Core Viewpoint - The article discusses the increasing importance of Southeast Asia in the global semiconductor supply chain, particularly in the context of capital investment uncertainties stemming from the Trump administration's policies. It highlights the region's advantages such as low labor costs, strategic location, and government support, which are attracting major semiconductor companies to invest in manufacturing and assembly operations [1][2]. Group 1: Southeast Asia's Role in Semiconductor Industry - Southeast Asia is becoming a key region for semiconductor supply chain restructuring post-Trump era, with companies planning to relocate or build new facilities in response to trade uncertainties [1]. - The region is gaining traction in assembly, testing, and packaging (ATP) due to favorable government policies and low production costs, making it a competitive player in semiconductor investments [1]. - Malaysia is emerging as a global supply chain hub, accounting for 13% of the global semiconductor backend processes, with significant investments from companies like Intel, Broadcom, and Micron [1][2]. Group 2: Major Investments and Developments - Intel is expanding its backend assembly lines in Malaysia, while Micron is establishing its second packaging and testing facility in Penang [2]. - Texas Instruments is investing $3.1 billion (approximately 4 trillion KRW) in Malaysia for production facilities, and Infineon is setting up a silicon carbide power semiconductor manufacturing plant [2]. - ARM has chosen Malaysia as its first production base, with the Malaysian government agreeing to pay $250 million in patent fees over ten years to support ARM's semiconductor production [2]. Group 3: Growth in Vietnam's Semiconductor Sector - Vietnam's semiconductor market has grown by 41%, increasing from $10.62 billion in 2016 to $15.01 billion in 2023, with a focus on packaging and testing [3]. - The Vietnamese government is investing in talent development, implementing a $1 billion project to train approximately 50,000 semiconductor engineers [3]. - Industry experts suggest that due to the long-term nature of semiconductor investments, Southeast Asia is viewed as a safer choice for companies looking to relocate production away from China amid ongoing U.S. semiconductor regulations [3].

Core Viewpoint - TSMC's advanced packaging technology, SoW-X, aims to meet the demands of the next-generation AI semiconductor market by integrating high-performance computing chips and HBM4 modules, significantly enhancing performance and efficiency [1][4][6]. Group 1: SoW-X Technology Overview - SoW-X is a next-generation packaging technology set to be mass-produced by TSMC in 2027, designed for high-performance systems semiconductors like GPUs and CPUs, as well as AI semiconductors [3]. - The technology allows for direct connections between memory and system semiconductors without the need for traditional substrates, utilizing a fine copper redistribution layer (RDL) for inter-chip connections [3][4]. - SoW-X can integrate up to 16 high-performance computing chips and 80 HBM4 modules, resulting in a total memory capacity of 3.75 TB [3]. Group 2: Performance and Efficiency - Compared to existing AI semiconductor clusters with the same number of computing chips, SoW-X reduces power consumption by 17% and improves performance by 46% [4]. - The overall performance per watt of SoW-X is approximately 1.7 times higher than that of current AI semiconductor clusters, thanks to excellent connectivity and low power consumption [4]. Group 3: Market Implications and Challenges - TSMC positions SoW-X as an innovative technology platform that surpasses industry standards, targeting the next generation of high-performance computing and AI industries [6]. - However, there are concerns that SoW-X may not have a significant short-term impact on the AI memory market due to limited demand for ultra-large capacity AI semiconductors [6]. - The predecessor of SoW-X, SoW, launched in 2020, has seen limited adoption among customers, including Tesla and Cerebras, indicating the niche market nature and high technical difficulty of the technology [6].

Core Viewpoint - The AI trade is gaining consensus on Wall Street, with major companies like Nvidia, Taiwan Semiconductor, and Vertiv trading at reasonable valuations despite the hype surrounding AI innovation [1][2]. Company Summaries Taiwan Semiconductor (TSM) - TSM plays a critical role in the global semiconductor supply chain, particularly in AI chip production, reporting nearly a 40% year-over-year increase in monthly revenue due to high demand for AI chips [3][4]. - Full-year sales are expected to grow by 28.2% in 2025 and 14.8% in 2026, with long-term earnings projected to grow at a 20.8% annual rate over the next three to five years [4]. - The stock trades at 23.1x forward earnings, aligning with its five-year median, making it an attractive investment given its strategic importance and growth potential [5]. Nvidia (NVDA) - Nvidia is the leader in AI hardware design, with its GPUs being essential for AI training and inference systems, and is expanding into robotics and quantum computing [7]. - Earnings are projected to grow at 28.2% annually over the next three to five years, with sales expected to increase by 51.4% this year and 25.1% next year [8]. - The stock trades at 36x forward earnings, significantly below its five-year median of 55x, presenting a buying opportunity for a high-growth company at a discounted valuation [9]. Vertiv (VRT) - Vertiv provides critical power and thermal management solutions for data centers, which are essential for the AI infrastructure [10][11]. - Sales are projected to grow in the high teens for the next two years, with earnings expected to rise at 27.2% annually over the next three to five years [14]. - The stock trades at 30.6x forward earnings, a premium to its five-year median of 23.3x, justified by its strong growth profile and a PEG ratio just above 1 [14]. Investment Considerations - Nvidia, Taiwan Semiconductor, and Vertiv are essential to the AI supply chain and offer reasonable valuations compared to other speculative AI investments, making them compelling options for investors [15][16].

如果您希望可以时常见面，欢迎标星收藏哦~ 东京大学校长藤井照夫 ( 左 ) 与台积电执行副总裁三井英机 (YJMi) 周四出席新闻发布会 来源 ：内容编译自 japantimes 。 东京大学和台积电开设了一个研究实验室，他们将共同研究芯片相关技术并支持教育和研发机会。 台积电执行副总裁 YJ Mii 周四在东京大学举行的新闻发布会上表示："今天对台积电来说是一个 里程碑，因为这标志着我们与中国台湾以外的大学建立了第一个联合实验室。" 该大学和芯片制造商表示，该项目将主要侧重于研究、教育和人才孵化。在芯片领域，他们将致力 于材料、器件和设计的研究。他们还计划开展芯片原型设计教育。 东京大学工程研究生院教授池田诚表示，过去几年，美国和欧洲的大学一直在加大芯片原型教育力 度。 "我认为东京大学在这方面已经相当落后了。从这个意义上来说，我希望利用这样的机会赶上世 界，甚至超越世界，"将担任新实验室联合主任的池田说道。 YJ Mii表示，由于日本与中国台湾地理位置接近，台积电与该大学将能够有效沟通并顺利共享资 源。 该设施将位于东京文京区的大学主校区，为博士生提供教育支持和实习项目。该实验室的研究成果 预计将被台积电 ...

Core Viewpoint - The article discusses the evolution and significance of TSMC's CoWoS packaging technology, particularly in relation to NVIDIA's increasing reliance on CoWoS-L for its Blackwell architecture, highlighting the challenges and advancements in the semiconductor industry [1][2][5]. Group 1: TSMC and NVIDIA Collaboration - TSMC has become a crucial partner for NVIDIA, especially in the CoWoS packaging technology, with NVIDIA's CEO stating that they have no alternative to TSMC for this advanced technology [1]. - TSMC has reportedly surpassed ASE Group to become the largest player in the global packaging and testing market, driven by the demand for advanced packaging solutions [1]. Group 2: CoWoS Technology Evolution - NVIDIA plans to increase the use of CoWoS-L packaging for its upcoming Blackwell series products, transitioning from CoWoS-S to meet the high bandwidth requirements of its GPUs [2]. - The CoWoS technology faces challenges due to the increasing chip sizes, which limit the number of chips that can be placed on a 12-inch wafer, and the associated thermal management issues [5]. Group 3: Innovations and Challenges - TSMC is exploring the use of flux-free bonding technology to address issues related to flux residue that can affect chip reliability, with testing expected to be completed by the end of the year [6]. - The current interposer size in TSMC's CoWoS packaging is 80x80mm, with plans to introduce larger sizes by 2026 and 2027, which may enhance performance but also pose design challenges [8]. Group 4: Future Technologies - TSMC is betting on CoPoS technology, which replaces the traditional wafer with a panel, allowing for greater chip density and efficiency, with plans for mass production by 2029 [9][10]. - CoPoS is positioned as a potential alternative to CoWoS-L, offering advantages in signal integrity and power transmission, particularly for high-performance applications [11]. Group 5: Market Implications - The shift from circular wafers to square panels in CoPoS technology is expected to significantly enhance production capacity and cost efficiency, making it competitive in AI, 5G, and high-performance computing sectors [12]. - Despite the advantages, the transition to CoPoS requires substantial investment in materials and equipment, and overcoming technical challenges related to precision and yield will be critical for its success [13].

Core Viewpoint - The article discusses the significant rise of TSMC's CoWoS packaging technology, driven by the increasing demand for GPUs in the AI sector, particularly through its partnership with NVIDIA, which has deepened over time [1][3]. Group 1: CoWoS Technology and NVIDIA Partnership - NVIDIA has emphasized its reliance on TSMC for CoWoS technology, stating that it has no alternative partners in this area [1]. - TSMC has reportedly surpassed ASE Group to become the largest player in the global packaging market, benefiting from the growing demand for advanced packaging solutions [1]. - NVIDIA's upcoming Blackwell series will utilize more CoWoS-L packaging, indicating a shift in production focus from CoWoS-S to CoWoS-L to meet the high bandwidth requirements of its GPUs [3]. Group 2: Challenges and Innovations in CoWoS - The increasing size of AI chips poses challenges for CoWoS packaging, as larger chips reduce the number of chips that can fit on a 12-inch wafer [4]. - TSMC is facing difficulties with the use of flux in CoWoS, which is essential for chip bonding but becomes problematic as the size of the interposer increases [4][5]. - TSMC is exploring flux-free bonding technologies to improve yield rates and address the challenges posed by flux residue [5]. Group 3: Future Developments and Alternatives - TSMC plans to introduce CoWoS-L with a mask size of 5.5 times larger by 2026 and aims for a record 9.5 times larger version by 2027 [8]. - The company is also developing CoPoS technology, which replaces traditional wafers with panel substrates, allowing for higher chip density and efficiency [9][10]. - CoPoS is positioned as a potential alternative to CoWoS-L, targeting high-performance applications in AI and HPC systems [12]. Group 4: Technical Comparisons - FOPLP and CoPoS both utilize large panel substrates but differ in architecture; FOPLP does not use an interposer, while CoPoS does, enhancing signal integrity for high-performance chips [11]. - CoPoS is transitioning to glass substrates, which offer better performance characteristics compared to traditional organic substrates [12]. - The shift from round wafers to square panels in CoPoS aims to improve yield and reduce costs, making it more competitive in the AI and 5G markets [12]. Group 5: Challenges Ahead - Transitioning to square panel technology requires significant investment in materials and equipment, along with overcoming technical challenges related to pattern precision [14]. - The demand for finer RDL line widths poses additional challenges for suppliers, necessitating breakthroughs in RDL layout technology [14]. Conclusion - The future of TSMC's packaging technologies appears promising, with ongoing innovations and adaptations to meet the evolving demands of the semiconductor industry [14].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自 theedgemalaysia 。 随着地缘政治紧张局势加剧以及全球半导体供应链发生重大调整，马来西亚在不断升级的中美科 技冷战中保持中立立场变得越来越困难。 自美国前总统乔·拜登于 2022 年 8 月签署《芯片与科学法案》以来，华盛顿推出了大量激励措 施，包括先进制造业投资信贷（第 48D 条）和制造业补助激励措施，旨在将芯片生产转移回国 内。 这些举措引发了半导体供应链投资浪潮，主要参与者包括英特尔公司、台积电、美光科技公司和安 靠科技公司。过去三年，这些投资为美国 28 个州宣布的 100 多个项目投资超过 5400 亿美元。 据美国半导体行业协会（SIA）估计，这些项目将创造超过50万个美国就业岗位，涵盖芯片制造、 建设和支持服务。迄今为止，美国商务部已批准32家公司48个项目的325.4亿美元拨款和高达58.5 亿美元的贷款。 最大的受益者之一是英特尔，该公司去年 9 月获得了高达 30 亿美元的直接资金，用于"支持微电 子制造"和"确保获得国内先进半导体供应链，保障国家安全"。 图注：Ta iwa n即中国台湾；Ch i n a即中国大 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ：内容编译自 japantimes 。 东京大学和台积电开设了一个研究实验室，他们将共同研究芯片相关技术并支持教育和研发机会。 台积电执行副总裁 YJ Mii 周四在东京大学举行的新闻发布会上表示："今天对台积电来说是一个 里程碑，因为这标志着我们与中国台湾以外的大学建立了第一个联合实验室。" 他们当时强调，开发节能专用半导体而非通用芯片的重要性，因为随着人工智能处理需求的增长， 数据量将进一步增加。 该大学和芯片制造商表示，该项目将主要侧重于研究、教育和人才孵化。在芯片领域，他们将致力 于材料、器件和设计的研究。他们还计划开展芯片原型设计教育。 东京大学工程研究生院教授池田诚表示，过去几年，美国和欧洲的大学一直在加大芯片原型教育力 度。 "我认为东京大学在这方面已经相当落后了。从这个意义上来说，我希望利用这样的机会赶上世 界，甚至超越世界，"将担任新实验室联合主任的池田说道。 东京大学校长藤井照夫 ( 左 ) 与台积电执行副总裁三井英机 (YJMi) 周四出席新闻发布会 YJ Mii表示，由于日本与中国台湾地理位置接近，台积电与该大学将能够有效沟通并顺利共享资 ...

吸引投资者买入半导体股票的利好因素接连不断。首先，中美举行贸易磋商，美国商务部长 暗示放宽半导体等出口管制。此外，生成式AI用先进半导体的销售坚挺。半导体巨头博通 的总市值已超过特斯拉…… 全球半导体相关股票呈现出强劲的上涨态势。在6月11日的东京股市，爱德万测试（Advantest）的涨幅 一度超过4%，与4月创出的年初以来低点相比，涨幅达到8成。日经平均股指连续4天上涨。半导体相关 股票带动整个股市行情的剧本备受期待。 当前，吸引投资者买入半导体股票的利好因素接连不断。首先，中美两国政府6月10日举行了与贸易问 题相关的部长级磋商。双方就切实履行5月在瑞士签订的协议内容达成一致。美国商务部长卢特尼克表 示，中国的稀土出口管制问题"可能会得到解决"，同时也暗示美国将放宽半导体等产品的出口管制。 中国市场需求扩大容易惠及爱德万测试和迪思科等日本企业。原因是虽然中国也有开展半导体制造设备 业务的企业，但也很依赖日本和欧洲的主要企业。 由全球主要半导体相关股票组成的费城半导体股票指数（SOX）6月10日上涨了超过2%，创出了2月以 来的新高。与美国宣布对等关税后4月创出的年初以来新低相比，涨幅达到5成。 由日本主 ...

Group 1 - The report from CMB International indicates that trade uncertainties have eased, leading to a rebound in global stock markets, with US stocks, A-shares, and Hong Kong stocks continuing their upward trend [1] - Apple Inc. launched iOS 26 at WWDC25, enhancing the user experience of its product line, which aligns with market expectations [1] - TSMC reported a 40% year-on-year increase in revenue for May, driven by sustained demand for AI, with projected revenue of NT$320.5 billion for May 2025, reflecting a 40% year-on-year growth despite an 8% quarter-on-quarter decline [1] Group 2 - The report highlights that AI remains a critical technological change for the foreseeable future, with market focus expected to shift back to system construction progress and application monetization as key industry chain companies complete product upgrades in the second half of the year [2] - Investors are advised to pay attention to the domestic substitution process within the technology supply chain, particularly in semiconductor design, equipment, and manufacturing sectors [2] - There is an anticipated marginal improvement in end-user demand in the automotive and industrial sectors, suggesting investment opportunities within these industry chains [2]