该行又预计，由于日月光投控仍在扩大其CoWoS生产线，并提出多个oS TCB订单，料ASMPT的订单量 将自今年第四季进一步改善。此外，该行预期ASMPT来自中国的传统封装订单亦会增加。 ASMPT(00522)涨超5%，截至发稿，涨5.05%，报94.75港元，成交额9561.22万港元。 野村发布研报称，ASMPT于今年5月底获得一间领先晶圆厂的资格，成为潜在的第二间oW(Chip on Wafer)热压焊接(TCB)供应商，而另一间供应商为K&S。该行认为，ASMPT或已克服障碍，并在不久的 将来正式赢得下一代oW TCB订单。因此，该行考虑到未来订单趋势上升的潜在估值重估，将ASMPT的 目标价由90港元上调至125港元，维持"买入"评级。 ...

Core Viewpoint - The advanced packaging concept continues to strengthen, with significant stock price increases observed in several companies within the sector [1] Company Performance - Shanzi Gaoke has reached its daily limit increase in stock price [1] - Other companies such as Baiwei Storage, Cambricon Technologies-U, Lianrui New Materials, Jiao Cheng Ultrasonic, Xingsen Technology, and Changdian Technology have also experienced stock price increases [1]

Investment Strategy - The first phase of the National Integrated Circuit Industry Investment Fund (大基金一期) was established in 2014 with a registered capital of 98.7 billion, and actual funds received were approximately 120 billion [3] - The second phase (大基金二期) was established in 2019 with a registered capital of 204.2 billion, and actual funds received were around 220 billion [3] - Significant investments from both phases were directed towards wafer manufacturing, including companies like SMIC, Hua Hong Semiconductor, and Changjiang Storage [3] - Investments also extended to the packaging segment, targeting companies such as Tongfu Microelectronics and Jiangsu Changjiang Electronics Technology [5] - The strategy focused on addressing the largest shortfall in the semiconductor industry, which is manufacturing, while also investing in the relatively stronger area of chip design [7] Management - The management of both phases is handled by Huaxin Investment Management Co., Ltd. (华芯), established in 2014 specifically for managing the fund [9] - The largest shareholder of Huaxin is the National Development Bank, which is also a significant contributor to the fund [9] - In the first phase, the Ministry of Finance was the largest contributor (36%), followed by the National Development Bank (22%) [10] - By the second phase, the Ministry of Finance remained the largest contributor (11.02%), with the National Development Bank as the second largest (10.78%) [10] - The first phase also involved Huaxin managing several market-oriented semiconductor funds to mitigate risks and enhance investment strategies [10] - By the second phase, Huaxin's investment capabilities had matured, managing 220 billion solely without additional fund managers [11]

Core Viewpoint - The article discusses the advancements and market potential of glass substrates in semiconductor packaging, highlighting their advantages over traditional materials and the expected growth in the market size from $213 million in 2024 to over $400 million by 2030 [3]. Group 1: Market Overview - The global semiconductor packaging glass substrate market is projected to reach approximately $213 million in 2024, with expectations to exceed $400 million by 2030, indicating a penetration rate of over 2% [3]. - Transitioning substrate sizes from 200mm to 300mm can save about 25% in costs, while moving from 300mm to board-level can achieve over 60% cost reduction [2]. Group 2: Advantages of Glass Substrates - Glass substrates offer superior surface flatness and low roughness, making them suitable for high-precision lithography and micro-line processing [3]. - They exhibit low warpage and high resistance to deformation due to adjustable thermal expansion coefficients, which can be aligned closely with silicon chips [3]. - The electrical performance of glass substrates is enhanced, reducing signal loss during transmission, which is crucial for high-speed applications [3]. - Glass substrates have better thermal conductivity compared to organic substrates, improving heat management in electronic systems [3]. - They possess excellent chemical stability, resisting moisture and environmental corrosion [3]. Group 3: Industry Developments - Several companies are actively developing glass substrate technologies, including Beijing BOE Sensor Technology, Jiangxi Woge Optoelectronics, and Wuhan Xinchengyuan Semiconductor, each focusing on different aspects of glass substrate applications [4][5][6]. - Shenzhen Deep Light Valley Technology has successfully established a production line for glass-based 3D optical waveguide chips, indicating advancements in the field [6]. - The industry is witnessing a trend towards integrating glass substrates in high-end semiconductor packaging, with companies like Xiamen Yuntian Semiconductor and Chongqing Glass Core Semiconductor planning significant production expansions [5][6]. Group 4: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 势银（ TrendBank）统计显示，2024年全球IC载板市场增速温和，仅为3.6%，整体营收规模为134.89亿美元 ，2025年AI数据中心、边缘AI 产品升级将带动ABF载板和高阶BT载板需求提升，预计将达到148.37亿美元。 中国IC载板市场快速崛起，整体营收规模达到10.38亿美元，同比增长34.9% ，但中国本土企业主要集中在MEMS、RF、存储载板，以BT材料 为主，而采用ABF膜的高端FCBGA载板还未能完全释放产量，这一块依旧由国际大厂主导，且上游ABF膜以日本、台湾供应为主，中国大陆正 在开始布局这一领域。 ABF膜作为半导体封装领域的高性能绝缘薄膜，主要由PET基底薄膜，以及ABF树脂（包含环氧树脂或聚酰亚胺等聚合物、固化剂、特殊填料 等）、覆盖膜组成。 数据来源：势银（ TrendBan ...

Core Viewpoint - Glass substrates are emerging as a superior alternative to organic substrates in advanced packaging due to their flatness, lower thermal expansion coefficient, and reduced warpage issues, making them ideal for high-frequency applications and 6G communications [2][3][5]. Group 1: Advantages of Glass Substrates - Glass substrates provide significant improvements in warpage reduction (50%) and positioning accuracy (35%) compared to organic substrates, facilitating the implementation of redistribution layers (RDL) with line widths and spacings below 2 micrometers [2]. - The dielectric constant of glass (2.8) is much lower than that of silicon (12), resulting in significantly lower transmission losses and enhanced signal integrity for high-frequency applications [3]. - Glass substrates are versatile and can be used as carriers, core substrates for embedded components, 3D stacking materials, or sealed cavities for sensors and MEMS [2]. Group 2: Manufacturing Challenges - Glass cutting is prone to micro-cracking, and the challenge of repeatedly manufacturing thousands of fine-pitch through-glass vias (TGV) hinders the full potential of glass substrates [3][22]. - The laser-induced deep etching (LIDE) technology is being improved to facilitate mass production of TGVs, allowing for the etching of vias as small as 3 micrometers with a spacing of 5 micrometers [10][11]. Group 3: Applications in 6G Technology - Glass substrates are ideal for 6G wireless communication networks, which require data rates exceeding 100 GHz, due to their high-frequency transmission capabilities and low loss characteristics [5]. - Heterogeneous integration in stacked glass can combine high-frequency front-end chips with low-loss interconnects, enhancing the performance of large-scale antenna arrays [5]. Group 4: Innovations in Glass Processing - The use of ABF (Ajinomoto Build-up Film) as a low-k dielectric and adhesive for glass bonding has shown promising results, achieving electrical performance up to 220 GHz with minimal loss [5][8]. - New methods for cutting glass substrates, such as embedding cut substrates in organic resin for edge protection, are being explored to minimize damage during handling [24]. Group 5: Yield Improvement Techniques - Predictive modeling and machine learning are being utilized to enhance yield rates in glass substrate manufacturing, particularly in identifying and mitigating defects early in the production process [18][19]. - The development of automated systems for wet etching and drying processes is aimed at improving the efficiency and yield of TGV manufacturing [10][11]. Group 6: Future Directions - The glass ecosystem is preparing for the continued growth in chip and substrate sizes in multi-chip advanced packaging, with significant progress being made in laser modification and high-frequency etching techniques [28]. - Ongoing research aims to further reduce micro-cracking during cutting processes and improve the compatibility of new processing techniques with stringent design rules [29].

Summary of the Conference Call for Aotwei Company Overview - **Company**: Aotwei - **Industry**: Photovoltaic Equipment and Lithium Battery Equipment Key Points and Arguments Photovoltaic Equipment Business - The increase in Aotwei's photovoltaic equipment business is primarily driven by capital inflow into the photovoltaic market and rising silicon material prices [2][3] - Aotwei's photovoltaic orders for the first half of the year reached 2.88 billion RMB, with an expected total of 6 billion RMB for the year, which is lower than last year's over 9 billion RMB but shows a smaller decline than the industry average [2][8] - Aotwei maintains a market share of 70%-80% in the photovoltaic equipment sector, with annual orders expected to be between 800 million to 1 billion RMB, potentially reaching 2 billion RMB in optimistic scenarios [2][12] - The company has a competitive edge due to its existing string welding machine technology and collaborations with leading companies like Longi and Aiko [2][12] Market Dynamics - The photovoltaic equipment market has seen a significant increase due to market capital inflow and rising silicon prices since June 2020, which has improved profitability across the entire photovoltaic supply chain [4][5] - Despite a decline in orders for many photovoltaic companies in Q2, battery sector profits have risen, indicating potential risks for future profitability [3][4] BC Battery Expansion - The expected annual expansion for BC batteries is 50GW, with equipment prices ranging from 25 million to 30 million RMB per GW. If Aotwei captures 40% of the market, it could generate an additional 500 million RMB in orders annually [2][13] - Technological upgrades in three-piece and four-piece technologies could release significant market potential, estimated at 2.4 billion to 4.8 billion RMB [2][13] Solid-State Battery Equipment - Aotwei's solid-state battery equipment is primarily linked to Yili Technology, with a current order of 50 million RMB and potential orders of 500 million to 1 billion RMB by 2026 [4][16] - The company is also developing new equipment for solid-state batteries, which could enhance its market position [18] Semiconductor and Other Business Areas - Aotwei has established a complete packaging line in the semiconductor sector, with orders nearing 100 million RMB and a target of achieving 1 billion RMB in orders within three years [20][21] - The company is also exploring opportunities in perovskite technology, although there are no strong order expectations yet [21] Future Outlook - Aotwei's new order expectations for 2025 are around 6 billion RMB, with over 80% coming from the photovoltaic business. If new technologies are successfully implemented, the total new orders could reach 8-10 billion RMB [17][22] - The projected profit for 2025 is around 600 million RMB, with potential growth to 800 million to 1 billion RMB by 2027-2028 as new businesses ramp up [22][23] - The estimated market value for Aotwei's various business segments could reach 250-300 billion RMB, indicating significant growth potential compared to its current market valuation [23] Additional Important Insights - The trend of machine replacement for manual labor in the AOI equipment market is accelerating, indicating a substantial market potential that could reach a hundred billion RMB if fully automated [15] - Aotwei's pricing strategy in the AOI market is competitive, with a selling price of 1.1 to 1.3 million RMB per unit compared to competitors, maintaining a gross margin of over 50% [15]

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 02 AGENDA 大会议程 扫描上方二维码，立马报名 01 INTRODUCTION 大会概况 随着半导体工艺逼近物理极限，集成电路产业正加速向"超越摩尔"时代跃迁，芯片功率密度与发热量剧 增。5G、AI、HPC、数据中心等新兴领域对高效热管理技术提出迫切需求。先进封装与热管理技术成为突 破算力瓶颈、应对高功率密度挑战的核心引擎。 9月25-26日，启明产链Flink将于江苏苏州举办2025先进 封装及热管理大会 ，特设 " 先进封装产业创新大会&高算力热管理创新大会 "两大平行论坛 ， 目前已有 40家院校/企业确认演讲。 大会将聚焦高算力热管理挑战， 围绕 Chiplet与异质异构、TGV与玻璃基板、面板级封装、芯片热管理产 业关键技术、超高导热金刚石、液态金属与热界面材料，液冷技术与应用案例 等产业热点话题展开深入探 讨。 n Oil. 先进封装及高算力热管理大 2025 ADVANCED PACKAGING & HPC THERMAL MANAGEMENT CONFERENCE 9月25-26日 江 ...

Core Viewpoint - The interposer has transitioned from a supporting role to a focal point in the semiconductor industry, with major companies like Resonac and NVIDIA leading initiatives to develop advanced interposer technologies [1][28]. Group 1: Definition and Importance of Interposer - Interposer serves as a critical layer between chips and packaging substrates, enabling high-density interconnections and efficient integration of various chiplets into a system-in-package (SiP) [3][5]. - The interposer is essential for achieving higher bandwidth, lower latency, and increased computational density in advanced packaging [3][5]. Group 2: Types of Interposers - Two main types of interposers are currently in production: Silicon Interposer (inorganic) and Organic Interposer (Redistribution Layer) [5][6]. - Silicon Interposer has been established since the late 2000s, with TSMC pioneering its use in high-performance computing [6]. - Organic Interposer is gaining traction due to its lower production costs and flexibility, despite challenges in wiring precision and reliability [6][23]. Group 3: JOINT3 Alliance - The JOINT3 alliance, led by Resonac, consists of 27 global companies aiming to develop next-generation semiconductor packaging, focusing on panel-level organic interposers [8][11]. - The alliance plans to establish a dedicated center in Japan for advanced organic interposer development, targeting a significant increase in production efficiency and cost reduction [11][12]. - The shift to organic interposers is driven by the limitations of silicon interposers, particularly in terms of geometric losses and production costs [11][12]. Group 4: SiC Interposer as a New Direction - NVIDIA is exploring the use of Silicon Carbide (SiC) interposers for its next-generation GPUs, indicating a potential shift in materials used for interposers [17][19]. - SiC offers superior thermal conductivity and electrical insulation, making it suitable for high-performance AI and HPC applications, although manufacturing challenges remain [19][25]. Group 5: Competitive Landscape of Interposer Materials - The competition among silicon, organic, and SiC interposers is characterized by their respective advantages and disadvantages, influencing performance, cost, and scalability [20][22][23]. - Silicon interposers are currently dominant but face challenges as chip sizes increase, while organic interposers are expected to gain market share due to cost advantages [22][26]. - SiC interposers, if successfully developed, could become the standard for cutting-edge AI and HPC packaging in the long term [26]. Group 6: Future Trends - In the short term, silicon interposers will remain the market leader, while organic interposers are anticipated to see widespread adoption in the mid-term due to their cost and scalability benefits [26]. - Long-term projections suggest that SiC interposers may emerge as the preferred choice for advanced packaging once manufacturing hurdles are overcome [26].

Investment Strategy - The first phase of the National Integrated Circuit Industry Investment Fund (大基金一期) was established in 2014 with a registered capital of 98.7 billion, and actual funds received were approximately 120 billion [3] - The second phase (大基金二期) was established in 2019 with a registered capital of 204.2 billion, and actual funds received were around 220 billion [3] - Significant investments from both phases were directed towards wafer manufacturing, including companies like SMIC, Hua Hong Semiconductor, and Changjiang Storage [3] - Investments also extended to packaging segments, with companies such as Tongfu Microelectronics and Jiangsu Changjiang Electronics Technology [5] - The strategy focused on addressing the largest gaps in the semiconductor industry, particularly in manufacturing, while also investing in chip design, exemplified by companies like Huawei's HiSilicon [6][7] Management - The management of both phases is handled by Huaxin Investment Management Co., Ltd. (华芯), established in 2014 specifically for managing the fund [9] - The largest shareholder of Huaxin is the National Development Bank, which is also a significant contributor to the fund [9] - In the first phase, the Ministry of Finance was the largest contributor (36%), followed by the National Development Bank (22%), while in the second phase, the Ministry of Finance contributed 11.02% and the National Development Bank 10.78% [10] - The management structure raised questions about the dual role of the National Development Bank as both a manager and a major limited partner, reflecting a high level of trust from the state [10] - The first phase involved collaboration with other semiconductor investment institutions to mitigate risks, while the second phase saw a more mature investment capability with no additional management entities [10][11]