同时，公司拟向不超过35名特定对象发行股份（锁定期6个月），募集资金不超过75.56亿元， 用于华力微技术升级改造项目，华力微特色工艺研发及产业化项目，补充流动资金、偿还债务 及支付中介机构费用。 12月31日晚间，华虹公司（688347）发布了发行股份购买资产并募集配套资金暨关联交易报告 书（草案）。 | 交易形式 | | 发行股份购买资产并募集配套资金 | | --- | --- | --- | | 交易方案简介 | | 上市公司拟通过发行股份方式向华虹集团等 4 名交易对方购买其合计 持有的华力微 97.4988%股权,并拟向不超过 35 名符合条件的特定对象 | | 发行股票募集配套资金。 | | | | 交易价格(不含募集 826,790.22 万元 配套资金金额) | | | | 名称 交易 | 上海华力微电子有限公司 | | | 主营业务 | | 主要从事 12 英寸集成电路晶圆代工服务,为通信、消费电子等终端应 | | | 用领域提供完整技术解决方案。 | | | 所属行业 标的 | C39 计算机、通信和其他电子设备制造业 | | | 符合板块定位 | | √是 □否 □不适用 | | 其他 ...

Core Viewpoint - TSMC has received an annual license from the U.S. government to ship U.S.-made chip manufacturing equipment to its factory in Nanjing, ensuring uninterrupted operations and product delivery [1][3]. Group 1 - TSMC joins Samsung Electronics and SK Hynix in being granted permission to export U.S. chip manufacturing equipment to mainland China [3]. - The previous exemption known as "Validated End Use" (VEU) expired on December 31, 2025, requiring U.S. export licenses for chip manufacturing equipment sent to China starting in 2026 [3]. - The U.S. Department of Commerce has issued TSMC an annual export license, allowing the supply of U.S. export-controlled items to the Nanjing plant without needing individual supplier applications [3]. Group 2 - TSMC's ADR stock price increased by 1.44% on the last trading day of 2025, with an annual growth rate exceeding 50% [3].

作为专用型计算架构（ASIC/DSA/可重构计算）路线的核心代表企业，燧原科技的上市征程颇具行业代表性。公司成立于2018年3月，2024年8月首次完成 辅导备案登记，历经辅导机构调整后，于2025年11月重启IPO进程。最新辅导备案报告显示，公司注册资本3.86亿元，创始人兼总经理张亚林担任法定代 表人，与ZHAO LIDONG（赵立东）通过直接持股及两家合伙企业合计控制28.14%的表决权，二人签署的一致行动协议为公司治理奠定了稳定基础。 七年深耕中，燧原科技已构建起差异化竞争优势。不同于海光信息、摩尔线程等通用GPU企业的技术路径，其专注于云端AI算力的深度定制，形成了从 推理到训推一体的完整产品矩阵。其中S60推理加速卡已实现7万片规模化部署，2025年WAIC发布的L600训推一体卡凭借144GB存储容量与200 TFLOPS FP8算力，成为高性能算力市场的潜力股。依托自主研发的"驭算"TopsRider平台，公司已在庆阳建成国产万卡推理集群，4天即可完成千亿级AI图片生成 需求的部署调优，展现了扎实的工程化交付能力。 2026年开局，国产AI芯片赛道传来重磅消息：证监会官网公示显示，上海AI芯片 ...

2025年12月30日，国内DPU芯片领域独角兽企业深圳云豹智能股份有限公司正式签署IPO辅导协议，辅导机构为中信证券，辅导周期定于2026年1月至4 月。若一切进展顺利，公司有望在2026年4月完成辅导验收，成功登陆资本市场，成为名副其实的"国产DPU芯片第一股"，为国产高端芯片产业再添标 杆。 | 辅导对象 | 深圳云豹智能股份有限公司 | | | | --- | --- | --- | --- | | 成立日期 | 2020-08-28 | | | | 注册资本 | 36,000 万元 | 法定代表人 | 肃启阳 | | 注册地址 | 深圳市宝安区新安街道海滨社区海秀路 2038 号鹏鼎时代大厦 A 座 2301A | | | | 控股股东及持 股比例 | 无控股股东 | | | | 行业分类 | 计算机、通信和其他 电子设备制造业 (C39) | 在其他交易场所(申请)挂 牌或上市的情况 | 无 | | 备 注 | 不存在近3年内提交首次公开发行股票/存托凭证并上市申请被终止审 | | | | | 查、不予核准、不予注册的情况 | | | | 辅导协议签署时间 | 2025年12月30日 | | -- ...

Core Viewpoint - Chongqing Ruishi Chuangxin Microelectronics Co., Ltd. has officially been accepted for IPO on the Sci-Tech Innovation Board, marking its significant progress in the capital market as a leading domestic RF front-end chip and module enterprise [1] Industry Overview - The RF front-end chip is a core component of wireless communication devices, significantly impacting signal quality and communication performance. The market has long been dominated by international giants such as Broadcom, Skyworks, and Qorvo, particularly in the critical components like filters, where domestic companies have faced supply chain constraints [3] - Among domestic listed companies in the RF front-end chip and module sector, there are established leaders and emerging players, showcasing diverse market positions, technological characteristics, and recent performance trends [3] Company Development - Ruishi Chuangxin's breakthrough began in 2024 with the launch of its high-performance filter wafer manufacturing base, marking a strategic shift from a Fabless to a Fab-lite model. This transition enables the company to achieve independent R&D and mass production of filters, reducing reliance on external supply chains [5] - The company's shareholder structure includes major mobile manufacturers and investment institutions, such as OPPO (5.9431%), Huawei's Hubble Investment (5.7187%), and Lei Jun's Shunwei Capital (5.3964%), indicating strong recognition of its technological capabilities [5] - Ruishi Chuangxin's products have been successfully integrated into major mobile manufacturers like OPPO, Xiaomi, and ZTE, as well as various consumer electronics and IoT companies, demonstrating a diversified application of its products [5] Financial and Market Position - The company plans to raise 809 million yuan through its IPO, focusing on three main areas: the second phase of the MEMS device production base, the establishment of a research and development center, and supplementing working capital [6] - The second phase of the MEMS device production base will enhance the manufacturing capacity of filters and solidify its leading position in the domestic filter market [6] - The R&D center will focus on advanced 5G and 6G technologies, as well as RF module integration technologies, positioning the company for future communication advancements [6] Market Demand and Growth - The global RF front-end market is projected to grow from approximately $22 billion in 2023 to $30 billion by 2028, with a compound annual growth rate of about 6.4% [7] - Domestic companies are poised to benefit from dual opportunities: the significant increase in RF front-end demand due to 5G smartphones (which require about 50% more RF front-end chips than 4G smartphones) and the supply chain restructuring driven by domestic substitution policies [7] - Ruishi Chuangxin's vertical integration from chip design to filter manufacturing and module packaging allows for better cost control, capacity assurance, and rapid response to customer needs [7] - With a registered capital of 434 million yuan and nearly 500 employees, the company has achieved rapid revenue growth in just seven years, positioning itself favorably for resource support and accelerated technological development following its IPO [7]

在全球人工智能产业驱动高带宽内存（HBM）需求激增的背景下，三星电子加码美国市场HBM供应的战略布局正遭遇重大挑战。 美国国际贸易委员会 （ITC）近期正式受理Netlist公司的投诉，对三星电子及多家相关企业启动337调查 ，此举不仅可能导致三星相关高性能内存产品被限制进入美国市场， 更让双方持续数年的专利争端再度升级。 据中国贸易救济信息网披露， 12月29日，美国国际贸易委员会经投票决定，对特定动态随机存取存储器（DRAM）设备及其下游产品和组件（Certain Dynamic Random Access Memory (DRAM) Devices, Products Containing the Same, and Components Thereof）启动编号为337-TA-1472的337调查。 这一 调查的源头可追溯至2025年9月30日，美国Netlist公司（总部位于加利福尼亚州欧文市）向ITC提交的立案调查申请。Netlist主张，对美出口、在美进口及 销售的相关产品违反美国337条款，涉嫌侵犯其6项美国注册专利（专利号分别为12,373,366、10,025,731、10,268,608 ...

Core Viewpoint - Hanbo Semiconductor has completed its IPO counseling process, marking a significant step towards its public listing and reflecting the growing interest in domestic GPU companies in China [1]. Group 1: Company Overview - Founded in December 2018, Hanbo Semiconductor focuses on high-end GPU chips, aiming to break the monopoly of foreign giants in the global GPU market [3]. - The company has developed core IP independently and launched two generations of GPU chips, creating a product matrix that includes graphics rendering GPUs, data center GPUs, and edge GPUs [3]. - Hanbo Semiconductor employs a highly skilled R&D team of over 500 members, with more than 80% holding advanced degrees, and many members having extensive experience from top companies like AMD and Intel [3]. Group 2: Market Position and Growth Potential - Hanbo Semiconductor's products are being utilized in various high-value sectors, including AI models, smart data centers, and digital twins, demonstrating strong commercialization capabilities [5]. - The Chinese GPU market is projected to reach 1.36 trillion yuan by 2029, driven by ongoing investments in AI infrastructure and a focus on self-sufficiency, positioning Hanbo Semiconductor favorably for growth [5]. - The company has achieved a valuation of 10.5 billion yuan and has attracted investments from major industry players like Alibaba and Kuaishou, indicating strong market confidence [5].

据环球时报，"消息人士透露，三星和SK海力士已获美国批准，在2026年向中国出口芯片制造设备。"路透社30日报道称，在今年早些时候撤销 一些科技公司在美国芯片制造设备出口方面的许可豁免后，美国暂时松绑了对韩国企业的限制。 报道称，三星、SK海力士和台积电此前受益于美国对华芯片相关出口全面限制的豁免政策，即"经验证最终用户（VEU）"制度。被列 入"VEU"清单的企业，可以从美国进口指定的受管制物项（包括半导体设备和技术），无须再单独申请出口许可证。 然而，今年8月，美国商务部宣布撤销三星和SK海力士在其中国工厂使用美国设备的豁免，相关措施在12月正式生效。这意味着此后将美国芯片 制造设备运往这些公司的在华工厂需要获得美国的出口许可证。 韩联社援引消息人士的信息称，美国商务部工业与安全局已修改政策，允许三星和SK海力士向其中国工厂出口芯片设备，只需每年获得批准。 为此，美国要求企业提交年度计划，列明所需设备类型和数量，并按年度审批。业内人士认为，新制度比之前的逐批出货许可流程要简便得多。 两名知情人士30日对路透社表示，美国政府已向三星和SK海力士颁发年度许可证，允许其在2026年向其位于中国的工厂出口芯片制造 ...

2025年12月30日，上交所官网显示，长鑫科技集团股份有限公司（简称：长鑫科技）科创板IPO申请获受理，保荐机构为中国国际金融股份有限公司、中 信建投证券股份有限公司，审计机构为德勤华永会计师事务所（特殊普通合伙），律师事务所为上海市锦天城律师事务所。 | 发行上市 > 审核项目动态 > | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | | 长鑫科技集团股份有限公司（已预先审阅） | | 科创板IPO | | | | | | | 已受理 2025-12-30 | | 已问询 | 上市委会议 | | | 提交注册 | 注册结果 | | 项目基本信息 | | | | | | | | | 公司全称 | 长鑫科技集团股份有限公司(已预先审阅) | | | 受理日期 | 2025-12-30 | | | | 公司简称 | 长鑫科技 | | | 融资金额(亿元) | 295.00 | | | | 审核状态 | 已受理 | | | 更新日期 | 2025-12-30 | | | | 保存机构 | 中国国际金融股份有限公司 中信建投证券股份有 ...

Core Viewpoint - The domestic power management chip sector is experiencing a significant opportunity for growth as the semiconductor industry emerges from a cyclical downturn, highlighted by the recent IPO progress of Voda Semiconductor [1][6]. Group 1: Company Overview - Voda Semiconductor, established in 2014, has become a leading supplier of power chips and solutions, recognized as a "little giant" enterprise by the Ministry of Industry and Information Technology, showcasing its strength in niche markets [3]. - The company focuses on four high-growth areas: consumer electronics, mobile accessories, automotive electronics, and industrial applications, creating a diversified product matrix that includes wireless charging chips, battery management chips, and automotive electronic chips [5]. - Voda Semiconductor has achieved five industry records in fast charging technology, which serves as a key differentiator and has enabled the company to enter the global supply chain, serving major clients such as Samsung, Xiaomi, and Tesla [5]. Group 2: Market Context - The global semiconductor industry is experiencing a mild recovery, with the market size expected to grow by 3.3% year-on-year by 2025, particularly in high-end sectors like automotive electronics where domestic replacement opportunities remain vast [6]. - In 2024, 84.3% of the top ten automotive analog chip manufacturers in China are expected to be foreign companies, indicating significant room for domestic players like Voda Semiconductor to expand their market share [6]. Group 3: Financial and Capital Support - Voda Semiconductor has established a global presence with offices in multiple cities, including Hefei, Shanghai, and Seoul, and has a workforce of approximately 300 employees, providing robust support for its global customer base [5]. - The company completed a multi-hundred million yuan D-round financing in 2020 and another E-round financing in 2022, with investments from notable firms such as SK Hynix and Samsung, which have fueled its technological development and market expansion [5].