demand Forecast**: Management is optimistic about rising CCL demand from data center clients in 2026, despite pressures from ongoing raw material price increases - **Market Stability**: Demand from consumer electronics and automotive markets has remained stable, with expected growth from AI/data center sectors supported by high-end CCL capacity expansion [4][4] 2. CCL Capacity Expansion - **Expansion Plans**: Shengyi Technology is actively expanding its CCL capacity, with new production expected to start in Thailand from 1Q26 - **Construction Progress**: The company's 'construction in progress' reached Rmb1.9 billion by the end of 3Q25, up from Rmb470 million at the end of 3Q24 - **Timeline**: Capacity expansion typically takes 14 to 16 months, with Phase I requiring more time due to infrastructure development [8][8] 3. Raw Material Supply - **Price Increases**: Management highlighted recent price hikes in raw materials, particularly fiberglass cloth, which has seen tight supply affecting both thin and thick cloth - **Cost Pressures**: The rising costs and uncertainties in raw material supply could impact profitability, as Shengyi focuses on CCL products and relies on third-party suppliers [9][9] 4. Expanding Data Center Business - **Market Diversification**: Shengyi has diversified its end markets, expecting increased contributions from AI/computing products that offer higher margins - **Client Engagement**: The company is working with both local and global-tier clients on server and switch products, focusing on the verification of new generation products [10][10] 5. AI PCB Market Insights - **Positive Market Sentiment**: Comments from Shengyi management regarding strong CCL demand from the AI/data center market align with a positive outlook for the AI PCB market growth - **Competitor Insights**: Shennan Circuits (002916.SZ) is also targeting computer/networking applications, indicating a broader industry trend towards AI-related products [2][2] Additional Insights - **Investment in HDI**: Shengyi Electronics, a subsidiary, announced a private placement plan to invest Rmb2.6 billion in HDI for AI computing applications, indicating a strategic focus on high-demand technology sectors [8][8] This summary encapsulates the key discussions and insights from the conference call regarding Shengyi Technology's current position and future outlook in the CCL and data center markets.

Investment Rating - The report maintains an "Outperform" rating for the PCB industry [2]. Core Insights - The industry is entering a new AI-driven cycle, fundamentally changing demand structures. The construction of AI server clusters is leading to simultaneous upgrades in PCB demand and pricing. The expected market for wired communication PCBs will reach 206.9 billion RMB by 2027, with a CAGR of 20% over the next two years [4]. - High-end PCBs are expected to remain in tight supply until 2027, with major global manufacturers expanding production aggressively. The combined output of 13 leading PCB manufacturers is projected to reach 186 billion RMB by 2027, with a CAGR of 54% from 2025 to 2027 [4]. - The trend towards high-end PCB manufacturing is accelerating due to technological iterations and material upgrades. The industry is expected to see a three-pronged evolution in materials, processes, and architectures driven by AI [4]. - The demand surge and profit improvement in upstream materials present opportunities for domestic substitution. The price of copper-clad laminates has risen significantly, and domestic manufacturers are making notable progress in high-end materials [4]. - The PCB industry is experiencing a long-term trend of simultaneous growth in volume, price, and structure, driven by AI. The report recommends focusing on leading companies with high-end manufacturing capabilities and overseas delivery layouts [4]. Summary by Sections AI-Driven Growth - The AI cycle is expected to drive significant growth in PCB demand, particularly in AI servers, high-speed switches, and optical modules. The total market for wired communication PCBs is projected to reach 1,433 billion RMB by 2025 and 1,815 billion RMB by 2026 [19]. Production Capacity Expansion - Major PCB manufacturers are announcing aggressive expansion plans, with significant investments in new production facilities in Southeast Asia and domestic high-end capacity [15]. Technological Advancements - The report highlights the rapid adoption of mSAP technology in AI servers and switches, which is essential for meeting the demands of high-density signal transmission [4][21]. Market Dynamics - The report notes that the global PCB market is expected to face a supply-demand gap of nearly 20 billion RMB by 2026, although this gap is anticipated to narrow by 2027 [19]. Key Players - The report identifies leading companies such as Huada Technology, Jingwang Electronics, and Shenghong Technology as key players to watch in the PCB industry due to their high-end manufacturing capabilities and strategic expansion plans [4].

Financial Performance - In Q3 2025, the company achieved a revenue of 6.301 billion CNY, representing a year-on-year growth of 33.25% [1] - The net profit attributable to shareholders reached 0.9287 billion CNY, with a year-on-year increase of 9.66% [1] - The non-recurring net profit totaled 0.916 billion CNY, reflecting a year-on-year growth of 94.16% [1] Gross Margin Improvement - The overall gross margin showed improvement in Q3 2025, driven by increased demand for storage packaging substrates and enhanced capacity utilization [2] - Revenue from PCB data centers and wired communication businesses continued to grow, contributing to a slight increase in gross margin [2] Business Expansion - The PCB business focuses on communication equipment, with key expansions in data centers (including servers) and automotive electronics [3] - The packaging substrate business includes a wide range of products, with significant growth in storage packaging substrates in Q3 2025 [4] Capacity Utilization - The overall capacity utilization remained high in Q3 2025, with a notable increase in packaging substrate business due to rising demand in the storage market [5] Production Capacity Development - The company has factories in Shenzhen, Wuxi, Nantong, and Thailand, with new capacity coming from both new factories and upgrades to existing ones [6] Raw Material Price Changes - Key raw materials include copper-clad laminates, semi-cured sheets, copper foil, gold salt, and ink, with some prices increasing in Q3 2025 due to commodity price fluctuations [7]

Core Viewpoint - The Chinese equity market is expected to perform well due to multiple supporting factors, with a tactical overweight view on A/H shares maintained by Guotai Junan Securities [1] Group 1: Market Performance - On November 25, 2025, the three major A-share indices opened higher, with the CSI A500 index rising by 1.10% [1] - Key stocks such as Huadian Co., Ltd. and Shenzhen South Circuit rose significantly, with Huadian hitting the daily limit and others like Shenghong Technology and Fuhua also seeing substantial gains [1] Group 2: Investment Outlook - Guotai Junan Securities highlights that the recent volatility and panic selling have released micro trading risks, creating a favorable environment for the market to establish new expectations as the 14th Five-Year Plan begins [1] - The firm believes that the regulatory authorities are determined to stabilize the capital market, and factors that previously caused valuation discounts have dissipated, indicating a potential upward trend in valuations [1] Group 3: Index Composition - As of October 31, 2025, the top ten weighted stocks in the CSI A500 index include major companies like CATL, Kweichow Moutai, and China Ping An, accounting for a total of 19.36% of the index [1] Group 4: Investment Products - Investors without stock accounts can access the A500 ETF through the A500 ETF Jiashi linked fund, allowing for a one-click investment in the top 500 A-share companies [2]

PCB概念震荡反弹，沪电股份涨停，生益电子、深南电路、胜宏科技等涨幅靠前。 炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 11月25日，A股三大指数集体高开。截至发稿，沪指涨0.61%，深证成指涨超1%，创业板指涨超2%。 | 上证指数 | 深证成指 | 创业板指 | | --- | --- | --- | | 3860.12 | 12774.40 | 2993.12 | | 23.35 0.61% | 189.32 1.50% | 64.08 2.19% | CPO概念拉升，德科立、瑞斯康达、可川科技、长飞光纤等涨停，长芯博创、光库科技等涨超10%。 | < V | CPO概念 | | | 2 O | | --- | --- | --- | --- | --- | | | 4323.41 | 5.29% | | | | 分时 五日 | 日K | 周K | 目K | 更多,◎ | | 成份股 | 股吧 | | | 资讯 | | 名称 | 最新 | 涨幅 ↓ | | 涨跌 | | 德科立 | 142.56 | 20.00% | | 23.76 | | 688205 科创 融 | | ...