公众号记得加星标⭐️，第一时间看推送不会错过。 近年来，随着芯片制程工艺不断向前演进，"摩尔定律"的迭代进度逐渐放缓。曾经依靠制程迭 代实现晶体管密度翻倍、性能提升的传统路径，如今受限于物理极限与成本激增的双重挑战， 单纯依赖制程突破的发展模式渐显乏力。 在此背景下，半导体行业开始积极探索"后摩尔时代"的破局方向，先进封装技术凭借独特价值迅速成 为业界焦点。尤其是随着AI芯片对超高算力、低延迟的迫切需求，以及Chiplet异构集成技术的兴 起，先进封装不再只是芯片的"保护壳"，更成为实现系统级性能跃升的关键载体。 与传统的封装技术相比，先进封装技术具有灵活性强、集成密度高、尺寸小、性能好等优势，主要包 括倒装芯片封装、晶圆级封装、系统级封装和2.5D、3D封装等技术。 据Yole Group预测，2030年全球先进封装市场规模将突破794亿美元，2024-2030年复合年增长率 （CAGR）达9.5%，AI与高性能计算需求成为拉动复苏的首要动能。市场潜力之下，行业厂商争相 布局，推动先进封装赛道成为驱动产业变革的新引擎。 代工三巨头，鏖战先进封装 在先进封装这一关键赛道，台积电、英特尔、三星等厂商作为先进封装 ...

Core Viewpoint -拓荆科技 is seeking to enhance its subsidiary,拓荆键科, through a capital increase involving multiple external investors, including国投集新, which will become the second-largest shareholder post-investment [1][3]. Group 1: Investment and Financial Details - The capital increase aims to support the rapid development of拓荆键科 in the three-dimensional integration equipment sector [2][3]. - The total investment from six entities in this capital increase is structured, with拓荆科技 and国投集新 each contributing up to 450 million yuan, while employee stockholding platforms and other investors contribute smaller amounts [2][3]. - The pre-investment valuation of拓荆键科 is set at 2.5 billion yuan, reflecting a significant increase in value [3]. Group 2: Business Focus and Market Trends -拓荆科技 operates in the high-end semiconductor equipment sector, focusing on the research and production of three-dimensional integration equipment [2][4]. - The company is responding to the shift towards new architectural designs and chip stacking methods as the semiconductor industry approaches physical limits [2][5]. - The demand for high-end semiconductor equipment is expected to grow due to increased capital expenditures and capacity expansions in wafer fabrication plants driven by emerging fields like artificial intelligence and high-performance computing [5][6]. Group 3: Expansion Plans -拓荆科技 plans to invest 1.768 billion yuan in a high-end semiconductor equipment industrialization base to significantly enhance production capacity [5]. - An additional 2 billion yuan is allocated for a cutting-edge technology research and development center to optimize existing thin film deposition equipment [5][6]. - The company acknowledges the current limitations in domestic technology and aims to bridge the gap with international standards through these investments [5][6].

Core Viewpoint - The article discusses the advancements in photonic chip technology as a promising solution to the challenges posed by the "post-Moore era" in semiconductor manufacturing, emphasizing the potential for significant improvements in computing power and energy efficiency [3][4][5]. Group 1: Industry Trends - The demand for enhanced intelligent computing capabilities is growing at an exponential rate, surpassing the performance improvements described by Moore's Law [2]. - The traditional electronic computing systems face significant challenges, including the "von Neumann bottleneck," slowing of Moore's Law, and the "power wall" [2]. Group 2: Photonic Chip Technology - Photonic chips utilize light as a carrier to replace electricity, offering higher bandwidth, greater parallelism, and lower energy consumption compared to electronic chips, which can lead to exponential increases in computing power [3]. - The Shanghai Jiao Tong University Wuxi Photonic Chip Research Institute (CHIPX) is a leader in the field, focusing on the development of high-end photonic chips and their industrial applications [4]. Group 3: Technological Advancements - CHIPX has established the first domestic pilot line for photonic chips, achieving low-loss and high-bandwidth performance in lithium niobate photonic chip production, with plans for large-scale production services by the end of the year [4][5]. - The research team at CHIPX has overcome technical bottlenecks in writing speeds, enabling ultra-high-density and large-capacity permanent storage using glass-based media [4]. Group 4: Future Vision - CHIPX aims to drive the fourth industrial revolution through advancements in photonic chips and quantum computing, aspiring to become a world-class center for the photonic industry [5]. - The institute has developed various advanced technologies, including DUV lithography and dry etching processes, to ensure complete control over the photonic chip manufacturing process [5]. Group 5: Industry Collaboration and Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference in November 2025, focusing on advanced packaging technologies and fostering collaboration between industry and academia [14]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced semiconductor materials and equipment [14].

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 7 东吴证券 ■ 半导体封装概览：后摩尔时代渐进，先进封 发快速发展 传统 统 先 进 封 装 设 备 有 一 定 重 合 （ 减 薄 / 测 片 / 固 晶 / 健 合 ） ， 增 量 主 要 在 于 前 道 图 形 化 设 备 2 3 他山之石可以攻玉，海外龙头经验借鉴 4 本土重点公司 5 | 投资建议 6 风险提示 % 公众号·材料汇 目录 1.1. 半导体封装的关键作用是实现芯片和外部系统的电连接 唱图 -芯片 机械连接 板上芯片(COB) 单芯片封装 多芯片封装(MCP) 1级封装 1级封装 机械保护 散热 模块、电路卡 2级封装 电气连接 主板 3级封装 省公众号·材料汇4 数据来源:半导体行业观察, ◆图: 半导体封装工艺等级 ◆ 图:半导体封装的主要作用 7 乐吴址芬 ● 封装的核心是实现芯片和系统的电连接。芯片封装是指将芯片密封在塑料、金属或陶瓷等材料制成的封装体 内，使芯片与外部环境之间建立一道屏障，保护芯片免受外部环境影响，同时封装还提供了一个接口，使芯 片能够与其他电子元件进行连接， ...

Core Viewpoint - Silicon photonics is recognized as a disruptive technology that combines the characteristics of integrated circuits, such as large scale, high precision, and low manufacturing costs, with the advantages of photonic technology, including ultra-high speed, low power consumption, and high anti-interference capabilities [1][5] Group 1: Competition Overview - The "Zhangjiang Cup Silicon Photonics Innovation and Entrepreneurship Competition" concluded with various roadshow activities focusing on "Optical Interconnect + Optical Computing" and "Optical Sensing + Open" categories [1][3] - A total of 19 innovative silicon photonics projects from enterprises, universities, and research institutes across the country entered the finals [3] Group 2: Award Winners - In the "Optical Interconnect + Optical Computing" category, Shanghai Lankun Microelectronics Technology Co., Ltd. won the first prize for its "Micro-ring Photonic Integrated Interconnect Chip" project [3] - The second prize was awarded to projects from Qiming Photonics (Beijing) Technology Co., Ltd. and Shanghai Jiao Tong University, while the third prize went to Shanghai University of Science and Technology and the Shanghai Institute of Microsystem and Information Technology [3] - In the "Optical Sensing + Open" category, Shanghai Jiao Tong University won the first prize for its "Integrated Optical Coherence Tomography System Based on Silicon Photonic Chips" [3] Group 3: Industry Support and Development - The competition was organized by the Silicon Photonics Innovation Alliance, which includes over 70 leading technology enterprises, key universities, and research institutions [6] - The Shanghai Silicon Photonics Future Industry Cluster was officially launched in June, with eight companies signing agreements to establish operations [5][6] - The Shanghai Future Industry Fund, in collaboration with eight quality market-oriented funds, launched a matrix for the Silicon Photonics Future Industry Fund, emphasizing the importance of project layout, platform construction, and ecosystem development [5][6]

Core Viewpoint - The company, Yongxi Electronics (Ningbo) Co., Ltd., maintains a stable credit rating of A with a stable outlook, supported by its technological strength and long-term partnerships with key chip enterprises, despite facing challenges in capacity expansion and profitability [3][4][5]. Financial Performance - Total assets increased from 83.21 billion yuan in 2022 to 123.31 billion yuan in 2023, with total liabilities rising from 53.76 billion yuan to 83.33 billion yuan during the same period [6][22]. - The company reported significant revenue growth, with total operating income rising from 21.77 billion yuan in 2022 to 36.09 billion yuan in 2023, while net profit improved from a loss of 1.35 billion yuan to a profit of 0.09 billion yuan [8][21]. - The gross profit margin decreased from 21.91% in 2022 to 13.90% in 2023, primarily due to increased costs associated with the second-phase factory construction [20][21]. Operational Capacity - The company is in a capacity expansion phase, with production capacity for non-wafer-level packaging increasing from 349.9 million units in 2022 to 575.7 million units in 2024, and production volume rising from 269 million units to 518 million units during the same period [17][16]. - The utilization rate for non-wafer-level packaging reached 90% in 2024, indicating effective capacity management [16]. R&D and Technological Development - The company has a strong focus on advanced packaging technologies, with R&D expenditures increasing from 1.22 billion yuan in 2022 to 2.17 billion yuan in 2024, representing a growing commitment to innovation [18][17]. - As of 2024, the company holds 400 patents, including 158 invention patents, showcasing its competitive technological capabilities [17][18]. Market Position and Customer Relationships - The company has established long-term relationships with major domestic chip manufacturers, with the top five customers accounting for approximately 38.38% of total sales in 2023 [13][14]. - The company benefits from strong customer loyalty and has successfully expanded its client base, particularly in the automotive and 5G sectors [13][14]. Industry Context - The global packaging and testing market is highly concentrated, with the top five companies holding over 50% market share, indicating significant competitive pressures [10][11]. - The advanced packaging market is expected to grow significantly, driven by increasing demand from high-performance computing and AI applications, positioning the company favorably for future growth [11][12].

Metal Materials - The future focus is on breaking traditional alloy performance limits, evolving towards multifunctional integration and sustainable manufacturing [3] - The industry impact shifts from "structural support" to "functional load-bearing," with metal materials remaining the backbone of high-end equipment [4] Polymer Materials - Advanced high-strength lightweight alloys such as magnesium, aluminum, and titanium alloys achieve "weight reduction and efficiency increase" through nano-precipitation and texture control, with topology optimization and 3D printing of customized alloy components becoming mainstream after 2040 [5] - High-entropy alloys (HEAs) break traditional design thinking with the "cocktail effect," offering high strength, corrosion resistance, and radiation resistance, making them irreplaceable in nuclear reactors and deep-sea equipment [5] - Sustainable metallurgy, including hydrogen metallurgy technology, aims for a metal closed-loop recycling rate exceeding 90% by 2050, reshaping the carbon neutrality path for the steel industry [5] Ceramic Materials - The future focus is on overcoming brittleness to expand applications in energy and aerospace [11] - The industry impact highlights the irreplaceable role of ceramics in aerospace, nuclear energy, and semiconductors, with significant domestic substitution potential [12] Carbon Materials - The future focus is on the industrialization of two-dimensional materials and the rise of carbon-based electronics [15] - China holds 70% of global graphene patents, necessitating a faster transition from laboratory to factory [16] Composite Materials - Graphene is expected to achieve low-cost mass production after 2030, with applications in ultrafast sensors, flexible electrodes, and seawater desalination membranes [17] - Carbon nanotubes (CNTs) are candidates for lightweight conductive composites, replacing copper wires [17] - Carbon fiber (CFRP) supports new-generation domestic T1100-grade carbon fiber for large aircraft and hydrogen storage tanks [17] Advanced Materials - Fiber-reinforced resin-based composites (FRP) are key to automotive lightweighting, with carbon fiber costs projected to drop to $10/kg by 2050 [21] - Smart composite materials with embedded sensors enable structural health monitoring [21] Information Materials - The future focus is on supporting computational power explosion and quantum communication [27] - The industry impact directly influences China's chip discourse power in the "post-Moore era" [28] Energy Materials - The future focus is on enhancing energy conversion and storage efficiency [31] - Material costs account for 60% of new energy device expenses, making them critical for achieving carbon neutrality goals [32] Biomedical Materials - The future focus is on personalization and bioactivity [35] - The aging global population creates a trillion-dollar market, with biocompatibility evaluation being a core entry criterion [36] Environmental Materials - The future focus is on pollution control and resource recycling [39] - Environmental policies drive mandatory replacements, with green certification becoming a standard for exports [40] Building Materials - The future focus is on transforming from energy consumers to producers [43] - New materials are seen as breakthroughs for urban carbon neutrality, given that buildings consume 40% of global energy [44] Material Surface Engineering - The future focus is on nanotechnology and multifunctional integrated coatings [47] - The industry impact emphasizes the value of coatings in remanufacturing [48] Material Analysis and Evaluation - The future focus is on AI-driven material analysis combining high-throughput experiments, computational simulations, and AI [51] - The industry impact shifts from "trial and error" to "rational design," reshaping material R&D paradigms [52] Conclusion - Over the next 40 years, material innovation will showcase four main themes: green, intelligent, composite, and precise [54] - The transition from a "material power" to a "material strong power" in China depends on breakthroughs in original basic research, key equipment autonomy, and collaborative ecosystems [56]

Core Viewpoint - The article highlights the advantages of optical computing chips, such as small unit size and low system energy consumption, making them more suitable for large-scale AI computing scenarios [1]. Group 1: Company Overview - "Guangbenwei Technology," established in 2022, is the world's first commercial company to adopt silicon photonics and phase change materials (PCM) for integrated optical chips [4]. - The company has achieved significant milestones, including the completion of the first commercially viable optical computing chip with a matrix size of 128x128, breaking the previous industry ceiling of 64x64 [4][6]. Group 2: Technology and Product Development - The optical computing chip technology offers a tenfold increase in integration density compared to other solutions, enabling better application in large model scenarios [4]. - The company is currently working on the 256x256 optical computing chip and has designed a 512x512 chip, which is expected to surpass the performance of existing top-tier electrical chip products [4][6]. Group 3: Investment and Financing - Guangbenwei Technology completed a financing round in December 2024 led by Jinqiu Fund, with participation from existing shareholders [2]. - In June 2024, the company disclosed another financing round led by Dunhong Asset, indicating strong investor interest and confidence in its technology [2]. Group 4: Strategic Partnerships and Market Position - The company has established a strategic partnership with a leading domestic internet company to collaborate on AI computing hardware [6]. - Investors view Guangbenwei as a key player in the optical computing field, with its unique technology path showing strong potential for industrial application and scalability [7][8][9]. Group 5: Team and Expertise - The founding team consists of young scientists from prestigious institutions, with expertise in photonic computing and AI applications [6]. - The team is recognized for its practical and efficient approach, which has led to impressive early-stage results in the commercialization of optical computing technology [7].

Core Viewpoint - The emergence of Tuojing Technology marks a significant step towards domestic production in the high-end semiconductor manufacturing sector, particularly in the film deposition equipment market, which has been dominated by international giants [2]. Group 1: Market Overview - The film deposition equipment sector accounts for over 20% of the wafer manufacturing equipment market, with Tuojing Technology capturing approximately 12% of the market share, translating to a revenue of 4.1 billion yuan in a market projected to reach 9.7 billion USD in 2024 [2]. - Tuojing Technology focuses on PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. Group 2: Technological Advancements - Chinese companies, represented by Tuojing Technology, are rapidly catching up in terms of process coverage and production equipment performance, achieving levels comparable to international counterparts [3]. - Tuojing Technology has undertaken 11 national major projects and has filed 1,640 patents, with 507 granted, showcasing its commitment to innovation and technology breakthroughs in the semiconductor film deposition field [3]. Group 3: Future Prospects - The company is preparing for future product generations, with 70% of its products being new or advanced process technologies, indicating a strong focus on innovation [4]. - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3].

Core Viewpoint - The emergence of Tuojing Technology represents a significant step towards domestic production in the monopolized thin film deposition equipment market, which is crucial for high-end semiconductor manufacturing [2][3]. Market Overview - The thin film deposition equipment accounts for over 20% of the wafer manufacturing equipment market, with the Chinese market for this equipment projected to reach approximately $9.7 billion in 2024 [2]. - Tuojing Technology's product market size is estimated at $4.85 billion, with the company generating revenue of 4.1 billion yuan, capturing about 12% market share [2]. Technological Advancements - Tuojing Technology focuses on the research and industrial application of PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. - The company has made significant technological breakthroughs, evidenced by its 1,640 patent applications (including PCT) and 507 authorized patents [3]. Future Prospects - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's future growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3]. - The company is proactively developing technologies for the next two to three generations of products, with 70% of its products being required for new and advanced processes [4].