如果您希望可以时常见面，欢迎标星收藏哦~ 2022年，欧盟推出《欧洲芯片法案》（EU Chips Act），提出到2030年将欧洲在全球半导体制造 市场的份额从当前的不足10%提升至20%。这是一个雄心勃勃的目标，象征着欧洲希望在数字经济 和技术主权方面摆脱对亚洲与美国的过度依赖。 当时欧盟委员会主席乌尔苏拉·冯德莱恩还表示，欧洲约占全球芯片产量的10%，实现市场份额的 翻倍并不算是遥不可及的事情。 然而，时间过去近三年，围绕该法案的争议和批评也愈发明显。项目推进迟缓、生态薄弱、战略目 标不切实际等问题，引发了多家欧洲主流媒体的质疑。 但与此同时，欧洲并没有停下脚步。在先进设备、功率器件、RISC-V架构以及吸引国际巨头方 面，欧洲半导体产业仍在努力构筑自己的价值链与战略纵深。 欧盟委员会表示，审计院已知共有29项潜在或正在进行的生产能力投资。其中包括13个"新型设 施"项目，其中4个已获批准，9个正在规划中，其中也包括英特尔尚未开工的马格德堡工厂。这13 个项目占据已知投资的最大份额：其中260亿欧元来自国家援助，600亿欧元来自制造商自身。 这也就是说，如果没有300亿欧元的英特尔工厂，就有超过三分之一的 ...

Core Viewpoint - The article emphasizes the strength and growth potential of the U.S. semiconductor industry, highlighting the need for policymakers to implement robust measures to promote industry growth and technological innovation [1]. Group 1: Industry Overview - The global semiconductor sales have increased from $139 billion in 2001 to an estimated $630.5 billion in 2024, with a compound annual growth rate (CAGR) of 6.8% [11]. - The U.S. semiconductor industry regained its global market leadership in 1997, maintaining a market share of 50.4% as of now, after experiencing a significant loss in the 1980s [13]. - U.S. semiconductor companies' sales rose from $71.1 billion in 2001 to $318.2 billion in 2024, reflecting a CAGR of 6.7% [16]. - In 2024, U.S. semiconductor exports reached $57 billion, ranking sixth among all U.S. exports [21]. Group 2: Global Market Dynamics - The demand for semiconductors is primarily driven by consumer products such as laptops, smartphones, and automobiles, with increasing demand from emerging markets in Asia, Latin America, Eastern Europe, and Africa [24]. - The Asia-Pacific region is the largest semiconductor market, with China being the largest single-country market, accounting for nearly 46% of the Asia-Pacific market and 24% of the global market [28]. Group 3: Capital Expenditure and R&D Investment - In 2024, U.S. semiconductor companies invested a total of $119.5 billion in R&D and capital expenditures, with a CAGR of approximately 6.4% from 2001 to 2024 [31]. - The average annual capital expenditure as a percentage of sales has remained between 10% and 15% over the past 20 years, indicating the capital-intensive nature of the industry [39]. - R&D spending in the U.S. semiconductor industry has a CAGR of approximately 7.5% from 2001 to 2024, with total R&D investment reaching $70 billion in 2024 [40]. Group 4: Employment Impact - The U.S. semiconductor industry directly provides 345,000 jobs and supports over 1 million indirect jobs, resulting in nearly 2 million additional jobs created [49]. Group 5: Productivity - Since 2001, labor productivity in the U.S. semiconductor industry has more than doubled, with per capita sales revenue exceeding $744,000 in 2024 [51].

Core Insights - The article discusses the challenges and solutions related to the transition to Chiplet and 3D-IC technologies in the semiconductor industry, emphasizing the importance of standards and collaboration among companies [3][5][6]. Group 1: Challenges in Semiconductor Integration - Leading chip manufacturers have limited options for 2D scaling, prompting a shift towards multi-chip components and Chiplet integration [5]. - The integration of different chips poses significant challenges, including ensuring reliability and yield, which is more complex than traditional 2D design processes [6][7]. - The industry faces bottlenecks in integrating process and packaging technologies, as well as testing these complex chips [6][7]. Group 2: Importance of Standards and Collaboration - The concept of a "chiplet economy" is emerging, where various suppliers provide chips that are integrated into 3D-IC systems, creating both opportunities and challenges [5]. - Standards are crucial for reducing costs and improving efficiency, allowing companies to share the burden of technology development [6][9]. - The need for a unified platform that integrates different technologies and standards is highlighted as essential for successful Chiplet integration [11]. Group 3: AI and Productivity Challenges - The demand for AI-driven solutions is increasing as companies face productivity challenges in integrating chips and meeting market demands [7][8]. - Traditional scaling methods are becoming less effective, necessitating innovative approaches to bridge the productivity gap [8]. Group 4: Thermal Management Solutions - Effective thermal management is critical for the performance of 3D-ICs, with various cooling technologies such as microfluidics and immersion cooling being explored [11][12]. - Designers must consider thermal issues from the outset of the design process, integrating cooling solutions into the chip design [12][13].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自sourceability. 。 探索半导体市场如何发展到 2029 年，近岸外包、先进节点增长和关税影响将重塑采购策略。 根据Gartner 2025 年第一季度的预测，全球半导体市场正处于历史性的发展轨迹中，预计到 2030 年，年收入将超过 1 万亿美元。但这一增长故事不仅仅关乎规模，而是由复杂性驱动的。 随着人工智能的加速普及、电动汽车成为主流以及工业系统进一步走向边缘计算，对先进硅片的需 求将重新定义整个价值链的采购优先级。在2023年实现软着陆之后，芯片市场如今正强势回归。 Gartner预测，2025年和2026年半导体行业的收入将实现两位数增长，分别为11.8%和11.2%。这 一预测预示着该行业尽管面临诸多挑战，但仍将迎来全面复苏。内存价格波动、地缘政治风险加剧 以及美国全面加征的关税，都可能扰乱全球贸易路线。 从长远来看，分析师预测重心将转向边缘。Gartner 预测，工业自动化、机器人技术和分布式人工 智能工作负载将强劲增长，这些工作负载需要智能边缘设备。这些应用需要种类繁多的半导体，这 给采购策略带来了新的压力。 鉴于当前环境的不 ...

Core Viewpoint - Intel has unveiled several breakthroughs in chip packaging technology at the Electronic Components Technology Conference (ECTC), focusing on the new EMIB-T technology, which enhances power delivery and communication efficiency for advanced chip designs, particularly for HBM4 integration [5][14][32]. Group 1: EMIB-T Technology - EMIB-T integrates Through-Silicon Vias (TSVs) into the existing EMIB technology, improving power delivery efficiency and enabling ultra-high-speed communications between dies [12][14]. - The technology supports larger package sizes exceeding 120 mm x 180 mm and allows for more than 38 bridges, with die-to-die interconnection pitch scaling below 45 micrometers [12][15]. - EMIB-T is designed to be a cost-effective and scalable solution for heterogeneous integration, facilitating the mix and match of different die types on a single package [12][14]. Group 2: Thermal Management Innovations - Intel has introduced a novel disaggregated heat spreader design that improves thermal interface material (TIM) coupling, reducing voids by 25% and effectively cooling processors with a thermal design power (TDP) of up to 1000W [19]. - A new thermo-compression bonding process has been developed to minimize warping during the bonding process, enhancing yield and reliability for large package substrates [23]. Group 3: Strategic Importance of Packaging Technology - Advanced packaging technology is crucial for Intel Foundry as it aims to provide comprehensive chip manufacturing options, allowing integration of various chip types from multiple suppliers [32]. - Intel's packaging services have become a leading offering for external customers, including major industry players like AWS and Cisco, as well as government projects, contributing significantly to revenue generation [32].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自半导体行业观察综合 。 台积电考虑在阿联酋建立先进芯片工厂 据彭博社援引内部人士的话称，台积电正在考虑在阿拉伯联合酋长国（UAE）建造一座先进的生 产设施，这一决定需要得到华盛顿的批准。 台积电一直在与美国驻中东特使史蒂夫·维特科夫（Steve Witkoff）以及阿联酋总统兄弟监管的投 资工具MGX的官员进行磋商。这些谈判是乔·拜登总统执政期间启动的谈判的延续，该谈判在其任 期结束时暂停。 拟议项目是一项重大投资，旨在建设一座超级晶圆厂，该工厂由六座工厂组成，与台积电正在亚利 桑那州建设的工厂类似。阿联酋工厂的总成本尚未确定。台积电已为其凤凰城项目拨款1650亿美 元，其中包括研发和封装设施。 阿联酋潜在工厂的建设时间表尚不确定，业内人士暗示动工可能还需要几年时间。推进的决定取决 于华盛顿的批准。特朗普政府的一些高级官员对这家全球领先芯片制造商向海湾地区扩张可能带来 的国家安全和经济影响表示担忧。 台积电将在德国慕尼黑开设芯片设计中心 台积电计划在德国慕尼黑开设一个芯片设计中心。该公司本周在荷兰阿姆斯特丹举行的欧洲技术研 讨会上宣布了该工厂的建成。 据 ...

Core Viewpoint - The current licensing model of VMware is reportedly in violation of European competition regulations, raising concerns about Broadcom's business practices and their impact on cloud service providers in Europe [4][5]. Group 1: Licensing Issues - Broadcom has transitioned many VMware customers to a new licensing framework, which has resulted in significant financial burdens and operational disadvantages for clients [4][5]. - The European Cloud Computing Competition Observatory (ECCO) indicates that VMware's licensing practices may harm both customers and the broader European cloud ecosystem, suggesting that shareholders should question the legality of this model [5]. Group 2: Partner Program Changes - VMware has raised prices after eliminating perpetual licenses and monthly pay-as-you-go pricing, which has been a major concern for its cloud partners and customers [5]. - The ECCO report highlights that Broadcom's recent modifications to its partner program force cloud service providers to choose between acting as service providers or resellers, further diminishing their competitive capabilities [5]. Group 3: Recommendations for Change - CISPE and ECCO have called for Broadcom to implement significant changes to restore fair licensing for cloud service providers, including a six-month notice period for any changes in contract terms or pricing structures [6]. - Smaller cloud service providers should have easier access to higher partnership levels, and there should be more transparent pricing models that reflect actual usage [6].

Core Viewpoint - The article discusses the advancements and future potential of Fan-Out Panel Level Packaging (FOPLP) technology in the semiconductor industry, highlighting the strategic moves by major players like ASE Technology and Powertech Technology to enhance their operational contributions starting next year [4][6]. Group 1: Industry Trends - The global semiconductor industry is experiencing growth driven by emerging applications such as AI, high-performance computing (HPC), 5G, and automotive electronics, which are pushing advanced packaging technologies to the forefront [4]. - FOPLP technology is gaining traction due to its high efficiency, low cost, and high yield, making it a key solution for next-generation packaging [4]. Group 2: Company Developments - ASE Technology has been developing FOPLP for over ten years and plans to begin trial production by the end of this year, with a gradual increase in operational contributions starting next year [4]. - Powertech Technology has already started small-scale shipments of FOPLP and is validating high-end products for significant clients, indicating a positive outlook for future operational contributions [6]. Group 3: Technical Specifications - ASE Technology has progressed from a 300x300mm specification to a 600x600mm specification for FOPLP, with expectations that if the yield meets projections, it will become the mainstream specification [5]. - Powertech Technology has developed a packaging solution for a high-end system-on-chip (SoC) using a 2nm process, with a total packaging cost reaching $25,000, showcasing the high value of advanced packaging designs [6].

Core Insights - The global smartphone CMOS image sensor (CIS) shipment is expected to grow by 2% year-on-year in 2024, reaching 4.4 billion units [1][4] - Sony remains the market leader, followed by GalaxyCore and OmniVision [1][4] Group 1: Market Predictions - The average number of cameras per smartphone is projected to decrease from 3.8 in 2023 to 3.7 in 2024 [4] - The increase in CIS shipments is driven by a recovery in end-market demand [4] - The average selling price (ASP) of CIS is expected to rise due to advancements in technologies like LOFIC and multispectral imaging [6] Group 2: Company Performances - Sony's shipment volume has slightly increased due to improved production yields and higher demand for premium smartphones [4] - GalaxyCore's shipment volume has surged by 34% year-on-year, attributed to its cost efficiency and transition to a light wafer fab model [4][5] - OmniVision anticipates a 14% year-on-year growth in shipments, supported by the success of its 50MP image sensor [5] Group 3: Market Dynamics - SK Hynix plans to exit the CIS business by March 2025, potentially creating new growth opportunities for Chinese suppliers like GalaxyCore and OmniVision [5] - Geopolitical tensions and macroeconomic uncertainties are expected to pose challenges to the global smartphone market, leading to a slight decline in CIS shipments in 2025 [6]

Core Viewpoint - The semiconductor industry is experiencing a complex and prolonged downcycle that deviates from traditional cyclical patterns, indicating a structural change rather than a simple cyclical downturn [1][16]. Group 1: Semiconductor Cycle Understanding - The typical semiconductor cycle consists of phases from demand surge to recovery, lasting approximately 16 quarters or 4 years, but the current cycle has shown prolonged and complicated downturns since the pandemic began in 2021 [1]. - Recent reports suggest that Wolfspeed, a leading SiC company, is seeking bankruptcy protection, highlighting the uncertainty in the current market phase [1][17]. Group 2: Performance of Analog Chip Companies - The performance of major analog chip manufacturers in Q1 2025 generally exceeded market expectations, indicating potential positive signals in the industry [5]. - Companies like TI, ADI, and Infineon have shown signs of recovery in industrial and automotive markets, while others like Microchip are still struggling with all major markets at low points [8][9]. Group 3: Market Recovery and Predictions - The Q2 2025 financial guidance shows a 3.6% quarter-over-quarter growth but a 2.9% year-over-year decline, suggesting a potential recovery phase that is still cautious [11][13]. - Nine out of twelve analog chip companies have raised their performance expectations, with TI and ADI anticipating a return to year-over-year growth in Q2 [14]. Group 4: Structural Changes in the Industry - The semiconductor industry is witnessing a shift where investment decisions are increasingly influenced by non-market factors such as policy guidance and geopolitical considerations, rather than solely by market demand and financial returns [16][20]. - The market dynamics have changed, with companies that are well-positioned in industrial and communication sectors showing resilience, while those reliant on consumer electronics face ongoing challenges [22].