证券代码：002436 证券简称：兴森科技 公告编号：2025-08-045 深圳市兴森快捷电路科技股份有限公司 关于 2021 年员工持股计划出售完毕暨终止的公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有 虚假记载、误导性陈述或重大遗漏。 深圳市兴森快捷电路科技股份有限公司（以下简称"公司"）2021 年员工持股计划（以下 简称"本持股计划"）所持有的公司股票已于近日全部出售完毕，根据中国证监会《关于上市 公司实施员工持股计划试点的指导意见》《深圳证券交易所上市公司自律监管指引第 1 号—— 主板上市公司规范运作》及《深圳市兴森快捷电路科技股份有限公司 2021 年员工持股计划（修 订稿）》的相关规定，现将有关情况公告如下： 一、员工持股计划的基本情况 公司分别于 2021 年 7 月 14 日、2021 年 7 月 30 日召开了第六届董事会第四次会议、第六 届监事会第三次会议和 2021 年第四次临时股东大会，均审议通过了《关于<深圳市兴森快捷电 路科技股份有限公司 2021 年员工持股计划（草案）>及其摘要的议案》等相关议案。详见公司 于2021年7月15日、2021年7月31日 ...

Group 1 - The company is currently in the small batch production phase for its FCBGA packaging substrate project [1] - Market expansion and customer certification are progressing steadily as planned [1] - The timeline for mass production largely depends on the recovery of industry demand, the customer's own production progress, and their supplier management strategies [1]

Group 1 - The company, Xingsen Technology (002436.SZ), has reported that its CSP packaging substrate production capacity is currently at full capacity and is in the process of expansion [1] - The market development and customer certification for the FCBGA packaging substrate project are progressing steadily as planned [1]

Group 1 - The main focus of the article is on the significant outflow of capital from specific stocks as of August 1, with a detailed list of the top 20 stocks experiencing the largest capital outflows [1] - The stock with the highest capital outflow is Xinyi Semiconductor, with an outflow of 1.468 billion [1] - Other notable stocks with substantial outflows include Northern Rare Earth (1.250 billion), Tianfeng Securities (1.207 billion), and WuXi AppTec (0.896 billion) [1] Group 2 - The total capital outflows from the top 20 stocks indicate a trend of investors pulling back from these companies, which may reflect broader market sentiments [1] - The data highlights a diverse range of sectors affected, including technology, materials, and finance, suggesting a widespread concern among investors [1] - The cumulative outflow from these stocks could impact their market performance and investor confidence moving forward [1]

Core Points - The component sector increased by 0.69% on July 31, with Shengyi Electronics leading the gains [1] - The Shanghai Composite Index closed at 3573.21, down 1.18%, while the Shenzhen Component Index closed at 11009.77, down 1.73% [1] Company Performance - Shengyi Electronics (688183) closed at 53.17, up 6.11% with a trading volume of 403,100 shares and a transaction value of 221.3 million [1] - Shengyi Technology (600183) closed at 42.92, up 3.80% with a trading volume of 452,300 shares and a transaction value of 194.4 million [1] - Hongxin Electronics (300657) closed at 29.61, up 3.42% with a trading volume of 478,600 shares and a transaction value of 1.418 billion [1] - Huhua Electric (002463) closed at 56.27, up 3.29% with a trading volume of 836,100 shares and a transaction value of 4.746 billion [1] - Maijie Technology (300319) closed at 11.45, up 3.15% with a trading volume of 514,300 shares and a transaction value of 578 million [1] - Dongshan Precision (002384) closed at 58.49, up 3.14% with a trading volume of 953,500 shares and a transaction value of 5.667 billion [1] - Jianghai Co. (002484) closed at 23.88, up 2.71% with a trading volume of 526,900 shares and a transaction value of 125.5 million [1] - Fangbang Co. (688020) closed at 56.78, up 2.12% with a trading volume of 127,600 shares and a transaction value of 74 million [1] - Qiangda Circuit (301628) closed at 92.46, up 2.05% with a trading volume of 35,300 shares and a transaction value of 329 million [1] - Xingsen Technology (002436) closed at 18.96, up 1.99% with a trading volume of 2,621,600 shares and a transaction value of 506.47 million [1] Fund Flow - The component sector experienced a net outflow of 581 million from main funds, while retail funds saw a net inflow of 431 million [3] - Speculative funds had a net inflow of 150 million [3]

格隆汇7月31日｜A股PCB概念持续拉升，东山精密、兴森科技、芯碁微装、生益科技、东材科技、生 益电子、胜宏科技、沪电股份盘中创历史新高，宏和科技涨停，德龙激光、中一科技、正业科技、方邦 股份、德福科技跟涨。 消息上，人工智能浪潮下，被誉为"电子产品之母"的PCB(印制电路板)产业链迎 来高景气。从已经披露的中报业绩预告来看，沪电股份、广合科技、鹏鼎控股、南亚新材、满坤科技等 A股上市公司均预计2025年上半年归属于上市公司股东的净利润下限同比增长超40%。 ...

Summary of Key Points Core Viewpoint - As of July 30, the margin financing and securities lending balance in the Shanghai and Shenzhen markets reached 1,978.407 billion yuan, reflecting an increase of 2.099 billion yuan from the previous trading day [1]. Market Overview - The financing balance was 1,964.255 billion yuan, up by 2.167 billion yuan compared to the previous day [1]. - The Shanghai market's margin balance was 1,011.196 billion yuan, increasing by 0.391 billion yuan, while the Shenzhen market's balance was 967.21 billion yuan, rising by 1.708 billion yuan [1]. Stock Performance - A total of 1,713 stocks experienced net inflows of financing funds [3]. - 43 stocks had net financing inflows exceeding 10% of their total trading volume, with the top three being Songji Co., Ltd. (23.02%), Conglin Technology (22.58%), and Ruilian New Materials (21.57%) [3][4]. Significant Net Inflows - 17 stocks had net inflows exceeding 100 million yuan, with WuXi AppTec, CATL, and Baosteel ranking first, second, and third, with net inflows of 447 million yuan, 437 million yuan, and 419 million yuan, respectively [7].

（文章来源：证券日报） 证券日报网讯兴森科技7月30日在互动平台回答投资者提问时表示，公司具备COWOP封装相关的技术 和产品，主要应用领域包括高速服务器架构等。 ...

Core Viewpoint - The company has advanced technologies and products applicable in the COWOP packaging field, including Tenting reduction method, Msap improved semi-additive method, and SAP semi-additive method [1] Group 1 - The company responded to investor inquiries on July 30, indicating its capabilities in specific packaging technologies [1]

Group 1 - The company has the capability to utilize Tenting reduction method, Msap improved semi-additive method, and SAP semi-additive method in its processes [2] - The relevant technologies and products can be applied in the COWOP packaging field [2]