5月9日下午2:30分，北京金融资产交易所人头攒动，科技创新债券上线暨集中路演活动(以下简称"活动")正在此举行，新希望、西科控股等8家发行人面向 现场几十家投资机构开展了一场集中路演。随着"科创未来金融护航"的蓝色横幅缓缓拉开，至此，银行间债券市场"科技板"正式上线。 党的二十届三中全会明确提出，要加快多层次债券市场建设，构建同科技创新相适应的科技金融体制。近日，中国人民银行、中国证监会联合发布关于支 持发行科技创新债券有关事宜的公告(中国人民银行中国证监会公告〔2025〕8号)。 银行间债券市场随即响应。5月7日，中国银行间市场交易商协会(以下简称"交易商协会")发布《关于推出科技创新债券构建债市"科技板"的通知》(以下简 称《通知》)，推出科技创新债券，市场反响热烈，多家机构积极参与注册发行。 以科技创新债券为桥梁 推动更多金融活水涌向创新高地 当前我国债券市场规模已经超过了180万亿元，稳居全球第二大债券市场。"科技创新债券的推出不仅是市场的一次重要创新，也是加快我国多层次债券市 场建设的一次关键机遇。"在活动上，中国人民银行金融市场司副司长曹媛媛关于各市场主体参与科技创新债券提出了四点倡议。 她表示 ...

中国央行：将继续完善公开市场一级交易商和做市商考核，加强投资者利率风险管理，优化债券市场结 构及制度安排，促进债券市场功能进一步增强，为利率市场化推进和货币政策调控转型提供坚实支撑。 ...

Core Viewpoint - The recent announcement by the People's Bank of China and the China Securities Regulatory Commission marks a significant milestone in the development of the technology innovation bond market in China, aiming to enhance the investment ecosystem for technology innovation bonds and stimulate the multi-tiered bond market [1][2]. Group 1: Development of Technology Innovation Bonds - Since its full launch in 2022, the technology innovation bond market has rapidly developed, accumulating a total issuance of 2.5 trillion yuan and a balance of 1.8 trillion yuan by the end of Q1 2025, accounting for 5.38% of the non-financial corporate credit bond balance [2][3]. - The funds raised from technology innovation bonds have primarily been used for repaying existing debts or supplementing liquidity, indicating a need for more targeted funding applications [2]. Group 2: Features of the New "Technology Board" - The "Technology Board" expands the range of issuers and the purposes for which funds can be raised, now including financial institutions and equity investment institutions, which can use the funds for various technology innovation-related activities [3]. - A differentiated review mechanism has been implemented to enhance issuance efficiency, including a "green channel" for simplified disclosures and extended validity of reports [3]. - Emphasis is placed on post-issuance supervision, ensuring compliance in the use of raised funds and enhancing the effectiveness of the bond market in supporting national strategies [3]. Group 3: Credit Rating Innovations - The credit rating system for technology innovation bonds has been innovated to better reflect the characteristics of tech enterprises, with a new rating method introduced in April 2024 that reduces the weight of asset and scale metrics while increasing the focus on technological innovation capabilities [4][5]. - This new approach aims to enhance the accessibility and convenience of financing for early-stage and growth-stage tech companies, thereby attracting more long-term capital into the technology innovation sector [4]. Group 4: Market Vitality and Future Outlook - The establishment of the "Technology Board" is expected to activate demand for technology innovation bonds from various entities, enhancing the synergy between loans, bonds, and equity financing [7]. - Nearly 100 market institutions are planning to issue over 300 billion yuan in technology innovation bonds, with expectations for further participation from additional institutions [7]. - Continuous innovation in bond types and improvement of the policy environment are essential for enhancing the liquidity and attractiveness of technology innovation bonds, particularly for lower credit quality issuers [8].

以增量政策下好先手棋 以自身韧性应对外部风高浪急 ■记者观察 稳企业。全球最大银行市场、第二大资本市场和第二大债券市场，将为科技型企业发展提供资金"后 盾"。债券市场"科技板"横空出世，为科技创新提供高效、便捷、低成本的增量资金；深化科创板、创 业板改革政策措施出台在即；信贷支持科技创新的专项机制蓄势待发，金融资产投资公司批设"开闸"， 将加大对科创企业的投资力度…… 面对关税冲击，外贸企业在危机中觅新机，以"广交世界"抵御外围"海啸"，金融政策将助力外贸行业筑 起"堤坝"。银行业保险业护航外贸发展系列政策措施将制定实施，对外贸企业将应贷尽贷、应续尽续； 受关税政策影响较大的上市公司，将在股权质押、再融资、募集资金使用等方面获得更高的监管包容 度。 稳预期。超常规政策"如约而至"，社会信心"如期充值"。作为重要的宏观调控工具，货币政策超预期、 力度大、工具多、落地快：降准方面，既针对大中型银行，也阶段性调降汽车金融公司、金融租赁公司 存款准备金率；降息方面，下调了政策利率和住房公积金贷款利率，并首次全面下调结构性货币政策工 具利率；结构性工具既有新工具创设，也有额度增加，还有价格优惠。超常规的政策组合，迎来了 ...

5月7日，中国人民银行、中国证监会联合发布关于支持发行科技创新债券有关事宜的公告（以下简称 《公告》），从丰富科技创新债券产品体系和完善科技创新债券配套支持机制等方面，对支持科技创新 债券发行提出多项重要举措。 随后，沪深北交易所同步发布《关于进一步支持发行科技创新债券服务新质生产力的通知》，从三大方 面进一步细化支持措施。交易商协会也迅速响应，制定并发布《关于推出科技创新债券构建债市"科技 板"的通知》，创新推出科技创新债券，围绕四个方面，激发科技创新动力和市场活力。与此同时，全 国银行间同业拆借中心通知称，即日起全额减免银行间债券市场境内成员以科技创新债券为标的的现券 买卖交易手续费，减免期为2025年至2027年。 至此，由多部门协同推进、多层面共同发力的政策"组合拳"，将成为支持科技创新企业发展的强大动 力。接受《证券日报》记者采访的专家表示，这股合力不仅体现出对科技创新企业融资难、融资贵问题 的精准"把脉"，更切实降低了这些企业的融资成本，助力其在技术研发、成果转化、市场拓展等关键环 节"轻装上阵"；同时，通过创新债券产品与机制，也极大丰富了债券市场的产品供给，吸引更多投资者 入场，有效提升了债券市 ...

Group 1 - The central viewpoint of the announcements is to enhance the issuance of technology innovation bonds through various supportive measures, thereby establishing a "technology board" in the bond market [1][6][8] - The People's Bank of China and the China Securities Regulatory Commission have introduced thirteen measures to support the issuance of technology innovation bonds, which are complemented by notifications from stock exchanges and trading associations [1][3][4] Group 2 - The issuance of technology innovation bonds will now include a wider range of issuers, such as financial institutions and private equity investment institutions, expanding the funding sources for technology-driven enterprises [3][4] - The new policies aim to encourage more mature and growth-stage private technology enterprises to issue technology innovation bonds for financing [4][5] Group 3 - Issuers are encouraged to innovate in bond terms, allowing for flexible arrangements that better match funding needs, such as equity conversion and project revenue-linked repayment structures [5][6] - The introduction of a "green channel" for bond issuance aims to streamline the approval process and enhance financing efficiency for technology innovation bonds [6][7] Group 4 - The trading mechanisms for technology innovation bonds will be enriched to attract a diverse range of investors, thereby improving liquidity in the secondary market [7][8] - The establishment of a risk-sharing mechanism is proposed to mitigate credit risks associated with technology enterprises and market-oriented equity investment institutions [8][9] Group 5 - Simplified information disclosure rules for issuers are expected to reduce the burden of compliance and enhance financing efficiency [9][10] - A new credit rating system tailored to the characteristics of technology enterprises and equity investment institutions is being developed to provide a more accurate assessment of creditworthiness [10]

Core Insights - The bond market's "Technology Board" is progressing with policy details emerging, indicating strong market interest and readiness for issuing technology innovation bonds [2][3][4] - Nearly 100 market institutions plan to issue over 300 billion yuan in technology innovation bonds, with expectations for more participants [2][5] - The initiative aims to enhance financial support for technology enterprises, particularly encouraging private technology firms to access financing through bond issuance [2][4][8] Policy Developments - The People's Bank of China (PBOC) and the China Securities Regulatory Commission (CSRC) have released announcements detailing measures to support the issuance of technology innovation bonds [5][6] - The new policies include improved systems for issuance, trading, information disclosure, and credit rating tailored to the characteristics of technology enterprises [4][5] Risk Management and Credit Enhancement - The initiative addresses the diverse risk profiles of technology enterprises, particularly smaller firms, by encouraging financial institutions to develop credit protection tools [6][8] - The PBOC plans to create risk-sharing tools and provide low-cost refinancing to support the issuance of technology innovation bonds, thereby reducing default risk [6][8] Market Dynamics - The "Technology Board" is expected to attract more institutional investors to focus on "hard technology," fostering a positive funding cycle [8][9] - The initiative will prioritize financing for key technology sectors such as artificial intelligence, big data, integrated circuits, and biotechnology [8] Credit Rating Innovations - The bond market's "Technology Board" will introduce a new credit rating system tailored to the characteristics of technology firms and private equity institutions [9] - Rating agencies are encouraged to develop specialized rating methodologies that reflect the unique aspects of technology enterprises, moving away from traditional asset-based metrics [9]

Core Viewpoint - The People's Bank of China and the China Securities Regulatory Commission have introduced a risk-sharing tool for technology innovation bonds to support long-term financing for equity investment institutions in the "Technology Board" [1][8]. Group 1: Policy Announcements - The announcement includes 13 specific measures aimed at enriching the product system for technology innovation bonds and improving supporting mechanisms [1]. - The Shanghai and Shenzhen Stock Exchanges have issued notifications to further support the issuance of technology innovation bonds, supplementing the measures outlined in the announcement [1][2]. Group 2: Market Response and Scale - Nearly 100 market institutions have planned to issue over 300 billion yuan in technology innovation bonds, indicating strong market response [2]. - The total scale of China's bond market is 183 trillion yuan, ranking second globally, which can provide efficient and low-cost funding for technology innovation [2]. Group 3: Focus Areas and Support Mechanisms - The "Technology Board" will focus on financing support for key technology industries such as artificial intelligence, big data, integrated circuits, and biotechnology [3]. - The new policies aim to reduce reliance on government funding and enhance investment efficiency by establishing a comprehensive support system for technology innovation bonds [3][4]. Group 4: Risk Management and Evaluation - The announcement includes measures to improve the risk-sharing mechanism for technology innovation bonds, allowing financial institutions to engage in credit protection tools and risk mitigation [6][8]. - A national evaluation mechanism for the effectiveness of financial institutions' technology financial services will be established to encourage investment in technology innovation bonds [3][6]. Group 5: Innovation in Bond Issuance - Issuers can innovate bond terms, including options for collateral and linking interest rates to project performance, enhancing the attractiveness of technology innovation bonds [7]. - The introduction of risk-sharing tools by the People's Bank of China aims to lower financing costs for equity investment institutions and support the issuance of longer-term bonds [8].

Core Viewpoint - The People's Bank of China (PBOC) is preparing to launch a "Technology Board" in the bond market to support the issuance of technology innovation bonds by financial institutions, technology companies, and private equity firms, with nearly 100 market institutions planning to issue over 300 billion yuan in such bonds [1][2]. Group 1: Policy and Mechanisms - The PBOC and the China Securities Regulatory Commission (CSRC) have created a risk-sharing tool for technology innovation bonds, allowing for low-cost refinancing and diverse credit enhancement measures to lower financing costs for private equity firms [2][3]. - The announcement includes 13 specific measures to support the issuance of technology innovation bonds, focusing on enriching the product system and improving support mechanisms [2][3]. - The issuance process for technology innovation bonds will be optimized, allowing for flexible terms and simplified disclosure rules to enhance financing efficiency [3][4]. Group 2: Market Response and Participation - Major financial institutions and exchanges have responded positively, with the Shanghai and Shenzhen stock exchanges implementing measures to support the issuance of technology innovation bonds [4][5]. - The interbank market has announced a full waiver of transaction fees for technology innovation bonds from 2025 to 2027, encouraging participation [4][5]. Group 3: Investment Opportunities and Market Dynamics - The introduction of the "Technology Board" is expected to alleviate funding challenges for private equity firms and stimulate long-term investments in hard technology sectors, potentially attracting more social capital into the technology innovation field [10][11]. - The policy aims to enhance market confidence and encourage private enterprises to strengthen independent innovation, particularly in sectors like artificial intelligence and biotechnology [10][11]. - The development of a comprehensive support system involving bonds, loans, equity, and insurance is anticipated to provide extensive funding support for technology enterprises [7][10]. Group 4: Credit Rating and Risk Assessment - The establishment of a tailored credit rating system for technology innovation bonds is crucial, focusing on the unique characteristics of technology companies and private equity firms [8][12]. - Rating agencies are encouraged to enhance their methodologies and incorporate forward-looking indicators to better assess the creditworthiness of technology innovation entities [8][12].

Group 1: Legal Framework and Impact - The "Private Economy Promotion Law" was passed on April 30, 2025, and will take effect on May 20, 2025, marking a significant legal recognition of the private economy's status in China[2] - The law aims to enhance the legal framework supporting private enterprises, promoting high-quality development and a multi-level capital market system[2] - It emphasizes the importance of the bond market as a crucial channel for direct financing, particularly for private enterprises[2] Group 2: Financing Mechanisms and Challenges - In the first four months of 2025, private enterprises issued bonds totaling approximately 102.2 billion yuan, accounting for only 2.1% of the total credit bond issuance, a significant drop of 11.4 percentage points from 2016[6] - The law introduces measures to optimize financing mechanisms for private enterprises, addressing issues of high financing costs and difficulties in accessing funds[4] - The law also mandates timely legal action against overdue payments to small and medium-sized private enterprises, which currently have accounts receivable constituting 11% of their total assets, higher than the average for all listed companies[7] Group 3: Innovation and International Cooperation - The law supports technological innovation and international cooperation, aiming to enhance the vitality of the private economy through various measures, including participation in national technology projects[8] - The bond market has seen the introduction of innovative financing tools for technology enterprises, with the current stock of technology bonds reaching approximately 1.85 trillion yuan[9] Group 4: Risk Management and Credit Rating - The law proposes a market-based mechanism for sharing financing risks, encouraging collaboration between banks and financing guarantee institutions to support private enterprises[9] - It highlights the need for improved credit rating services, with a focus on enhancing the methodologies used by credit rating agencies to better assess the creditworthiness of private enterprises[10]