点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 "最晚将在2027年导入" ：这是一个非常关键的时间点。它并非"可能"或"正在研究"，而是"计划"和"最晚"。这表明 技术可行性已得到英伟达和台积电内部的初步认 可 ，进入了 工程化与供应链准备阶段 。2027年对应的是英伟达Feynman架构周期，意味着SiC封装可能是Feynman的"秘密武器"。 "解决CoWoS封装散热问题成为AI算力芯片发展重要课题" ：这句话将"散热"从"技术挑战"提升到了"产业发展课题"的高度。它揭示了AI算力竞赛的下半场， 胜负 手可能不在晶体管密度，而在于封装和散热能力 。 "SiC有望成为未来CoWoS发展中Interposer最优解" ：这里的"最优解"是在"性能"与"可行性"之间权衡后的结果。金刚石性能更优但不可行，玻璃/有机材料可行但 性能不足。SiC恰好位于 "最佳甜蜜区" 。 "中国大陆SiC产业链有望重点受益" ：其背后的深层逻辑是，一旦CoWoS采用SiC，将创造一个全新的、巨大的增量市场。这个市场独立于传统的功率SiC，而中国 大陆在衬底产能投资上最为激进， ...

证券研究报告 SiC深度（一） 先进封装：英伟达、台积电未来的材料之选 1 摘要 根据行家说三代半，9月2日，据中国台湾媒体报道，英伟达正计划在新一代GPU芯片的先进封装环节中采用12英寸碳化硅衬底，最晚将在2027年导入。 • 解决CoWoS封装散热问题成为AI算力芯片发展重要课题 根据《高算力Chiplet的热管理技术研究进展》，集成电路发展受到"功耗墙"的严重制约。英伟达和AMD在追求算力大幅提升的情况下，不得不继续提高 芯片功率。主流算力芯片基本标配CoWoS封装，尤其英伟达算力芯片全部使用CoWoS封装。因此我们认为AI算力芯片的发展亟需解决CoWoS封装散热的难题。 • SiC有望成为未来CoWoS发展中Interposer最优解 戚舒扬(SAC NO:S1120523110001) 卜灿华(SAC NO:S1120524120006) 2025年11月5日 请仔细阅读在本报告尾部的重要法律声明 目录 一、英伟达、台积电考虑使用SiC作为未来先进封装中介层 CoWoS核心价值在于interposer（中介层）的连通作用，Interposer当前与未来面临热管理、结构刚性等难题。根据北京大学、Nat ...

Core Insights - The global advanced packaging market is projected to reach $56.9 billion in 2025, with a year-on-year growth of 9.6%, and is expected to grow to $78.6 billion by 2028, reflecting a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [3]. Industry Transformation - The logic of semiconductor packaging has shifted from merely providing protective casings to creating economic value, indicating a significant change in the industry dynamics [1][2]. - Advanced packaging is becoming a strategic focal point in the semiconductor supply chain, driven by the demand for AI and high-performance computing [2]. Market Dynamics - The demand for advanced packaging is largely fueled by AI applications, which have significantly increased the need for computing chips [2]. - The advanced packaging sales are expected to surpass traditional packaging for the first time in 2025, with consumer electronics and automotive electronics accounting for 85% of this market [2]. Innovation Directions - The industry is witnessing a surge in new technologies and materials, such as Chiplet technology, CoWoS packaging, and advanced substrates like silicon carbide and glass substrates [4]. - Key challenges in advanced packaging include efficient thermal management, heterogeneous integration of Chiplets, and the need for finer line widths and larger package sizes [5]. Equipment and Material Trends - The global advanced packaging equipment market is expected to reach $30 billion by 2030, with significant investments in hybrid bonding equipment and TSV etching machines [5]. - Glass substrates are emerging as a superior packaging material due to their better electrical and thermal performance, although they face challenges in production and reliability [5]. Strategic Development - The industry requires a collaborative ecosystem that integrates large, medium, and small enterprises to achieve high-quality development and innovation breakthroughs [6]. - There is a need for China to enhance its international influence by developing local standards and actively participating in global standard-setting to secure competitive advantages [6].

Core Insights - The AI semiconductor industry is expected to experience significant growth in 2026, with a shift in investment logic from upstream to downstream infrastructure [2][10] - The bottleneck in AI development has transitioned from chip manufacturing and packaging to downstream components such as data center space, power supply, and cooling systems [2][5] Upstream Capacity No Longer the Sole Bottleneck - Chip manufacturing and packaging have significantly expanded, alleviating previous supply concerns [4] - TSMC reported stronger-than-expected AI demand and a quick ramp-up in CoWoS capacity, indicating flexibility in the supply chain [4] - Despite ongoing tightness in advanced node wafer front-end capacity, AI semiconductors are prioritized over other applications like cryptocurrency ASICs [4] Bottleneck Shift - The current constraints are now focused on data center space, power availability, and supporting infrastructure, which have longer construction cycles than chip manufacturing [6] - The deployment of large-scale GPU clusters presents challenges in power consumption and heat dissipation, leading to a shift towards liquid cooling and high-voltage direct current (HVDC) solutions [6] Storage and Memory - AI workloads demand high-speed data storage and access, with companies like Meta opting for QLC NAND flash for cost efficiency [8] - The global demand for HBM (High Bandwidth Memory) is projected to surge, with NVIDIA expected to consume 54% of the total HBM by 2026 [8] Racks and Networking - OCP has introduced standardized blueprints for "AI Open Data Centers" and "AI Open Cluster Designs" to facilitate large-scale deployments [9] - Companies like Alibaba are focusing on pluggable optics for their cost-effectiveness and flexibility, while new technologies like CPO/NPO are gaining attention [9] Demand Forecast Indicates Explosive Growth for Downstream Components - Global cloud service capital expenditure is expected to grow by 31% in 2026, reaching $582 billion, significantly exceeding market expectations [11] - AI server capital expenditure could see approximately 70% year-over-year growth if its share in overall capital spending increases [11] AI Chip Demand Breakdown - NVIDIA is projected to dominate the CoWoS capacity consumption with a 59% share, followed by Broadcom, AMD, and AWS [12] - In AI computing wafer consumption, NVIDIA leads with a 55% share, followed by Google, AMD, and AWS [12] Investment Focus Shift - The signals from the OCP conference and industry data indicate a new direction for AI hardware investment, emphasizing the importance of downstream infrastructure [13] - Investors are encouraged to broaden their focus from individual chip companies to the entire data center ecosystem, identifying key players in power, cooling, storage, memory, and networking [13]

Group 1 - Morgan Stanley upgraded SMIC's rating, raising the target price from HKD 40 to HKD 80, anticipating an expansion in leading edge capacity and resolution of equipment bottlenecks [2] - Chinese mobile announced plans to deploy 100,000 local GPU networks by 2028, leading to an updated revenue forecast for China's AI GPU market, projected to reach RMB 113 billion in 2026 and RMB 180 billion in 2027, with a compound annual growth rate of 62% [2] - The report indicates that while NVIDIA's market share in China is nearly zero, there are still opportunities for local suppliers to fill the gap, particularly in AI high-performance computing and other semiconductor demands [2] Group 2 - The bottleneck in the semiconductor market is not expected to be TSMC's capacity but rather specific memory or server rack components, with TSMC reporting stronger-than-expected AI demand [3] - AI cluster sizes are moving towards over 100,000 GPUs, driving new standards in Ethernet design and liquid cooling for AI racks [3] - The semiconductor supply chain is projected to expand significantly by 2026, with a focus on CPO and NAND module manufacturers [4] Group 3 - Global CoWoS consumption is expected to reach 1,154k wafers in 2026, with NVIDIA holding a 59% market share, and HBM consumption projected at 2.6 billion GB [5] - AI capital expenditures remain strong, with cloud capex expected to reach USD 582 billion in 2026, reflecting a 31% annual growth [5] - AI GPU and ASIC rental prices have seen slight declines, but demand for AI inference in China remains robust, indicating a positive outlook for the AI supply chain [5]

Core Insights - The core argument of the article is that the bottleneck in AI development has shifted from chip manufacturing and packaging to downstream infrastructure, including data center power supply, liquid cooling, high bandwidth memory (HBM), server racks, and optical modules [2][4][9]. Upstream Capacity Expansion - Chip manufacturing and packaging have significantly expanded, alleviating previous concerns about supply shortages [5][6]. - TSMC has reported strong AI demand and is working to close the supply-demand gap, with a lead time of only six months for expanding CoWoS capacity [6][9]. - The report predicts that global CoWoS demand will reach 1.154 million wafers by 2026, a 70% year-on-year increase, indicating a robust supply response [6][12]. Downstream Infrastructure Challenges - As chip supply is no longer the main issue, the focus has shifted to the availability of data center space, power, and supporting infrastructure, which have longer construction cycles than chip manufacturing [9][12]. - The deployment of large-scale GPU clusters presents significant challenges in power consumption and heat dissipation, leading to a preference for liquid cooling solutions and high-voltage direct current (HVDC) power supply systems [9][12]. - The demand for HBM is expected to explode, with global consumption projected to reach 26 billion GB by 2026, with NVIDIA alone accounting for 54% of this demand [9][12]. Investment Opportunities - The shift in focus towards downstream infrastructure opens new investment opportunities beyond traditional chip manufacturers, emphasizing the importance of companies that excel in power, cooling, storage, memory, and networking [12][13]. - Global cloud service capital expenditure is expected to grow by 31% to $582 billion by 2026, significantly higher than the market's general expectation of 16% [12]. - AI server capital expenditure could see approximately 70% year-on-year growth if AI servers' share of capital expenditure increases [12][13].

Core Insights - The core argument of the article is that the bottleneck in AI development has shifted from chip manufacturing and packaging to downstream infrastructure, including data center power, liquid cooling, HBM memory, racks, and optical modules [4][9][19] Group 1: Shifts in Industry Focus - The focus of the market has transitioned from TSMC's CoWoS packaging and advanced processes to downstream supply chain challenges [4][5] - Chip manufacturing and packaging have significantly expanded, alleviating previous supply concerns [5][6] - The demand for AI semiconductors is expected to grow robustly, with the global CoWoS demand projected to reach 1.154 million wafers by 2026, a 70% year-on-year increase [7][14] Group 2: Downstream Infrastructure Challenges - The new bottlenecks are centered around data center space, power supply, and supporting infrastructure, which have longer construction cycles than chip manufacturing [9][10] - The OCP conference highlighted the need for redesigning data centers to accommodate large-scale AI clusters, emphasizing power and cooling requirements [10][18] - The demand for HBM is expected to surge, with global consumption projected to reach 26 billion GB by 2026, where NVIDIA alone is expected to consume 54% [18] Group 3: Investment Opportunities - Investment opportunities are shifting from upstream wafer foundries and packaging to a broader downstream supply chain [4][19] - Companies with robust power and space resources in data centers will have a competitive edge in the AI computing race [4][19] - The report suggests that investors should broaden their focus from individual chip companies to the entire data center ecosystem, identifying key players in power, cooling, storage, memory, and networking [19]

Core Insights - TSMC's Q3 2025 financial report showcases a significant revenue of $33.1 billion, exceeding market expectations by $1.6 billion and reflecting a year-on-year growth of 41% [2][3] - The company has revised its 2025 revenue growth forecast from 30% to nearly 35%, targeting $121.6 billion, which is $1 billion above market expectations [2][3] - TSMC's net profit reached $15.1 billion, marking a 39% year-on-year increase, equating to a daily net profit of $168 million [2][3] Revenue and Profitability - TSMC's quarterly revenue of $33.1 billion surpassed market expectations of $31.5 billion, with a quarter-on-quarter increase of 10.1% and a year-on-year increase of 41% [4] - The adjusted EPS reached $2.92, a 39% increase year-on-year, exceeding expectations by $0.33, with a net profit margin of 45.7% [4] Gross Margin - The gross margin reached 59.5%, up 1.7 percentage points year-on-year and 0.9 percentage points quarter-on-quarter, exceeding the expected 58.9% [6] - Key drivers include a surge in 3nm and 5nm process shipments and effective internal cost control [6] Process and Platform Structure - Advanced processes contributed 74% of wafer revenue, with 5nm accounting for 37% and 3nm for 23% [8] - The high-performance computing (HPC) segment, primarily driven by AI servers, accounted for 57% of revenue, indicating strong demand resilience [10] Implicit Highlights - The average selling price (ASP) of wafers reached $7,040, a 15% year-on-year increase, reflecting the value added by advanced processes [11] - Free cash flow was NT$139.38 billion (approximately $4.56 billion), a 12% year-on-year increase, providing ample resources for future expansion and R&D [11] AI Demand - TSMC's CEO stated that AI demand is stronger than three months ago, indicating an early stage of a long-term trend supported by three main drivers: cloud, enterprise, and sovereign AI [13] - The number of AI tokens is growing exponentially, necessitating stronger computing power, with TSMC's AI revenue growth forecast of nearly 35% for 2025 being lower than token growth due to technological iterations [14] Technology Roadmap - TSMC's N2 family of technologies is set to drive growth over the next decade, with N2 production starting in Q4 2025 and expected to contribute 5% of wafer revenue by 2026 [17][18] - N2P and A16 technologies are also in the pipeline, targeting high-end AI training and HPC applications, respectively [19][20] Global Expansion - TSMC is advancing its global production capabilities, with significant projects in Arizona, Japan, Germany, and Taiwan to support AI demand [21][22][24][26] - The company aims to achieve over 1 million 12-inch equivalent wafers in Arizona by 2027, leveraging government subsidies to reduce costs [22] Capital Expenditure - TSMC has narrowed its 2025 capital expenditure (CapEx) forecast to $40-42 billion, with 70% allocated to advanced processes [26] - The company expects a return of $1.5-$2 for every $1 spent on CapEx over the next 3-5 years, indicating a strong growth outlook [27] Non-AI Market and Competition - The smartphone market is recovering, with a 19% quarter-on-quarter increase, while automotive electronics are also gaining momentum [29] - TSMC's "Foundry 2.0" strategy aims to build a competitive moat by offering comprehensive solutions, including advanced packaging services [31] Future Signals - To validate TSMC's $65 billion revenue target for 2030, key indicators to monitor include Q4 2025 revenue performance, N2 process ramp-up speed, and overseas factory margin dilution [33] Conclusion - TSMC's Q3 2025 performance exemplifies the benefits of AI-driven advanced processes, solidifying its position as a cornerstone of the global semiconductor industry [35]

Core Viewpoint - TSMC expects a nearly 30% revenue growth in 2025, with an increase in capital expenditure to $40 billion to $42 billion, up from a previous estimate of $38 billion to $42 billion [1][4][10]. Group 1: Performance Guidance - TSMC has raised its revenue growth forecast for 2025 to the mid-point of 30% [2]. - The company anticipates a gross margin of 59% to 61% for Q4, exceeding market expectations of 57% [2][4]. - Q4 sales are projected to be between $32.2 billion and $33.4 billion, surpassing market estimates of $31.23 billion [2][4]. Group 2: Artificial Intelligence - TSMC remains optimistic about AI growth prospects, noting that demand is stronger than anticipated three months ago [2][5]. - The company believes AI demand will remain robust throughout 2025, with a significant focus on expanding production capacity for AI-related products [5][11]. - TSMC is working to increase CoWoS capacity by 2026 due to tight AI-related production capacity [5][12]. Group 3: Capital Expenditure - TSMC's capital expenditure for the first nine months of 2025 totaled $29.39 billion, with an annual forecast of $40 billion to $42 billion [2][10]. - The company emphasizes that capital expenditure is unlikely to drop suddenly in any given year [4][10]. Group 4: Technology and Capacity - The A16 process is expected to achieve mass production in the second half of the year, while the 2nm process is set to begin mass production later this quarter [2][5]. - TSMC is accelerating capacity expansion in Arizona and has begun construction on its second wafer fab in Japan [3][13]. - The company is committed to maintaining a strong competitive edge through advanced manufacturing processes and technology [10][19].

Core Insights - The semiconductor foundry industry is experiencing significant differentiation, with TSMC dominating the market, capturing 70.2% of global market share in Q2 2025, and achieving a revenue of $30.239 billion, marking an 18.5% quarter-over-quarter increase [1][2][5] - TSMC's success is attributed to its advanced process technologies (3nm, 5nm) and unique packaging solutions, which have positioned it as a critical player in the AI and high-performance computing (HPC) sectors [5][9][11] - Other foundries, such as Samsung, SMIC, and UMC, are facing challenges in maintaining market share and profitability, with Samsung's revenue at $3.159 billion and a market share of 7.3%, while SMIC's revenue declined slightly to $2.209 billion [2][6][12] Industry Overview - The top ten foundries collectively generated $41.718 billion in revenue in Q2 2025, reflecting a 14.6% increase from the previous quarter, indicating a recovery in the semiconductor cycle [2][4] - TSMC's revenue for the first half of 2025 reached $55.6 billion, with a gross margin of 58.7% and a net profit of $24 billion, showcasing its strong financial performance compared to its competitors [5][19] - The foundry landscape is characterized by a "one strong, many strong" dynamic, where TSMC leads while other firms like UMC and GlobalFoundries maintain stability through specialized processes [4][5][6] Trends and Challenges - The industry is witnessing three major trends: AI-driven demand, structural recovery in mature processes, and geopolitical reshaping of global supply chains [8][13] - AI and HPC demand have intensified the focus on advanced packaging, with TSMC being the only supplier capable of large-scale, high-yield CoWoS packaging, which is critical for AI chip production [9][16] - Mature process nodes are undergoing a recovery phase after significant inventory adjustments, with companies like UMC and VIS reporting improved margins due to rising demand in consumer electronics and automotive sectors [12][13] Future Outlook - The second half of 2025 will be pivotal, with TSMC expanding its packaging capacity and Samsung betting on its 2nm technology to regain competitiveness [15][17] - SMIC and other Chinese foundries need to enhance their product mix and manage depreciation pressures to improve profitability, while companies like Huahong and PSMC face challenges in maintaining financial stability [17][18] - The evolving landscape suggests that future winners will be those who can provide comprehensive system solutions rather than just excel in individual technologies [19]