Core Viewpoint - Intel is strategically targeting the South Korean market for its foundry services, particularly aiming to compete with Samsung's wafer foundry business by hosting the Direct Connect Asia event in Seoul [1][2]. Group 1: Event and Strategic Intent - Intel's foundry division will hold the Direct Connect Asia event in Seoul on June 24, marking the first time this event is held outside the U.S. [1] - The event aims to engage with local IC design companies in South Korea that require low-cost advanced process foundry services, indicating Intel's intent to capture market share from Samsung [1][2]. Group 2: Technology and Competitive Landscape - Intel has high hopes for its Intel 18A process technology, which utilizes advanced RibbonFET and PowerVia technologies, and plans to begin mass production in the second half of 2025 [1][2]. - Intel 18A is positioned to compete directly with TSMC's 2nm process technology, showcasing its potential in the foundry market [2]. - Samsung's advanced process technology has lagged behind TSMC, with reports indicating only a 50% yield for its 3nm process and a current 40% yield for its 2nm process, which may hinder its ability to attract large clients [2].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自digitimes 。 台积电2纳米将于2025年下半如期量产，客户排队投片下单盛况丝毫未减，到今年底可望有3万片 的月产能，芯片业界也传出代工报价上看3万美元。 尽管在制程技术与订单展望部分，老大哥台积可说是"没有对手"，再度横扫所有客户大单，但是半 导体供应链端仍认为，台积后续恐怕有"四大挑战"得面对。 部分供应链业者表示，台积电危机估计只增未减，四大挑战包括： 一、美国厂研发中心与抢救英特尔的底线。 二、反垄断难题。 三、关税战通膨下的成本转嫁考验。 四、地缘政治下的产能布局计画。 四大挑战考验台积电经营团队智慧 业界人士分析，首先，是因应川普（Donald Trump）的要求，宣布投入1,000亿美元扩大亚利桑那 州厂建厂大计，恐怕只是上集。 下集包括美国研发中心内容项目，以及与英特尔（Intel）的合作底线，董事长魏哲家与台积经营 团队还在精算中，这些恐都会是影响未来营运表现， 其次，是反垄断问题。 台积电在全球晶圆代工市占已逾6成，至年底将达7成，甚至更高，晶圆代工产业已形成台积电 与"非台积"两个世界。 台积电与美国政府的合作，并不能持盈保 ...

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Group 1 - TSMC reported a record Q1 2025 revenue of $25.53 billion, a 41.6% year-over-year increase, and an operating profit of $12.38 billion, up 56.1% year-over-year [1] - TSMC's market share has been steadily increasing since Q1 2019, projected to reach 68% by 2025, while Samsung's share is expected to decline from 19% to 8% in the same period [2] - TSMC's wafer shipments in Q1 2025 were 3.26 million, which is 82% of the peak shipment of 3.97 million wafers [9][14] Group 2 - TSMC's 8-inch and 12-inch fab utilization rates are projected to be 69% and 86% respectively in Q1 2025, indicating underutilization compared to historical levels [10][12][14] - The decline in demand for 7nm technology has led to a significant drop in sales, with expectations that TSMC may convert 7nm capacity to 5nm or 3nm nodes [21][23] - TSMC's sales to the US reached a record 77% in Q1 2025, driven by increased demand for AI semiconductors, particularly NVIDIA GPUs [25][27] Group 3 - The share of smartphone sales in TSMC's revenue has decreased to 28% by Q1 2025, while high-performance computing (HPC) sales have risen to 59% [29][31] - TSMC's automotive semiconductor sales remain low, which may impact the future prospects of its Kumamoto factory [32]

Core Viewpoint - Goldman Sachs and JP Morgan have released contrasting analyses on SMIC, highlighting differing perspectives on the company's future performance and market conditions [1]. Group 1: Goldman Sachs Analysis - Goldman Sachs maintains a positive outlook on SMIC, citing strong customer demand and the benefits of local production trends and diversified partnerships [2][4]. - The management of SMIC is optimistic about maintaining high capacity utilization rates through 2025, with a stable capital expenditure plan to support expansion [2][3]. - Despite short-term pressures on average selling prices (ASP) and rising depreciation costs, SMIC's long-term gross margin target remains at 20%, supported by operational efficiency and product upgrades [3][4]. Group 2: JP Morgan Analysis - JP Morgan reports that SMIC's first-quarter revenue fell short of market expectations by 5%, primarily due to ASP declines caused by factory yield fluctuations [5][6]. - The second-quarter revenue guidance indicates a projected decline of 4-6%, reflecting ongoing ASP weakness and cautious outlook on technology demand due to tariff concerns [6][7]. - JP Morgan has lowered its revenue growth expectations for 2025 to 10-11%, down from 16%, due to a weak outlook for the second half of the year [6][7]. Group 3: Comparative Insights - Both firms predict similar gross margin ranges for SMIC, with Goldman Sachs focusing on industry recovery and domestic substitution benefits, while JP Morgan is more sensitive to supply-demand imbalances and cost pressures [8].

华虹半导体 (1347 HK) 港股通 九厂放量有望推动收入稳步增长 | 华泰研究 | | 季报点评 | | --- | --- | --- | | 2025 年 | 5 月 13 日│中国香港 | 半导体 | 1Q25 营收 5.41 亿美元（YoY：+17.6%，QoQ：+0.3%），达到公司指引中 值，主要得益于晶圆出货量增加。付运晶圆 123.1 万片（YoY+20.0%， QoQ+1.5%），产能利用率 102.7%，持续饱满。毛利率 9.2%，同比+2.8pct （产能利用率提升），环比-2.2pct（受新产线折旧影响），符合公司指引的 9%~11%。归母净利润 375 万美元，上季度为净亏损 2520 万美元。展望 Q2，指引营收 5.5-5.7 亿美元（中值环比+3.5%），毛利率 7～9%，主要受 到折旧影响。展望全年：1）看好公司产能持续饱满，12 英寸产能稳步爬坡， 后续有望增厚收入；2）全年价格或稳健，ASP 随着产品组合改善存在上升 空间；3）模拟和电源管理收入稳健增长，受益于关税下国产化趋势加速。 维持华虹的"买入"评级，目标价 43.0 港币。 证券研究报告 目标价 43.0 港 ...

| 风格指数 | 昨日表现 | 1 个月表现 | 6 个月表现 | | --- | --- | --- | --- | | | （％） | （％） | （％） | | 大盘指数 | 1.15 | 4.03 | -4.11 | | 中盘指数 | 1.37 | 3.44 | -10.64 | | 小盘指数 | 1.45 | 4.46 | -4.76 | | 行业涨幅 | 昨日涨 | 1 个月涨 | 6 个月涨 | | 航海装备Ⅱ | 7.08 | 10.86 | -2.56 | | 军工电子Ⅱ | 5.21 | 7.66 | -1.5 | | 地面兵装Ⅱ | 4.67 | 9.89 | 10.73 | | 消费电子 | 4.38 | 9.21 | -10.4 | | 航空装备Ⅱ | 3.9 | 9.04 | -8.78 | | 行业跌幅 | 昨日跌 | 1 个月跌 | 6 个月跌 | | 贵金属 | -2.03 | -0.87 | 21.22 | | 化学制药 | -1.93 | 2.72 | -2.45 | | 种植业 | -1.03 | -7.34 | -7.73 | | 农产品加工 | -0.77 | 0. ...

Core Viewpoint - The semiconductor industry is shifting from a singular focus on process miniaturization to diversified innovation, with advanced packaging and specialty processes becoming key drivers for performance optimization and differentiation [1][2]. Group 1: Specialty Processes and Market Growth - The global specialty process market has surpassed $50 billion, with a compound annual growth rate (CAGR) of 15%, significantly outpacing the average growth rate of the semiconductor industry [1]. - Specialty processes focus on customized and diverse process optimizations, achieving a precise balance of performance, power consumption, and cost, particularly in demanding fields like automotive electronics and IoT [1]. Group 2: TSMC's Leadership in Specialty Processes - TSMC is establishing itself as a global benchmark in specialty processes through a combination of technological breadth and ecosystem depth, expanding its capabilities across various domains including automotive and RF technologies [2][4]. - TSMC's advanced logic technologies, such as N7A, N5A, and N3A, are specifically designed for automotive applications, ensuring high reliability and long lifecycle [4]. Group 3: Innovations in Embedded Non-Volatile Memory (eNVM) - TSMC is addressing the limitations of traditional eFlash memory by advancing RRAM and MRAM technologies, which are expected to replace eFlash in automotive and IoT applications [6][8]. - The introduction of RRAM and MRAM technologies allows for significant improvements in performance, reliability, and power efficiency, with TSMC's RRAM already in mass production at 40, 28, and 22 nm nodes [7][8]. Group 4: Competitive Landscape and Future Trends - Major MCU manufacturers are collaborating with foundries to leverage specialty processes, with companies like Infineon and NXP adopting eNVM technologies to enhance their product offerings [9][16]. - The market for embedded NVM is projected to grow rapidly, with wafer production expected to increase from approximately 3 KWPM in 2023 to about 110 KWPM by 2029, indicating a strong shift towards new storage technologies [26]. Group 5: Diverse Storage Technologies - Various new storage technologies, including eRRAM, eMRAM, and ePCM, are being explored by different manufacturers, each offering unique advantages in terms of speed, power consumption, and integration capabilities [30][32]. - The trend indicates a move towards a multi-storage technology ecosystem rather than a single dominant solution, reshaping the MCU landscape in the post-eFlash era [32].

晶圆代工龙头发布业绩，短期波动不扰长期逻辑 [Table_ReportDate] 2025 年 5 月 12 日 证券研究报告 行业研究 [行业专题研究（普通） Table_ReportType] | [Table_StockAndRank] 电子 | | | --- | --- | | 投资评级 | 看好 | | 上次评级 | 看好 | [Table_Author] 莫文宇 电子行业首席分析师 执业编号：S1500522090001 邮 箱：mowenyu@cindasc.com 信达证券股份有限公司 CINDA SECURITIES CO.,LTD 北京市西城区宣武门西大街甲 127 号金 隅大厦 B 座 邮编：100031 [Table_Title] 晶圆代工龙头发布业绩，短期波动不扰 长期逻辑 [Table_ReportDate] 2025 年 05 月 12 日 本期内容提要: | 中芯国际：短期因素扰动上半年业绩，中长期成长逻辑不变 5 | | --- | | 华虹半导体： 产能利用率维持高位，模拟收入提升较为显著 7 | | 台积电：4 月营收同比大幅增长，创历史单月新高 9 | | 投资建议 ...