Core Viewpoint - AMD is planning to adopt multi-chip module (MCM) architecture for consumer-grade GPUs, leveraging its experience from the Instinct MI200 AI accelerator series, which was the first to implement MCM design [3][5]. Summary by Sections Multi-Chip Module (MCM) Concept - The MCM concept is gaining traction in the graphics processing industry due to limitations of single-chip designs, with AMD being a key player in this transition [3]. - AMD's Instinct MI200 series integrated multiple chiplets, including graphics processing cores, HBM stacked memory, and I/O chips [3]. Technical Innovations - AMD's new patent reveals a "smart switch data structure circuit" that connects compute chiplets with memory controllers, optimizing memory access and reducing latency to nanoseconds [4]. - Each Graphics Compute Die (GCD) will feature L1 and L2 caches, similar to AI accelerators, and will have access to a shared L3 cache through the switch, minimizing global memory access [4]. Ecosystem and Competitive Advantage - AMD has a complete ecosystem in place, utilizing TSMC's InFO-RDL bridging technology and a specific version of Infinity Fabric for chip interconnects [5]. - The integration of gaming and AI architectures into a unified UDNA architecture positions AMD favorably against competitors, despite the complexities associated with chiplet designs [5]. Future Outlook - AMD aims to address latency issues experienced in previous architectures, such as RDNA 3, through innovative solutions like the shared L3 cache [5]. - The market may not see the full impact of these innovations until the release of UDNA 5 [5].

Core Viewpoint - Intel's subsidiary RealSense has officially spun off to become an independent company, securing $50 million in funding to expand into new markets and accelerate innovation in AI, robotics, and biometrics [3][4]. Group 1: Company Overview - RealSense is a leading developer of computer vision systems, focusing on depth perception and tracking technology, enabling devices like robots and drones to understand their 3D environments [3]. - The company's core product line includes a popular series of "depth cameras" that utilize stereo vision, structured light, and time-of-flight technologies for precise depth measurement [3][4]. - RealSense has embedded its depth camera products in approximately 60% of the global autonomous mobile robots (AMR) and humanoid robots, serving over 3,000 clients worldwide [4]. Group 2: Market Potential - The global robotics market is projected to grow from $50 billion to over $200 billion in the next six years, with significant growth driven by humanoid robots and other smart devices that rely on computer vision technology [4]. - Biometric technology is expected to expand rapidly, becoming a standard feature in airport security and large event access control systems [5]. Group 3: Strategic Initiatives - The funding will be used to expand the sales team, accelerate product development, and recruit AI, robotics, and software engineers to strengthen RealSense's leadership in AI vision technology [5]. - RealSense's CEO emphasized that their technology aims to enhance human capabilities by taking over repetitive tasks, allowing humans to focus on more creative and decision-making roles [5].

Core Viewpoint - The semiconductor industry is crucial for modern technology and is a key driver of innovation, with the U.S. holding a significant share of the global market but facing challenges from international competitors [1][2]. Group 1: Current State of the Semiconductor Industry - By 2025, semiconductors will be foundational to various sectors, including AI, quantum computing, and defense systems, highlighting their importance in global technological leadership [1]. - The U.S. semiconductor industry has seen a decline in manufacturing capacity from 37% in 1990 to just 10% in 2022, raising concerns about future competitiveness [1]. - The U.S. semiconductor industry currently accounts for over 50% of global chip revenue, but its manufacturing capacity is under threat from international competition [1][43]. Group 2: Government Initiatives and Investments - Significant government incentives and research investments have been implemented to reverse the decline in U.S. semiconductor leadership, with over $500 billion in private investments announced across 28 states [2][11]. - These investments are expected to create over 500,000 jobs and double U.S. chip manufacturing capacity by 2032 [2][11]. - The Advanced Manufacturing Investment Credit (AMIC) has been increased from 25% to 35%, further stimulating investment in the semiconductor sector [11]. Group 3: Research and Development - Federal R&D investments are crucial for maintaining and expanding U.S. technological leadership, with 2024 R&D spending projected to reach $62.7 billion, a 5.7% increase from 2023 [18][19]. - The semiconductor industry invests 17.7% of its revenue in R&D, the second highest among U.S. industries, which supports innovation and market leadership [19][18]. - Ongoing federal research initiatives are essential for fostering innovation and enhancing national security [13][14]. Group 4: Workforce Development - The semiconductor industry employs approximately 345,000 people directly, with a projected shortfall of 67,000 skilled workers by 2030 [29][32]. - Collaboration between government and industry is necessary to expand the pipeline of STEM graduates and attract top engineering talent [32]. - A skilled domestic workforce is vital for maintaining U.S. leadership in the semiconductor sector and ensuring economic and national security [32]. Group 5: Global Market Dynamics - The U.S. semiconductor industry generates about 70% of its revenue from international sales, emphasizing the need for a strong global market presence [40]. - The global semiconductor market is projected to grow to $701 billion by 2025, with the U.S. expected to maintain a significant share [54][55]. - The demand for semiconductors is driven by advancements in AI, 5G, and other transformative technologies, with a strong growth outlook for the next decade [56][59]. Group 6: Economic Contributions - The U.S. semiconductor industry remains a top export sector, with exports projected to reach $57 billion in 2024, reflecting a 13% growth [43][44]. - The industry's growth is supported by increasing domestic manufacturing capacity and significant investments, enhancing export potential [44]. - The semiconductor sector's health is critical for the U.S. economy, influencing various downstream industries such as AI, telecommunications, and healthcare [60][61].

Core Viewpoint - Qualcomm has been relatively inactive in the wearable chip market compared to its smartphone chip investments, but it is now reportedly developing a new wearable platform that could significantly enhance the performance of next-generation Wear OS devices [1][2][3]. Group 1: Qualcomm's Wearable Chip Development - Qualcomm's previous wearable chips were mostly adaptations of existing smartphone chips, with minimal custom designs specifically for wearables [2]. - The new chip, codenamed Aspen and model SW6100, is currently in internal testing and is expected to be a significant upgrade over previous models [3][4]. - The SW6100 chip is manufactured using TSMC processes, which is anticipated to improve energy efficiency compared to previous generations [3]. Group 2: Technical Specifications and Improvements - The SW6100 will feature an upgraded memory controller supporting LPDDR5X, which is expected to enhance battery life compared to the previous W5 Gen 1 that only supported LPDDR4 [3]. - The CPU architecture of the SW6100 includes 1× Cortex-A78 and 4× Cortex-A55 cores, marking a substantial upgrade from the older Cortex-A53 used in previous models [4]. - The introduction of the QCC6100 co-processor is noted, although specific details about it are currently unknown [3]. Group 3: Future Outlook - If the SW6100 chip successfully enters mass production, it is projected to appear in Wear OS smartwatches by 2026 [5].

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：本文编译自 Chip Interfaces ApS 。 飞利浦半导体公司（现为恩智浦半导体公司）于 1980 年发明的 I2C（Inter-Integrated Circuit：内 部集成电路）总线，在简化嵌入式系统通信方面迈出了一大步。它是一种简单的双线接口，用于同 步、多主/多从、单端串行通信。 45 年后，它仍然广泛用于连接低速外设集成电路 (IC)、处理器和微控制器。但如今的硅片已经发 生了变化，我们已经从 8 位 MCU 发展到多核 SOC，从简单的传感器发展到复杂的多模传感器设 备。对带宽、延迟和功耗的需求都在增加，而这正是新型改进型总线变体得以发展的契机。 什么是I3C以及它为何重要？ I3C（Improved Inter-Integrated Circuit：改进型集成电路）是由MIPI 联盟开发的一种总线，是一 种基于 I2C 的双线接口，并对其进行了改进以提高速度和效率。它旨在取代 I2C（以及部分 SP I），同时仍保持与 I2C 的向后兼容。它提供高达 12.5 MHz 的更高时钟速度、无需额外线路的带 内中断、动态寻址、双数据速率 ...

Core Viewpoint - The article discusses a groundbreaking photonic chip developed by researchers at Laval University, capable of transmitting data at a speed of 1 terabit per second (1 Tbps) while consuming significantly less energy than traditional systems [3][4]. Group 1: Technology Breakthrough - The photonic chip utilizes the phase of light for data transmission, expanding the signal dimensions compared to traditional methods that rely solely on light intensity [4]. - The chip can transmit data at a speed of 1000 gigabits per second (Gbps), a substantial increase from the current maximum of approximately 56 Gbps [4]. - It requires only 4 joules of energy to achieve this transmission speed, equivalent to the energy needed to heat 1 milliliter of water by 1°C [4]. Group 2: Implications for AI and Data Centers - This dual-channel design not only reduces the chip's size but also significantly enhances bandwidth, making it an ideal solution for AI data centers [5]. - At a speed of 1000 Gbps, the chip can transmit an entire training dataset, equivalent to 100 million books, in less than seven minutes [5]. - The new technology allows for efficient communication between processing units, potentially addressing the increasing energy demands of AI systems [5]. Group 3: Future Prospects - Although the technology is still in the laboratory stage, commercial applications are anticipated to be on the horizon, with companies like NVIDIA already utilizing microring modulators [5]. - The breakthrough introduces phase modulation as a new dimension, bringing the industry closer to the concept of "light-speed AI" [5]. - The research team has laid the groundwork for this technology over the past decade, indicating a potential for significant advancements in the coming years [5].

Core Viewpoint - GlobalWafers faces significant challenges in its development due to dual threats from market competition and investment pressures, leading to a decline in stock price from over 600 TWD to around 300 TWD this year [2]. Group 1: Financial Performance - GlobalWafers plans to invest 4 billion USD in expanding its advanced 12-inch silicon wafer manufacturing facility in Texas, despite a projected revenue decline of 11.4% to 62.6 billion TWD in 2024 compared to 2023 [2][3]. - The company's earnings per share (EPS) for 2024 is expected to be 21.06 TWD, more than halving from the previous year, with Q1 2024 EPS at 3.05 TWD, a decline of over 60% year-on-year [2][3]. Group 2: Market Dynamics - The demand for 8-inch wafers is limited, and the market is facing low-price competition from China, which is expanding its silicon wafer production capacity [4]. - GlobalWafers' revenue is primarily from mature 8-inch wafers, and the transition to advanced 12-inch wafers is contingent on new capacities in Europe and the US [3][4]. Group 3: Strategic Initiatives - The company is focusing on SOI (Silicon On Insulator) wafers, which are critical for silicon photonics packaging, and plans to establish the first and only 12-inch SOI wafer production line in Missouri [5][6]. - The SOI wafer market is projected to grow at a compound annual growth rate of 13.6%, reaching 10.5 billion USD by 2032, indicating a strategic opportunity for GlobalWafers [6]. Group 4: Impact of Subsidiary Performance - GlobalWafers holds a 13.67% stake in Siltronic AG, which reported a revenue decline of 6.7% to 1.41 billion EUR and a significant drop in EPS by 65.9% [6][7]. - The performance of Siltronic AG negatively impacts GlobalWafers' financials, with potential EPS impact exceeding 4 TWD if Siltronic's stock price drops significantly [7].

Core Viewpoint - A former employee of semiconductor companies ASML and NXP was sentenced to three years in prison for sharing sensitive company technology with Russian contacts, violating EU sanctions [1][2][3] Group 1: Legal Proceedings - The court in Rotterdam sentenced German Aksenov to three years in prison, reducing the initial four-year sentence due to lack of payment evidence [6] - Aksenov was arrested in August 2023 and has been in custody since then, facing charges of selling design manuals and contacting the Russian Federal Security Service (FSB) [2][3] - The court found that Aksenov copied hundreds of confidential documents from ASML and NXP's servers and shared them with a Russian individual [3][5] Group 2: Implications of the Crime - The prosecution emphasized the severity of the crime, noting that microchips are critical components for military vehicles, precision weapons, and drones [2] - By assisting Russia in semiconductor production, Aksenov was considered to have made a "significant contribution" to violence against Ukraine [2] - The court stated that the sanctions aim to limit Russia's access to technology that could aid its military during conflicts [4]

相较于辉达第一季69% 的营收暴增，台积电第二季成长幅度略显保守，不过在高阶芯片制造领域， 台积电依然占据无可动摇的领先地位。 业界普遍认为，未来数年内难有竞争对手能撼动其地位。英特尔（Intel）持续努力吸引AI 业者采用 其制造设施，但成效有限。 公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容来自 巴伦周刊 。 《巴隆周刊》报导，辉达是当今人工智能(AI) 芯片的超级巨星，不过全球晶圆代工龙头台积电有望 成为比辉达更大的AI 芯片赢家。 根据台积电周四(10 日) 公布的最新月度报告，第二季营收达新9338 亿新台币(约319.3 亿美元)，优 于市场预期的9240.5 亿新台币，年增幅高达39%，虽略低于第一季42% 的年增，但仍展现强劲动 能。 台积电并未揭露各产品线营收细节，预计将于7 月17 日的法说会中进一步说明。 不过报导指出，市场普遍认为，推升营收的主力来源正是来自AI 芯片的订单，尤其来自主要客户辉 达( NVDA-US ) 的需求。辉达近期市值突破4 兆美元，成为市场焦点，其高效能运算需求亦同步带 动台积电产能满载。 尽管台积电ADR 周四小幅回落0.90%，市场认为这可能与 ...

Core Insights - The explosive growth of artificial intelligence since 2020 has significantly driven the development of the semiconductor industry, particularly through the need for advanced interconnect protocols to optimize performance [1][3]. Market Growth and Projections - The interface IP market is expected to grow by 23.5% in 2024, reaching $2.365 billion, with a projected annual growth rate of around 20% from 2024 to 2029 [3][10]. - Despite a decline in the semiconductor market in 2023, the interface IP market still saw a growth of 17% [3]. - The share of interface IP in the overall IP market has increased from 18% in 2017 to 28% in 2023, with expectations to rise to 38% by 2024 [3][10]. Key Protocols and Their Growth - The majority of growth in the interface IP market is anticipated to come from three categories: PCIe, memory controllers (DDR), and Ethernet/SerDes, with five-year compound annual growth rates (CAGR) of 17%, 17%, and 21% respectively [10]. - The top five protocols are projected to grow from $2.2 billion in 2024 to $4.9 billion by 2029, maintaining a CAGR of 17% [10]. Company Performance and Market Share - In 2024, the design IP revenue is expected to reach $8.5 billion, marking a 20% increase, with wired interfaces being the primary growth driver [13][15]. - The top four IP companies (ARM, Synopsys, Cadence, and Alphawave) are projected to capture 75% of the market share in 2024, with growth rates exceeding the overall market [13][15]. - ARM's market share is expected to decrease from 48.1% in 2016 to 43.5% in 2024, while Synopsys is projected to increase its share from 13.1% to 22.5% [16][17]. Strategic Shifts and Future Trends - A significant strategic shift is anticipated in the next decade, with IP suppliers focusing on multi-product strategies and promoting ASICs, ASSPs, and chiplets based on leading IP [11]. - Companies like Credo and Rambus have already begun to generate substantial revenue from ASSPs, with measurable results from chiplets expected by 2026 [11]. Summary of Key Players - Synopsys is expected to lead the IP licensing revenue market with a 32% share in 2024, followed closely by ARM at 30% [21]. - Alphawave has rapidly grown to rank fourth in the market, highlighting the importance of high-performance SerDes IP for modern data center applications [23].