经济观察网澜起科技30日早间公告，公司按照有关规定于1月30日在香港联交所网站刊发本次发行上市 H股招股说明。本次全球发售H股基础发行股数为6589万股，发行价最高不超过106.89港元/股，预计于2 月9日在香港联交所主板挂牌并开始上市交易。 ...

格隆汇1月30日｜中国芯片设计公司、沪交所上市的澜起科技(6809.HK)今日起至下周三(2月4日)招股， 发售6589万股H股，香港公开发售占10%，其余为国际配售，每股招股价将不高於106.89港元，集资最 多70.43亿港元。一手100股，入场费10796.8港元。该股预期2月9日挂牌。中金公司、摩根士丹利及瑞银 集团为联席保荐人。 公司拟将所得款项净额中，约70%将在未来5年内用于投资互连类芯片领域的研 发，提升集团的全球领先地位，把握云计算和AI基础设施领域的机遇；约5%将用于提高集团的商业化 能力；约15%将用于战略投资及/或收购，以实现长期增长策略；及约10%将用于营运资金及一般公司用 途。 基石投资者共投资4.5亿美元，当中包括摩根大通投资管理(JPMIMI)、瑞银资产管理、云锋基金及 阿里巴巴等。 ...

1月30日，金融界财经早餐，宏观政策、资本市场、行业板块、公司个股资讯一览： 3、中国航天科技集团作为我国商业航天器及应用产业链"链长"单位，将在"十五五"期间围绕发展商业航天 国家战略部署，发挥中央企业战略引领、生态构建等职能，带动产业链上中下游企业共谋新发展、共建新 能力、共筑新生态，实施五大工程。其中，包括实施未来产业发展培育工程，谋划推动太空数智基础设 施、太空资源开发、太空交通管理、太空旅游等新领域发展。 4、民政部发布《关于进一步推进民政科技创新的指导意见》，其中提出，广泛应用人形机器人、脑机接 口、人工智能等前沿技术，开展失能失智预防和抗衰老、生活照料和康复护理、精神慰藉和社会参与促 进、安全风险监测和紧急救援、老年宜居环境建设和适老化改造等方面关键技术装备研发，推动助餐助 行、二便护理、进食穿衣、助洁助浴、移乘转运、康复训练、心理干预、情感陪伴、监测预警、应急响应 等产品研发集成、安全化和规模化应用。推动大语言模型、脑机接口等技术在残疾儿童康复领域的应用， 加强脑瘫、孤独症等残疾儿童康复技术和设备研发。 5、美国贸易代表日前在达沃斯表示，在可能举行的中美领导人会晤之前，中美双方有机会开启新一轮 ...

证券代码：688008 证券简称：澜起科技 公告编号：2026-007 澜起科技股份有限公司 关于刊发 H 股招股说明书、H 股发行价格上限 及 H 股香港公开发售等事宜的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 澜起科技股份有限公司（以下简称"公司"）正在进行申请发行境外上市股 份（H 股）并在香港联合交易所有限公司（以下简称"香港联交所"）主板挂牌 上市（以下简称"本次发行上市"）的相关工作。 2025 年 7 月 11 日，公司向香港联交所递交了本次发行上市的申请，并于同 日在香港联交所网站刊登了申请资料。详见公司于 2025 年 7 月 12 日在上海证券 交易所网站（http://www.sse.com.cn）披露的《关于向香港联交所递交境外上市 股份（H 股）发行并上市申请并刊发申请资料的公告》（公告编号：2025-042）。 2025 年 12 月 9 日，公司收到中国证券监督管理委员会（以下简称"中国证 监会"）出具的《关于澜起科技股份有限公司境外发行上市备案通知书》（国合 函〔2025〕219 ...

点击蓝字，关注我们 公司简介 澜起科技成立于2004年，是一家专注于 内存接口与高速互连芯片设计 的高新技术企业，服务于云计算 与AI训练平台。公司产品覆盖 DDR内存接口芯片、PCIe Retimer、CXL控制器 等，是全球内存接口芯 片市场的领先者，全球市占率超 36% 。 市场格局 | 竞争领域(1 | 主要竞争对手(] | 澜起的市场地位(1 | | --- | --- | --- | | 内存接口芯片(1 | 瑞萨电子（日本）、Rambus（美国） | 全球第一,24年市场份额 36.8%2 | | PCle Retimer 芯片4 | Astera Labs（美国）、博通(2 | 全球第二,24年市场份额10.9%2 | | CXL 内存控制器(2 | Marvell (美国) ( | 全球首发量产 CXL MXC 芯片,成本较 | | | | Marvell 低 30% | | 时钟芯片( | 瑞萨、TI 等(2 | 新产品布局,已通过多家头部客户测试验证( | 澜起科技在 内存接口芯片 领域占据全球第一 ，2024年市占率达 36.8% ，领先瑞萨电子与Rambus。作为 DDR5国际标准的 ...

1月30日早间，澜起科技在港交所公告，公司拟全球发售65,890,000股H股，香港发售股份6,589,000股H 股，国际发售股份59,301,000股H股，另有15%的超额配股权；发售价最高为每股106.89港元；预期股份 将于2026年2月9日开始在香港联交所买卖。 ...

Core Viewpoint - 公司 plans to globally offer 65.89 million H-shares, with 6.589 million shares available in Hong Kong and 59.301 million shares for international offering, aiming for a maximum price of HKD 106.89 per share [1] Group 1: Company Overview - 公司 is a leading fabless integrated circuit design company focused on providing innovative, reliable, and high-efficiency interconnect solutions for cloud computing and AI infrastructure [1] - According to Frost & Sullivan, 公司 ranks as the largest supplier of memory interconnect chips globally in 2024, holding a market share of 36.8% by revenue [1] Group 2: Product Offerings - 公司 offers a full range of DDR2 to DDR5 memory interface chips and supporting chips, including SPD, temperature sensors, and power management integrated circuits [2] - The newly launched interconnect chips aim to enhance the reliability and efficiency of data transmission in AI servers and personal computers [2] Group 3: Investment Agreements - 公司 has entered into cornerstone investment agreements, with cornerstone investors agreeing to subscribe for shares totaling USD 450 million (approximately HKD 3.509 billion) at the international offering price [3] - The total number of shares to be subscribed by cornerstone investors is approximately 32.828 million shares at the maximum offering price of HKD 106.89 [3] Group 4: Use of Proceeds - 公司 estimates to net approximately HKD 6.9046 billion from the global offering, assuming no exercise of the over-allotment option and a share price of HKD 106.89 [4] - The proceeds will be allocated as follows: approximately 70% for R&D in interconnect chip technology, 5% for enhancing commercialization capabilities, 15% for strategic investments or acquisitions, and 10% for working capital and general corporate purposes [4]

Group 1 - The company, Lianqi Technology (06809), plans to conduct a global offering of 65.89 million shares from January 30 to February 4, 2026, with a maximum offer price of HKD 106.89 per share [1] - The company is a leading fabless integrated circuit design firm focused on providing innovative, reliable, and energy-efficient interconnect solutions for cloud computing and AI infrastructure [1] - According to Frost & Sullivan, the company is projected to be the largest supplier of memory interconnect chips globally in 2024, holding a market share of 36.8% by revenue [1] Group 2 - The company offers a full range of memory interface chips from DDR2 to DDR5, including supporting chips like SPD, TS, and PMIC, which are critical for stable data transmission between CPUs and DRAM modules in servers [2] - The company has two main product lines: interconnect chips and Zindai products, with interconnect chips including memory interface chips, PCIe/CXL interconnect chips, and clock chips [2] Group 3 - The company has secured cornerstone investments totaling USD 450 million from various investors, including JPMIMI and UBS AM, under specific conditions [3] - The estimated net proceeds from the global offering are approximately HKD 6.905 billion, assuming no exercise of the over-allotment option and a share price of HKD 106.89 [3] - About 70% of the proceeds will be allocated to R&D in the interconnect chip sector over the next five years, while 5% will enhance commercialization capabilities, 15% for strategic investments or acquisitions, and 10% for working capital and general corporate purposes [3]

Core Viewpoint - The company, 澜起科技, is set to launch an initial public offering (IPO) from January 30 to February 4, 2026, aiming to raise approximately 6.589 million shares globally, with a maximum price of HKD 106.89 per share, focusing on interconnect solutions for cloud computing and AI infrastructure [1]. Group 1: Company Overview - 澜起科技 is a leading fabless integrated circuit design company specializing in innovative and reliable interconnect solutions for cloud computing and AI infrastructure [1]. - The company provides interconnect chips, including memory interconnect chips and PCIe/CXL interconnect chips, applicable in data centers, servers, and computers [1]. - According to Frost & Sullivan, the company is projected to be the largest supplier of memory interconnect chips globally by 2024, holding a market share of 36.8% [1]. Group 2: Product Lines - The company offers a full range of DDR2 to DDR5 memory interface chips and supporting chips, including SPD, temperature sensors, and power management integrated circuits [2]. - The DDR5 memory interface chips are critical components for stable data transmission between CPUs and DRAM modules in servers [2]. - New interconnect chips, such as MRCD/MDB, clock drivers, PCIe Retimer, and CXL MXC, aim to enhance data transmission reliability and efficiency in AI servers and personal computers [2]. Group 3: Fundraising and Use of Proceeds - The company has secured cornerstone investments totaling USD 450 million from various investors, including JPMIMI and UBS AM, under specific conditions [3]. - After deducting underwriting commissions and estimated expenses, the net proceeds from the global offering are estimated to be approximately HKD 6.905 billion, assuming no exercise of the over-allotment option [3]. - Approximately 70% of the proceeds will be allocated to R&D in the interconnect chip sector over the next five years, 5% to enhance commercialization capabilities, 15% for strategic investments or acquisitions, and 10% for working capital and general corporate purposes [3].

每经AI快讯，1月30日，澜起科技在港交所公告，在港上市拟发行65,890,000股H股（视乎超额配股权行 使与否而定），定价不超106.89港元/股。预期H股将在2月9日开始交易。 （文章来源：每日经济新闻） ...