黄仁勋预告今年的GTC大会上发布"世界从未见过"的全新芯片产品，分析认为新品可能涉及Rubin系列衍生产品或更具革命性的Feynman架构芯片，市场预期 Feynman架构将针对推理场景进行深度优化。 英伟达CEO黄仁勋隔夜在接受媒体wccftech采访时透露，公司将在今年的GTC大会上发布"世界从未见过"的全新芯片产品。这一表态引发市场对英伟达 下一代产品路线图的高度关注，分析认为新品可能涉及Rubin系列衍生产品或更具革命性的Feynman架构芯片。 黄仁勋表示： 我们准备了多款世界从未见过的全新芯片。这并非易事，因为所有技术都已逼近物理极限。 考虑到英伟达刚在CES 2026上展示了已进入全面生产的Vera Rubin AI系列产品，包括六款新设计芯片，市场预期此次GTC可能推出更前沿的技术方 案。这对于密切关注AI基础设施竞赛的投资者而言，意味着英伟达可能再次刷新行业技术标准。 英伟达GTC主题演讲将于3月15日在加州圣何塞举行，届时AI基础设施竞赛的下一阶段将成为核心议题。 新品指向两大可能方向 第二种可能性更具颠覆性——英伟达可能提前揭晓下一代Feynman架构芯片。 据了解，Feynman被业内 ...

英伟达CEO黄仁勋罕见"亲自出马"，在硅谷韩式餐厅宴请30多名工程师，敦促SK海力士按时交付第六 代HBM4。随着三星率先出货搅动战局，这场关乎下一代AI芯片Vera Rubin成败的供应链争夺战已进 入白热化，SK海力士能否守住55%的市场份额，未来数月的执行力将是生死关键。 英伟达CEO黄仁勋上周亲自出面宴请合作伙伴的工程师团队，这一罕见举动凸显出下一代高带宽内存 HBM4对这家AI芯片巨头的战略重要性。随着三星电子在HBM4竞赛中率先出货，SK海力士能否按时 交付高性能产品，将直接影响英伟达今年下半年推出的新一代AI加速器Vera Rubin的市场表现。 2月14日晚间，黄仁勋现身英伟达总部附近的一家韩式炸鸡餐厅，花费约两小时为30多名SK海力士和 英伟达工程师逐桌调制烧啤、敬酒致意。他反复强调"我们是一个团队"和"我为你们骄傲"，并敦促工 程师们"通过不懈挑战和努力交付非凡成果"， 特别提及SK海力士承诺供应的第六代HBM4产品。 这场临时安排的聚会释放出明确信号：HBM4被英伟达视为Vera Rubin加速器的关键差异化组件。英 伟达对HBM4供应商提出了"运行速度11 Gbps以上"和"带宽3.0 ...

Markets slipped sharply into the red by midday on Thursday, reversing early optimism as broad-based selling pressure pulled both benchmark indices below critical technical support zones. The BSE Sensex was trading at 82,963.08 as of 12.55 PM, down 771.17 points or 0.92 per cent from its previous close of 83,734.25, having opened the session at 83,969.82. The NSE Nifty 50 mirrored the weakness, shedding 218.30 points or 0.85 per cent to trade at 25,601.05, after opening at 25,873.35, against its previous clo ...

Core Insights - NVIDIA's CEO Jensen Huang announced that the company will unveil "world's first" new chip products at the upcoming GTC conference, sparking significant market interest in NVIDIA's next-generation product roadmap [1] - The GTC keynote will take place on March 15 in San Jose, California, focusing on the next phase of the AI infrastructure race [1] Potential New Products - The new products are speculated to fall into two main categories: 1. Derivative chips from the Rubin series, such as the previously leaked Rubin CPX, following the recent launch of the Vera Rubin AI series, which includes six chips now in full production [2] 2. The potentially revolutionary Feynman architecture chip, which may utilize broader SRAM integration and possibly 3D stacking technology for Language Processing Units (LPU), although this has not been officially confirmed [2] Market Demand and Product Evolution - NVIDIA is responding to changing computational demands, with a shift from pre-training to inference capabilities becoming central, as indicated by the introduction of Grace Blackwell Ultra and Vera Rubin [3] - The Feynman architecture is expected to be deeply optimized for inference scenarios, addressing performance bottlenecks related to latency and memory bandwidth, which will significantly impact cloud service providers and enterprise customers reliant on AI inference capabilities [3] - Huang emphasized the importance of broader partnerships and investment strategies, indicating NVIDIA's transition from a chip supplier to an AI ecosystem builder, aiming to maintain a leading position in the AI infrastructure competition through acquisitions and collaborations [3]

上天天基金APP搜索777注册即可领500元券包，优选基金10元起投！限量发放！先到先得！ 2月19日消息，据外媒wccftech报道，英伟达首席执行官黄仁勋在接受媒体采访时，对即将到来的GTC 2026大会进行预热，明确表示将在会上揭晓"世界前所未见"的全新芯片，引发业界广泛关注。作为AI芯 片领域的领军者，英伟达此次重磅预告，被认为将进一步巩固其在AI基础设施领域的领先地位。 免责声明 据悉，GTC 2026大会的主题演讲将于3月15日在加利福尼亚州圣何塞举行，核心聚焦AI基础设施竞赛的 新时代。黄仁勋坦言，这些全新芯片的研发极具挑战，"所有技术都已逼近极限"，但结合其过往履约记 录，业界对英伟达此次新品充满期待。 目前，新品具体型号尚未披露，但外界普遍猜测，大概率出自两大芯片系列：一是Rubin系列的衍生产品 （如此前曝光的Rubin CPX），该系列已于2026年CES大会上亮相，包含6款全新设计芯片，目前已全 面量产；二是下一代Feynman系列芯片，该系列被称为"革命性"产品，英伟达正探索以SRAM为核心的 广泛集成，或通过3D堆叠技术整合LPUs，不过相关细节尚未确认。 值得注意的是，英伟达正适 ...

Group 1 - The GTC 2026 conference will focus on the new era of AI infrastructure competition, with a keynote speech scheduled for March 15 in San Jose, California [3] - Jensen Huang acknowledged the challenges in developing new chips, stating that "all technologies are approaching their limits," yet there is high industry anticipation for NVIDIA's upcoming products based on its past performance [3] - The specific models of the new products have not been disclosed, but speculation suggests they will likely come from two major chip series: the Rubin series derivatives and the next-generation Feynman series, with the former already in mass production [3] Group 2 - The Rubin series includes six newly designed chips that were showcased at the 2026 CES and are now fully in production, while the Feynman series is described as "revolutionary" and may utilize SRAM and 3D stacking technology [3] - NVIDIA is adapting to quarterly changes in AI computing demands, shifting focus from model pre-training with the Hopper and Blackwell series to inference scenarios with the Grace Blackwell Ultra and Vera Rubin series, aiming to address latency and memory bandwidth bottlenecks [3] - Huang emphasized that extensive collaboration and investment are key to NVIDIA maintaining its leadership position, as the company is strategically positioning itself across the entire AI industry chain, including energy, semiconductors, and data centers [3]

Market Analysis by covering: NVIDIA Corporation, Analog Devices Inc, iShares Semiconductor ETF. Read 's Market Analysis on Investing.com ...

昨晚全球股市上演了一出惊心动魄的"深V"大戏！ 正当大家以为美股要跟着白天的期指一起"跳水"时，它却在开盘后硬生生拉了起来。 最 终，欧美股市全线飘红，但剧情可没那么简单，盘中像是坐过山车，跌了拉，拉了又跌，看得人心惊肉跳。 更刺激的是板块间的冰火两重天。 之前连跌几天的科技巨头英伟达和苹果，突然成了"救市主"，盘中从大跌猛冲到暴涨。 而另一边，有色 金属却集体"扑街"，铜、铝、稀有金属跌得一片惨绿。 中概股则显得有点蔫，整体小幅收跌。 这市场到底唱的哪一出？ 是反弹真的来了，还是只是昙花一现？ 咱们先看看美股的具体表演。 纳斯达克指数低开了0.68%，这开局可不 妙。 但故事才刚开始，开盘后没多久，它就被砸到了下跌1.25%的位置。 你以为这就一跌到底了？ 并没有。 市场资金仿佛突然苏醒，又把它给拉红了。 可好景不长，红盘没保持多久，空头再次发力，指数又掉头 向下。 到了尾盘，又是一波跳水，眼看就要收跌，神秘力量再次出现，临收盘前一顿拉升，最终勉强收涨0.14%。 标普500的剧本也差不多。 同样是低开，开盘二十分钟内跌得最狠，幅度达到1.02%。 之后同样经历了拉红、下砸、再拉起的循环。 最终收 盘上涨0 ...

据悉，GTC 2026大会的主题演讲将于3月15日在加利福尼亚州圣何塞举行，核心聚焦AI基础设施竞赛的 新时代。黄仁勋坦言，这些全新芯片的研发极具挑战，"所有技术都已逼近极限"，但结合其过往履约记 录，业界对英伟达此次新品充满期待。 （原题为：重磅预告！黄仁勋将在GTC 2026发布"世界前所未见"芯片） 2月19日消息，据外媒wccftech报道，英伟达首席执行官黄仁勋在接受媒体采访时，对即将到来的GTC 2026大会进行预热，明确表示将在会上揭晓"世界前所未见"的全新芯片，引发业界广泛关注。作为AI芯 片领域的领军者，英伟达此次重磅预告，被认为将进一步巩固其在AI基础设施领域的领先地位。 来源：环球网 目前，新品具体型号尚未披露，但外界普遍猜测，大概率出自两大芯片系列：一是Rubin系列的衍生产 品（如此前曝光的Rubin CPX），该系列已于2026年CES大会上亮相，包含6款全新设计芯片，目前已全 面量产；二是下一代Feynman系列芯片，该系列被称为"革命性"产品，英伟达正探索以SRAM为核心的 广泛集成，或通过3D堆叠技术整合LPUs，不过相关细节尚未确认。 值得注意的是，英伟达正适配AI算力需求 ...

Core Insights - Meta and Nvidia have established a long-term strategic partnership focusing on large-scale deployment of chips and comprehensive optimization from hardware to software in the competitive AI landscape [1][2] - The collaboration has led to a rise in stock prices for both Meta and Nvidia, while AMD's stock fell over 4% [1][3] - Meta plans to deploy millions of Nvidia chips, including Blackwell and next-generation Rubin architecture GPUs, marking the first large-scale independent deployment of Nvidia's Grace CPU [1][3] - Meta aims to introduce the more powerful Vera series processors by 2027 to strengthen its position in high-efficiency AI computing [1][2] Company-Specific Developments - Nvidia is providing a unified solution covering training, inference, and data processing by integrating CPU, GPU, networking technologies, and software ecosystems for Meta [2] - Meta's large-scale procurement of Nvidia chips is seen as a long-term commitment to external computing power, ensuring competitiveness against Google and Microsoft [2][3] - Meta plans to integrate Nvidia's security technology into WhatsApp's AI features, enhancing performance while meeting stringent data security and privacy requirements [2] Industry Implications - Analysts estimate the scale of the partnership could reach hundreds of billions, with Meta's capital expenditure for AI infrastructure projected to be as high as $135 billion by 2026 [3] - The collaboration validates Nvidia's "full-stack" infrastructure strategy, as Meta's shift towards Nvidia's solutions comes amid challenges in its own AI chip development [3][4] - The partnership signals a significant shift in the competitive landscape, particularly for traditional chip giants like Intel and AMD, as Meta's move towards Arm architecture CPUs indicates a structural change in the data center market [4]