后摩尔时代

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瞄准“后摩尔时代”颠覆性技术路线 上海选出硅光领域“潜力股”
Di Yi Cai Jing· 2025-08-24 09:25
硅光作为一种颠覆性技术路径,能够结合集成电路超大规模、超高精度、低制造成本的特性和光子技术 超高速率、超低功耗、高抗干扰的优势。上海继6月启动硅光未来产业集聚区建设后,又举行了创新创 业大赛。 硅光作为"后摩尔时代"的颠覆性技术路线,是全球高度关注和重点发展的战略领域。上海高度重视硅光 领域前沿技术创新与未来产业培育,大力开展项目布局、平台建设、生态打造等工作。 此前的6月28日,上海硅光未来产业集聚区在浦东新区正式启动建设,8家企业代表与张江高科签约落 地。同时,上海未来产业基金联合8家优质市场化基金发布硅光未来产业基金矩阵,硅光概念验证平台 建设启动。 在"光传感+开放"赛道,上海交通大学的"基于硅光芯片的集成化光学相干断层扫描系统"斩获大赛一等 奖,浙江大学的"高性能片上光谱仪系统"、中国科学院上海微系统与信息技术研究所的"芯声·聆微一基 于光机械微环的超灵敏宽频超声传感芯片"获二等奖,上海曼光信息科技有限公司的"AI大模型智能辅助 光电设计平台"、大连理工大学的"集成光子射频干扰消除芯片"获三等奖。 项目获得一等奖的上海澜昆微电子负责人对第一财经介绍,上海在一些研发攻关的必备要素上,合作都 很顺畅,包 ...
未来40年材料革命:这13大领域将重塑人类文明!
材料汇· 2025-07-24 15:52
Metal Materials - The future focus is on breaking traditional alloy performance limits, evolving towards multifunctional integration and sustainable manufacturing [3] - The industry impact shifts from "structural support" to "functional load-bearing," with metal materials remaining the backbone of high-end equipment [4] Polymer Materials - Advanced high-strength lightweight alloys such as magnesium, aluminum, and titanium alloys achieve "weight reduction and efficiency increase" through nano-precipitation and texture control, with topology optimization and 3D printing of customized alloy components becoming mainstream after 2040 [5] - High-entropy alloys (HEAs) break traditional design thinking with the "cocktail effect," offering high strength, corrosion resistance, and radiation resistance, making them irreplaceable in nuclear reactors and deep-sea equipment [5] - Sustainable metallurgy, including hydrogen metallurgy technology, aims for a metal closed-loop recycling rate exceeding 90% by 2050, reshaping the carbon neutrality path for the steel industry [5] Ceramic Materials - The future focus is on overcoming brittleness to expand applications in energy and aerospace [11] - The industry impact highlights the irreplaceable role of ceramics in aerospace, nuclear energy, and semiconductors, with significant domestic substitution potential [12] Carbon Materials - The future focus is on the industrialization of two-dimensional materials and the rise of carbon-based electronics [15] - China holds 70% of global graphene patents, necessitating a faster transition from laboratory to factory [16] Composite Materials - Graphene is expected to achieve low-cost mass production after 2030, with applications in ultrafast sensors, flexible electrodes, and seawater desalination membranes [17] - Carbon nanotubes (CNTs) are candidates for lightweight conductive composites, replacing copper wires [17] - Carbon fiber (CFRP) supports new-generation domestic T1100-grade carbon fiber for large aircraft and hydrogen storage tanks [17] Advanced Materials - Fiber-reinforced resin-based composites (FRP) are key to automotive lightweighting, with carbon fiber costs projected to drop to $10/kg by 2050 [21] - Smart composite materials with embedded sensors enable structural health monitoring [21] Information Materials - The future focus is on supporting computational power explosion and quantum communication [27] - The industry impact directly influences China's chip discourse power in the "post-Moore era" [28] Energy Materials - The future focus is on enhancing energy conversion and storage efficiency [31] - Material costs account for 60% of new energy device expenses, making them critical for achieving carbon neutrality goals [32] Biomedical Materials - The future focus is on personalization and bioactivity [35] - The aging global population creates a trillion-dollar market, with biocompatibility evaluation being a core entry criterion [36] Environmental Materials - The future focus is on pollution control and resource recycling [39] - Environmental policies drive mandatory replacements, with green certification becoming a standard for exports [40] Building Materials - The future focus is on transforming from energy consumers to producers [43] - New materials are seen as breakthroughs for urban carbon neutrality, given that buildings consume 40% of global energy [44] Material Surface Engineering - The future focus is on nanotechnology and multifunctional integrated coatings [47] - The industry impact emphasizes the value of coatings in remanufacturing [48] Material Analysis and Evaluation - The future focus is on AI-driven material analysis combining high-throughput experiments, computational simulations, and AI [51] - The industry impact shifts from "trial and error" to "rational design," reshaping material R&D paradigms [52] Conclusion - Over the next 40 years, material innovation will showcase four main themes: green, intelligent, composite, and precise [54] - The transition from a "material power" to a "material strong power" in China depends on breakthroughs in original basic research, key equipment autonomy, and collaborative ecosystems [56]
光计算系统解决方案商「光本位」半年完成两轮融资,获两地国资加持丨早起看早期
36氪· 2025-07-15 00:11
Core Viewpoint - The article highlights the advantages of optical computing chips, such as small unit size and low system energy consumption, making them more suitable for large-scale AI computing scenarios [1]. Group 1: Company Overview - "Guangbenwei Technology," established in 2022, is the world's first commercial company to adopt silicon photonics and phase change materials (PCM) for integrated optical chips [4]. - The company has achieved significant milestones, including the completion of the first commercially viable optical computing chip with a matrix size of 128x128, breaking the previous industry ceiling of 64x64 [4][6]. Group 2: Technology and Product Development - The optical computing chip technology offers a tenfold increase in integration density compared to other solutions, enabling better application in large model scenarios [4]. - The company is currently working on the 256x256 optical computing chip and has designed a 512x512 chip, which is expected to surpass the performance of existing top-tier electrical chip products [4][6]. Group 3: Investment and Financing - Guangbenwei Technology completed a financing round in December 2024 led by Jinqiu Fund, with participation from existing shareholders [2]. - In June 2024, the company disclosed another financing round led by Dunhong Asset, indicating strong investor interest and confidence in its technology [2]. Group 4: Strategic Partnerships and Market Position - The company has established a strategic partnership with a leading domestic internet company to collaborate on AI computing hardware [6]. - Investors view Guangbenwei as a key player in the optical computing field, with its unique technology path showing strong potential for industrial application and scalability [7][8][9]. Group 5: Team and Expertise - The founding team consists of young scientists from prestigious institutions, with expertise in photonic computing and AI applications [6]. - The team is recognized for its practical and efficient approach, which has led to impressive early-stage results in the commercialization of optical computing technology [7].
拓荆科技——踏遍荆棘冲破国际巨头垄断
证券时报· 2025-06-24 23:50
Core Viewpoint - The emergence of Tuojing Technology marks a significant step towards domestic production in the high-end semiconductor manufacturing sector, particularly in the film deposition equipment market, which has been dominated by international giants [2]. Group 1: Market Overview - The film deposition equipment sector accounts for over 20% of the wafer manufacturing equipment market, with Tuojing Technology capturing approximately 12% of the market share, translating to a revenue of 4.1 billion yuan in a market projected to reach 9.7 billion USD in 2024 [2]. - Tuojing Technology focuses on PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. Group 2: Technological Advancements - Chinese companies, represented by Tuojing Technology, are rapidly catching up in terms of process coverage and production equipment performance, achieving levels comparable to international counterparts [3]. - Tuojing Technology has undertaken 11 national major projects and has filed 1,640 patents, with 507 granted, showcasing its commitment to innovation and technology breakthroughs in the semiconductor film deposition field [3]. Group 3: Future Prospects - The company is preparing for future product generations, with 70% of its products being new or advanced process technologies, indicating a strong focus on innovation [4]. - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3].
拓荆科技—— 踏遍荆棘冲破国际巨头垄断
Zheng Quan Shi Bao· 2025-06-24 18:42
Core Viewpoint - The emergence of Tuojing Technology represents a significant step towards domestic production in the monopolized thin film deposition equipment market, which is crucial for high-end semiconductor manufacturing [2][3]. Market Overview - The thin film deposition equipment accounts for over 20% of the wafer manufacturing equipment market, with the Chinese market for this equipment projected to reach approximately $9.7 billion in 2024 [2]. - Tuojing Technology's product market size is estimated at $4.85 billion, with the company generating revenue of 4.1 billion yuan, capturing about 12% market share [2]. Technological Advancements - Tuojing Technology focuses on the research and industrial application of PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. - The company has made significant technological breakthroughs, evidenced by its 1,640 patent applications (including PCT) and 507 authorized patents [3]. Future Prospects - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's future growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3]. - The company is proactively developing technologies for the next two to three generations of products, with 70% of its products being required for new and advanced processes [4].
后摩尔时代的新集成与新材料报告(附17页PPT)
材料汇· 2025-06-08 14:03
Core Viewpoint - The article discusses the evolution of semiconductor technology, particularly focusing on the transition from traditional SoC (System on Chip) designs to Chiplet architectures, which are expected to extend the economic benefits of Moore's Law in the post-Moore era [4][6][18]. Group 1: Chiplet Technology - Chiplet architecture allows for modular design, enabling flexible customization for specific applications, which can lead to significant performance and cost optimizations [5][7]. - The Chiplet model is anticipated to reduce development cycles and risks associated with chip manufacturing, as seen in AMD's 32-core Chiplet example, which has a total area of 852 mm² compared to a SoC's 777 mm² [5][6]. - Chiplet technology is gaining traction in various fields, including FPGA, CPU, and GPU, with a projected market growth rate (CAGR) of 46% for FPGA and 58% for GPU applications from 2018 to 2025 [10][9]. Group 2: Advanced Packaging Techniques - Advanced packaging technologies such as 2.5D and 3D packaging are critical for the successful implementation of Chiplet architectures, enhancing integration and performance [13][16]. - The industry is focusing on various advanced packaging methods, including Flip-Chip, Wafer Level Packaging, and System in Package (SiP), which improve electrical performance and reduce overall costs [13][16]. - Major players like TSMC, Intel, and Samsung are investing heavily in high-performance packaging as a key direction for the next generation of semiconductor technology [16]. Group 3: SiC Power Semiconductors - Silicon Carbide (SiC) is emerging as a preferred material in the post-Moore era due to its superior performance in high-power and high-frequency applications, particularly in electric vehicles and renewable energy systems [20][22]. - The global SiC power device market is expected to grow significantly, with a CAGR of 42.4% from 2017 to 2021, driven by applications in electric vehicles and industrial automation [28][29]. - SiC devices offer advantages such as higher efficiency, reduced size, and improved thermal performance compared to traditional silicon devices, making them ideal for high-temperature and high-voltage applications [22][27]. Group 4: Market Dynamics and Trends - The SiC power device market is rapidly expanding, with China increasing its market share significantly, indicating a shift in the global supply chain dynamics [28][30]. - The SiC industry is characterized by a strong reliance on substrate suppliers, with a significant portion of the market controlled by foreign companies, highlighting the need for domestic investment and development [30][32]. - The cost structure of SiC devices is heavily influenced by substrate and epitaxy processes, which are critical for maintaining competitive pricing and performance in the market [30][32].
研判2025!中国芯片级玻璃基板行业发展背景、市场现状及趋势分析:受益于先进封装下大尺寸AI算力芯片更新迭代,玻璃基板对硅基板的替代将加速[图]
Chan Ye Xin Xi Wang· 2025-05-30 01:36
Group 1 - Glass substrates are characterized by high transparency, excellent flatness, and good stability, serving as a support carrier to ensure the reliable fixation of functional materials and the overall stability and lifespan of devices [1][2] - The global advanced packaging market is projected to grow from $28.8 billion in 2019 to $42.5 billion by 2024, indicating a rising penetration rate [1][13] - The introduction of glass substrates can reduce capacitance between interconnections, leading to faster signal transmission and improved overall performance, particularly in data centers, telecommunications, and high-performance computing applications [1][15] Group 2 - The glass substrate industry chain includes key segments such as raw materials, equipment, technology, production, packaging testing, and applications, with special glass materials being crucial for semiconductor manufacturing [6] - The TGV (Through Glass Via) technology is a core technique for glass substrate packaging, enabling vertical electrical interconnections and addressing challenges associated with traditional TSV technology [19][20] - The glass substrate market is expected to reach over $400 million by 2030, with a penetration rate exceeding 2%, although organic substrates will continue to dominate the semiconductor packaging field in the near term [15][17] Group 3 - The glass substrate technology is anticipated to play a significant role in the semiconductor industry, with ongoing advancements focusing on process optimization, improving via precision and density, and expanding the functional applications of glass substrates [25] - The global semiconductor market is projected to reach $635.1 billion in 2024, reflecting a 19.8% year-on-year growth, driven by the increasing demand for high-performance semiconductor products [9]
2025年中国半导体先进封装行业研究:后摩尔时代,先进封装引领半导体创新趋势
Tou Bao Yan Jiu Yuan· 2025-05-20 12:23
Investment Rating - The report does not explicitly state an investment rating for the semiconductor advanced packaging industry Core Insights - Advanced packaging technology is a critical link between chip design and application, significantly enhancing chip performance and reducing power consumption while alleviating constraints in high-end chip manufacturing processes. The Chinese government places high importance on the development of the semiconductor industry, implementing various policies to support independent innovation and technological breakthroughs, making research into China's semiconductor advanced packaging industry particularly significant [2] Summary by Sections Overview of the Semiconductor Packaging Industry - Packaging is a core process in semiconductor manufacturing, involving the placement, fixation, sealing of chips, and connecting chip contacts to the packaging shell [14][18] - The four core functions of packaging include physical protection, mechanical support, electrical connection, and thermal management [17] Development of Packaging Technology - The development of semiconductor packaging technology can be divided into four stages, with the current global packaging technology being in the advanced packaging stage [19][21] - The core goals of packaging technology evolution include miniaturization, improved electrical performance, enhanced thermal management, and cost reduction [21] Market Analysis - The Chinese semiconductor packaging market is expected to reach 355.19 billion yuan by 2025, with advanced packaging accounting for 32% of the market [45][47] - The global packaging testing market is projected to grow from $51 billion in 2016 to $72.27 billion by 2025, with advanced packaging expected to capture half of the market share [47] Advanced Packaging Manufacturers Overview - Global advanced packaging market participants include IDM, Foundry, and OSAT manufacturers, with leading companies adopting a "large platform + technology branch" architecture covering various advanced packaging technologies [51] - Major OSAT manufacturers in mainland China have formed industrial capabilities in advanced packaging through independent research and mergers, covering a wide range of applications from consumer electronics to AI chips [7]
2025年中国半导体先进封装市场研读:后摩尔时代,先进封装引领半导体创新趋势
Tou Bao Yan Jiu Yuan· 2025-05-20 12:16
Investment Rating - The report does not explicitly state an investment rating for the semiconductor advanced packaging industry Core Insights - Advanced packaging technology is a critical link between chip design and application, significantly enhancing chip performance and reducing power consumption while alleviating constraints in high-end chip manufacturing processes [2] - The Chinese government places high importance on the development of the semiconductor industry, implementing various policies to support independent innovation and technological breakthroughs [2] - The advanced packaging market is expected to grow rapidly, with China's packaging market projected to reach 355.19 billion yuan by 2025, with advanced packaging accounting for 32% of the market [45][47] Summary by Sections Overview of the Semiconductor Packaging Industry - Packaging is a core process in semiconductor manufacturing, involving the placement, fixation, sealing of chips, and connecting chip contacts to the package shell [14][18] - The development of semiconductor packaging technology can be divided into four stages, with the current stage being advanced packaging [19][21] Advanced Packaging Technology Types - The global advanced packaging market includes IDM, Foundry, and OSAT manufacturers, with leading companies adopting a "large platform + technology branch" architecture [4][51] - Major OSAT manufacturers in China have formed industrial capabilities through independent research and acquisitions, covering a wide range of applications from consumer electronics to AI chips [7] Market Dynamics - The global packaging testing market is expected to grow from $51 billion in 2016 to $72.27 billion by 2025, with advanced packaging projected to capture half of the market share [47] - China's packaging testing market is growing at a compound annual growth rate (CAGR) of 12.54%, significantly higher than the global market's 3.89% [47] Importance of Advanced Packaging - Advanced packaging is essential for integrating multiple functions within a system, enhancing overall system performance beyond the limitations of Moore's Law [35][38] - The report highlights that advanced packaging can improve chip performance without shrinking process nodes, addressing the rising costs associated with advanced process development [39][44]
混合键合,风云再起
半导体行业观察· 2025-05-03 02:05
Core Viewpoint - The article emphasizes the rapid development and industrialization of hybrid bonding technology as a key enabler for overcoming performance bottlenecks in the semiconductor industry, particularly in the post-Moore's Law era [1][12]. Group 1: Hybrid Bonding Technology Overview - Hybrid bonding technology, also known as direct bonding interconnect, is a core technology in advanced packaging, enabling high-density vertical interconnections between chips through copper-copper and dielectric bonding [3][12]. - This technology allows for interconnect distances below 1μm, significantly increasing the number of I/O contacts per unit area compared to traditional bump bonding, which has distances above 20μm [3][5]. - Advantages include improved thermal management, enhanced reliability, flexibility in 3D integration, and compatibility with existing wafer-level manufacturing processes [3][5]. Group 2: Industry Adoption and Applications - Major semiconductor companies like SK Hynix and Samsung are adopting hybrid bonding in their products, such as HBM3E and 3D DRAM, achieving significant improvements in thermal performance and chip density [5][8]. - Samsung's implementation of hybrid bonding has reduced chip area by 30% while enhancing integration [8]. - TSMC's SoIC technology and NVIDIA's GPUs also utilize hybrid bonding to improve performance and density in advanced applications [10][11]. Group 3: Market Growth and Equipment Demand - The global hybrid bonding equipment market is projected to grow from approximately $421 million in 2023 to $1.332 billion by 2030, with a compound annual growth rate (CAGR) of 30% [13]. - Equipment manufacturers are competing to meet the rising demand for high-precision bonding machines and related technologies, with companies like Applied Materials and ASMPT leading the charge [13][14]. Group 4: Competitive Landscape - Applied Materials is focusing on building a comprehensive hybrid bonding ecosystem through strategic investments and partnerships, aiming to cover the entire process from material to bonding [14][15]. - ASMPT is enhancing its position by developing high-precision bonding technologies and collaborating with industry leaders to drive standardization [17][22]. - BESI is capitalizing on the demand for AI chips and HBM packaging, with a significant market share in CIS sensors and a focus on high-precision bonding equipment [18][19]. Group 5: Future Trends and Challenges - The shift from 2D scaling to 3D integration is reshaping the competitive landscape in the semiconductor industry, with hybrid bonding technology at the forefront [22][23]. - Despite its potential, hybrid bonding faces challenges such as high costs and stringent manufacturing environment requirements, which may slow its widespread adoption [23][21].