业 及 产 业 2025 年 07 月 13 日 行 业 研 究 / 行 业 点 评 相关研究 证 券 研 究 报 告 证券分析师 杨海晏 A0230518070003 yanghy@swsresearch.com 李天奇 A0230522080001 litq@swsresearch.com 袁航 A0230521100002 yuanhang@swsresearch.com 研究支持 陈俊兆 A0230124100001 chenjz@swsresearch.com 杨紫璇 A0230524070005 yangzx@swsresearch.com 联系人 陈俊兆 (8621)23297818× chenjz@swsresearch.com AI 算力高景气持续向上 看好 ——25 年 6 月暨 2 季度台股电子板块景气跟踪 图 1：台股电子半导体制造板块 2025-06 营收情况 本期投资提示： 请务必仔细阅读正文之后的各项信息披露与声明 本研究报告仅通过邮件提供给 中庚基金 使用。1 行 电子 - ⚫ AI 领域：持续高景气，信骅、台光电、纬创等多个环节供应商月营收创历史新高。25 年 6 月信骅营收 ...

根据睿兽分析监测数据，本周国内一级市场披露的融资事件62个，与上周相比减少85个，其中已披 露融资金额的事件29个，总融资规模为52.63亿元人民币，平均融资金额为1.81亿元人民币。 以下文章来源于睿兽Pro ，作者Bestla 睿兽Pro . 创业邦旗下横跨一二级市场的科创数据平台。实时投资数据、追踪产业创新。找数据、做分析、链资 源，就上睿兽分析。 全球投融资周报 睿兽分析每周整理当周最值得关注的国内外热门投融资事件，帮助大家及时了解全球市场动向。 一级市场投融资概览 其次是汽车交通行业，已披露融资总额为4.20亿元人民币。其中空气悬架系统核心零部件提供商「时 驾科技」完成数亿人民币A轮融资。 时驾科技是一家空气悬架系统核心零部件提供商，主要致力于研发、生产和销售空气悬架系统核心零 部件、软硬件及系统解决方案。 行业分布 从融资事件数量来看，本周人工智能、智能制造、企业服务领域融资最活跃。分别为人工智能19 个、智能制造9个、企业服务6个。 从已披露金额事件的融资规模来看，人工智能最高，融资总规模约为36.87亿元人民币。其中AI驱动 的具身智能技术公司「它石智航」获1.22亿美元天使+轮融资。 它石智 ...

瞭望塔财经获悉，6月28日，上交所官网披露了江西红板科技股份有限公司（以下简称"红板科技"）的IPO申报材料，这家在PCB行业深耕二十年的技术型企 业正式向资本市场迈进。 瞭望塔财经发现，作为全球手机HDI主板13%市场份额的拥有者，红板科技在招股书中展示了自己在消费电子领域的竞争力。2024年，公司为全球前十大手 机品牌提供1.54亿件手机HDI主板，同时其柔性电池板和刚柔结合电池板供货量更是占到这些品牌出货量的20%。 然而在亮眼的技术参数背后，控股股东95.12%的绝对控制权、2023年净利润近乎腰斩的波动曲线，以及高度集中的客户结构，都成为红板科技IPO之路上待 解的难题。 1、技术突围，二十年磨剑的行业隐形冠军 2005年10月17日，江西吉安，叶森然创立了红板科技的前身。这位毕业于台湾海洋大学电子工程系的76岁企业家，将毕生积累投入到了印制电路板领域。二 十年深耕，公司已从一家地方企业成长为全球PCB行业第58强的技术领军者。 红板科技的核心竞争力在于其高密度互连板技术。公司掌握着行业领先的HDI板生产技术，其最小激光盲孔孔径可达50μm，芯板电镀层板厚最薄做到 0.05mm，任意层互连HDI板最 ...

半导体产业作为信息技术的基石，其产业链的整合升级是培育新质生产力的关键抓手。"并购六条"的出 台，为这一进程注入了强劲的动能。 "并购六条"提出，"积极支持上市公司围绕战略性新兴产业、未来产业等开展并购重组，涵盖有助于补 链强链和提升关键技术水平的未盈利资产收购，引导更多资源要素向新质生产力方向聚集"。 记者梳理发现，政策落地后，深市新增披露的资产收购类重组中，新质生产力行业占比超七成，而作为 战略性新兴产业核心的半导体领域，典型整合案例持续涌现，成为产业升级的生动注脚，彰显出政策引 导下市场资源向高附加值领域流动的鲜明趋势。 富乐德（301297）的跨界整合颇具代表性，其不仅是企业自身的一次战略跃迁，更是半导体产业链垂直 整合的典范。公司通过发行股份及可转债方式，作价65.50亿元收购富乐华100%股权。富乐华是覆铜陶 瓷载板领域全球前三的企业，2023年在AMB载板市场份额占比达19%，其产品是功率半导体模块的关 键组成部分。此次收购交易对手方数量达59名，为满足不同交易对方多元化的对价要求，采用了发行股 份和定向可转债相结合的方式，顺利整合控股股东旗下优质半导体零部件制造业务，使富乐德从设备洗 净服务商 ...

Group 1 - The Shenzhen Municipal Government has introduced measures to promote high-quality development in the semiconductor and integrated circuit industry, including a 5 billion yuan "Semi Industry Private Equity Fund" to support the entire industry chain optimization [1] - The China Securities Regulatory Commission (CSRC) released guidelines to deepen the reform of the listed companies' merger and acquisition (M&A) market, encouraging companies to focus on technological innovation and industrial upgrades [1][2] - The semiconductor sector has seen a significant increase in M&A activities, with over 70% of newly disclosed asset acquisitions in Shenzhen's stock market related to new productivity industries [1][2] Group 2 - Semiconductor companies are actively pursuing innovation and collaboration through M&A, transforming policy benefits into practical advancements in technology [2] - For instance, Anhui Fulede Technology Co., Ltd. plans to acquire Jiangsu Fulehua Semiconductor Technology Co., Ltd., which holds a 19% market share in the active metal brazing copper ceramic substrate market, enhancing Fulede's position in the semiconductor materials sector [2] - Another example includes Robotech's acquisition of the German company ficonTEC, which specializes in semiconductor automation and testing equipment, aiming to accelerate domestic production in electronic packaging [3] Group 3 - The current wave of technological revolution and industrial transformation is driving the need for effective M&A strategies to enhance resource allocation and accelerate technology transfer, particularly in the semiconductor industry [4] - Policies have been implemented to support M&A activities, including financial subsidies to reduce initial costs and direct participation from industry funds, providing dual support for companies [4][5] - The semiconductor M&A market is experiencing not only an increase in transaction volume but also an improvement in the quality of mergers, with larger companies using M&A to build ecological barriers and smaller firms leveraging it as a growth opportunity [5]

Company Overview - Chaoying Electronics is a high-tech enterprise focused on the research, development, production, and sales of printed circuit boards (PCBs) [1] - The main products include high-density interconnect boards, multi-layer flexible boards, and IC packaging substrates, with applications in automotive electronics, displays, and storage [1] Financial Performance - Projected revenues for Chaoying Electronics from 2022 to 2024 are 3.514 billion, 3.656 billion, and 4.124 billion yuan, respectively [1] - Projected net profits attributable to shareholders for the same period are 141 million, 266 million, and 276 million yuan, indicating a slowdown in profit growth in 2024 but overall steady growth [1] Technology and Innovation - The company has developed several core technologies in automotive electronics and display fields, including high-frequency millimeter-wave radar board manufacturing technology and large-size LCD display mainboard manufacturing technology [1] - As of the reporting period, Chaoying Electronics has obtained 14 invention patents and 85 utility model patents, along with several non-patent technologies [1] Client Relationships - In the automotive electronics sector, the company has long-term partnerships with Continental Automotive, Valeo, Bosch, and Aptiv [2] - In the display sector, stable collaborations exist with BOE and LG Group, while leading storage manufacturers like Seagate, Western Digital, and SK Hynix are also clients [2] Financial Ratios - The company's asset-liability ratios from 2022 to 2024 are 72.14%, 68.75%, and 72.83%, indicating a relatively high level of debt [2] - The increase in the asset-liability ratio in 2024 is attributed to the construction and commissioning of a factory in Thailand, leading to increased funding needs and higher bank loans [2] Market Outlook - The global PCB market is projected to reach a total output value of 73.565 billion USD in 2024, indicating significant market potential [3] - The PCB industry is expected to grow at a compound annual growth rate (CAGR) of 5.5% from 2024 to 2028, driven by the booming demand from sectors like new energy vehicles and cloud computing [3] Investment Plans - The funds raised from the IPO will be used for the second phase of high-layer and HDI project investments, supplementing working capital, and repaying bank loans [3] - The implementation of these projects is expected to add 360,000 square meters of production capacity annually, enhancing the company's high-layer PCB and advanced HDI processing capabilities [3]

Core Viewpoint - The company, Chaoying Electronics, is facing significant challenges as it seeks to go public, including slowing profit growth, questionable related-party transactions, and high debt levels, raising concerns among investors and the market [1][2][3]. Financial Performance - Chaoying Electronics has shown steady profit growth from 2022 to 2024, with net profits of 141 million, 266 million, and 276 million yuan respectively [2]. - The company's net profit growth is projected to slow to 3.78% in 2024 [1]. Related-Party Transactions - There are notable discrepancies in related-party transactions, particularly in pricing. For instance, the price for double-sided boards sold to the parent company was 606.32 yuan/㎡, while the average price for other customers was 678.13 yuan/㎡ [2]. - The company's subsidiary in Seychelles reported a net profit of 129 million yuan in 2023, a 70% increase from 2021, raising suspicions of profit shifting through transfer pricing [2]. Debt and Financial Health - The company's debt-to-asset ratio has increased to 72.83% in 2024, marking a five-year high and significantly above industry averages [4]. - Short-term borrowings surged to 1.726 billion yuan in 2024, nearly doubling from the previous year, primarily due to funding needs for a factory in Thailand [6]. - Accounts payable also rose sharply from 1.153 billion yuan to 2.038 billion yuan, reflecting increased obligations related to the factory's construction [7]. Revenue Sources and Risks - Over 80% of the company's revenue comes from international markets, with export revenues accounting for 81.89%, 81.67%, and 82.77% from 2022 to 2024 [7]. - The company benefits from a 13% export tax rebate, but potential reductions in this rate could adversely affect profitability [7]. Fundraising and R&D Concerns - Chaoying Electronics plans to raise 660 million yuan, with 39.4% earmarked for working capital and debt repayment, raising concerns about the legitimacy of its fundraising intentions [8]. - The company's R&D expenditure as a percentage of revenue is below 4%, with rates of 3.07%, 3.34%, and 3.27% from 2022 to 2024, which is lower than industry peers [8][10]. Competitive Landscape - The PCB industry is highly competitive, with approximately 1,500 manufacturers in China. Chaoying Electronics ranks in the lower tier, with a revenue significantly less than leading competitors like Pengding Holdings, which reported 35.14 billion yuan in 2024 [10].

投资者关系活动 类别 ■特定对象调研 □分析师会议 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □现场参观 □其他 （） 参与单位名称 招商证券/泰康基金/摩根士丹利基金/华商基金/浦银国际 时间 2025 年 07 月 01 日 地点 公司会议室 上市公司接待人 员姓名 副总、董秘：周红 投资者关系活动 主要内容介绍 怎么看待算力市场与终端市场之间的发展关系？ 答：当前 AI 服务器与终端产品的发展呈现出深度协同、 双向驱动的演进格局，两者共同构成"云-边-端"智能体 系的支柱。个人觉得，算力需求的未来发展空间最终需要 终端产品来落地决定，一旦端侧产品及应用打开空间后， 对算力的需求就会进一步提升，是一个正循环的过程。 在 AI 服务器领域客户拓展进展？ 答:今年一季度，公司汽车及服务器用板营收同比增长 81.3%，仍呈快速增长趋势。公司持续与服务器终端客户 展开积极合作，目前主流客户也在加快推进相关工作。同 时，泰国园区第一期项目已建成，正在进行客户认证及打 样阶段，预计下半年能小批量投产。 公司产能投放周期大概是什么节奏？ 答：在有厂房和机电配套具备的条件下，确定产能投向， 从布置设备到投产大概 ...

Company Overview - Hongban Technology Co., Ltd. has received approval for its IPO on the Shanghai Stock Exchange, with Minsheng Securities as the sponsor and Lixin Accounting Firm as the auditor [3] - The company focuses on the research, production, and sales of printed circuit boards (PCBs), targeting the mid-to-high-end application market [3] Industry Insights - The global PCB industry is the largest segment in the electronic components sector, with a total output value of $81.74 billion in 2022, which decreased to $69.52 billion in 2023, a decline of 15% due to weak demand and oversupply [4] - The global PCB market is expected to recover to $73.57 billion in 2024, driven by AI servers, high-speed network infrastructure, and a revival in the smartphone market, representing a year-on-year growth of 5.8% [4] - The PCB market is projected to grow at a compound annual growth rate (CAGR) of 5.2% from 2024 to 2029, reaching an estimated value of $94.66 billion by 2029 [4] Regional Market Dynamics - Historically, North America, Europe, and Japan dominated the PCB market, accounting for over 70% of global output before 2000 [5] - In the last two decades, production capacity has shifted to Asia, particularly mainland China, Taiwan, and South Korea, establishing a new manufacturing center in Asia [5] - By 2024, mainland China's PCB output value is expected to reach $41.2 billion, representing 56% of the global total, solidifying its position as the leading PCB production hub [7][8] Future Projections - The PCB industry in mainland China is forecasted to grow at a CAGR of 3.8%, reaching $49.7 billion by 2029 [8] - Other regions, such as Taiwan and South Korea, are also expected to see growth, with Taiwan's PCB market projected to grow at a CAGR of 6.9% and South Korea at 4.2% [7]

Core Viewpoint - Xinqiang Electronics (Qingyuan) Co., Ltd. has officially submitted its IPO application to the Shenzhen Stock Exchange, focusing on the R&D, production, and sales of printed circuit boards (PCBs) targeting the mid-to-high-end market [1][2] Group 1: Company Overview - The company specializes in high-end PCBs, primarily those with eight layers or more, with an average product price exceeding 2,000 yuan per square meter, positioning itself in the industry's top tier [1] - Xinqiang Electronics' products are known for their high reliability, stability, precision, and continuous iteration, including rigid boards, HDI boards, flexible boards, and rigid-flex boards [1] - The company has a strong reputation and brand advantage in the storage and communication sectors, with PCB products widely used in storage, communication, and consumer electronics [1] Group 2: Market Position and Financials - In the storage sector, PCB product revenue accounts for approximately 60%-70% of the company's total revenue, with a projected global market share of about 12.57% in memory module PCBs and 2.57% in SSD PCBs for 2024 [1] - The company’s memory module boards are designed for high-speed data transmission and require materials that can withstand high temperatures and frequencies, with strict control over board thickness tolerance at ±5% [1] Group 3: Technological Capabilities - In the communication sector, Xinqiang Electronics has the capability to mass-produce 800G and 1.6T optical module boards, which require high reliability, stability, and low loss rates [2] - The technical specifications for the 1.6T optical module boards include a line width impedance of 1.8mil/1.8mil and an impedance tolerance of ±3%, indicating a high level of technical difficulty [2] Group 4: IPO and Future Plans - The company plans to raise 962 million yuan through the IPO to fund the expansion of its high-density interconnect PCB production capacity, aiming to add an annual production capacity of 380,000 square meters [2] - This expansion is expected to significantly enhance the company's production capabilities, meet market demand, and improve its competitive position in the industry [2]