马年首单！这家公司科创板IPO过会。 2月24日，集成电路晶圆级先进封测企业盛合晶微半导体有限公司（下称：盛合晶微）成功通过上交所上市委审议，成为马年首单科创板过会企业。 上市进程显示，盛合晶微于2023年6月与中金公司签署上市辅导协议，正式启动A股IPO进程；2025年6月，该公司科创板IPO辅导状态变更为"辅导验收"， 正式冲刺科创板IPO，拟募资48亿元。 值得一提的是，盛合晶微来自被誉为中国半导体"第一县"的江阴，这里已经拥有66家上市公司。未来，伴随盛合晶微正式上市，该地也将再迎一个半导体 IPO。 事实上，盛合晶微曾用名为——中芯长电半导体（江阴）有限公司。从名称不难看出，这是一家带有中芯国际和长电科技双重基因的合资公司。2014年8 月，前述两家公司联合宣布，双方签约建设的具有12英寸凸块加工及配套晶圆芯片测试能力的中芯长电，落户江阴高新技术产业开发区。 中芯长电联合孵化，招银中金都来了 也正是在此时，中芯长电举办了第二轮增资意向的签约仪式，获得中芯国际、国家集成电路产业基金和美国高通公司2.8亿美元融资。其股东阵容从做前 段的中芯国际、做后段封装的长电科技，进一步拓展到移动芯片设计厂商高通、支 ...

证券研究报告|宏观研究报告 [Table_Date] 2026 年 02 月 25 日 [Table_Title] 半导体 ETF 投资指南 [Table_Title2] ETF 投资手册之二 [Table_Summary] ► 股票型 ETF 是什么产品？ 股票型 ETF 全称是交易型开放式指数基金，其名称刚好对应它 的三个特点："交易型"指该基金份额可在证券交易所内像股 票一样进行买卖，投资者可按市场价格实时交易；"开放式" 意味着基金份额不设固定上限，投资者既可通过券商在二级市 场交易，也可按净值在一级市场进行申购与赎回。"指数基 金"则是该基金采取被动管理策略，其主要目标是紧密跟踪某 一特定指数的表现，而非由基金经理进行主动选股。 ► 股票型 ETF 近年来发展如何？ 2023 年以来股票型 ETF 大幅扩张。绝对水平来看，我国股票型 [Table_Summary] 本篇报告在系统梳理半导体产业链构成的基础上，层层递进地 提出对应半导体 ETF 筛选和分析框架，为 ETF 策略提供参考。 ►半导体产业：主题投资热土，集成电路为先锋 半导体产品包含集成电路、光电器件、分立器件和传感器四 类。从规模上看， ...

Core Viewpoint - Changdian Technology (Jiangyin) Co., Ltd. has significantly increased its registered capital from 10 million RMB to 2.5 billion RMB, marking a 24,900% increase, which has attracted market attention [1] Group 1: Company Overview - The company was established in May 2025 and is less than a year old, with Li Quanbing as the legal representative [1] - It operates in the fields of power electronic components manufacturing, integrated circuit manufacturing and sales, and integrated circuit chip and product manufacturing and sales [1] - The company is wholly owned by Jiangsu Changdian Technology Co., Ltd. (600584), which is listed on the A-share market [1] Group 2: Capital Increase Implications - The increase in registered capital from 10 million to 2.5 billion RMB indicates a 249-fold expansion, suggesting a strategic move rather than a routine operational adjustment [1] - As the third-largest packaging and testing company globally and the largest in China, Changdian Technology's capital actions are closely monitored within the industry [1] - The timing of this capital injection coincides with a recovery in the semiconductor industry and accelerated advancements in packaging technology, signaling confidence in the long-term prospects of the packaging and testing business [1]

盛合晶微是一家集成电路晶圆级先进封测企业。本次IPO，该公司计划募集资金48亿元。其中，40亿元用于三维多芯片集成封装项目、8亿元用于超高密 度互联三维多芯片集成封装项目的建设。 2.5D集成大陆市占率第一 持续布局3D集成等领域 上交所上市审核委员会今日（2月24日）审议通过了盛合晶微科创板IPO申请。该公司上市申请于2025年10月30日获受理，经历两轮问询后，成为2026春 节后第一家过会企业。 此外，盛合晶微在招股书中披露了业绩预测，该公司预计2026年1-3月实现营业收入16.6亿元-18亿元，同比增加9.91%-19.91%，归母净利润为1.35亿元-1.5 亿元，同比增加6.93%-18.81%。 2.5D/3D封装高增长态势延续，国内外龙头密集扩产布局 从行业方面来看，近年来，智能手机等移动终端向小型化、集成化、高性能方向更新迭代，带动单机芯片数量和芯片性能要求的提升，是全球先进封装行 业发展的最重要驱动因素之一。与此同时，人工智能、数据中心等高性能运算产业正逐步成为先进封装行业的关键增长点和盈利点。 其中，芯粒多芯片集成封装是先进封装行业主要增长点转变的最充分受益者。Yole数据显示，全球芯 ...

Group 1: Overall Industry Outlook - The semiconductor industry is experiencing an upward trend in performance, driven by strong demand in storage, equipment, and foundry sectors [1] - The report maintains an overweight recommendation for the semiconductor sector due to the overall industry recovery and growth potential [1] Group 2: Performance of Overseas Listed Companies - North American cloud service providers, including Microsoft, Amazon, Google, and Meta, reported significant year-on-year growth in cloud revenues, driven by AI demand, with capital expenditures expected to increase substantially in 2026 [14][15][16][17] - TSMC, the global leader in foundry services, reported a 25.5% year-on-year increase in Q4 2025 revenue, reaching $33.73 billion, with net profit growing over 40% [21] - Micron Technology's Q1 FY26 revenue reached approximately $13.64 billion, benefiting from rising storage prices driven by AI demand [31] - Texas Instruments and Analog Devices showed signs of recovery in the analog chip sector, with Texas Instruments reporting a 10% year-on-year revenue increase in Q4 2025 [39][41] Group 3: Performance of Domestic Listed Companies - SMIC reported a Q4 2025 revenue of 17.81 billion yuan, a year-on-year increase of 11.9%, with net profit growing by 23.2% [57] - The semiconductor packaging and testing sector is recovering, with several companies reporting improved profitability and growth driven by AI demand [60] - The analog chip sector is also showing signs of recovery, with many companies reporting improved performance compared to 2024 [62] Group 4: Investment Recommendations - The report suggests focusing on high-growth segments driven by AI, such as computing chips, storage, advanced packaging, and semiconductor equipment [7]

Group 1 - The Integrated Circuit ETF (159546) opened with a gain of 0.29%, priced at 2.063 yuan [1] - Major holdings in the ETF include: Cambrian (up 0.79%), SMIC (up 1.02%), Haiguang Information (up 0.75%), and others with varying performance [1] - The ETF's performance benchmark is the CSI All-Share Integrated Circuit Index return, managed by Guotai Fund Management Co., Ltd., with a return of 105.49% since its establishment on October 11, 2023, and a one-month return of -4.74% [1]

Group 1 - The semiconductor ETF (159813) opened with a slight increase of 0.16%, priced at 1.246 yuan [1] - Key holdings in the semiconductor ETF include: - SMIC up 1.02% - Haiguang Information up 0.75% - Cambrian up 0.79% - Northern Huachuang up 0.23% - Zhaoyi Innovation down 2.18% - Zhongwei Company down 0.20% - Lanke Technology up 0.01% - OmniVision up 0.01% - Tuojing Technology up 0.82% - Changdian Technology up 1.52% [1] - The performance benchmark for the semiconductor ETF is the National Securities Semiconductor Chip Index return rate, managed by Penghua Fund Management Co., Ltd. [1] Group 2 - Since its establishment on April 17, 2020, the semiconductor ETF has achieved a return of 86.69% [1] - The ETF has experienced a return of -4.87% over the past month [1]

2月24日，上交所官网显示，盛合晶微半导体有限公司（以下简称"盛合晶微"）科创板IPO已成功通过上 交所上市审核委员会审议。 现场问询中，上交所上市委要求盛合晶微结合其2.5D业务的技术来源，三种技术路线的应用领域、发展 趋势、市场空间，以及新客户开拓情况，说明与主要客户的业务稳定性及业绩可持续性。 21世纪经济报道记者 孙燕 招股书显示，盛合晶微目前的客户集中度较高：2022年、2023年、2024年、2025年上半年，该公司对前 五大客户的合计销售收入占比分别为72.83%、87.97%、89.48%和90.87%，其中，对第一大客户的销售 收入占比分别为40.56%、68.91%、73.45%和74.40%。 此次登陆科创板，盛合晶微拟募资48亿元，将投资于三维多芯片集成封装项目、超高密度互联三维多芯 片集成封装项目。财通证券研究指出，项目达产后将形成多个芯粒多芯片集成封装技术平台的规模产 能，并配套凸块制造及3DIC技术平台产能，进一步匹配中国大陆芯粒多芯片集成封装领域的高增长需 求。 根据Gartner的统计，2024年度，盛合晶微是全球第十大、境内第四大封测企业，且2022年度至2024年 度营业 ...

盛合晶微前身为中芯长电半导体（江阴）有限公司，由中芯国际（688981.SH）与长电科技（600584.SH）合资创立。自成立之 初，盛合晶微即将芯粒多芯片集成封装作为该公司发展方向和目标，并聚焦在更加前沿的晶圆级技术方案领域。 在摩尔定律逐步逼近极限的情况下，通过芯粒多芯片集成封装技术持续优化芯片系统的性能已经成为行业共识。在这一领域， 台积电、英特尔、三星电子等全球领先半导体制造企业已经布局多年且正在持续扩充产能，日月光、安靠科技等全球领先封测 企业，以及长电科技、通富微电（002156.SZ）、华天科技（002185.SZ）等中国大陆领先封测企业也正在持续布局中。 从价值量上看，芯粒多芯片集成封装及配套的测试环节也已进入高算力芯片制造产业的价值链高端，一定程度上重构了集成电 路制造产业链的价值分布。目前最主流的高算力芯片的成本结构中，CoWoS及配套测试环节的合计价值量已经接近先进制程芯 片制造环节。 此次登陆科创板，盛合晶微拟募资48亿元，将投资于三维多芯片集成封装项目、超高密度互联三维多芯片集成封装项目。财通 证券研究指出，项目达产后将形成多个芯粒多芯片集成封装技术平台的规模产能，并配套凸块制造及3 ...

Core Insights - The Shenzhen Bay Super Headquarters Base (深超总) is accelerating its construction, transforming from a planning blueprint into a reality, which injects strong momentum into Shenzhen's high-quality development [1][8]. Investment and Development - The area has completed 80% of land transfers, with a total investment of approximately 210 billion yuan, of which about 120 billion yuan has been invested so far [3]. - The project has attracted numerous Fortune 500 and innovative tech companies, with 19 corporate headquarters already established in the area [3][7]. Project Progress - Construction activities are in full swing, with significant progress on various projects, including the DU09-03 project, which is undergoing foundation and earthworks [4]. - Notable buildings such as the C Tower and the global headquarters of China Merchants Bank have reached key construction milestones, with the latter now illuminated as a financial landmark [7]. Urban Planning and Environment - The area covers 117 hectares with a planned total construction area of approximately 5.2 million square meters, accommodating around 250,000 residents [8]. - The design emphasizes a blend of headquarters, culture, and ecology, providing a balanced solution for high-density urban development [10]. Community and Cultural Impact - The development aims to enhance the sense of identity and belonging for residents, focusing on public service improvements and cultural enrichment [12]. - The project is seen as a model for future urban living, integrating diverse cultural, artistic, and technological facilities [12]. Innovative Design Approach - The project employs a city chief designer system, led by Chinese Academy of Engineering academician Meng Jianmin, marking a first for Shenzhen in comprehensive technical oversight [13]. - The design philosophy aims to redefine modern urban quality, emphasizing harmony between nature, efficiency, and cultural vitality [16].