来源：中国半导体行业协会 近日，我会会员企业闻泰科技在荷兰的分支机构安世半导体（Nexperia）受到当地政府的干预，引发产业 界高度关注。中国半导体行业协会对此表示严重关切，并郑重表明以下立场： 1.我们坚定支持会员单位捍卫自身的合法权益，维护公平、公正、非歧视的营商环境和全球产业链的稳 定。 2.我们反对滥用"国家安全"概念、对中国企业海外分支机构实施选择性和歧视性限制的做法。 3.针对特定企业的歧视性措施，将破坏开放、包容、协同的全球半导体生态，我们对此坚决反对。 中国半导体行业协会将持续关注事态发展,积极倾听会 员呼声,并通过一切合法渠道向国际社会表达中国产业界的 共同关切。 中国半导体行业协会 声明 近日,我会会员企业闻泰科技在荷兰的分支机构安世半 导体(Nexperia)受到当地政府的干预,引发产业界高度关 注。中国半导体行业协会对此表示严重关切,并郑重表明以 下立场: 1. 我们坚定支持会员单位捍卫自身的合法权益,维护公 平、公正、非歧视的营商环境和全球产业链的稳定。 2. 我们反对滥用"国家安全"概念、对中国企业海外分 支机构实施选择性和歧视性限制的做法。 3. 针对特定企业的歧视性措施,将破 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 近日，博通宣布其Tomahawk 6 - Davisson（或TH6-Davisson）产品现已上市。这意义重大， 因为这是一款共封装光纤 (CPO) 以太网交换机，可提供惊人的 102.4 Tb/s。而且，随着它的出 现，它将共同封装的光器件带入了下一代网络。 CPO 通过将光转换引擎与交换机 ASIC 并排嵌入，避免了传统可插拔光模块的缺点，信号无需通过 长距离电气线路传输，而是几乎立即耦合到光纤中。因此，电气损耗降低至 4 分贝，每端口功耗降至 9W。这种布局省去了众多可能出现故障的组件，并大大简化了光互连的实施。 在博通看来，共封装光学器件 (CPO) 是一种先进的异构集成技术，将光学器件和硅片集成在单个封 装基板上，旨在应对下一代带宽、功耗和成本挑战。CPO 融合了光纤、数字信号处理 (DSP)、ASIC 以及先进的封装和测试技术，为支持横向扩展和纵向扩展网络的数据中心互连提供颠覆性的系统价 值。 博通进一步指出，如今，可插拔光模块内部需要高功率 DSP，以补偿信号从 ASIC 传输过程中产生 的路径互连损耗。随着 SerDes 技术扩展到 212 G ...

Core Viewpoint - The article discusses the urgent need for advanced cooling technologies in data centers due to the increasing power density of computer chips, particularly driven by artificial intelligence applications. Traditional fan-based cooling methods are becoming inadequate as chip power consumption rises significantly, necessitating a shift towards liquid cooling solutions [2][3][20]. Group 1: Current Challenges in Data Centers - The average power density of racks is currently around 8 kW, but it is expected to rise to 100 kW for AI applications, creating a pressing need for improved cooling methods [3]. - The power consumption of GPUs has escalated dramatically, with the latest models reaching up to 1200 watts, and projections suggest future chips may exceed 2000 watts [2][3]. Group 2: Liquid Cooling Technologies - Liquid cooling is seen as the future for AI-focused data centers, with various methods being explored, including single-phase direct chip cooling, two-phase direct chip cooling, single-phase immersion cooling, and two-phase immersion cooling [4][5][10][12][15]. - Single-phase direct chip cooling involves circulating a coolant, typically a water and glycol mixture, directly over the hottest chips to absorb heat [5][7]. - Two-phase direct chip cooling utilizes the latent heat of vaporization, allowing a special dielectric fluid to boil and absorb heat more efficiently than single-phase methods [8][10]. Group 3: Immersion Cooling Techniques - Single-phase immersion cooling involves submerging servers in a dielectric fluid, which can lead to significant energy savings and a dust-free environment [12][14]. - Two-phase immersion cooling is emerging as a promising technology, where servers are submerged in a boiling liquid, providing up to 100 times the cooling capacity of single-phase methods [15][17]. - The total cost of ownership for two-phase immersion cooling systems is estimated to be lower than that of single-phase systems due to reduced power requirements and simplified mechanical systems [18]. Group 4: Industry Outlook - The demand for cooling technologies is expected to grow alongside the increasing power requirements of AI systems, with industry experts emphasizing the need for continued innovation in cooling solutions [19][20]. - Companies are actively researching and developing new cooling technologies to address the challenges posed by high-density computing environments [20].

2025年10月15-17日 ， 第二届湾区半导体产业生态博览会（湾芯展2025） 将在 深圳会展中心（福田） 盛大开幕。 60000+㎡ 展览面积、 600+ 家半导体优质企业、 30+ 场同期活动，预计吸引 60000+ 名专业观众参展参会，数百位半导体行业大咖、专家学者齐聚，共襄盛会。 提前预登记，免现场排队 大咖汇聚，共襄盛会 同期活动一览 | 时间 /Time | 论坛 /Forum | 地点 /Location | | --- | --- | --- | | | 10月 14日 | | | 09:30-17:30 | 第九届国际先进光刻技术研讨会 Day1(收费论坛) | 五洲宾馆 | | | International Workshop on Advanced Patterning Solutions-IWAPS (Premium Forum) | Wuzhou Guest House | | 14:00-16:00 | TOP20 高层战略研讨闭门会(国际) | 五洲宾馆 | | | Top20 Executive Strategy Retreat (International) | Wuzh ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ：内容 编译自 Wired 。 1999年，《过山车大亨》（Rollercoaster Tycoon）或许算不上最火爆的电脑游戏。但如果你深入探 究像素之下——摇摇晃晃的游乐设施，饥肠辘辘、口渴难耐、呕吐不止的人群（以及在他们身后拖地 的清洁工）——深入代码层面，你会看到这款游戏对工艺的执着近乎疯狂。游戏的唯一开发者克里斯 ·索耶（Chris Sawyer）用汇编语言编写了整款游戏。 某些编程语言，例如 Python、Go 或 C++，之所以被称为"高级"语言，是因为它们的工作方式有点 像人类语言，用命令和习语编写，这些命令和习语在诗歌朗诵会上或许会用得上。一般来说，像编译 器这样的软件会将这些语言转换成机器真正能读懂的东西：由 1 和 0（或者可能是十六进制）组成的 数据块，用来告诉实际的晶体管如何工作。汇编语言是"低级"语言中最低级的一种，它与机器的母语 几乎一一对应。它直接在机器上编码。用汇编语言开发一款复杂的电脑游戏就像用脱落的猫毛编织挂 毯。 为什么有人会这么做？效率是原因之一。在 20 世纪 90 年代，高级编程的工具并不齐全。编译器非 常慢。 ...

Core Viewpoint - Samsung Electronics' semiconductor division has shown a strong recovery in Q3 2023, with preliminary sales increasing by 8.72% year-on-year to 86 trillion KRW and operating profit rising by 31.81% to 12.1 trillion KRW, exceeding market expectations [1][2]. Group 1: Financial Performance - The operating profit has rebounded to around 10 trillion KRW for the first time in five quarters, marking the highest value since Q2 2022 [1]. - Compared to Q2 2023, where a 1 trillion KRW loss was recorded due to unsold memory inventory, the operating profit growth represents a 158.55% increase [1]. - The semiconductor business (DS division) is expected to generate around 5 trillion KRW in operating profit, significantly higher than the 400 billion KRW in Q2 2023 [1]. Group 2: Market Dynamics - The semiconductor industry is entering an "early semiconductor super cycle," driven by a surge in demand, particularly for AI accelerators and high-bandwidth memory (HBM) [3]. - The average fixed trading price for general PC DRAM products (DDR4 8Gb) rose by 10.53% in September, reaching $6.3, the highest since January 2019 [4]. - Analysts predict that Samsung Electronics will capture 32% of the DRAM market and 30% of NAND flash production by 2026, positioning it as a major beneficiary of the memory super cycle [4]. Group 3: Business Developments - Samsung Electronics has passed NVIDIA's HBM3E quality tests and is negotiating supply volumes, enhancing its competitive position against SK Hynix [5]. - The company is expanding its high-performance DRAM supply through participation in OpenAI's Stargate project, which is expected to significantly boost HBM sales [6]. - The foundry business is showing signs of recovery, with new customer orders focusing on 8-4nm processes, and the production of the Exynos 2600 processor is expected to increase utilization rates [7]. Group 4: Product Performance - The smartphone business contributed positively to Q3 performance, with the Galaxy Z Fold7 performing well in markets like the U.S. [8]. - Samsung Display's profits are estimated to reach around 1 trillion KRW, as the company begins supplying OLED panels for Apple's iPhone 17 [8]. - Despite challenges in the home appliance and TV sectors due to tariffs and logistics costs, overall performance is expected to improve, with projected operating profit for 2026 raised by 36% to 73 trillion KRW [8].

公众号记得加星标⭐️，第一时间看推送不会错过。 来源： 内容 编译自 Yole 。 半导体后端设备市场正在进入一个新时代。该市场曾一度由成熟且成本敏感的工艺主导，如今正被颠 覆性的封装技术和日益复杂的半导体器件重塑。预计2025年至2030年间，后端设备市场规模将从69 亿美元增长至98亿美元，年复合增长率高达7.1%。 这种扩张不仅是产量增长的结果，也是深刻的技术变革重新定义行业的结果。随着先进封装成为高性 能计算 (HPC)、人工智能 (AI) 和汽车应用的关键，后端不再是事后诸葛亮。相反，它已成为半导体 性能和系统级集成的关键推动因素。 市场动态：通过复杂性实现转型 半导体制造业正在快速发展，而后端是这一转型的核心。从芯片架构到异构集成，再到HBM的兴 起，一系列因素共同推动了对新型设备的需求。 截至2025年，核心后端设备细分市场包括芯片键合机、倒装芯片键合机、热压键合机 (TCB)、混合 键合、引线键合、晶圆减薄、切割以及计量与检测。虽然引线键合等传统解决方案仍然具有市场潜 力，但TCB和混合键合等先进技术才是推动最重大变革的关键。 混合键合：混合键合是当今最具颠覆性的后端技术。它能够实现低于 5 ...

Core Insights - The research team from Peking University has achieved a breakthrough in high-precision, scalable analog matrix equation solving, published in Nature Electronics, marking a significant advancement in analog computing technology [1][2] - This innovation demonstrates that analog computing can efficiently and accurately address core computational problems in modern science and engineering, potentially disrupting the long-standing dominance of digital computing [2][3] Group 1: Key Innovations - The first key innovation is the use of resistive random-access memory (RRAM), which allows for precise control of resistance states and retains data without power, enabling it to function as both a memory and a computing unit [4] - The second key innovation stems from a foundational discovery in 2019, where the team designed an analog circuit capable of solving matrix equations in a single step, significantly compressing traditional iterative algorithms [5] - The third key innovation is the "bit slicing" technique, which breaks down 24-bit precision into multiple 3-bit segments for processing, allowing for a more sophisticated and efficient analog computation [5] Group 2: Practical Implications - The breakthrough allows for solving matrix equations with 24-bit precision in just a few iterations, drastically reducing the computational steps required for complex tasks, such as 6G signal detection [7] - In the AI field, this advancement could alleviate the "computational bottleneck" faced by large models, enabling faster and more efficient training processes [7] - The technology also addresses critical challenges in 6G communication, enhancing signal detection capabilities while significantly reducing energy consumption [8]

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ：内容 编译自 CNBC 。 博通半导体解决方案集团总裁 Charlie Kawwas周一表示，OpenAI 并不是其在 9 月份财报电话会议 上宣布的那个价值100 亿美元的神秘客户。 Kawwas 与 OpenAI 总裁 Greg Brockman 一起出现在 CNBC 的" Squawk on the Street "节目中， 讨论他们共同构建和部署 10 千兆瓦定制人工智能加速器的计划。 这笔交易在分析师们迅速指出 OpenAI 将成为博通潜在的 100 亿美元新合作伙伴后，基本上是意料 之中的事情。但在两家公司周一正式公布计划后，Kawwas 表示 OpenAI 并不符合这一描述。 "我很想从我的好朋友格雷格那里得到一份 100 亿美元的（采购订单），"卡瓦斯说。"他还没给我那 份采购订单。" 博通没有立即回应 CNBC 的进一步评论请求。 博通并未透露其大型网络客户，但分析师指出谷歌、Meta以及TikTok母公司字节跳动是其三大客 户。博通首席执行官陈福阳在9月份与分析师举行的季度电话会议上表示，第四大客户已下达价值100 亿美元的定制AI芯 ...

Core Insights - Japanese electronic component manufacturers are restructuring global production in response to US-China trade tensions, with Tamura Electric planning to reduce its bases in China by 30% by March 2028 [2] - The global shipment volume of Japanese electronic component manufacturers is expected to reach a record 4.53 trillion yen in FY2024, marking a 3% increase from the previous year [4] Group 1: Company Actions - Tamura Electric will begin mass production of current sensors in Saitama Prefecture, Japan, in November, shifting from previous production solely in China [2] - TDK plans to start mass production of smartphone batteries in Haryana, India, by the end of this year, marking the first production of such components outside China [2] - Murata Manufacturing will establish its first production base in India for multi-layer ceramic capacitors (MLCC) by FY2026, aiming to localize production [3] Group 2: Market Trends - The US has announced tariffs on Chinese products, with rates fluctuating from 145% to 30%, and recently indicating a potential increase to 100% on imports due to China's restrictions on rare earth exports [3] - Japanese electronic component manufacturers are increasingly shifting production bases to Southeast Asia and India to mitigate the impact of high tariffs on Chinese-made components [3] - Exports to regions outside Japan and China have increased by 9%, reaching 958.6 billion yen, indicating a diversification in market focus [4]