如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自半导体行业观察综合 。 申报资料显示，英伟达CEO黄仁勋今年计划交易出售英伟达价值逾8亿美元的股票。只不过，他目 前为止还没出售半股。 根据美国证管会（SEC）28日揭露的英伟达申报资料，黄仁勋3月20日依所谓「10b5-1」规则拟订 计划，将出售英伟达600万股。只不过，黄仁勋这项计划目前尚未售出任何英伟达股票。 黄仁勋在他上次的计划中也出售相同数量的股票，他在去年6月14日至9月13日间出售自家股票， 总计获得7.13亿美元入袋，平均每股售价118.83美元。 由 于 英 伟 达 股 价 持 续 飙 涨 ， 因 此 他 今 年 的 计 划 可 望 让 他 收 获 更 丰 。 若 根 据 英 伟 达 28 日 收 盘 价 134.81美元，黄仁勋今年计划出售的股票将价值8.09亿美元。英伟达29日早盘因财报佳而开高走 高，一度上涨3.8%，站上140美元整数大关。 黄仁勋资产，近千亿美元 身着皮夹克的英伟达联合创始人兼首席执行官黄仁勋不仅是一位科技界的远见卓识者，还是硅谷最 富有、最具影响力的人物之一。如今，英伟达已覆盖从游戏PC到全球最先进AI系统等 ...

Core Viewpoint - The article discusses the transformative shift in computing paradigms from CPU-centric to memory-centric systems, emphasizing the emergence of "AI memory chips" as a key innovation in enhancing system efficiency and intelligence [1][3]. Group 1: Technological Transition - The transition from storage to "memory power" represents a significant upgrade in technology, redefining the boundaries of advanced memory capabilities [2]. - The company, DeYi Microelectronics, has introduced the concept of "AI memory chips," which aims to implement AI intelligence in memory units, providing valuable computational offloading and data insights for AI systems [1][3]. Group 2: Company Developments - DeYi Microelectronics is one of the few domestic companies with complete independent research and development capabilities for storage control chips, marking a high point in its development history [3]. - The company has successfully integrated its storage control chip products with leading smartphone manufacturers and has made significant breakthroughs in industrial and automotive storage markets, particularly achieving double-digit growth in automotive products [3]. Group 3: AI Integration and Challenges - The rise of AI has shifted the role of storage, where core data now includes model parameters and neural network weights, with GPUs taking precedence over CPUs in storage systems [3][4]. - Current challenges in AI systems include bandwidth bottlenecks and the limitations of existing memory technologies like HBM, necessitating a reevaluation of product strategies [4]. Group 4: AI-MemoryX Innovation - The AI-MemoryX graphics memory expansion card developed by DeYi Microelectronics significantly increases single-machine memory capacity from traditional levels to the terabyte range, enabling the training of large models with fewer GPUs [6]. - This technology not only serves as an expansion card but also as a comprehensive solution for fine-tuning large models, providing extensive technical support for AI applications [6]. Group 5: Future Strategy - The company plans to follow a three-step strategy: leveraging existing chips and software for rapid value creation, embedding software innovations into chips, and promoting the application and ecosystem of AI memory chips [7]. - DeYi Microelectronics aims to redefine the computing paradigm with its AI memory chips, transitioning from passive support of computing power to actively driving it [9].

如果您希望可以时常见面，欢迎标星收藏哦~ 尽管已经发现了数百种二维材料，但将它们组合成全新的材料仍然是一项挑战。大多数尝试都是像 卡片一样堆叠这些层，但这些层之间的相互作用通常很弱。 "各层之间并不是简单地相互叠加；电子会移动并形成新的相互作用和振动状态，从而产生任何一 种材料本身都不具备的特性。"研究第一作者、莱斯大学博士生Sathvik Iyengar说。 更重要的是，艾扬格指出，这项新技术可以应用于各种二维材料，从而可以设计用于量子器件、光 子学和下一代电子产品的混合材料。 艾扬格补充道："它为结合全新的二维材料打开了大门，例如将金属与绝缘体或磁铁与半导体结合 起来，从头开始创造定制材料。" 该团队开发了一种两步单反应方法，从含有硅和碳的液体前体中生长出石墨烯。通过在加热过程中 仔细调节氧气含量，他们首先形成石墨烯，然后改变条件以促进二氧化硅层的形成。 为了实现这一目标，研究人员与印度贝拿勒斯印度大学客座教授 Anchal Srivastava 合作，历时数 月，构建了一个定制的高温低压装置。 艾扬格表示："正是这种装置使得合成成为可能。最终得到的材料是一种真正的混合物，具有新的 电子和结构特性。" 来 ...

Core Insights - Qualcomm is leveraging its experience in low-power CPU design from the mobile sector to enter the cloud computing market with a focus on cost-effective and energy-efficient server chips [1][2] - The Falkor CPU architecture is designed to meet performance benchmarks while maintaining low power consumption and silicon area requirements [4][7] - The Centriq 2400 series chips integrate up to 48 Falkor cores on a 398 mm² die, with a thermal design power (TDP) of 120 watts, indicating a power consumption of less than 2.5 watts per core [7][8] Performance and Architecture - Falkor is a 4-wide aarch64 core that runs on a 64-bit Arm instruction set, inheriting features from Qualcomm's previous mobile cores [4] - The architecture includes a unique L0 and L1 instruction cache setup, providing higher instruction cache capacity compared to contemporary cores [9][13] - Falkor's performance in SPEC CPU2017 tests shows a significant lead over Arm's Cortex A72, with a 21.6% advantage in integer operations and a 53.4% lead in floating-point operations [74][76] Memory and Cache Design - The L2 cache of Falkor is 512 KB with 8-way set associative design, serving as an intermediate cache between L1 and the on-chip network [49] - The Centriq's L3 cache capacity totals 60 MB across 12 slices, with a latency of 40.9 ns, which is relatively high compared to competitors [61][65] - Falkor's memory subsystem is designed to handle high bandwidth, with a theoretical memory bandwidth of 128 GB/s [69] System Architecture - The Centriq architecture does not support multi-socket configurations, limiting it to a maximum of 48 cores, which is a strategic decision to focus on mainstream cloud applications [71][72] - The interconnect topology utilizes a segmented ring design, allowing for efficient data transfer between cores and caches [56][58] Future Outlook - Qualcomm aims to re-enter the server market with new CPU offerings, building on the lessons learned from the Centriq experience [90][91] - The company is exploring partnerships for AI solutions, indicating a strategic pivot towards integrating AI capabilities into its server offerings [91]

Core Viewpoint - The new export restrictions imposed by the U.S. on China have created uncertainty for Synopsys in selling chip design software, leading the company to suspend its annual and quarterly forecasts [1][2]. Group 1: Impact of U.S. Export Restrictions - Synopsys announced the suspension of its financial guidance for Q3 and the full year of FY2025 due to new export restrictions from the U.S. Department of Commerce [2][3]. - The U.S. has ordered multiple companies to halt shipments to China without a license, affecting the export of Electronic Design Automation (EDA) software [1][2]. - Cadence Design Systems also reported that it now requires a license to export EDA software to China, indicating a significant regulatory change [3]. Group 2: Company Responses - Synopsys is currently evaluating the potential impact of the U.S. Department of Commerce's letter on its business and financial performance [1][2]. - Cadence stated that the new requirements are complex and that they are working with the Department of Commerce for further clarification [3].

Core Viewpoint - Malaysia is actively reshaping its position to become a core participant in the global semiconductor supply chain, aiming to attract over 500 billion Malaysian Ringgit (approximately 107 billion USD) in public and private investments through its National Semiconductor Strategy (NSS) launched in May 2024 [1][2]. Investment and Incentives - The Malaysian government has committed to providing 25 billion Malaysian Ringgit (approximately 5.3 billion USD) in incentives, including tax exemptions, grants, and infrastructure support to attract foreign investors and local entrepreneurs [2]. - Major semiconductor manufacturers like Intel and Infineon are expanding their operations in Malaysia, with Intel investing 7 billion USD in Penang and Infineon committing 5 billion Euros to enhance its power semiconductor capacity in Kulim [2]. Talent Development - The NSS includes an ambitious plan to train and upskill 60,000 local engineers to meet the complex demands of modern semiconductor manufacturing [2][3]. - A dual training system has been approved to combine classroom learning with practical factory experience, aiming to address the current skills gap and retain top engineering talent by offering competitive salaries [3]. Local Industry Growth - The NSS aims to nurture at least 10 local advanced packaging and integrated circuit (IC) design companies, with each expected to generate revenues between 1 billion to 4.7 billion Malaysian Ringgit (approximately 210 million to 1 billion USD) by 2030 [3]. - Government-related investors are creating targeted funding pools to support local deep-tech startups, emphasizing the commercialization of research outcomes in semiconductor physics and materials science [3]. Strategic Positioning - Malaysia's strategic location at the crossroads of East Asia and West Asia, along with its political neutrality, makes it an ideal place for semiconductor companies seeking to diversify their production bases [3][4]. - The country is enhancing its appeal as a regional semiconductor hub by actively participating in regional trade agreements and fostering cross-border R&D collaborations [4]. Sustainability and ESG Focus - Malaysia is positioning itself as a forward-thinking and environmentally conscious manufacturing base, integrating renewable energy and carbon tracking tools in semiconductor production [4]. - The NSS aligns with Malaysia's push for sustainable manufacturing practices, which is increasingly prioritized by technology companies [4]. Long-term Vision - Malaysia's investment in the semiconductor sector is not just about factories and engineers but also about establishing long-term technological sovereignty amid accelerating global semiconductor competition [5].

Core Viewpoint - Renesas Electronics has abandoned its plans to use silicon carbide (SiC) for power semiconductor production, which was initially set to begin in early 2025 at its Takasaki plant in Gunma Prefecture [1][2]. Group 1: Renesas Electronics' Strategy - Renesas Electronics previously announced plans to start producing next-generation power semiconductor products using SiC to reduce losses, but specific investment amounts and production scales were not determined [1]. - The company has signed a $2 billion deposit agreement with Wolfspeed to ensure a 10-year supply of SiC wafers and epitaxial wafers, which is crucial for its transition from silicon to SiC power devices [2]. Group 2: Wolfspeed's Role - The long-term supply agreement requires Wolfspeed to supply 150mm SiC bare wafers and epitaxial wafers starting in 2025, with plans to provide 200mm wafers once its manufacturing center in North Carolina is fully operational [2]. - Wolfspeed's executives emphasized the importance of having Renesas as a customer to lead the global transition from silicon to SiC, especially as demand for SiC in automotive, industrial, and energy sectors rises [2]. Group 3: Market Implications - The $2 billion deposit from Renesas will support Wolfspeed's capacity expansion plans, including the establishment of the largest SiC materials factory in the world [2]. - The shift to 200mm SiC wafers, which are 1.7 times larger than 150mm wafers, will allow for the production of more chips per wafer, thereby reducing device costs [2].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 earth 。 微软对新型量子计算设计的追求引发了广泛关注。其最新研究重点关注一种特殊的亚原子实体，这 种实体可以为曾经被视为不可能完成的任务提供更快、更可靠的计算能力。 "经过17年的努力，我们展示的成果不仅令人难以置信，而且是真实的。它们将从根本上重新定义 量子计算的下一阶段如何展开，"微软该部门负责人祖尔菲·阿拉姆（Zulfi Alam ）生动地描述了 这项工作。 意大利物理学家埃托雷·马约拉纳于 1937 年首次提出了马约拉纳费米子，强调了一种自身就是反 粒子的粒子。 由于这一概念具有增强量子硬件抗噪声能力的潜力，科学家们几十年来一直在追寻这一概念。 当信号因环境干扰而变得混乱时，量子硬件就会陷入困境。 Majorana 1的设计目的是通过以所谓的拓扑超导模式排列量子位来减轻这些影响，从而偏转常见 的干扰。 这一策略旨在让科学家在不牺牲速度的情况下获得更好的读数。 "我们将不再需要进行实验。你可以想象这样一个世界：科学家可以计算他们想要的材料，而且他 们的计算精度非常高，以至于第一次就能计算正确。"阿拉姆解释道。 微软的新芯片 Majora ...

Core Viewpoint - ASML's market value has decreased by over $130 billion (approximately 936.5 billion RMB) in less than a year due to export restrictions to China and uncertainties regarding U.S. tariffs [1][2]. Group 1: Market Impact - ASML's stock price reached a historical high of over €1000 per share in July last year, with a market capitalization of $429.5 billion, but has since fallen to just below $297 billion [1]. - The semiconductor sector has been volatile since last year, primarily due to increased U.S. restrictions on chip exports to China and tariff threats from the Trump administration [1][2]. - All equipment manufacturers in the semiconductor field have seen their stock prices decline, reflecting concerns over U.S. restrictions on China [1]. Group 2: ASML's Position and Future Outlook - ASML is considered a crucial player in the semiconductor supply chain, known for its extreme ultraviolet (EUV) lithography equipment, which is essential for producing advanced chips [2]. - The company has begun shipping its next-generation high numerical aperture (High NA) equipment, but has not been able to ship its most advanced lithography machines to China, limiting potential sales [2]. - ASML's CEO expects that the company's business in China will account for a lower percentage of revenue in 2025 compared to 2023 and 2024 [2]. Group 3: Analyst Sentiment - Despite external pressures, analysts remain relatively optimistic about ASML, with an average target price of slightly above €779, indicating a potential increase of about 17% from the recent closing price [3]. - Wells Fargo analysts expressed optimism about ASML's growth opportunities in 2025 and 2026, highlighting investments from companies like Samsung and Intel in next-generation chip manufacturing tools [3].

Core Viewpoint - AMD's acquisition of Enosemi aims to accelerate the development of co-packaged optical devices for AI systems, enhancing its position as a full-stack AI provider [1][2][3]. Group 1: Acquisition Details - AMD announced the acquisition of Enosemi, a startup focused on photonic integrated circuits, to boost its capabilities in optical device development for AI [1]. - The financial terms of the acquisition have not been disclosed, and Enosemi was founded in 2023 with 16 employees and 11 investors [1]. - Enosemi's products include integrated photodetectors and custom silicon chips, indicating a strong product portfolio that complements AMD's existing technologies [1]. Group 2: Technological Implications - Photonic integrated circuits utilize photons for data transmission, offering high speed and low power consumption, which is crucial for applications in healthcare, automotive, and communications [1]. - The demand for faster data transmission is increasing with the complexity of AI models, making co-packaged optical devices essential for next-generation AI systems [2][4]. - AMD's strategy includes integrating its leading CPU, GPU, and SoC technologies with enhanced networking, software, and system integration expertise to support advanced AI workloads [2][4]. Group 3: Future Outlook - The acquisition is expected to enhance AMD's capabilities in supporting various photonic and co-packaged optical solutions for AI systems [3][4]. - AMD aims to provide a comprehensive innovation stack that encompasses computing, networking, system architecture, and software, positioning itself uniquely in the AI market [4].