深南电路股份有限公司 2025 年半年度非经营性资金占用及其他关联资金往来情况汇总表 编制单位：深南电路股份有限公司 单位：万元 法定代表人：杨之诚 主管会计工作负责人：楼志勇 会计机构负责人（会计主管人员）：楼志勇 | | | 往来方与上 | 上市公司核算 | 年期初 2025 | 2025 年半年度往来 | 年半年度往来 2025 | 年半年度偿还 2025 | 年半年度期 2025 | 往来形成 | 往来性质 （经营性往 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 其他关联资金往来 | 资金往来方名称 | 市公司的关 | | | 累计发生金额（不 | | | | | | | | | 联关系 | 的会计科目 | 往来资金余额 | 含利息） | 资金的利息（如有） | 累计发生金额 | 末往来资金余额 | 原因 | 来、非经营 | | | | | | | | | | | | 性往来） | | | 中航工业集团财 | 受同一最终 | 银行存款 | 86,841.42 | 453,744.81 | 5.58 | ...

深南电路股份有限公司 2025 年半年度报告全文 深南电路股份有限公司 2025 年半年度报告 2025 年 8 月 1 深南电路股份有限公司 2025 年半年度报告全文 第一节 重要提示、目录和释义 公司董事会及董事、高级管理人员保证半年度报告内容的真实、准确、 完整，不存在虚假记载、误导性陈述或者重大遗漏，并承担个别和连带的法 律责任。 公司负责人杨之诚、主管会计工作负责人楼志勇及会计机构负责人(会计 主管人员)楼志勇声明：保证本半年度报告中财务报告的真实、准确、完整。 所有董事均已出席了审议本次半年报的董事会会议。 本半年度报告涉及未来计划等前瞻性描述，不构成公司对投资者的实质 承诺，请投资者注意投资风险。 公司已在报告中描述可能存在的宏观经济波动风险、国际经贸摩擦风险、 市场竞争风险、进入新市场及开发新产品的风险、海外工厂建设运营风险、 产能扩张后的爬坡风险、原物料供应及价格波动风险、汇率风险，敬请查阅 "第三节 管理层讨论与分析 十、公司面临的风险和应对措施"相关内容。 公司计划不派发现金红利，不送红股，不以公积金转增股本。 2 | | | | 第一节 | 重要提示、目录和释义 2 | | --- ...

证券代码：002916 证券简称：深南电路 公告编号：2025-026 深南电路股份有限公司 第四届董事会第八次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 本次会议审议通过了以下议案： （一）《2025 年半年度报告及其摘要》 具体内容详见披露于《证券时报》和巨潮资讯网（http://www.cninfo.com.cn） 的《2025 年半年度报告摘要》（公告编号：2025-027），以及披露于巨潮资讯网 （http://www.cninfo.com.cn）的《2025 年半年度报告》全文。 该议案已经审计委员会以 3 票同意全票审议通过。与会董事以同意 9 票，反 对 0 票，弃权 0 票的结果通过。 （二）《2025 年半年度募集资金存放与使用情况的专项报告》 公司对募集资金实行专户存储制度和专项使用，并按相关规定及时、真实、 准确、完整地披露了募集资金的存放及实际使用情况，不存在变相改变募集资金 用途和损害股东利益的情况，不存在违规使用募集资金的情况。 具体报告详见披露于《证券时报》和巨潮资讯网（http://www.cninfo.co ...

Market Overview - On August 27, the component sector declined by 0.46% compared to the previous trading day, with Jin'an Guoji leading the decline [1] - The Shanghai Composite Index closed at 3800.35, down 1.76%, while the Shenzhen Component Index closed at 12295.07, down 1.43% [1] Stock Performance - Notable gainers included: - Fangzheng Technology (600601) with a closing price of 8.70, up 9.99% and a trading volume of 6.44 million shares, totaling 5.467 billion yuan [1] - Shennan Circuit (002916) closed at 169.50, up 4.19% with a trading volume of 135,900 shares, totaling 2.342 billion yuan [1] - Major decliners included: - Jin'an Guoji (002636) closed at 13.27, down 6.42% with a trading volume of 565,400 shares, totaling 776 million yuan [2] - Nanya New Materials (688519) closed at 68.68, down 6.34% with a trading volume of 130,600 shares, totaling 916 million yuan [2] Capital Flow - The component sector experienced a net outflow of 1.111 billion yuan from institutional investors, while retail investors saw a net inflow of 1.493 billion yuan [2] - The capital flow for specific stocks showed: - Fangzheng Technology had a net inflow of 1.099 billion yuan from institutional investors, while retail investors had a net outflow of 487 million yuan [3] - Xingsen Technology (002436) had a net inflow of 190 million yuan from institutional investors, but a net outflow of 75.252 million yuan from retail investors [3]

Group 1 - The storage chip sector continues to strengthen, with ShenNan Circuit reaching a new high during trading [1] - Xingsen Technology has hit the daily limit increase [1] - Other companies such as Bai'ao Chemical, Defu Technology, Lierda, Shangluo Electronics, and Jucheng Co. also experienced gains [1]

Core Viewpoint - The report from Minsheng Securities highlights "speed" and "power" as the two core contradictions in current AI development, with PCB (Printed Circuit Board) being a crucial component in the AI industry chain, benefiting significantly from the ongoing advancements in PCB technology and processes [1] Group 1: PCB Industry Trends - The PCB industry is experiencing rapid development in advanced packaging and high-density interconnect technologies, transitioning from traditional HDI and substrate technologies to mSAP processes capable of sub-10μm line widths to meet the demands of high-speed signal transmission and large-scale integration [1] - New technologies such as CoWoP (Chip-on-Wafer-on-Panel) are changing the form of packaging substrates by using large-size PCBs to carry multiple chips, thereby reducing costs and enhancing interconnect density [1] Group 2: Upstream Material Demand - Driven by AI demand, leading PCB manufacturers like Shenghong Technology, Huitian Technology, and Pengding Holdings are actively expanding production, creating a resonance between material upgrades and capacity expansion [2] - Key upstream materials for PCBs include copper foil, electronic cloth, and resin, with upgrades in these materials to meet the requirements of high-speed signal transmission and lightweight designs [2] Group 3: Equipment Supply and Domestic Substitution - The core processes of PCB manufacturing, including drilling, electroplating, and etching, are critical for determining interconnect density, signal integrity, and production yield, with increasing demands for precision and reliability in these processes [3] - Domestic equipment manufacturers such as Dazhu CNC, Dingtai High-Tech, and Dongwei Technology are accelerating their layouts in advanced process equipment for high-layer boards, HDI, and mSAP, reflecting the industry's shift towards domestic substitution [3] Group 4: Investment Recommendations - Recommended PCB leading manufacturers include Shenghong Technology (300476.SZ), Pengding Holdings (002938.SZ), Huitian Technology (002463.SZ), Shenzhen South Circuit (002916.SZ), Guanghe Technology (001389.SZ), and Jingwang Electronics (603228.SH) [4] - In the materials sector, companies with core technologies and customer resources such as Honghe Technology (603256.SH), Zhongcai Technology (002080.SZ), Feilihua (300395.SZ), Defu Technology (301511.SZ), Longyang Electronics (301389.SZ), and Meilian New Materials (300586.SZ) are recommended [4] - For equipment, focus on domestic substitution in core segments with companies like Dazhu CNC (301200.SZ), Xinqi Microelectronics (688630.SH), Dingtai High-Tech (301377.SZ), and Dongwei Technology (688700.SH) [4]

Market Performance - The component sector increased by 4.52% on August 25, with Shengyi Electronics leading the gains [1] - The Shanghai Composite Index closed at 3883.56, up 1.51%, while the Shenzhen Component Index closed at 12441.07, up 2.26% [1] Top Gainers in Component Sector - Shengyi Electronics (688183) closed at 73.36, up 12.69% with a trading volume of 344,400 shares and a transaction value of 2.39 billion [1] - Fangbang Co., Ltd. (688020) closed at 66.99, up 12.31% with a trading volume of 78,400 shares and a transaction value of 507 million [1] - Jingwang Electronics (603228) closed at 59.60, up 10.00% with a trading volume of 592,700 shares and a transaction value of 3.43 billion [1] - Victory Technology (300476) closed at 239.90, up 9.00% with a trading volume of 837,800 shares and a transaction value of 18.58 billion [1] - Other notable gainers include Shenzhen South Circuit (002916) and Dongshan Precision (002384), with increases of 7.46% and 7.32% respectively [1] Underperformers in Component Sector - Tianjin Pulin (002134) closed at 23.40, down 10.00% with a trading volume of 312,600 shares [2] - Jinsai Technology (871981) closed at 44.24, down 4.63% with a trading volume of 59,700 shares [2] - ST Dongjing (002199) closed at 10.93, down 3.10% with a trading volume of 73,900 shares [2] Capital Flow in Component Sector - The component sector saw a net inflow of 162 million from main funds, while retail investors experienced a net outflow of 236 million [2]

Group 1 - The company ShenNan Circuit Co., Ltd. has applied for a patent for a method and device for cleaning pool walls, including an underwater robot and storage medium, with the patent publication number CN120520461A and application date of May 2025 [1] - The patent addresses the issue of underwater robots slipping on wet surfaces while climbing pool walls, which significantly affects their work efficiency [1] Group 2 - ShenNan Circuit Co., Ltd. was established in 1984 and is located in Shenzhen, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has a registered capital of 5,128.77535 million RMB and has made investments in 10 enterprises, participated in 2,213 bidding projects, and holds 1,652 patents [2]

Investment Rating - The report maintains a "Recommended" rating for leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd. [4][5] Core Viewpoints - The PCB industry is experiencing rapid advancements in packaging and high-density interconnect technologies, with traditional HDI and substrate technologies evolving into mSAP processes to meet the demands of high-speed signal transmission and large-scale integration [1][2] - The demand for PCB is driven by AI applications, leading to significant expansions in production capacity among leading companies, with total investments exceeding 30 billion RMB [2][20] - The core materials for PCB, including copper foil, electronic cloth, and resin, are undergoing upgrades to meet the high-frequency and high-speed requirements of AI applications [2][20][26] Summary by Sections 1. CoWoP and mSAP as Core Technologies - CoWoP (Chip-on-Wafer-on-PCB) is emerging as a future packaging route, enhancing interconnect density and reducing costs by directly using large-size PCBs [1][11] - mSAP (Modified Semi-Additive Process) is becoming the core process for achieving sub-10 µm line capabilities, essential for high-performance applications [1][14] 2. PCB Capacity Expansion and Material Upgrades - Leading PCB manufacturers are actively expanding production capacity, with significant investments announced by companies like Huadian Co., Ltd. and Shenghong Technology [2][20] - The upgrade of core materials includes the transition of copper foil from HVLP1 to HVLP5, electronic cloth to third-generation low-dielectric cloth, and resin to hydrocarbon and PTFE types [2][20][28] 3. Tight Supply of Core Equipment and Acceleration of Domestic Substitution - The supply of core PCB equipment, including drilling, plating, and etching imaging, is tight, with domestic manufacturers accelerating their layouts in advanced process equipment [2][49] - Companies like Dazhu CNC and Ding Tai High-Tech are focusing on high-layer boards and HDI equipment to meet the increasing demands of the industry [2][49] 4. Investment Recommendations - The report suggests focusing on leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd., as well as material companies with core technologies like Honghe Technology and Zhongcai Technology [3][4] - Equipment manufacturers involved in domestic substitution, such as Dazhu CNC and Xinqi Microelectronics, are also highlighted as potential investment opportunities [3][4]

证券之星消息，8月22日元件板块较上一交易日上涨3.35%，南亚新材领涨。当日上证指数报收于 3825.76，上涨1.45%。深证成指报收于12166.06，上涨2.07%。元件板块个股涨跌见下表： | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | | --- | --- | --- | --- | --- | --- | --- | | 688519 | 南亚新材 | 75.75 | 11.61% | 19.07万 | | 14.21亿 | | 688183 | 生益电子 | 65.10 | 10.55% | 32.79万 | | 20.87亿 | | 600601 | 方正科技 | 7.89 | 10.04% | 267.95万 | | 20.65 Z | | 600183 | 生益科技 | 47.61 | 7.11% | 55.74万 | | 26.20亿 | | 002916 | 深南电路 | 149.92 | 5.89% | 18.11万 | | 27.04亿 | | 603186 | 华正新材 | 41.18 | 4.65% | 17.18万 | | 7.03 ...